CN203720516U - Heating and heat radiation device of camera - Google Patents

Heating and heat radiation device of camera Download PDF

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Publication number
CN203720516U
CN203720516U CN201420050881.3U CN201420050881U CN203720516U CN 203720516 U CN203720516 U CN 203720516U CN 201420050881 U CN201420050881 U CN 201420050881U CN 203720516 U CN203720516 U CN 203720516U
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CN
China
Prior art keywords
heating
heat
camera
conductive pad
heat conduction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201420050881.3U
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Chinese (zh)
Inventor
杜王芳
王汉荣
陈新友
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Tongbao Intelligent Transportation Technology Co ltd
Hangzhou Hikvision Digital Technology Co Ltd
Original Assignee
Hangzhou Hikvision Digital Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to CN201420050881.3U priority Critical patent/CN203720516U/en
Application granted granted Critical
Publication of CN203720516U publication Critical patent/CN203720516U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Studio Devices (AREA)

Abstract

The utility model provides a heating and heat radiation device of a camera. The heating and heat radiation device of the camera comprises a shell, a heating and heat radiation part, an installation support, a camera chip and a PCB, the shell comprises a front shell and a rear shell mutually connected, the heating and heat radiation part and the shell are made of heat conduction materials, the installation support is fixed to the front shell, the camera chip is arranged on the PCB, the PCB is fixed on the installation support, the heating and heat radiation part comprises a heat conduction support, a heater, first heat conduction pads and a second heat conduction pad, the heat conduction support is fixed to the installation support, the heater, the first heat conduction pads and the second heat conduction pad are tightly attached to the heat conduction support, the first heat conduction pads are tightly attached to the camera chip, and the second heat conduction pad is tightly attached to the rear shell. According to the heating and heat radiation device of the camera, functions of heating and heat radiation for the camera chip can be realized, the resistance power of the heater is small so that a plurality of chips can be simultaneously heated, the integral power of the camera is effectively controlled, and the heater and the camera chip are not directly contacted so that the problem that the service lifetime of the chip is reduced due to the over-large temperature rise of the surface of the chip during the operation for the heating of the resistor can be avoided.

Description

The heating of video camera and heat abstractor
Technical field
The utility model relates to a kind of heating and heat abstractor of video camera.
Background technology
At some cold districts, because some key chips of video camera cannot normally start under low temperature environment, video camera cannot normally start and work outdoor, to the heat treated of these chips, is therefore key issues.Equally, in some high temperature areas, during these key chip work, all can produce larger heat, make video camera interior environment temperature too high, thereby affect the normal work of video camera, and cause the life-span of video camera to decline.
Existing heating technique, general whole heating and the local type of heating of adopting.Whole type of heating heating resistor power is large, and effect is general because cavity space is large; Spot heating mode is used heating resistor to be close to chip transferring heat by heat conductive pad, can make rapidly chip surface temperature increase, but cannot take into account the heating of other chips, and chip is close to and can be caused chip surface excess Temperature and life-span reduction with heating resistor.
Existing heat dissipation technology, generally adopts shell to be close to chip, makes the heat of chip pass to shell, then by shell by heat loss through radiation in external environment condition, yet, when dispelling the heat, do not take into account heating.
Utility model content
The purpose of this utility model is to provide a kind of heating and heat abstractor of video camera, and the low temperature environment that can solve camera chip needs heating, needs the problem of heat radiation under hot environment.
For addressing the above problem, the utility model provides a kind of heating and heat abstractor of video camera, comprising:
Housing, comprises interconnected fore shell and back cover;
Be arranged at the mounting bracket in described housing, camera chip, PCB and heating and thermal component, wherein, described heating and thermal component and housing are made by heat-conducting, described mounting bracket is fixed on described fore shell, described camera chip is arranged on PCB, described PCB is fixed on described mounting bracket, described heating and thermal component comprise heat conduction support, well heater, the first heat conductive pad and the second heat conductive pad, described heat conduction support is fixed on described mounting bracket, described well heater, the first heat conductive pad and the second heat conductive pad and described heat conduction support fit tightly, described the first heat conductive pad and described camera chip fit tightly, described the second heat conductive pad and described back cover fit tightly.
Further, in said apparatus, described camera chip is infrared ball type camera chip.
Further, in said apparatus, on the inwall of described fore shell and back cover, be respectively arranged with fin lamellar projection.
Further, in said apparatus, described back cover be shaped as semisphere.
Further, in said apparatus, comprise an electric supply installation being connected with described PCB.
Further, in said apparatus, described the first heat conductive pad is arranged at a side of described heat conduction support, and described the second heat conductive pad and well heater are arranged at the opposite side of described heat conduction support.
Further, in said apparatus, the quantity of described the first heat conductive pad is one or more.
Further, in said apparatus, the quantity of described camera chip is one or more.
Compared with prior art, the utility model is by the heating and the thermal component that fit tightly with camera chip; The housing that holds described camera chip and heating and thermal component, wherein, described heating and thermal component and housing are made by heat-conducting, described heating and thermal component and described housing fit tightly, the function that realization can be heated and can dispel the heat camera chip, under low temperature environment, camera chip is heated, make equipment can normally start work; And under hot environment, can reduce camera chip and inner temperature, thus the normal work of service equipment effectively, the life-span of extension device, solve camera chip low temperature environment and needed heating, under hot environment, need the problem of heat radiation.
In addition, by being fixed on the heat conduction support on described mounting bracket; The well heater, the first heat conductive pad and the second heat conductive pad that fit tightly with described heat conduction support, wherein, the first heat conductive pad and described camera chip fit tightly, described the second heat conductive pad and described back cover fit tightly, because the resistor power of well heater is little, can heat a plurality of chips simultaneously, effectively controlled the overall power of video camera, and well heater does not directly contact with camera chip, can avoid chip and reduce the life-span because heating resistor when work surface temperature rise is excessive, extend the serviceable life of video camera.
Accompanying drawing explanation
Fig. 1 is the heating of video camera and the assembling schematic diagram of heat abstractor of the utility model one embodiment;
Fig. 2 is the heating of video camera and the cut-open view of heat abstractor of the utility model one embodiment;
Fig. 3 is heating in Fig. 1 and Fig. 2 and the structural drawing of thermal component.
Embodiment
For above-mentioned purpose of the present utility model, feature and advantage can be become apparent more, below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
As shown in Fig. 1~2, the utility model provides a kind of heating and heat abstractor of video camera, comprising:
Housing, comprises interconnected fore shell 6 and back cover 5;
Be arranged at the mounting bracket 4 in described housing, camera chip 1, PCB(Printed Circuit Board, printed circuit board (PCB)) 2 and heating and thermal component 3, wherein, described heating and thermal component 3 and housing are made by heat-conducting, described mounting bracket 4 is fixed on described fore shell 6, described camera chip 1 is arranged on PCB2, described PCB2 is fixed on described mounting bracket 4, described heating and thermal component 3 comprise heat conduction support 31, well heater 32, the first heat conductive pad 33, the 34 and second heat conductive pad 35, described heat conduction support 31 is fixed on described mounting bracket 4, described well heater 32, the first heat conductive pad 33, the 34 and second heat conductive pad 35 fits tightly with described heat conduction support 31, described the first heat conductive pad 33, 34 fit tightly with described camera chip 1, described the second heat conductive pad 35 fits tightly with described back cover 5.
Preferably, described camera chip 1 is infrared ball type camera chip.
Preferably, as shown in Figure 1, on the inwall of described fore shell 6 and back cover 5, be respectively arranged with fin lamellar projection 7, to increase heat conduction contact area.
Preferably, as shown in Figure 1, described back cover 5 be shaped as semisphere, to increase heat conduction contact area.
Preferably, the heating of described video camera and heat abstractor 3 also comprise an electric supply installation being connected with described PCB2.
Preferably, described the first heat conductive pad 33,34 is arranged at a side of described heat conduction support 31, and described the second heat conductive pad 35 and well heater 32 are arranged at the opposite side of described heat conduction support.
Preferably, the quantity of described the first heat conductive pad 33,34 is one or more.Concrete, the quantity of the first heat conductive pad can be set to one or more according to the quantity of camera chip 3, size and position.
Preferably, the quantity of described camera chip 1 is one or more.
Detailed, as shown in Figure 3, heating and thermal component 3 have comprised heat conduction support 31, well heater 32, the first heat conductive pad 33, the first heat conductive pad 33,34 and the second heat conductive pad 35.Heat conduction support 31 fits tightly with well heater 32, and well heater 32 is fixed on heat conduction support 31, and the first heat conductive pad 33, the first heat conductive pad 33,34 and the second heat conductive pad 35 fit tightly with heat conduction support 31.Heat conduction support 31, the first heat conductive pad 33,34, the second heat conductive pad 35 all adopt the material that heat conductivility is good to make with back cover 5.The resistor power of well heater 32 is little; can heat a plurality of camera chip 1 simultaneously; can effectively control the overall power of video camera; and well heater 32 does not directly contact with chip; can avoid chip and reduce the life-span because heating resistor when work surface temperature rise is excessive, thereby effectively protect the ordinary life of equipment.
When video camera is under low temperature environment, well heater 32 work produce heat, sub-fraction heat is delivered on back cover 5 by heat conductive pad 35, back cover 5 rejects heat in external environment condition by heat radiation mode, all the other most of heats can be passed in camera chip 1 by heat conduction support 31 and the first heat conductive pad 33,34 simultaneously, camera chip 1 surface temperature reaches after requirement, and the function that makes to make a video recording normally starts; On the other hand, can effectively protect these video cameras not heated and affect serviceable life;
When video camera is normally worked, well heater 32 quits work, the heat that camera chip 1 produces is passed to back cover 5 by heat conduction support 31 and heat conductive pad 35, back cover 5 can be designed to larger area of dissipation, can promptly will by heat radiation mode, reject heat to external environment condition from the heat of well heater 32 and radiating module 3 absorptions.Can effectively reduce the temperature of camera chip 1 and video camera inside, the normal work of service equipment, the serviceable life of extension device.
In sum, the utility model provides a kind of heating and heat abstractor of the video camera that can heat, can dispel the heat again, has solved camera chip low temperature environment and has needed heating, needs the problem of heat radiation under hot environment, and effectively safeguard the normal work of video camera, extend the serviceable life of video camera.
Obviously, those skilled in the art can carry out various changes and modification and not depart from spirit and scope of the present utility model utility model.Like this, if within of the present utility model these are revised and modification belongs to the scope of the utility model claim and equivalent technologies thereof, the utility model is also intended to comprise these change and modification.

Claims (8)

1. the heating of video camera and a heat abstractor, is characterized in that, comprising:
Housing, comprises interconnected fore shell and back cover;
Be arranged at the mounting bracket in described housing, camera chip, PCB and heating and thermal component, wherein, described heating and thermal component and housing are made by heat-conducting, described mounting bracket is fixed on described fore shell, described camera chip is arranged on PCB, described PCB is fixed on described mounting bracket, described heating and thermal component comprise heat conduction support, well heater, the first heat conductive pad and the second heat conductive pad, described heat conduction support is fixed on described mounting bracket, described well heater, the first heat conductive pad and the second heat conductive pad and described heat conduction support fit tightly, described the first heat conductive pad and described camera chip fit tightly, described the second heat conductive pad and described back cover fit tightly.
2. the heating of video camera as claimed in claim 1 and heat abstractor, is characterized in that, described camera chip is infrared ball type camera chip.
3. the heating of video camera as claimed in claim 1 and heat abstractor, is characterized in that, is respectively arranged with fin lamellar projection on the inwall of described fore shell and back cover.
4. the heating of video camera as claimed in claim 1 and heat abstractor, is characterized in that, described back cover be shaped as semisphere.
5. the heating of video camera as claimed in claim 1 and heat abstractor, is characterized in that, also comprises an electric supply installation being connected with described PCB.
6. the heating of video camera as claimed in claim 1 and heat abstractor, is characterized in that, described the first heat conductive pad is arranged at a side of described heat conduction support, and described the second heat conductive pad and well heater are arranged at the opposite side of described heat conduction support.
7. the heating of video camera as claimed in claim 1 and heat abstractor, is characterized in that, the quantity of described the first heat conductive pad is one or more.
8. the heating of video camera as claimed in claim 1 and heat abstractor, is characterized in that, the quantity of described camera chip is one or more.
CN201420050881.3U 2014-01-26 2014-01-26 Heating and heat radiation device of camera Expired - Lifetime CN203720516U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420050881.3U CN203720516U (en) 2014-01-26 2014-01-26 Heating and heat radiation device of camera

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420050881.3U CN203720516U (en) 2014-01-26 2014-01-26 Heating and heat radiation device of camera

Publications (1)

Publication Number Publication Date
CN203720516U true CN203720516U (en) 2014-07-16

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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106698038A (en) * 2016-12-09 2017-05-24 浙江三维橡胶制品股份有限公司 Traction machine provided with safety protection fences and used for production of rubber conveying belt
CN106851073A (en) * 2017-03-29 2017-06-13 浙江大华技术股份有限公司 A kind of thermal imaging camera
CN107703702A (en) * 2017-11-20 2018-02-16 广东弘景光电科技股份有限公司 Take the camera module of white defrosting function
CN108600587A (en) * 2018-04-27 2018-09-28 重庆恩光科技有限公司 High-speed dome camera
CN108810361A (en) * 2018-04-27 2018-11-13 重庆恩光科技有限公司 Outdoor monitoring apparatus
CN108810360A (en) * 2018-04-27 2018-11-13 重庆恩光科技有限公司 Spherical camera with water proof and dust proof anti-fog function
CN109445236A (en) * 2018-12-12 2019-03-08 广东弘景光电科技股份有限公司 Camera module with heating function
CN110178361A (en) * 2017-03-20 2019-08-27 罗森伯格高频技术有限及两合公司 Housing parts for camera case
CN110891401A (en) * 2018-09-10 2020-03-17 杜尔克普-阿德勒股份公司 Cooling device for at least one component on a printed circuit board and printed circuit board
CN111752077A (en) * 2019-03-29 2020-10-09 日本电产三协株式会社 Optical unit
CN113067990A (en) * 2019-12-16 2021-07-02 杭州海康微影传感科技有限公司 Handheld thermal imaging shell and thermal imaging equipment
CN115420307A (en) * 2022-11-04 2022-12-02 四川凌翔科技发展有限公司 Real-time self-calibration self-diagnosis low-temperature drift data acquisition system

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106698038A (en) * 2016-12-09 2017-05-24 浙江三维橡胶制品股份有限公司 Traction machine provided with safety protection fences and used for production of rubber conveying belt
CN110178361B (en) * 2017-03-20 2021-07-06 罗森伯格高频技术有限及两合公司 Housing part for a camera housing
CN110178361A (en) * 2017-03-20 2019-08-27 罗森伯格高频技术有限及两合公司 Housing parts for camera case
CN106851073A (en) * 2017-03-29 2017-06-13 浙江大华技术股份有限公司 A kind of thermal imaging camera
CN106851073B (en) * 2017-03-29 2023-01-06 浙江大华技术股份有限公司 Thermal imaging camera
CN107703702A (en) * 2017-11-20 2018-02-16 广东弘景光电科技股份有限公司 Take the camera module of white defrosting function
CN108600587A (en) * 2018-04-27 2018-09-28 重庆恩光科技有限公司 High-speed dome camera
CN108810361A (en) * 2018-04-27 2018-11-13 重庆恩光科技有限公司 Outdoor monitoring apparatus
CN108810360A (en) * 2018-04-27 2018-11-13 重庆恩光科技有限公司 Spherical camera with water proof and dust proof anti-fog function
CN110891401A (en) * 2018-09-10 2020-03-17 杜尔克普-阿德勒股份公司 Cooling device for at least one component on a printed circuit board and printed circuit board
CN109445236A (en) * 2018-12-12 2019-03-08 广东弘景光电科技股份有限公司 Camera module with heating function
CN111752077A (en) * 2019-03-29 2020-10-09 日本电产三协株式会社 Optical unit
US11119391B2 (en) 2019-03-29 2021-09-14 Nidec Sankyo Corporation Optical unit
CN111752077B (en) * 2019-03-29 2022-05-13 日本电产三协株式会社 Optical unit
CN113067990A (en) * 2019-12-16 2021-07-02 杭州海康微影传感科技有限公司 Handheld thermal imaging shell and thermal imaging equipment
CN115420307A (en) * 2022-11-04 2022-12-02 四川凌翔科技发展有限公司 Real-time self-calibration self-diagnosis low-temperature drift data acquisition system
CN115420307B (en) * 2022-11-04 2023-02-07 四川凌翔科技发展有限公司 Real-time self-calibration self-diagnosis low-temperature drift data acquisition system

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20230726

Address after: No.555, Qianmo Road, Binjiang District, Hangzhou City, Zhejiang Province

Patentee after: Hangzhou Hikvision Digital Technology Co.,Ltd.

Patentee after: Jiangsu Tongbao Intelligent Transportation Technology Co.,Ltd.

Address before: Building 1, Haikang Science Park, 700 Dongliu Road, Binjiang District, Hangzhou, Zhejiang 310052

Patentee before: Hangzhou Hikvision Digital Technology Co.,Ltd.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20140716