CN217064199U - Heat radiation structure of motor controller - Google Patents
Heat radiation structure of motor controller Download PDFInfo
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- CN217064199U CN217064199U CN202220076931.XU CN202220076931U CN217064199U CN 217064199 U CN217064199 U CN 217064199U CN 202220076931 U CN202220076931 U CN 202220076931U CN 217064199 U CN217064199 U CN 217064199U
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Abstract
The application discloses machine controller's heat radiation structure includes: the heat dissipation shell comprises a bottom surface and a side surface vertical to the bottom surface; a heat conductive substrate in close contact with a side surface of the heat dissipation case; a circuit board including a power device positioned above a bottom surface of the heat dissipation housing; the power device is attached to the heat conducting substrate and is electrically connected with the circuit board through a pin of the power device. The utility model discloses with the side in close contact with of power device setting on the heat conduction base plate and heat dissipation casing for the heat need not transmit through the air, improves machine controller's radiating efficiency.
Description
Technical Field
The utility model relates to a controller technical field, more specifically relates to machine controller's heat radiation structure.
Background
With the widespread use of electrical devices such as motor controllers, rectifier power supplies, inverter power supplies, and the like, the importance of electrical devices such as motor controllers, rectifier power supplies, inverter power supplies, and the like has increased. The interior of the electric devices such as the motor controller, the rectifier power supply, the inverter power supply and the like usually contains a large number of heating power devices, and the heating power devices can generate a large amount of heat during working. For example, a large amount of heat can be released by a high-power IGBT of the motor controller during operation, and the normal operation of the motor controller is affected by overheating protection when the temperature of the IGBT rises rapidly, so that it is important to dissipate heat of an internal heating power device of the electrical apparatus.
In the prior art, heating power devices of electric devices such as a motor controller, a rectification power supply and an inverter power supply generally use a natural heat dissipation mode to dissipate heat, the heat dissipation effect of the heating power devices is poor, and the electric devices are easy to influence normal work or even damage due to untimely heat dissipation.
In addition, different equipment internally mounted spaces are not the same, if the condition that the size does not meet the requirements may appear in the single heat dissipation casing of mounting means, if the shape of heat dissipation casing is designed separately to every type of equipment, the cost is increased by a wide margin.
SUMMERY OF THE UTILITY MODEL
In view of the above, an object of the present invention is to provide a heat dissipation structure of a motor controller, which improves heat dissipation efficiency of the motor controller, and is suitable for various devices.
According to the utility model discloses an aspect provides a motor controller's heat radiation structure, include: the heat dissipation shell comprises a bottom surface and a side surface vertical to the bottom surface; a heat conductive substrate in close contact with a side surface of the heat dissipation case; a circuit board including a power device positioned above a bottom surface of the heat dissipation housing; the power device is attached to the heat conducting substrate and is electrically connected with the circuit board through a pin of the power device.
Preferably, the heat dissipation structure of the motor controller further includes: and the copper column is fixed on the bottom surface of the heat dissipation shell.
Preferably, a limiting groove is formed in the side surface of the heat dissipation shell; one side of the circuit board is arranged in the limiting groove, and the other side of the circuit board is fixed on the copper column.
Preferably, the bottom surface and the side surface of the heat dissipation shell are both provided with symmetrical U-shaped grooves.
Preferably, the substrate comprises a metal layer, an insulating layer and a circuit layer which are sequentially arranged from bottom to top; the surface of the power device is attached to the circuit layer, and the metal layer is in close contact with the side face of the heat dissipation shell.
Preferably, the metal layer is at least one of aluminum, copper and iron.
Preferably, the side of the heat conducting substrate far away from the power device is coated with heat conducting silicone grease.
Preferably, a thermistor is further disposed on the heat conducting substrate and is used for measuring the temperature of the power device.
Preferably, a fan is installed on one side of the side surface of the heat dissipation shell, which is far away from the heat conduction substrate, and the fan is turned on or off according to the temperature of the power device.
Preferably, a plurality of fins are further arranged on one side of the side surface of the heat dissipation shell, which is far away from the heat conducting substrate.
Preferably, the heat dissipation housing is an aluminum housing.
According to the utility model discloses machine controller's heat radiation structure sets up power device on the heat conduction base plate and the side in close contact with of heat conduction base plate and heat dissipation casing for the heat need not transmit through the air, improves machine controller's radiating efficiency.
Furthermore, one end of the circuit board is fixed with the bottom surface of the heat dissipation shell through the copper column by utilizing a screw, and the other end of the circuit board is fixed with the side surface of the heat dissipation shell through the limiting groove, so that a certain gap is formed between the circuit board and the bottom surface of the heat dissipation shell, and partial heat on the circuit board is taken away through the gap.
Furthermore, the side surface of the heat dissipation shell is also provided with a through hole for mounting a fan, and the fan can be mounted on one side of the side surface of the heat dissipation shell, which is far away from the heat conduction substrate, so as to reduce the temperature. Furthermore, heat-conducting silicone grease is coated on one side, away from the power device, of the heat-conducting substrate, so that the heat dissipation efficiency is improved.
Drawings
The above and other objects, features and advantages of the present invention will become more apparent from the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:
fig. 1 shows a perspective view of a heat dissipation structure of a motor controller according to an embodiment of the present invention.
Fig. 2 shows another perspective view of a heat dissipation structure of a motor controller according to an embodiment of the present invention.
Detailed Description
Various embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. In the various figures, like elements are identified with the same or similar reference numerals. For purposes of clarity, the various features in the drawings are not necessarily drawn to scale.
The following detailed description of the embodiments of the present invention is made with reference to the accompanying drawings and examples.
Fig. 1 shows a schematic perspective view of a heat dissipation structure of a motor controller according to an embodiment of the present invention. As shown in fig. 1, the heat dissipation structure of the motor controller includes a heat dissipation housing 1, a heat conduction substrate 2, a circuit board 3, a copper pillar 4, a first through hole 5, a second through hole 6, a third through hole 7, and a fourth through hole 9.
The heat dissipation shell 1 comprises a bottom surface 11 and a side surface 12 perpendicular to the bottom surface 11, the heat dissipation shell 1 is made of aluminum, heat conductivity is good, heat dissipation performance is strong, and heat dissipation efficiency of the motor controller is improved.
Referring to fig. 1, a side surface 12 of the heat dissipation housing 1 is provided with a limiting groove 13, and the copper pillar 4 is fixed on a bottom surface 11 of the heat dissipation housing.
The circuit board 3 is provided with a first through hole 5, one side of the circuit board 3 is fixed with the copper column 4 through the first through hole 5 by screws, and the other side of the circuit board is fixed through a limiting groove 13. This spacing groove 13 not only can not become flexible with circuit board 3 chucking, can also save fixed mounting's material, compact structure the time the cost is reduced. At this time, a gap is formed between the circuit board 3 and the base of the heat dissipation case 1, which creates a condition for air flow, and partial heat generated on the circuit board 3 and the heat dissipation case 1 can be taken away through the gap.
Still be provided with a plurality of power wares 8 on circuit board 3, power device for example be Insulated Gate Bipolar Transistor (IGBT), and it is when motor controller work, and the electric current of passing through is great, can lead to motor controller to generate heat because power loss, if do not have timely heat dissipation, the high temperature can influence the normal use of component, burns out components and parts even.
In this embodiment, a metal-packaged power device 8 is adopted, the power device 8 is attached to the heat conducting substrate 2 through solder, and the heat conducting substrate 2 is fixed on the side surface 12 of the heat dissipation housing 1 through the second through hole 6 by screws. The power device 8 is electrically connected with the circuit board 3 through a pin on the side. The heat conduction base plate is metal-based heating panel, and it includes metal level, insulating layer and the circuit layer that stacks gradually from supreme down, and the power device surface is pasted and is adorned on the circuit layer, and the produced heat of power device during operation conducts metal-based layer fast through the insulating layer, then goes out heat transfer by metal-based layer to realize the heat dissipation. The material of the metal layer may be aluminum, copper, iron, or other metal materials with good thermal conductivity, but is not limited thereto.
Further, the side of the heat conductive substrate 2 opposite to the side 12 of the heat dissipation case 1 is coated with heat conductive silicone grease.
Further, the bottom surface 11 and the side surface 12 of the heat dissipation housing 1 are both provided with symmetrical U-shaped grooves 14, which is convenient for installation. When the device is not installed through the side 12 of the heat dissipation housing 1 due to insufficient space inside the device, the device can be installed with the bottom 11, and vice versa, and can be applied to different devices.
Further, a thermistor is mounted on the heat conducting substrate 2 through the third through hole 7, the resistance value of the thermistor is detected in real time, and then the temperature of the heat conducting substrate 2 is estimated, and since a relatively stable temperature difference exists in the heat conducting substrate 2 after the power device 8 works for a long time, the temperature of the power device 8 can be estimated approximately. When the temperature is too high, the motor controller is closed in time to avoid burning the motor controller. In order to accurately estimate the temperature of the power device 8, the third through hole 7 is located at a position where the power device 8 is concentrated.
Referring to fig. 2, a fourth through hole 9 is further disposed on a side surface 12 of the heat dissipation housing for installing a fan, so as to further improve heat dissipation efficiency. Whether the fan is turned on or not can be determined according to actual conditions.
In the present embodiment, when the temperature of the heat conductive substrate 2 is detected to be greater than 60 ℃, the fan is turned on; if the temperature of the heat conducting substrate 2 is detected to be less than 55 ℃, the fan is turned off.
The side 12 of the heat dissipation casing 1 away from the heat conducting substrate 2 is further provided with a plurality of fins 15, so that the heat dissipation area is increased, and the heat dissipation efficiency is improved.
The utility model discloses machine controller's heat radiation structure sets up power device on the heat conduction base plate and the side in close contact with of heat conduction base plate and heat dissipation casing for the heat need not transmit through the air, improves machine controller's radiating efficiency.
Furthermore, one end of the circuit board is fixed with the bottom surface of the heat dissipation shell through the copper column by utilizing a screw, and the other end of the circuit board is fixed with the side surface of the heat dissipation shell through the limiting groove, so that a certain gap is formed between the circuit board and the bottom surface of the heat dissipation shell, and partial heat on the circuit board is taken away through the gap.
Furthermore, the side surface of the heat dissipation shell is also provided with a through hole for mounting a fan, and the fan can be mounted on the side surface of the heat dissipation shell, which is far away from the heat conduction substrate, to reduce the temperature. Furthermore, heat-conducting silicone grease is coated on one side, away from the power device, of the heat-conducting substrate, so that the heat dissipation efficiency is improved.
In accordance with the embodiments of the present invention as set forth above, these embodiments are not exhaustive and do not limit the invention to the precise embodiments described. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical application, to thereby enable others skilled in the art to best utilize the invention and its various embodiments with various modifications as are suited to the particular use contemplated. The present invention is limited only by the claims and their full scope and equivalents.
Claims (11)
1. A heat radiation structure of a motor controller is characterized by comprising:
the heat dissipation shell comprises a bottom surface and a side surface vertical to the bottom surface;
a heat conductive substrate in close contact with a side surface of the heat dissipation case;
a circuit board including a power device positioned above a bottom surface of the heat dissipation housing;
the power device is attached to the heat conducting substrate and is electrically connected with the circuit board through a pin of the power device.
2. The heat dissipation structure of claim 1, further comprising: and the copper column is fixed on the bottom surface of the heat dissipation shell.
3. The heat dissipation structure of claim 2, wherein a side surface of the heat dissipation housing is provided with a limit groove; one side of the circuit board is arranged in the limiting groove, and the other side of the circuit board is fixed on the copper column.
4. The heat dissipation structure of claim 1, wherein the bottom surface and the side surface of the heat dissipation housing are both provided with symmetrical U-shaped grooves.
5. The heat dissipation structure of claim 1, wherein the substrate comprises a metal layer, an insulating layer and a circuit layer sequentially arranged from bottom to top;
the surface of the power device is attached to the circuit layer, and the metal layer is in close contact with the side face of the heat dissipation shell.
6. The heat dissipation structure of claim 5, wherein the metal layer is at least one of aluminum, copper, and iron.
7. The heat dissipation structure of claim 1, wherein a side of the heat conductive substrate away from the power device is coated with a heat conductive silicone grease.
8. The heat dissipation structure of claim 1, wherein a thermistor is further disposed on the heat conductive substrate for measuring a temperature of the power device.
9. The heat dissipating structure of claim 1, wherein a fan is installed on a side of the heat dissipating housing facing away from the heat conductive substrate, and the fan is turned on or off according to a temperature of the power device.
10. The heat dissipating structure of claim 1, wherein the heat dissipating housing is further provided with a plurality of fins on a side of the heat dissipating housing facing away from the heat conducting substrate.
11. The heat dissipation structure according to any one of claims 1 to 10, wherein the heat dissipation housing is an aluminum housing.
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CN202220076931.XU CN217064199U (en) | 2022-01-12 | 2022-01-12 | Heat radiation structure of motor controller |
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CN202220076931.XU CN217064199U (en) | 2022-01-12 | 2022-01-12 | Heat radiation structure of motor controller |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN115513073A (en) * | 2022-11-23 | 2022-12-23 | 季华实验室 | Power device heat dissipation structure and assembly method thereof |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115513073A (en) * | 2022-11-23 | 2022-12-23 | 季华实验室 | Power device heat dissipation structure and assembly method thereof |
CN115513073B (en) * | 2022-11-23 | 2023-03-07 | 季华实验室 | Power device heat dissipation structure and assembly method thereof |
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