CN209517311U - Camera radiator structure suitable for hot environment - Google Patents
Camera radiator structure suitable for hot environment Download PDFInfo
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- CN209517311U CN209517311U CN201920424553.8U CN201920424553U CN209517311U CN 209517311 U CN209517311 U CN 209517311U CN 201920424553 U CN201920424553 U CN 201920424553U CN 209517311 U CN209517311 U CN 209517311U
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- radiator
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Abstract
The utility model discloses a kind of camera radiator structures suitable for hot environment, including external cooling body and internal heat dissipating body, internal heat dissipating body includes the heat dissipation for circuit board device for being located at camera circuit plate module lower surface and the mainboard heat ink for being located at camera mainboard lower surface；Camera mainboard is located at below camera circuit plate module, and mainboard heat ink is connect with heat dissipation for circuit board device by conducting-heat elements, external cooling body is the external shell radiator for encasing internal heat dissipating body, and semiconductor chilling plate is equipped between the lower surface of mainboard heat ink and the external shell heat sink inner surface of its direction, the cold end of semiconductor chilling plate is bonded with the lower surface of mainboard heat ink, and the hot end of semiconductor chilling plate is bonded with the inner surface of external shell radiator.The utility model can be by the heat collection inside camera and conduction is to outside, guarantees that internal temperature is consistently lower than external temperature, internal electric elements is avoided to reduce the service life since environment temperature is excessively high.
Description
Technical field
The utility model relates to a kind of radiator structure, specifically a kind of camera radiator structure suitable for hot environment,
Belong to vehicle-mounted camera field.
Background technique
The effect of vehicle-mounted camera mainly shoots the scene of vehicle periphery, thus needs when using on general vehicle
Has certain environmental suitability.Especially on job that requires special skills vehicle or engineering machinery vehicle, it is desirable that camera is resistant to height
Up to 70 DEG C of environment temperature, however current vehicle-mounted camera heat dissipation performance is very poor, internal camera mainboard and circuit board etc.
Electric elements often lead to the reduction of service life since environment temperature is excessively high, and serious meeting is due directly to high temperature is damaged.
Summary of the invention
In view of the above-mentioned problems of the prior art, the purpose of the utility model is to provide a kind of suitable for hot environment
Camera radiator structure can completely cut off the heat of external environment, can be to avoid the electric elements inside camera due to environment temperature
Height is spent to reduce the service life or damage.
A kind of in order to achieve the above purposes, the technical solution adopted by the utility model is: camera suitable for hot environment
Radiator structure, including external cooling body and internal heat dissipating body, the internal heat dissipating body include being located under camera circuit plate module
The heat dissipation for circuit board device on surface and the mainboard heat ink for being located at camera mainboard lower surface, camera mainboard are located at camera circuit
Below plate module；The mainboard heat ink is connect with heat dissipation for circuit board device by conducting-heat elements, and the external cooling body is to encase
The external shell radiator of internal heat dissipating body, and the external shell heat sink inner surface of the lower surface of mainboard heat ink and its direction
Between be equipped with semiconductor chilling plate, the cold end of the semiconductor chilling plate is bonded with the lower surface of mainboard heat ink, semiconductor system
Cold hot end is bonded with the inner surface of external shell radiator.
Preferably, above-mentioned mainboard heat ink and heat dissipation for circuit board device are heat-conducting plate made of aluminium alloy or magnesium alloy.Aluminium closes
Gold or magnesium alloy thermal coefficient with higher, manufactured heat-conducting plate can transmit camera circuit plate module and camera mainboard
The heat come is quickly collected and is exported outward.
Preferably, the external shell radiator is radiation shell made of aluminium alloy or magnesium alloy, and radiation shell outer surface
Equipped with heat dissipation grid.The heat that semiconductor chilling plate is spread out of can quickly be transmitted and be distributed by radiation shell made of aluminium alloy or magnesium alloy
Into external environment, heat dissipation grid has further speeded up the speed that heat distributes.
It can further be filled in cavity between said external radiator and internal heat dissipating body and be equipped with insulation foam, institute
Stating insulation foam is PU foam or XPE foam.Be insulated foam can to avoid external shell radiator heat reradiation to interior
On portion's radiator, to ensure that being normally carried out, improving the efficiency of heat dissipation for radiation processes.
Conducting-heat elements can be made for using thermally conductive sheet or thermally conductive circle made of the Heat Conduction Material with Thermal conductivity
With being to conduct the heat collection in heat dissipation for circuit board device again to facilitate to mainboard heat ink all to concentrate internal heat and suitable
Benefit is transmitted to semiconductor chilling plate.In the present invention, the conducting-heat elements preferably dissipate mainboard heat ink and circuit board
The heat-conducting plate that the both ends of hot device are connected respectively, heat-conducting plate can satisfy to use with good heat conductive and need
It asks.
When the utility model camera works, heat dissipation for circuit board device radiates to camera circuit plate module, mainboard dissipates
Hot device radiates to camera mainboard, while conducting-heat elements are by the heat collection in heat dissipation for circuit board device and conduction to mainboard dissipates
Hot device, further heat can be transferred to external shell radiator by semiconductor chilling plate, and external shell radiator is by generation
All heats are dispersed into environment again.When on the lower surface that the cold end of semiconductor chilling plate is attached to mainboard heat ink and hot
End is when being attached on the inner surface of external shell radiator, and semiconductor chilling plate cold end can absorb internal heat again by heat from heat
End is discarded in external shell radiator, is guaranteed that the temperature of internal heat dissipating body is lower than the temperature of external cooling body always, is reached guarantor
Protect the purpose of Internal camera head circuit board module and camera mainboard.
The utility model can be by the heat collection inside camera and conduction is into external environment, guarantees that internal temperature begins
It is lower than ambient temperature eventually；Semiconductor chilling plate and insulation foam can be avoided outside heat and pass to the inside of camera simultaneously
Lead, can effectively completely cut off the high temperature of external environment, thus avoid electric elements inside camera since environment temperature is excessively high and
Reduce the service life the scaling loss even occurred under high temperature.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the cross-sectional view of the utility model；
In figure, 1, external shell radiator, 2, insulation foam, 3, semiconductor chilling plate, 4, mainboard heat ink, 5, heat-conducting part
Part, 6, heat dissipation for circuit board device, 7, camera circuit plate module, 8, camera mainboard, 9, pick-up lens.
Specific embodiment
The utility model is described in further detail with reference to the accompanying drawing.
As shown in the figure is the camera radiator structure suitable for hot environment, including external cooling body and internal heat dissipating
Body, the internal heat dissipating body include being located at the heat dissipation for circuit board device 6 of 7 lower surface of camera circuit plate module and being located at camera master
The mainboard heat ink 4 of 8 lower surface of plate, camera mainboard 8 are located at 7 lower section of camera circuit plate module.It is mentioned in the utility model
Camera mainboard 8 and camera circuit plate module 7 be the common structure for including inside existing vehicle-mounted camera, wherein camera
Circuit board module 7 is specifically the image information that pick-up lens 9 connected to it takes is converted into electric signal to be transmitted to again to take the photograph
It is transmitted as on head mainboard 8, camera mainboard 8 is electrically connected with camera circuit plate module 7 for receiving camera circuit plate module 7
Next signal simultaneously carries out real-time control to camera circuit plate module 7, and specifically, camera circuit plate module 7 can use type
It number is Intel D400 type depth module, camera mainboard 8 can use model Intel D4 type vision processor.Above-mentioned master
Plate radiator 4 and heat dissipation for circuit board device 6 are connect by conducting-heat elements 5, and the external cooling body is encase internal heat dissipating body outer
Portion's shell radiator 1, and half is equipped between the lower surface of mainboard heat ink 4 and 1 inner surface of external shell radiator of its direction
The cold end of conductor cooling piece 3, the semiconductor chilling plate 3 is bonded with the lower surface of mainboard heat ink 4, semiconductor chilling plate 3
Hot end is bonded with the inner surface of external shell radiator 1.
Working principle: heat dissipation for circuit board device 6 carries out heat loss through conduction, master to camera circuit plate module 7 when camera works
Plate radiator 4 radiates to camera mainboard 8, while conducting-heat elements 5 are by the heat collection in heat dissipation for circuit board device 6 and conduction
To mainboard heat ink 4, further heat can be transferred to external shell radiator 1, external shell heat dissipation by semiconductor chilling plate
All heats of generation are dispersed into environment by device 1 again.The semiconductor chilling plate 3 that the utility model uses is by semiconductor
The common cooling device of manufactured one kind, the main bat that pa effect using semiconductor, when direct current is partly led by two kinds of differences
Body material in series at galvanic couple when, galvanic couple both ends can absorb respectively heat and release heat, realize the purpose of refrigeration.When half
The cold end of conductor cooling piece 3 is attached on the lower surface of mainboard heat ink 4 and hot end is attached to the inner surface of external shell radiator 1
When upper, heat is discarded in external shell radiator 1 by the heat inside cold end absorption from hot end again, guarantees internal heat dissipating body
Temperature is lower than the temperature of external cooling body always, reaches the mesh of protection Internal camera head circuit board module 7 and camera mainboard 8
's.
Mainboard heat ink 4 and heat dissipation for circuit board device 6 can be using the components with heat loss through conduction function.Preferably, on
It states mainboard heat ink 4 and heat dissipation for circuit board device 6 is heat-conducting plate made of aluminium alloy or magnesium alloy.Aluminium alloy or magnesium alloy have compared with
High thermal coefficient, manufactured heat-conducting plate can quickly receive the heat that camera circuit plate module 7 and the transmitting of camera mainboard 8 are come
Collection gets up and exports outward.
Preferably, the external shell radiator 1 is radiation shell made of aluminium alloy or magnesium alloy, and radiation shell outer surface
Equipped with heat dissipation grid.The heat that semiconductor chilling plate is spread out of can quickly be transmitted and be distributed by radiation shell made of aluminium alloy or magnesium alloy
Into external environment, heat dissipation grid has further speeded up the speed that heat distributes.
It can further be filled in cavity between said external radiator and internal heat dissipating body and be equipped with insulation foam 2,
The insulation foam 2 is PU foam or XPE foam.Being insulated foam 2 can be to avoid the heat reradiation of external shell radiator 1
Onto internal heat dissipating body, to ensure that being normally carried out, improving the efficiency of heat dissipation for radiation processes.
Conducting-heat elements 5 can be to use thermally conductive sheet or thermally conductive circle made of the Heat Conduction Material with Thermal conductivity,
Effect is to conduct the heat collection in heat dissipation for circuit board device 6 again to have been further facilitated to mainboard heat ink 4 by internal heat
It all concentrates and is smoothly transmitted to semiconductor chilling plate 3.In the present invention, the conducting-heat elements 5 preferably dissipate mainboard
The heat-conducting plate that the both ends of hot device 4 and heat dissipation for circuit board device 6 are connected respectively, heat-conducting plate can be the strong copper sheet of ability of leading
Or aluminium sheet, there is good heat conductive can satisfy use demand.
Claims (5)
1. a kind of camera radiator structure suitable for hot environment, which is characterized in that including external cooling body and internal heat dissipating
Body, the internal heat dissipating body include being located at the heat dissipation for circuit board device (6) of camera circuit plate module (7) lower surface and being located at camera shooting
The mainboard heat ink (4) of head mainboard (8) lower surface, camera mainboard (8) are located at below camera circuit plate module (7)；It is described
Mainboard heat ink (4) is connect with heat dissipation for circuit board device (6) by conducting-heat elements (5), and the external cooling body is to encase internal dissipate
The external shell radiator (1) of hot body, and in the external shell radiator (1) of the lower surface of mainboard heat ink (4) and its direction
Semiconductor chilling plate (3) are equipped between surface, the cold end of the semiconductor chilling plate (3) and the lower surface of mainboard heat ink (4)
Fitting, the hot end of semiconductor chilling plate (3) is bonded with the inner surface of external shell radiator (1).
2. the camera radiator structure according to claim 1 suitable for hot environment, which is characterized in that the mainboard dissipates
Hot device (4) and heat dissipation for circuit board device (6) are heat-conducting plate made of aluminium alloy or magnesium alloy.
3. the camera radiator structure according to claim 1 suitable for hot environment, which is characterized in that the external shell
Body radiator (1) is radiation shell made of aluminium alloy or magnesium alloy, and radiation shell outer surface is equipped with heat dissipation grid.
4. the camera radiator structure according to claim 1 suitable for hot environment, which is characterized in that the outside dissipates
Filling is equipped with insulation foam (2) in cavity between hot body and internal heat dissipating body, and the insulation foam (2) is PU foam or XPE
Foam.
5. the camera radiator structure according to claim 1 suitable for hot environment, which is characterized in that the heat-conducting part
Part (5) is the heat-conducting plate for being connected respectively the both ends of mainboard heat ink (4) and heat dissipation for circuit board device (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920424553.8U CN209517311U (en) | 2019-03-29 | 2019-03-29 | Camera radiator structure suitable for hot environment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920424553.8U CN209517311U (en) | 2019-03-29 | 2019-03-29 | Camera radiator structure suitable for hot environment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209517311U true CN209517311U (en) | 2019-10-18 |
Family
ID=68188003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920424553.8U Active CN209517311U (en) | 2019-03-29 | 2019-03-29 | Camera radiator structure suitable for hot environment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209517311U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111818252A (en) * | 2020-08-31 | 2020-10-23 | 维沃移动通信有限公司 | Electronic equipment and camera module thereof |
| CN113422896A (en) * | 2021-07-06 | 2021-09-21 | 蚌埠学院 | Camera heat abstractor and camera device |
| CN113777473A (en) * | 2021-09-24 | 2021-12-10 | 长江存储科技有限责任公司 | Aging test system |
-
2019
- 2019-03-29 CN CN201920424553.8U patent/CN209517311U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111818252A (en) * | 2020-08-31 | 2020-10-23 | 维沃移动通信有限公司 | Electronic equipment and camera module thereof |
| CN113422896A (en) * | 2021-07-06 | 2021-09-21 | 蚌埠学院 | Camera heat abstractor and camera device |
| CN113777473A (en) * | 2021-09-24 | 2021-12-10 | 长江存储科技有限责任公司 | Aging test system |
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