CN203466179U - Stack structure for chip heating through electric heating sheet conduction - Google Patents
Stack structure for chip heating through electric heating sheet conduction Download PDFInfo
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- CN203466179U CN203466179U CN201320503148.8U CN201320503148U CN203466179U CN 203466179 U CN203466179 U CN 203466179U CN 201320503148 U CN201320503148 U CN 201320503148U CN 203466179 U CN203466179 U CN 203466179U
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Abstract
The utility model provides a stack structure for chip heating through electric heating sheet conduction. A circuit module possesses a circuit board and a chip unit on the circuit board. And a heat dissipation apparatus is sticked and positioned on an another side surface of the chip unit relatively to the circuit board. A heat dissipation bottom surface possessed by the heat dissipation apparatus is convexly provided with a heat conduction block which is sticked on the chip unit. A heat conduction layer which is sticked on the chip unit and an electric heating sheet on an another side surface of the chip unit relatively to the heat conduction layer are arranged on a position which is on a heat dissipation seat and is located around the heat conduction block. An heat insulation component is sticked and positioned between the electric heating sheet and the heat dissipation seat. When a chip unit temperature of the circuit module is detected to be lower than 0 DEG C, a power supply lead can be used to provide power for the electric heating sheet and heat generated after the electric heating sheet is electrified can be uniformly conducted to the chip unit through the heat conduction layer. When the temperature reaches an allowable working temperature range, the electric heating sheet is controlled to automatically carry out outage. Therefore, computer equipment can normally carry out power on and starting or operation in a low-temperature or cold outdoor environment.
Description
Technical field
The utility model is to provide a kind of electric heating piece and conducts in the stacked structure of chip heating, espespecially the chip unit temperature of circuit module is during lower than 0 ℃, can utilize the heat producing after electric heating piece energising evenly to conduct on chip unit by heat-conducting layer, until reach 0 ℃ of auto-breaking when above, make computer equipment in low temperature environment starting up or running normally.
Background technology
Electronics technology is grown up with the speed of making rapid progress now, the computer equipments such as computer, notebook computer have been prevalent in upper each corner of society all, and the direction strong towards calculation function, speed is fast and volume is little strides forward, and along with the application of the computer equipments such as computer, notebook computer all trends towards high speed development, the temperature producing during the runnings such as its central processing unit, image processor also relatively significantly improves, therefore will how to utilize radiator structure to guarantee to work under allowable temperature, be considered as the problem of desiring most ardently solution by industry.
Moreover, the current general practice of industry, that radiator is supported to the chip unit be affixed on circuit board (as central processing unit, image processor etc.), or can be by fan further combined with on radiator, and make fan and radiator collocation form optimized radiator structure, while but using under the environment of the chip unit normal temperature on general circuit plate, it only has too high the caused temperature of running speed and rises and cause overheated problem, if the weather in the extreme variation of temperature, under humidity and strong sunshine and severe outdoor environment, for all computer equipments, it is all very harsh test, and in the very large environment of day and night temperature (as desert), though it can utilize radiator, fan reaches the effect of heat radiation when day temperature is high, but computer equipment night temperature lower or extremely low in temperature, cold outdoor environment (as snowfield), make chip unit on circuit board just can Yin Wendu too low and cause the situation of starting up normally or running to occur.
Yet, computer equipment is applied in for wide temperature has the industry of demand and the operating temperature range of harsh environment between-40 ℃～+ 80 ℃, but because the electronic component on general circuit plate (active or passive device) normal operation temperature is about 0 ℃～+ 75 ℃, therefore in temperature, be in the cold outdoor environment below 0 ℃, if want, make computer equipment operate normally, just must make computer equipment inner sustain in certain temperature range, traditional practice is that insulation material is coated on to computer equipment inside, to prevent outside air cooler from entering, reach the effect of insulation, make electronic component on circuit board be difficult for Yin Wendu too low and cannot start or running by normal boot-strap, but along with computer equipment development trend all trends towards compact design, add and on computer equipment, there is a lot of joints and control button etc., cause insulation material to be difficult to computer equipment inside coated completely, whole holding temperature effect limited and not conforming in practicality.
And in order to solve the problem of above-mentioned insulation material, Bian You manufacturer is provided with a heater on the circuit board of computer equipment inside, existing heater includes a zone of heating, DC power supply and current regulator, wherein this zone of heating is arranged between a plurality of insulating barriers in circuit board, and on zone of heating, there is heater circuit, and this heater circuit is made by the electric conducting material with predetermined resistance, can provide current in the heater circuit of zone of heating by DC power supply, current regulator regulates the size of current of heater circuit, though it can produce heat by current flowing in the heater circuit of zone of heating, and by the metallic circuit layer on circuit board, heat is conducted to electronic component and be heated in normal operating temperature range, but volume that must matching computer equipment because of circuit board is dwindled, make the number of electronic components of unit are on circuit board become many and more intensive, cause the zone of heating of heater to be arranged between a plurality of insulating barriers and metallic circuit layer on circuit board, become very complex and degree of difficulty of whole fabrication schedule increases, thereby cause making circuit board fabrication cost effectively to reduce, do not meet considering in economic benefit yet.
In addition, Yi You manufacturer is provided with a heating module on circuit board, existing heating module is for including metal oxide semiconductcor field effect transistor, DC power supply, current sensor and on state resistance controller, wherein this metal oxide semiconductcor field effect transistor (MOSFET) is arranged on circuit board surface, and provide burning voltage to metal oxide semiconductcor field effect transistor by DC power supply, the current strength that can detect according to current sensor by state resistance controller is adjusted the on state resistance value of metal oxide semiconductcor field effect transistor, make metal oxide semiconductcor field effect transistor perseverance in conducting, continue to produce heat with the critical condition of not conducting, the dissipation of heat that just can utilize fin that metal oxide semiconductcor field effect transistor is produced is extremely outside, make the electronic component on circuit board maintain normal operation, but on this kind of circuit board surface, be provided with a plurality of metal oxide semiconductcor field effect transistors and will affect its integrated circuit layout, and because available space limited on circuit board is difficult for the configuration of appropriate arrangements overall space, make near the metal oxide semiconductcor field effect transistor heating effect of electronic component better, and it is bad away from the metal oxide semiconductcor field effect transistor heating effect of electronic component, separately because using metal oxide semiconductcor field effect transistor to coordinate on state resistance controller or required with high costs of other wide temperature element, holistic cost still cannot effectively be reduced, be and engage in the direction place that this journey dealer desires most ardently research improvement.
Therefore, the utility model creator is because the heater of available circuit plate or module problem and the disappearance on using, be to collect related data via in many ways assessing and considering, and utilize the research and development experience for many years of engaging in the industry constantly study and revise, begin to design this kind of electric heating piece and conduct in the novel birth of stacked structure of chip heating.
Summary of the invention
Main purpose of the present utility model is to be to provide a kind of electric heating piece to conduct in the stacked structure of chip heating, this circuit module has circuit board and chip unit, and on another side surface, support and paste the heat abstractor that is positioned with tool radiating seat with respect to circuit board in chip unit, and place, radiating seat bottom surface convexes with to the heat-conducting block being affixed on chip unit, and on radiating seat, be positioned at locate around heat-conducting block to be provided with to be affixed on heat-conducting layer on chip unit and heat-conducting layer with respect to chip unit the electric heating piece on another side surface, and to pasting, be positioned with heat insulating element between electric heating piece and radiating seat, when the chip unit temperature that detects circuit module is when lower than 0 ℃, just can to electric heating piece, power by a plurality of power leads, make the heat producing after electric heating piece energising conduct to uniformly on chip unit by heat-conducting layer, until reach permission operating temperature range (as 0 ℃～+ 75 ℃) just in can control electric heating piece auto-breaking, make computer equipment in low temperature or cold outdoor environment starting up or running normally, situation about producing in the time of also can avoiding operating when machine occurs.
Secondary objective of the present utility model is to be to provide a kind of electric heating piece to conduct in the stacked structure of chip heating, when electric heating piece produces heat, can form an isolation by heat insulating element and radiating seat, heat when effectively preventing that electric heating piece from heating is absorbed by radiating seat and arranges loose, and guarantee the heating effect of electric heating piece to chip unit integral body, and can effectively reduce its thermal resistance by heat-conducting layer, improve firing rate and thermal power, this kind of electric heating piece stacked structure design, can effectively solve uses thermal insulation material is difficult for problem coated and that holding temperature effect is limited, also can avoid deriving and having fabrication schedule complicated because the heater circuit of tool resistance value or wide temperature element are set on circuit board, affect circuit layout and disappearance with high costs, also the overall space of can making appropriate arrangements configuration, and then raising electric heating piece heat conducts the heating effect on chip unit.
In order to achieve the above object, the utility model provides a kind of electric heating piece to conduct in the stacked structure of chip heating, include circuit module, heat abstractor, heat-conducting layer, electric heating piece and heat insulating element, wherein this circuit module has the chip unit on a circuit board and circuit board, and support to paste the heat abstractor that is positioned with tool radiating seat in chip unit on respect to the another side surface of circuit board, and place, radiating seat bottom surface convexes with to the heat-conducting block being affixed on chip unit, and be positioned on radiating seat, locate to be provided with at least one around heat-conducting block and support the heat-conducting layer that is affixed on chip unit and heat-conducting layer with respect to the electric heating piece by heat-conducting layer, chip unit being heated on the another side surface of chip unit, and between electric heating piece and radiating seat, support to paste and be positioned with at least one heat insulating element.
Wherein, the chip unit of this circuit module includes a chip and can form thereon for chip set the support plate of electric connection, and place, the heat-conducting block bottom surface of heat abstractor radiating seat is formed with to the contact-making surface being affixed on chip, and is formed with and can supports the supporting surface that pastes location for heat insulating element adjacent to radiating seat place in heat-conducting block top.
Wherein, between the heat-conducting block of the chip of this circuit module chip unit and heat abstractor radiating seat, be further provided with a heat-conducting medium, and heat-conducting medium is the conducting strip attaching on chip surface or is coated with the heat-conducting cream forming.
Wherein, the chip unit of this circuit module is a central processing unit.
Wherein, this heat-conducting layer is positioned on the support plate of chip unit for supporting to paste.
Wherein, the chip unit of this circuit module has a chipset, and the heat-conducting block of heat abstractor radiating seat bottom is formed with to the contact-making surface being affixed on chipset, and is formed with to the supporting surface being affixed on heat insulating element adjacent to radiating seat place in heat-conducting block.
Wherein, between the heat-conducting block of the chipset of this circuit module chip unit and heat abstractor radiating seat, be further provided with heat-conducting medium, and heat-conducting medium is the conducting strip attaching on chipset surface or is coated with the heat-conducting cream forming.
Wherein, the chipset of this circuit module is the flash memory on platform controller, figure and memory controller hub, i/o controller maincenter or solid state hard disc internal circuit board.
Wherein, this heat-conducting layer supports to paste and is positioned on the chipset of chip unit.
Wherein, the radiating seat of this heat abstractor is provided with respect to the another side roof part surface of heat-conducting block the recess that can locate at least one heat pipe.
Wherein, this heat-conducting layer is that a silica gel, rubber or pottery are made.
Wherein, a plurality of power leads that include hot zone on this electric heating piece and can be connected for institute's tool power circuit on circuit module board or default power supply device.
Wherein, this heat insulating element centre is provided with and can be passed down through for the heat-conducting block of heat abstractor radiating seat and forms with the chip unit of circuit module the perforation of supporting subsides.
Wherein, this heat insulating element is that a rubber, silica gel, polyester film, foam, mica sheet or alumina ceramic plate are made.
The utility model can improve electric heating piece heat and conduct the heating effect on chip unit.
Accompanying drawing explanation
Fig. 1 is stereo appearance figure of the present utility model.
Fig. 2 is three-dimensional exploded view of the present utility model.
Fig. 3 is the three-dimensional exploded view at another visual angle of the utility model.
Fig. 4 is front sectional elevation of the present utility model.
Use state diagram when Fig. 5 is the utility model heating.
Use state diagram when Fig. 6 is the utility model running.
Fig. 7 is the front sectional elevation of another preferred embodiment of the utility model.
Use state diagram when Fig. 8 is another preferred embodiment heating of the utility model.
Description of reference numerals: 1-circuit module; 11-circuit board; 12-chip unit; 121-chip; 122-support plate; 123-chipset; 13-heat-conducting medium; 2-heat abstractor; 21-radiating seat; 211-heat-conducting block; 212-contact-making surface; 213-supporting surface; 214-recess; 22-heat pipe; 3-heat-conducting layer; 31-through hole; 4-electric heating piece; 40-hot zone; 41-power lead; 42-open-work; 5-heat insulating element; 51-perforation.
Embodiment
For reaching above-mentioned purpose and effect, the technological means that the utility model adopts and structure thereof, hereby draw and illustrate with regard to preferred embodiment of the present utility model that in detail its structure is as follows with function, to understand completely.
Refer to shown in Fig. 1 to 4, be respectively stereo appearance figure of the present utility model, three-dimensional exploded view, the three-dimensional exploded view at another visual angle and front sectional elevation, in figure, can know and find out, the utility model includes circuit module 1, heat abstractor 2, heat-conducting layer 3, electric heating piece 4 and heat insulating element 5, wherein this circuit module 1 has the chip unit 12 on a circuit board 11 and circuit board 11, and support to paste the heat abstractor 2 that is positioned with tool radiating seat 21 in chip unit 12 on respect to the another side surface of circuit board 11, and radiating seat 21 places, bottom surface convex with to the heat-conducting block 211 being affixed on chip unit 12, and be positioned at heat-conducting block 211 on radiating seat 21, locate to be provided with at least one around and support the heat-conducting layer 3 that is affixed on chip unit 12 and heat-conducting layer 3 with respect to the electric heating piece 4 by heat-conducting layer 3, chip unit 12 being heated on the another side surface of chip unit 12, and between electric heating piece 4 and radiating seat 21, be positioned with at least one heat insulating element 5.
Moreover, the better enforcement of chip unit 12 of circuit module 1 can be central processing unit (CPU), and include chip 121(Die) and support plate 122, chip 121 can be bonded on lead frame (not shown) or support plate 122 and form and be electrically connected, after encapsulating encapsulation, become one again, and the radiating seat 21 of heat abstractor 2 is a plate body shape, and be formed with to the smooth shape contact-making surface 212 being affixed on chip 121 in heat-conducting block 211 places, bottom surface, and heat-conducting block 212 is formed with to the smooth shape supporting surface 213 being affixed on heat insulating element 5 adjacent to radiating seat 21 places; Separately, it can be only a kind of state of preferably implementing in conjunction with the recess 214 of locating at least one heat pipe 22 that the radiating seat 21 of heat abstractor 2 is provided with respect to heat-conducting block 211 another side roof part surfaces, also can be on demand or the difference of structural design omit heat pipe 22 designs, and at radiating seat 21 tops, be provided with a plurality of fin (not shown)s of vertical, also can above a plurality of fin, locate, for further combined with there being a fan (not shown), in order to the chip unit 12 to circuit module 1, to assist and dispel the heat.
Yet, the chip 121 of chip unit 12 and 211 of the heat-conducting blocks of radiating seat 21 are further provided with heat-conducting medium 13, and this heat-conducting medium 13 can be the conducting strip attaching on chip 121 surfaces or is coated with the heat-conducting cream forming, in order to fill up formed predetermined gap between chip 121 and heat-conducting block 211, out-of-flatness surface or tiny flaw, and heat-conducting layer 3 can be a silica gel (Silicone), rubber, the conducting strip (Thermal pad) of pottery or other heat conduction function is made, better being embodied as to pasting of its heat-conducting layer 3 is positioned on the support plate 122 of chip unit 12, and heat-conducting layer 3 centre are provided with the through hole 31 corresponding to chip 121 places of chip unit 12, again, electric heating piece 4 is a soft thin electric heating sheet 4, on this electric heating piece 4, include hot zone 40 and can be for a plurality of power leads 41 that there is power circuit or default power supply device on circuit module 1 circuit board 11 and be connected, and 40 centre are provided with the open-work 42 corresponding to chip 121 places of chip unit 12 in hot zone, but the specification of these electric heating piece 4 Ge Jia manufacturers is mostly not identical, and because of kind and the pattern of electric heating piece 4 a lot, also can produce predetermined area according to actual demand or application, the electric heating piece 4 of various shapes and size, but how the relevant electric heating piece 4 of this part produces 40Ji hot zone, hot zone 40 is the category of prior art by the rear mode that produces heat of a plurality of power lead 41 energising, and the formation of this thin portion is not the main points of founding of this case, hereby not remaking one repeats.
In addition, it is made that the better enforcement of heat insulating element 5 can be rubber (Rubber) material, but when practical application, also can be a silica gel (Silicone), polyester film (PET, be commonly called as the sheet for Mylar), foam, glass fibre, the plastic cement materials such as carbon fiber, or mica sheet, alumina ceramic plate or other material are made, and there is high temperature resistant and good electrical insulating property, and heat insulating element 5 centre are provided with the perforation 51 that can be passed down through for the heat-conducting block 211 of radiating seat 21, can make the heat-conducting block 211 of radiating seat 21 and the chip of chip unit 12 121 form good Elastic Contact by heat insulating element 5, also can utilize heat insulating element 5 to make the hot zone 40 of electric heating piece 4 and the supporting surface of radiating seat 21 213 form isolation, effectively to prevent that 40 heats that produce conduct to and affect its heating effect to chip unit 12 integral body on radiating seat 21 in hot zone because of electric heating piece 4.
Please arrange in pairs or groups and consult Fig. 5, shown in 6, use state diagram when the use state diagram while being respectively the utility model heating and running, in figure, can know and find out, when the circuit for detecting of the circuit board 11 of circuit module 1 or default board (not shown) institute tool or temperature-sensitive sticker detect chip unit 12 temperature lower than 0 ℃, just can control its power circuit or default power supply device powers to electric heating piece 4 by a plurality of power leads 41, and the heat that the electric heating piece 4 rear hot zones 40 of energising are produced can conduct on the support plate 122 of chip unit 12 uniformly by heat-conducting layer 3, just can carry out heating chip 121 by support plate 122, until chip 121 reaches the interior normal operation of the operating temperature range (as 0 ℃～+ 75 ℃) of permission, and this circuit for detecting or temperature-sensitive sticker detect chip 121 temperature and reach 0 ℃ when above, just can control electric heating piece 4 auto-breakings, make computer equipment (as computer, notebook computer etc.) in low temperature or cold outdoor environment starting up or running normally, also the situation that can avoid computer equipment to produce because temperature is too low when machine when running occurs.
When the hot zone 40 of electric heating piece 4 produces heat, can form an isolation by heat insulating element 5 and the supporting surface 21 of radiating seat 21, in order to effectively to prevent that the heat that hot zone 40 produces while heating from being absorbed by radiating seat 21 and arranging loose, guarantee the heating effect of electric heating piece 4 integral body, and the speed that electric heating piece 4 heats by 3 pairs of chip units 12 of heat-conducting layer is the coefficient of heat conduction and the thickness that depends on heat-conducting layer 3, can effectively reduce its thermal resistance by adaptive heat-conducting layer 3, improve firing rate and the thermal power of chip 121, this kind of electric heating piece 4 stacked structure designs, can effectively solve uses thermal insulation material is difficult for problem coated and that holding temperature effect is limited, also can avoid thering is the heater circuit of resistance value or wide temperature element and deriving and have fabrication schedule complexity because arranging on circuit board, affect circuit layout and disappearance with high costs, also the overall space of can making appropriate arrangements configuration, and then raising electric heating piece 4 heats conduct the heating effect on chip unit 12.
When the chip unit 12 of the utility model circuit module 1 is during in running, the heat that can utilize radiating seat 21 that heat abstractor 2 is made by aluminium or copper material to come absorbent core blade unit 12 to produce by heat-conducting medium 13, can effectively reduce thermal resistance by heat-conducting medium 13, and make heat via heat-conducting medium 13, after heat-conducting block 211 conducts in the heat absorbing end of heat pipe 22, just can conduct to fast on another heat abstractor of release end of heat and increase whole area of dissipation by the heat pipe 22 internal work fluid convection circulations amount of heat of carrying under one's arms, the heat that the chip unit 12 of auxiliary circuit module 1 is hoarded when running is taken out of fast arrange to outside and is fallen apart, and improve integral heat sink efficiency and there is good cooling and radiating effect.
Yet, above-mentioned heat-conducting layer 3, electric heating piece 4 and heat insulating element 5 can coordinate the chip 121 of chip unit 12, the heat-conducting block 211 of radiating seat 21 and omit through hole 31, open- work 42,51 the structural design of boring a hole, also can form a stacked structure according to actual demand or application change magnitude setting, predetermined area, various shape and set of dimensions structure, such as use simple and easy modification and the equivalent structure that the utility model specification and graphic content are done to change, all should in like manner be contained in the scope of the claims of the present utility model, close and give Chen Ming.
Please continue to refer to Fig. 7, shown in 8, use state diagram while being respectively the front sectional elevation of another preferred embodiment of the utility model and another preferred embodiment heating, in figure, can know and find out, wherein the chip unit 12 of this circuit module 1 is a central processing unit, and include chip 121(Die) and support plate 122, just heat-conducting layer 3 can be supported and paste that to be positioned on the chip 121 of chip unit 12 or support plate 122 be only a kind of state of preferably implementing, and also can there is chipset 123(Chipset on chip unit 12), and this chipset 123 can be platform controller (PCH), figure and memory controller hub (GMCH), i/o controller maincenter (ICH), flash memory (NAND Flash) or other chipset 123 on solid state hard disc (SSD) internal circuit board 11, just the contact-making surface 212 at radiating seat 21 heat-conducting block 211 places, bottom surface and heat-conducting layer 3 can be positioned on chipset 123 for directly supporting to paste, this kind omits the structural design of support plate 122, the heat producing after electric heating piece 4 energisings can be directly conducted on chipset 123 by heat-conducting layer 3, can change according to chip unit 12 kinds the space configuration of integral stacked structure from the different of pattern, to improve electric heating piece 4 heats, conduct firing rate and the thermal power in chipset 123.
Above-mentioned detailed description is for a kind of preferably possible embodiments explanation of the utility model, but this embodiment is not in order to limit claim of the present utility model, all other do not depart from the equalization completing under the skill spirit that the utility model discloses to be changed and modifies change, all should be contained in the scope of the claims that the utility model contains.
In sum, the above-mentioned electric heating piece of the utility model conducts stacked structure in chip heating for really reaching its effect and object, therefore the utility model is really the creation of a practicality excellence, meets the application important document of utility model patent, files an application in accordance with the law.
Claims (14)
1. an electric heating piece conducts in the stacked structure of chip heating, it is characterized in that, include circuit module, heat abstractor, heat-conducting layer, electric heating piece and heat insulating element, wherein this circuit module has the chip unit on a circuit board and circuit board, and support to paste the heat abstractor that is positioned with tool radiating seat in chip unit on respect to the another side surface of circuit board, and place, radiating seat bottom surface convexes with to the heat-conducting block being affixed on chip unit, and be positioned on radiating seat, locate to be provided with at least one around heat-conducting block and support the heat-conducting layer that is affixed on chip unit and heat-conducting layer with respect to the electric heating piece by heat-conducting layer, chip unit being heated on the another side surface of chip unit, and between electric heating piece and radiating seat, support to paste and be positioned with at least one heat insulating element.
2. electric heating piece according to claim 1 conducts in the stacked structure of chip heating, it is characterized in that, the chip unit of this circuit module includes a chip and can form thereon for chip set the support plate of electric connection, and place, the heat-conducting block bottom surface of heat abstractor radiating seat is formed with to the contact-making surface being affixed on chip, and is formed with and can supports the supporting surface that pastes location for heat insulating element adjacent to radiating seat place in heat-conducting block top.
3. electric heating piece according to claim 2 conducts in the stacked structure of chip heating, it is characterized in that, between the heat-conducting block of the chip of this circuit module chip unit and heat abstractor radiating seat, be further provided with a heat-conducting medium, and heat-conducting medium is the conducting strip attaching on chip surface or is coated with the heat-conducting cream forming.
4. electric heating piece according to claim 2 conducts in the stacked structure of chip heating, it is characterized in that, the chip unit of this circuit module is a central processing unit.
5. electric heating piece according to claim 2 conducts in the stacked structure of chip heating, it is characterized in that, this heat-conducting layer is positioned on the support plate of chip unit for supporting to paste.
6. electric heating piece according to claim 1 conducts in the stacked structure of chip heating, it is characterized in that, the chip unit of this circuit module has a chipset, and the heat-conducting block of heat abstractor radiating seat bottom is formed with to the contact-making surface being affixed on chipset, and be formed with to the supporting surface being affixed on heat insulating element adjacent to radiating seat place in heat-conducting block.
7. electric heating piece according to claim 6 conducts in the stacked structure of chip heating, it is characterized in that, between the heat-conducting block of the chipset of this circuit module chip unit and heat abstractor radiating seat, be further provided with heat-conducting medium, and heat-conducting medium is the conducting strip attaching on chipset surface or is coated with the heat-conducting cream forming.
8. electric heating piece according to claim 6 conducts in the stacked structure of chip heating, it is characterized in that, the chipset of this circuit module is the flash memory on platform controller, figure and memory controller hub, i/o controller maincenter or solid state hard disc internal circuit board.
9. electric heating piece according to claim 6 conducts in the stacked structure of chip heating, it is characterized in that, this heat-conducting layer supports to paste and is positioned on the chipset of chip unit.
10. electric heating piece according to claim 1 conducts in the stacked structure of chip heating, it is characterized in that, the radiating seat of this heat abstractor is provided with respect to the another side roof part surface of heat-conducting block the recess that can locate at least one heat pipe.
11. electric heating pieces according to claim 1 conduct in the stacked structure of chip heating, it is characterized in that, this heat-conducting layer is that a silica gel, rubber or pottery are made.
12. electric heating pieces according to claim 1 conduct in the stacked structure of chip heating, it is characterized in that a plurality of power leads that include hot zone on this electric heating piece and can be connected for institute's tool power circuit on circuit module board or default power supply device.
13. electric heating pieces according to claim 1 conduct in the stacked structure of chip heating, it is characterized in that, this heat insulating element centre is provided with and can be passed down through for the heat-conducting block of heat abstractor radiating seat and forms with the chip unit of circuit module the perforation of supporting subsides.
14. electric heating pieces according to claim 1 conduct in the stacked structure of chip heating, it is characterized in that, this heat insulating element is that a rubber, silica gel, polyester film, foam, mica sheet or alumina ceramic plate are made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320503148.8U CN203466179U (en) | 2013-08-16 | 2013-08-16 | Stack structure for chip heating through electric heating sheet conduction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320503148.8U CN203466179U (en) | 2013-08-16 | 2013-08-16 | Stack structure for chip heating through electric heating sheet conduction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203466179U true CN203466179U (en) | 2014-03-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320503148.8U Expired - Lifetime CN203466179U (en) | 2013-08-16 | 2013-08-16 | Stack structure for chip heating through electric heating sheet conduction |
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| Country | Link |
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| CN (1) | CN203466179U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105913867A (en) * | 2016-03-31 | 2016-08-31 | 联想(北京)有限公司 | Adjustment device and electronic equipment |
| CN109360814A (en) * | 2018-09-29 | 2019-02-19 | 上海华虹宏力半导体制造有限公司 | The encapsulating structure and its manufacturing method of IC chip |
| TWI718449B (en) * | 2018-12-07 | 2021-02-11 | 廖文池 | Stackable heat pipe assembly and method of making the same |
| CN112397107A (en) * | 2019-08-16 | 2021-02-23 | 神讯电脑(昆山)有限公司 | Heating and radiating structure of storage device |
-
2013
- 2013-08-16 CN CN201320503148.8U patent/CN203466179U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105913867A (en) * | 2016-03-31 | 2016-08-31 | 联想(北京)有限公司 | Adjustment device and electronic equipment |
| CN105913867B (en) * | 2016-03-31 | 2019-06-25 | 联想(北京)有限公司 | A kind of adjustment device and electronic equipment |
| CN109360814A (en) * | 2018-09-29 | 2019-02-19 | 上海华虹宏力半导体制造有限公司 | The encapsulating structure and its manufacturing method of IC chip |
| TWI718449B (en) * | 2018-12-07 | 2021-02-11 | 廖文池 | Stackable heat pipe assembly and method of making the same |
| CN112397107A (en) * | 2019-08-16 | 2021-02-23 | 神讯电脑(昆山)有限公司 | Heating and radiating structure of storage device |
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