CN109168302A - A kind of wearable device - Google Patents
A kind of wearable device Download PDFInfo
- Publication number
- CN109168302A CN109168302A CN201811238592.5A CN201811238592A CN109168302A CN 109168302 A CN109168302 A CN 109168302A CN 201811238592 A CN201811238592 A CN 201811238592A CN 109168302 A CN109168302 A CN 109168302A
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- Prior art keywords
- heat
- heat source
- wearable device
- semiconductor cooler
- radiating
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- 239000004065 semiconductor Substances 0.000 claims abstract description 68
- 230000037361 pathway Effects 0.000 claims abstract description 20
- 239000012212 insulator Substances 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000004020 conductor Substances 0.000 claims description 17
- 239000006260 foam Substances 0.000 claims description 16
- 238000001816 cooling Methods 0.000 claims description 5
- 238000009998 heat setting Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 31
- 230000005855 radiation Effects 0.000 description 9
- 125000004122 cyclic group Chemical group 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000004880 explosion Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 210000000707 wrist Anatomy 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
This application discloses a kind of wearable devices, including functional component, heat source and semiconductor cooler, heat source outer cover is equipped with thermal insulator, the main radiating surface of the first end connection heat source of the thermally conductive pathways of semiconductor cooler, the second end connection of the thermally conductive pathways of semiconductor cooler for heating sink to the radiator outside wearable device, heat source, semiconductor cooler with the heat-insulated setting of radiating piece for radiating for functional component.Heat source is isolated from the outside and its heat dissipation channel with other waits for that thermal component and space are not connected to, forms the exclusive heat dissipation channel for being directed to heat source, avoiding is influenced by other structures, and the radiating efficiency of heat source is able to ascend.
Description
Technical field
The present invention relates to wearable device technical fields, more specifically to a kind of wearable device.
Background technique
The wearable devices such as display equipment, wrist strap, watch are worn, increasingly by the favor of ordinary consumer.With intelligence
Energyization, miniaturization, light-weighted development and consumer's wearing comfort require to improve, the heat dissipation performance of these wearable devices
Important indicator as overall performance.
Traditional big heat sink and fan are not suitable for minimizing wearable device.Traditional heat sink conception is unable to satisfy
Minimize the radiating requirements of wearable device.
It needs to develop new heat sink conception to promote the heat dissipation performance of miniaturization wearable device, and then promotes user's body
It tests.
Summary of the invention
In view of this, the wearable device can be realized in it the object of the present invention is to provide a kind of wearable device
Portion's heat source radiates, good heat dissipation effect and structure is simple.
To achieve the goals above, the invention provides the following technical scheme:
A kind of wearable device, including functional component and heat source, further include semiconductor cooler, are arranged outside the heat source
There is thermal insulator；
The first end of the thermally conductive pathways of the semiconductor cooler connects the main radiating surface of the heat source, the semiconductor system
The second end of the thermally conductive pathways of cooler is connected for heating sink to the radiator outside wearable device；
The heat source, the semiconductor cooler with the heat-insulated setting of radiating piece for radiating for the functional component.
Preferably, the main radiating surface of the heat source fits over heat-conducting pad, and the another side of the heat-conducting pad is bonded institute
State the first end of the thermally conductive pathways of semiconductor cooler；
The heat-conducting pad and the heat-insulated setting of the radiating piece.
Preferably, the second end of the semiconductor cooler thermally conductive pathways fits over metal conducting strip, and the metal is led
Backing connects the radiator by heat pipe；
The metal conducting strip, the heat pipe with the heat-insulated setting of the radiating piece.
Preferably, it is equipped between the heat pipe and the radiating piece and is used for heat-insulated foam；And/or the heat pipe includes
At least two ultrathin heat pipes.
Preferably, through-hole is provided on the radiating piece, the heat source is located inside the through-hole, and the thermal insulator includes
Between the heat source and the through-hole, for the heat-insulated heat-insulated foam of ring-type.
Preferably, the heat source is installed on pcb board, and the other side of the pcb board is equipped with LCD screen, and the pcb board and
LCD frame is equipped between the LCD screen.
Preferably, the pcb board is equipped with several functional chips, and the radiating surface of the functional chip is bonded described dissipate
Warmware, the side of the radiating piece are equipped with the fan to wearable device external cooling；
The radiator is set to the side of the fan.
Preferably, the power supply of the semiconductor cooler is equipped with the control switch for adjusting its current direction, the control
System is switched for being reversely powered when environment temperature is lower than preset value and needs to start the heat source to the semiconductor cooler,
So that the second end is conducted heat to the first end.
Preferably, the heat source is the master chip of the wearable device.
Preferably, the wearable device includes wearing display equipment.
In wearable device provided herein, heat source is isolated from the outside by thermal insulator, passes through semiconductor refrigerating
By the heat of heat source, efficiently heat dissipation transmitting, heat dissipation channel wait for that thermal component and space are not connected to other to device outward, are formed
For the exclusive heat dissipation channel of heat source, avoiding is influenced by other structures, be able to ascend the radiating efficiency of heat source and realize compared with
Good heat dissipation effect.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is that a kind of wearable device provided by the present invention removes the schematic diagram after front housing；
Fig. 2 is a kind of perspective view of the explosion of wearable device provided by the present invention；
Fig. 3 is the perspective view of the explosion of heat radiation module provided by the present invention；
Fig. 4 is the schematic diagram that radiating piece is arranged in heat radiation module provided by the present invention；
Fig. 5 is sectional view along A-A in Fig. 4.
In Fig. 1-5:
1 is front housing, and 2 be main body case, and 3 be lens module, and 4 be LCD screen, and 5 be LCD frame, and 6 be pcb board, and 61 be heat source, 7
It is camera module for radiating piece, 8,9 be heat radiation module, and 10 be cell apparatus；
901 be cyclic annular heat-insulated foam, and 902 be heat-conducting pad, and 903 be semiconductor cooler, and 903-1 is potsherd, 903-2
It is copper sheet for semiconductor material, 904,905 be heat pipe, and 906 be fan, and 907 be radiator, and 908 be heat-insulated foam.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Core of the invention is to provide a kind of wearable device, which, which can be realized, carries out its internal heat resource
Heat dissipation, good heat dissipation effect and structure is simple.
Fig. 1 to Fig. 5 is please referred to, Fig. 1 is that a kind of wearable device provided by the present invention removes the schematic diagram after front housing；Figure
2 be a kind of perspective view of the explosion of wearable device provided by the present invention；Fig. 3 is the explosion of heat radiation module provided by the present invention
Schematic diagram；Fig. 4 is the schematic diagram that radiating piece is arranged in heat radiation module provided by the present invention；Fig. 5 is sectional view along A-A in Fig. 4.
A kind of wearable device provided by the present application, which has the characteristics that compact structure and thermal diffusivity is good,
It can be any one equipment worn, can be to wear VR equipment, wrist wearing devices etc..The wearable device includes
Functional component and heat source 61, functional component and heat source 61 are respectively provided with inside the shell, in this configuration further include semiconductor cooler
903,61 outer cover of heat source is equipped with thermal insulator, and the of the thermally conductive pathways of the main radiating surface connection semiconductor cooler 903 of heat source 61
The second end of one end, the thermally conductive pathways of semiconductor cooler 903 is connected for heating sink to the heat dissipation outside wearable device
Device 907, heat source 61, semiconductor cooler 903 with the heat-insulated setting of radiating piece 7 for radiating for functional component.
It should be noted that the heat source 61 in wearable device is not limited to unique mainboard chip of wearable device,
It refers to the objective chip for mainly needing to radiate, can be mainboard chip or be other chips important, that cooling requirements are high,
Or the heat generating components such as battery.Functional component is heat production or the component by heat radiation when wearable device is run, and be can be
Any part inside wearable device.Another angle, heat source 61 have quantity of heat production big or importance compared with functional component
High feature.
Wherein, semiconductor cooler (TEC, Thermo Electric Cooler) 903 refers to utilizing semiconductor material
Peltier effect made of have heat absorption and heat release function structure, when there is electric current to flow through from TEC, by electric current in TEC
Upper generation hot and cold sides, realize the transmitting of heat.
Semiconductor cooler 903 forms hot end and cold end according to energization direction, and the two is defined as first in this application
End and second end.When forward direction is powered, first end is cold end, and second end is hot end.
61 outer cover of heat source is equipped with thermal insulator so that heat source 61 and the heat-insulated setting of its external component, and and outside air
Heat radiation and convection current can not be carried out, and the main radiating surface of heat source 61 refers to a surface on heat source with heat sinking function, half
The first end of the thermally conductive pathways of conductor refrigerator 903 connects main radiating surface, the second end of the thermally conductive pathways of semiconductor cooler 903
The radiator 907 of connection, is mainly used for heating sink to outside wearable device, that is to say, that semiconductor cooler 903, heat dissipation
Device 907 forms the heat dissipation channel of heat source 61, and this heat dissipation channel is not connect with other structures and its heat dissipation channel, mutually
Between without heat interaction.
When being powered using cell apparatus 10 is positive to semiconductor cooler 903, the heat for the heat source 61 being connect with cold end
It can be transferred to the hot end connecting with radiator 907, so as to which the heat of heat source 61 sheds.Due to using semiconductor refrigerating
Device 903 radiates to heat source 61, and heat dissipation effect is preferable, can be realized the purpose of rapid cooling.
In wearable device provided herein, heat source 61 is isolated from the outside, it will be hot by semiconductor cooler 903
The heat in source 61 carries out efficient heat dissipation transmitting, heat dissipation channel outward and waits for that thermal component and space are not connected to other, is formed
For the exclusive heat dissipation channel of heat source 61, avoiding is influenced by other structures, is able to ascend the radiating efficiency of heat source 61 and real
Now preferable heat dissipation effect.
On the basis of above-described embodiment, the main radiating surface of heat source 61 fits over heat-conducting pad 902, heat-conducting pad
The first end of the thermally conductive pathways of 902 another side laminated semiconductor refrigerator 903, heat-conducting pad 902 with radiating piece 7 is heat-insulated sets
It sets.
It should be noted that semiconductor cooler 903 connects heat source 61 by heat-conducting pad 902, to guarantee that heat source 61 dissipates
Heat-conducting pad 902 is fitted over the main radiating surface in heat source by the stabilization of the thermal efficiency, main radiating surface completely with heat-conducting pad 902
It is bonded, heat can be conducted to heat-conducting pad 902 by all sites on main radiating surface.In view of semiconductor cooler 903
The first ends of thermally conductive pathways be also planar structure, therefore the another side of heat-conducting pad 902 is bonded completely with above-mentioned first end, is used
In uniformly transferring for guarantee heat.Above-mentioned heat-conducting pad 902 is also heat-insulated setting with above-mentioned radiating piece 7 simultaneously, avoids radiating piece 7
Heat-conducting pad 902 is transferred heat to, the problem of reducing by 61 radiating efficiency of heat source is caused.
Optionally, above-mentioned heat-conducting pad 902 can be made of various material or structure.
On the basis of above-described embodiment, the second end of 903 thermally conductive pathways of semiconductor cooler fits over metal and leads
Backing, metal conducting strip connect radiator 907 by heat pipe 905, metal conducting strip, heat pipe 905 with radiating piece 7 is heat-insulated sets
It sets.
It should be noted that the hot end of semiconductor cooler 903, that is, the second end and metal conducting strip of thermally conductive pathways
Connection heat pipe 905 is passed to by metal conducting strip for realizing heat, the connection type and above-mentioned 902 explanation of heat-conducting pad
Structure it is similar.For the high efficiency for promoting thermally conductive allround fastness and heat dissipation, the second end face paste and metal of thermally conductive pathways are led
Backing guarantees the uniform of heat transmitting.In addition, heat pipe 905 is a kind of efficient heat-conducting piece, it can be ensured that the stable transmitting of heat.
Optionally, metal conducting strip heat transfer can be obviously improved to radiator 907 by radiating efficiency using heat pipe 905, certainly,
Other efficient transfer modes can also be used.
On the basis of above-described embodiment, it is equipped between heat pipe 905 and radiating piece 7 and is used for heat-insulated foam；And/or
Heat pipe 905 includes at least two ultrathin heat pipes.
It should be noted that heat pipe 905 centainly cannot be with since heat pipe 905 has efficient thermal conducting function
Other wait for that thermal component, high-temperature component have heat transmitting, otherwise will seriously affect the heat dissipation of heat source 61.It, will be hot in the present embodiment
Pipe 905 and the heat-insulated setting of radiating piece 7, herein heat-insulated both include not contacting, not conducting heat in structure, both further include in sky
Between in arrangement, acted on without mutual heat radiation, avoid the passive transmitting of heat.
The concrete type of heat pipe 905 can be selected as ultrathin heat pipe, to realize high-strength heat transfer, and can reduce biography
Thermal resistance during passing, in addition, the quantity of heat pipe 905 can for one, two or more, and set to realize wearable
Standby interior route is arranged, and heat pipe 905 can have certain bending design or design the evacuation of functional component.
On the basis of any one above-mentioned embodiment, through-hole is provided on radiating piece 7, heat source 61 is located in through-hole
Portion, and be provided between heat source 61 and through-hole for the heat-insulated heat-insulated foam 901 of ring-type.
It should be noted that heat source 61 is realized heat-insulated with outside by cyclic annular heat-insulated foam 901, Fig. 2 is specifically please referred to
And Fig. 3, it is equipped with cyclic annular heat-insulated foam 901 in the outside of heat source 61, so that the periphery of heat source 61 is thermally shielded, and heat source 61
Main radiating surface is bonded with heat-conducting pad 902, and the face opposite with main radiating surface is the mounting surface of heat source 61 on heat source 61, specifically,
Heat source 61 is arranged by mounting surface in fixed position, and cyclic annular heat-insulated foam 901 can be avoided to absorb heat from outside, cyclic annular heat-insulated foam
901 can be stuck on the through-hole of radiating piece 7.Usual situation lower through-hole can be slightly larger than heat source 61, so that being cased with cyclic annular heat-insulated
The heat source 61 of foam 901 can be stuck on the through-hole of radiating piece 7.
On the basis of any one above-mentioned embodiment, heat source 61 is installed on pcb board 6, and the other side of pcb board 6 is set
There is LCD screen 4, and be equipped with LCD frame 5 between pcb board 6 and LCD screen 4,.
It should be noted that above-mentioned pcb board 6 is connect with heat source 61, if pcb board is influenced to make by outside heat
Therefore LCD frame 5 is arranged in the other side of pcb board 6, LCD frame 5 can be by the heat of LCD screen 4 in the influence that pairs of heat source 61 radiates
It is isolated, avoids influencing pcb board 6.
On the basis of any one above-mentioned embodiment, pcb board 6 is equipped with several functional chips, functional chip
Radiating surface is bonded radiating piece 7, and the side of radiating piece 7 is equipped with the fan 906 to wearable device external cooling.
It should be noted that under normal conditions, heat source 61 is arranged on pcb board 6, also have on pcb board 6 other chips or
Functional component, wherein functional chip is bonded radiating piece 7, transfers heat to radiating piece 7 and radiates.
Radiating piece 7 provided in the application can be heat sink, preferably metallic heat radiating plate, due to heat dissipation plate suqare compared with
Greatly, after part-structure is bonded above-mentioned functional component, other parts can carry out the heat dissipation of uniform high-efficiency.Certainly, above-mentioned heat dissipation
Part 7 or bar shaped or other structures.
It should be noted that being additionally provided with the components such as camera module 8 in above structure, which connect with radiating piece 7,
So that the heat transfer of generation is transmitted to radiating piece 7.
After the heat of the lesser chip of other power consumptions is uniformly spread by radiating piece 7 on pcb board 6, a part heat
Amount can be exchanged by the ventilation hole on fan 906 or shell to the external world, and another part is dissipated in surrounding air.
Heat source 61 is wrapped up using cyclic annular heat-insulated foam 901 in the application, and passes through heat-conducting pad 902, semiconductor system
Cooler 903, heat pipe 905, radiator 907 thermally conductive pathways radiate.Heat dissipation road of this paths independently of other component
Diameter not will do it therebetween heat exchange.Other component can connect radiating piece 7 (being specifically as follows heat sink etc.), optional
, above-mentioned radiator 907 is set to the side of fan 906.Optionally, fan 906 is positioned close to the position of front housing 1, while before
Heat release hole is set on shell 1, and hull outside can be discharged by fan 906 in heat by radiating piece 7 and radiator 907.It is wearable
The shell of equipment includes main body cover 2 and front housing 1, and each functional component and heat source 61 of wearable device etc. are respectively provided with outside the main body
In the cavity that shell 2 and front housing 1 are formed.
Semiconductor cooler 903 provided by the present application includes semiconductor material 903-2, metallic conductor, potsherd 903-1,
Wherein semiconductor material 903-2 includes P-type semiconductor and N-type semiconductor, is referred to as semiconductor.P-type semiconductor and N-type semiconductor are simultaneously
Column are arranged alternately, and have gap between two adjacent semiconductors, and the head end and tail end of the same semiconductor pass through not respectively
Same metallic conductor connection is located at the semiconductor of its two sides, and two adjacent semiconductors only have one end and pass through the same sheet metal
Connection so that several semiconductors by several sheet metals formed serpentine configuration, due to all semiconductors be substantially at it is flat
Row setting, therefore the both ends of several metallic conductors difference semiconductor, all metallic conductors positioned at the same end pass through same
Potsherd 903-1 connection, two potsherd 903-1 are respectively hot end and cold end.
On the basis of any one above-mentioned embodiment, the power supply of semiconductor cooler 903 can be cell apparatus 10,
The anode and cathode of cell apparatus 10 are separately connected two metallic conductors, and electric current is circulated with serpentine fashion, successively pass through first
Metallic conductor, first P-type semiconductor, second metallic conductor, first N-type semiconductor, third metallic conductor, second
P-type semiconductor, the 4th metallic conductor, and so on, this is worked as metallic conductor in the process and receives the electricity from P-type semiconductor
When flowing, and being conducted to N-type semiconductor, this metallic conductor is presented to external heat release state, that is, hot end, corresponding when gold
When belonging to conductor and receive the electric current from N-type semiconductor, and being conducted to P-type semiconductor, this metallic conductor is presented to external heat absorption
State, that is, cold end.Such as above-mentioned second metallic conductor is heat release state, as hot end, the 4th metallic conductor is to inhale
Warm status, as cold end.The above-mentioned principle of device is based on paltie effect, and the semiconductor of two kinds of opposed polarities connects into access
Later, junction can have thermoelectric potential difference, and the lifting of potential difference is had when impressed current driving carrier passes through point of interface,
And then cause to absorb or discharge heat.
In this application, heat-insulated foam 901 is filled for heat source 61 and external high temperature air insulated shape using ring at heat source 61
At closed low-temperature region.After semiconductor cooler 903 works, cold end is being formed close to 61 side of heat source, close to heat pipe 905
Side forms hot end；The heat that heat source 61 generates under action of thermal difference is cold under TEC driving by conduction to potsherd 903-1
Hold heat transfer to hot end.
Optionally, above-mentioned metal conducting strip can be copper sheet 904, and above-mentioned metal conducting strip can be by being welded to connect heat pipe
905。
Optionally, above-mentioned metal conducting strip, can be with foam, for separating the heat exchange of itself and radiating piece 7 on heat pipe 905.
Heat source 61 in the application specifically can be master chip in wearable device, either can it is larger for power consumption or
The biggish component of radiating requirements.Wherein master chip refers to the more important chip of mainboard chip or a certain structure.
Wearable device in the application be specifically as follows wear display equipment, bracelet, arm hang it is one of standby.Wherein
Wearing display equipment includes VR equipment, AR equipment, MR equipment etc..
On the basis of above-mentioned each embodiment, cell apparatus 10 is equipped with and opens for adjusting the control of its current direction
It closes, control switch is used for reversely logical to semiconductor cooler 903 when environment temperature is lower than preset value and needs to start heat source 61
Electricity, so that second end is conducted heat to first end.
It should be noted that above structure is at low ambient temperatures, can be directly powered from battery by external switch,
And it is passed through the electric current of opposite direction when freezing with above-mentioned heat dissipation, so that hot end and cold end are exchanged, 61 temperature of release heat lift heat source
Degree can cut off the power after success starts at low temperature.If 61 temperature of heat source is excessively high in use, forward direction can be connected
Electric current is to realize heat dissipation.
When above-mentioned wearable device be specially wear display equipment when, wear display equipment outdoors low temperature environment or other
When needing to start under low temperature environment, after getting enabling signal, first environment temperature can be incuded, it is low when getting temperature
When preset value, above-mentioned control switch is reversely powered using power supply to semiconductor cooler 903, realizes above-mentioned second end to the
One end heat transfer discharges the temperature of heat lift heat source 61 so that hot end and cold end are exchanged.And it is increased to when getting environment temperature
More than preset value or after helmet start completion, the control switch to semiconductor cooler 903 can be closed, to stop supplying
Electricity.
The heat source 61 of the structure of wearable device provided by the present application can be deposited for photographic device, synchronous dynamic random-access
The equipment that the needs such as reservoir DDR, WiFi individually radiate.The application is that above equipment is provided with the path independently radiated, make its with
The heat dissipation of other structures is not interfere with each other, and guarantees whole heat dissipation capacity, can be obviously improved radiating efficiency, even if working long hours feelings
Under condition, the high efficiency and heat radiation of precise part can also ensure that.
In addition to the primary structure of wearable device provided by above-mentioned each embodiment, other each sections of wearable device
Structure refer to the prior art, repeats no more herein.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.
Wearable device provided by the present invention is described in detail above.Specific case used herein is to this
The principle and embodiment of invention is expounded, method of the invention that the above embodiments are only used to help understand and
Its core concept.It should be pointed out that for those skilled in the art, in the premise for not departing from the principle of the invention
Under, it can be with several improvements and modifications are made to the present invention, these improvement and modification also fall into the protection of the claims in the present invention
In range.
Claims (10)
1. a kind of wearable device, including functional component and heat source (61), which is characterized in that further include semiconductor cooler
(903) (61) outer cover of heat source described in a is equipped with thermal insulator；
The main radiating surface of the first end connection heat source (61) of the thermally conductive pathways of the semiconductor cooler (903), described half
The second end of the thermally conductive pathways of conductor refrigerator (903) is connected for heating sink to the radiator outside the wearable device
(907)；
The heat source (61), the semiconductor cooler (903) with the radiating piece (7) for radiating for the functional component every
Heat setting.
2. wearable device according to claim 1, which is characterized in that the main radiating surface of the heat source (61) fits over
Heat-conducting pad (902), the another side of the heat-conducting pad (902) are bonded the thermally conductive pathways of the semiconductor cooler (903)
First end；
The heat-conducting pad (902) and the radiating piece (7) heat-insulated setting.
3. wearable device according to claim 2, which is characterized in that semiconductor cooler (903) thermally conductive pathways
Second end fit over metal conducting strip, the metal conducting strip connects the radiator (907) by heat pipe (905)；
The metal conducting strip, the heat pipe (905) with the radiating piece (7) heat-insulated setting.
4. wearable device according to claim 3, which is characterized in that the heat pipe (905) and the radiating piece (7) it
Between be equipped be used for heat-insulated foam；And/or the heat pipe (905) includes at least two ultrathin heat pipes.
5. wearable device according to any one of claims 1 to 4, which is characterized in that be provided on the radiating piece (7)
Through-hole, the heat source (61) are located inside the through-hole, the thermal insulator include be set to the heat source (61) and the through-hole it
Between, for the heat-insulated heat-insulated foam (901) of ring-type.
6. wearable device according to claim 5, which is characterized in that the heat source (61) is installed on pcb board (6),
The other side of the pcb board (6) is equipped with LCD screen (4), and LCD frame is equipped between the pcb board (6) and the LCD screen (4)
(5)。
7. wearable device according to claim 5, which is characterized in that the pcb board (6) is equipped with several function cores
Piece, the radiating surface of the functional chip are bonded the radiating piece (7), and the side of the radiating piece (7) is equipped with to be set to wearable
The fan (906) of standby external cooling；
The radiator (907) is set to the side of the fan (906).
8. wearable device according to claim 5, which is characterized in that the power supply of the semiconductor cooler (903) is set
There is the control switch for adjusting its current direction, the control switch is used to be lower than preset value in environment temperature and needs to start
It is reversely powered when heat source (61) to the semiconductor cooler (903), so that the second end is conducted heat to the first end.
9. wearable device according to claim 5, which is characterized in that the heat source (61) is the wearable device
Master chip.
10. wearable device according to claim 1-4, which is characterized in that the wearable device includes head
Wear display equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811238592.5A CN109168302B (en) | 2018-10-23 | 2018-10-23 | Wearable equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811238592.5A CN109168302B (en) | 2018-10-23 | 2018-10-23 | Wearable equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109168302A true CN109168302A (en) | 2019-01-08 |
| CN109168302B CN109168302B (en) | 2024-04-09 |
Family
ID=64878777
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811238592.5A Active CN109168302B (en) | 2018-10-23 | 2018-10-23 | Wearable equipment |
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| Country | Link |
|---|---|
| CN (1) | CN109168302B (en) |
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| CN110716315A (en) * | 2019-11-29 | 2020-01-21 | 北京枭龙防务科技有限公司 | Intelligent glasses |
| CN111142637A (en) * | 2019-02-27 | 2020-05-12 | 广东小天才科技有限公司 | Heat dissipation method of wearable device and wearable device |
| CN112333978A (en) * | 2020-10-19 | 2021-02-05 | Oppo广东移动通信有限公司 | Heat dissipation assembly, electronic equipment and heat dissipation control method |
| CN113067963A (en) * | 2019-12-31 | 2021-07-02 | 杭州海康威视数字技术股份有限公司 | Camera and refrigerating device thereof |
| CN113422896A (en) * | 2021-07-06 | 2021-09-21 | 蚌埠学院 | Camera heat abstractor and camera device |
| US20220147124A1 (en) * | 2020-11-09 | 2022-05-12 | Facebook Technologies, Llc | Active thermal management of a display panel |
| WO2023049050A1 (en) * | 2021-09-21 | 2023-03-30 | Callisto Design Solutions Llc | Selective insulation of mount points |
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|---|---|
| CN109168302B (en) | 2024-04-09 |
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