CN218001865U

CN218001865U - Semiconductor refrigerating device

Info

Publication number: CN218001865U
Application number: CN202221650516.7U
Authority: CN
Inventors: 陈阳; 舒贝贝
Original assignee: InfoVision Optoelectronics Kunshan Co Ltd
Current assignee: InfoVision Optoelectronics Kunshan Co Ltd
Priority date: 2022-06-28
Filing date: 2022-06-28
Publication date: 2022-12-09
Anticipated expiration: 2032-06-28

Abstract

The utility model discloses a semiconductor refrigerating plant relates to on-vehicle display product refrigeration technology field. The semiconductor refrigerating device comprises a refrigerating assembly and a power supply assembly. The refrigeration assembly comprises a first metal piece, a second metal piece and a third metal piece, wherein an N-type semiconductor is electrically connected between the first metal piece and the second metal piece, and a P-type semiconductor is electrically connected between the first metal piece and the third metal piece; the power supply assembly comprises a photoelectric conversion element, the positive pole of the power supply assembly is electrically connected with the second metal element, and the negative pole of the power supply assembly is electrically connected with the third metal element. This semiconductor refrigerating plant can convert light energy into the electric energy and come for the refrigeration subassembly power supply for the use of on-vehicle display product does not receive the influence of vehicle power supply position, and does not need solitary refrigeration power supply line, can not influence pleasing to the eye and use, has promoted user experience.

Description

Semiconductor refrigerating device

Technical Field

The utility model relates to a vehicle-mounted display product refrigeration technology field especially relates to a semiconductor refrigerating plant.

Background

At present, in order to meet the use requirements of users on vehicle-mounted display products, the display products are often integrated with multiple functions, so that the appearance size, the performance and the visual experience of the products are enhanced and improved, the power consumption of the display products is increased easily, and meanwhile, along with continuous generation of heat, the use performance of the display products is influenced by gradual superposition of the heat.

In order to reduce the size of the display product and improve the heat dissipation efficiency, a semiconductor refrigerating device is mostly adopted to cool and dissipate the heat of the display product. The semiconductor refrigerating device utilizes the principle of the Peltier effect to achieve the purpose of cooling a display product by electrifying the semiconductor refrigerating device. However, the semiconductor refrigeration device requires vehicle power, which limits the use location of the vehicle-mounted display product, and the separate circuit may also affect the aesthetics and use, reducing the user experience.

In view of the above problems, it is necessary to develop a semiconductor cooling apparatus to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor refrigerating plant can convert light energy into the electric energy and come for the refrigeration subassembly power supply for the use of on-vehicle display product does not receive the influence of vehicle power supply position, and does not need solitary refrigeration power supply line, can not influence pleasing to the eye and use, has promoted user experience.

To achieve the purpose, the utility model adopts the following technical proposal:

a semiconductor refrigeration device comprising:

the refrigeration assembly comprises a first metal piece, a second metal piece and a third metal piece, wherein an N-type semiconductor is electrically connected between the first metal piece and the second metal piece, and a P-type semiconductor is electrically connected between the first metal piece and the third metal piece;

the power supply assembly comprises a photoelectric conversion element, the photoelectric conversion element converts light energy into electric energy, the positive electrode of the power supply assembly is electrically connected with the second metal element, and the negative electrode of the power supply assembly is electrically connected with the third metal element.

Preferably, the power supply module further comprises a rechargeable battery, the photoelectric conversion module charges the rechargeable battery, and the rechargeable battery supplies power to the refrigeration module.

Preferably, the refrigeration assembly further comprises a first heat exchange piece, and the first heat exchange piece is in heat exchange connection with the first metal piece.

Preferably, the first heat exchange member includes an annular body, the first metal member is annular and attached to the body, and the second metal member and the third metal member are respectively located at two opposite ends of the first metal member.

Preferably, the periphery of the body is provided with a heat exchanging part, and the heat exchanging part is perpendicular to the body.

Preferably, the refrigeration assembly further comprises two second heat exchange pieces, and the two second heat exchange pieces are respectively connected with the second metal piece and the third metal piece in a heat exchange manner.

Preferably, one end of each of the second metal piece and the third metal piece extends out of the body, and the second heat exchange pieces and the heat exchange portions are arranged in parallel at intervals.

Preferably, a heat insulating member is disposed between the second heat exchanging member and the heat exchanging part.

Preferably, a plurality of heat dissipation grooves are arranged on the inner surface of the first heat exchange member and/or the outer surface of the second heat exchange member at intervals.

Preferably, the first metal piece, the second metal piece and the third metal piece are all made of copper.

The utility model has the advantages that:

the utility model provides a semiconductor refrigerating device. The power supply assembly can supply power to the refrigeration assembly by using the photoelectric conversion assembly, so that current sequentially passes through the second metal piece, the N-type semiconductor, the first metal piece, the P-type semiconductor and the third metal piece, and according to the Peltier effect, the heat of the first metal piece is transferred to the second metal piece and the third metal piece, so that the first metal piece is a heat absorption end, and the second metal piece and the third metal piece are heat release ends. The first metal piece and the vehicle-mounted display product are only required to be close to or attached to each other, heat of the vehicle-mounted display product can be absorbed, the heat is dissipated to the outside through the second metal piece and the third metal piece, and cooling and heat dissipation of the vehicle-mounted display product are completed.

This semiconductor refrigerating plant's power supply module can convert light energy into the electric energy and come for the refrigeration subassembly power supply for the use of on-vehicle display product does not receive the influence of vehicle power supply position, and does not need solitary refrigeration power supply line, can not influence pleasing to the eye and use, has promoted user experience.

Drawings

Fig. 1 is a schematic structural diagram of a semiconductor refrigeration device provided by the present invention;

fig. 2 is a schematic structural diagram of a refrigeration assembly provided by the present invention;

fig. 3 is an exploded view of the refrigeration assembly provided by the present invention.

In the figure:

1. a refrigeration assembly; 2. a power supply component;

11. a first metal member; 12. a second metal piece; 13. a third metal piece; 14. an N-type semiconductor; 15. a P-type semiconductor; 16. a first heat exchange member; 17. a second heat exchange member; 18. a thermal insulation member; 21. a photoelectric conversion element; 22. a rechargeable battery; 23. a circuit board;

161. a body; 162. a heat exchanging part.

Detailed Description

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Wherein the terms "first position" and "second position" are two different positions.

Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "secured" are to be construed broadly and encompass, for example, both fixed and removable connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may include the first feature being in direct contact with the second feature, or may include the first feature being in direct contact with the second feature but being in contact with the second feature by another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.

Fig. 1 is a schematic structural view of a semiconductor refrigeration apparatus, fig. 2 is a schematic structural view of a refrigeration module 1, and fig. 3 is an exploded view of the refrigeration module 1. The present embodiment provides a semiconductor refrigeration device, which includes a refrigeration module 1 and a power module 2, as shown in fig. 1 to 3. The refrigeration component 1 comprises a first metal piece 11, a second metal piece 12 and a third metal piece 13, wherein an N-type semiconductor 14 is electrically connected between the first metal piece 11 and the second metal piece 12, and a P-type semiconductor 15 is electrically connected between the first metal piece 11 and the third metal piece 13. The power module 2 includes a photoelectric conversion device 21, the photoelectric conversion device 21 converts light energy into electrical energy, the photoelectric conversion device 21 may be disposed on an outer surface of the vehicle-mounted display product to better absorb external light energy, and the photoelectric conversion device 21 may be made of a transparent material so as not to affect the display of the vehicle-mounted display product. The positive electrode of the power module 2 is electrically connected to the second metal fitting 12, and the negative electrode of the power module 2 is electrically connected to the third metal fitting 13.

The power module 2 can supply power to the refrigeration module 1 by using the photoelectric conversion element 21, and current passes through the second metal element 12, the N-type semiconductor 14, the first metal element 11, the P-type semiconductor 15, and the third metal element 13 in this order, and as can be seen from the peltier effect, the heat of the first metal element 11 is transmitted to the second metal element 12 and the third metal element 13 at this time, so that the temperature of the first metal element 11 is lowered to be able to serve as a heat absorption end, and the temperatures of the second metal element 12 and the third metal element 13 are raised to be able to serve as a heat release end. The heat of the vehicle-mounted display product can be absorbed only by approaching or attaching the first metal piece 11 to the vehicle-mounted display product, and the heat is dissipated to the outside through the second metal piece 12 and the third metal piece 13, so that the cooling and heat dissipation of the vehicle-mounted display product are completed.

This semiconductor refrigerating plant's power supply module 2 can convert light energy into the electric energy and come for the power supply of refrigeration subassembly 1 for the use of on-vehicle display product does not receive the influence of vehicle power supply position, and does not need solitary refrigeration power supply line, can not influence pleasing to the eye and use, has promoted user experience.

The second metal piece 12, the N-type semiconductor 14, the first metal piece 11, the P-type semiconductor 15 and the third metal piece 13 are connected with each other through high-temperature conductive silver adhesive.

It will be appreciated that the peltier effect is reversible, i.e. only the direction of current flow needs to be changed, i.e. the direction of heat transfer can be changed. Therefore, the refrigerating assembly 1 can be changed into a heating assembly only by connecting the positive electrode and the negative electrode of the power adjusting assembly 2 with the refrigerating assembly 1, and by utilizing the principle, the semiconductor refrigerating device can also be used as an air conditioning system of a vehicle to realize the switching between refrigeration and heating.

It can be understood that when the refrigeration device is required to refrigerate, the vehicle may be in an environment with insufficient light conditions, the photoelectric conversion element 21 may not provide enough electric energy, and when the refrigeration device is not required to refrigerate, the light energy received by the photoelectric conversion element 21 may be wasted. To solve this problem, the power supply module 2 further includes a rechargeable battery 22, the photoelectric conversion module 21 charges the rechargeable battery 22, and the rechargeable battery 22 supplies power to the cooling module 1.

The rechargeable battery 22 can store the electric energy when the photoelectric conversion element 21 provides sufficient electric energy, and when the refrigeration device needs to be used in an environment with insufficient light, the rechargeable battery 22 can be used for supplying power, or the rechargeable battery 22 and the photoelectric conversion element 21 can be used together for supplying power to provide larger refrigeration power.

As shown in fig. 1, the power module 2 further includes a controller and a circuit board 23, the photoelectric conversion module 21 and the rechargeable battery 22 are both electrically connected to the circuit board 23, an output end of the circuit board 23 is electrically connected to the refrigeration module 1, and the controller can change a connection mode of the circuit according to actual needs. When the refrigeration assembly 1 needs to be powered, the controller controls the circuit board 23 to connect the photoelectric conversion element 21 and the rechargeable battery 22 in parallel, and both the photoelectric conversion element 21 and the rechargeable battery 22 can directly supply power to the refrigeration assembly 1. When the power supply to the refrigeration assembly 1 is not needed, the controller controls the circuit board 23 to connect the photoelectric conversion element 21 and the rechargeable battery 22 in series, so as to charge the rechargeable battery 22 for storing electric energy.

As shown in fig. 2 and 3, the refrigeration assembly 1 further comprises a first heat exchanging element 16, and the first heat exchanging element 16 is connected with the first metal element 11 in a heat exchanging manner. First heat exchange member 16 is hugged closely with the shell of on-vehicle demonstration product, and first heat exchange member 16 can absorb the heat that on-vehicle articles for use produced to the realization is to the cooling heat dissipation of on-vehicle demonstration product. Specifically, the first heat exchange member 16 is an insulating member to prevent the current flowing through the cooling module 1 from affecting the in-vehicle display product.

Specifically, the first heat exchanging element 16 includes an annular body 161, the first metal element 11 is annular and attached to the annular body 161, and the second metal element 12 and the third metal element 13 are respectively located at two opposite ends of the first metal element 11. The second metal piece 12 and the third metal piece 13 are arranged at two opposite ends of the first metal piece 11, so that the distance between the second metal piece 12 and the third metal piece 13 is farthest, mutual influence of the second metal piece and the third metal piece in a heat dissipation process can be prevented, and further the heat dissipation efficiency is improved. The annular body 161 and the first metal part 11 can pass through part of the structure of the vehicle-mounted display product, so that the refrigeration assembly 1 is mounted on the vehicle-mounted display product and the first heat exchange part 16 is attached to the surface of the vehicle-mounted display product. Meanwhile, the overall internal resistance of the refrigeration assembly 1 can be reduced, so that the Joule heat effect of the refrigeration assembly 1 is reduced, and the influence of Joule heat on the refrigeration effect of the refrigeration assembly 1 is reduced.

Preferably, the body 161 is provided at the outer circumference thereof with a heat exchanging part 162, and the heat exchanging part 162 is perpendicular to the body 161. The heat exchanging portion 162 can exchange heat with the housing of the vehicle-mounted display product, thereby increasing the heat exchange area and improving the heat exchange efficiency. As shown in fig. 2 and 3, each outer contour of the body 161 is provided with a heat exchanging portion 162, the plurality of heat exchanging portions 162 enclose a frame structure, the vehicle-mounted display product can be accommodated in the frame structure, and the vehicle-mounted display product is cooled from the periphery, so that the heat exchange area between the first heat exchanging portion 16 and the vehicle-mounted display product is increased, the heat generated by the vehicle-mounted display product can be transferred to the heat releasing end more quickly, and the heat dissipation effect is improved.

Further, the refrigeration assembly 1 further comprises two second heat exchange pieces 17, and the two second heat exchange pieces 17 are respectively connected with the second metal piece 12 and the third metal piece 13 in a heat exchange manner. Like the first heat exchange member 16, the second heat exchange member 17 can improve heat exchange efficiency, and the second heat exchange member 17 is also an insulating member, thereby preventing the current flowing through the refrigerating module 1 from affecting other components.

Specifically, the first heat exchanging element 16 and the second heat exchanging element 17 are made of a heat-conducting ceramic material, and heat-conducting silica gel is disposed between the ceramic material and the first metal element 11, the second metal element 12, and the third metal element 13.

As shown in fig. 2 and 3, one end of each of the second metal part 12 and the third metal part 13 extends out of the frame, and the second heat exchanging part 17 extends toward the other opening of the frame and is spaced from the frame. The second heat exchanging part 17 is parallel to and spaced from the heat exchanging part 162, so that the overall size of the refrigerating device can be greatly reduced, and the refrigerating device can be conveniently installed. The second heat exchange member 17 is spaced apart from the frame body, so that heat of the second heat exchange member 17 can be prevented from being transferred to the first heat exchange member 16 to heat the first heat exchange member 16, and the first heat exchange member 16 is influenced to absorb heat generated by the vehicle-mounted display product.

Further, a heat insulator 18 is provided between the second heat exchanger 17 and the heat exchanging portion 162. The heat insulation piece 18 is used for further isolating the heat exchange between the second heat exchange piece 17 and the frame body, so that the heat of the second heat exchange piece 17 can be directly dissipated to the surrounding air, and the heat exchange effect is further improved.

As shown in fig. 2 and 3, the inner surface of the first heat exchange member 16 and/or the outer surface of the second heat exchange member 17 are provided with a plurality of heat dissipation grooves at intervals. It can be understood that the inner surface of the first heat exchange member 16 and the outer surface of the second heat exchange member 17 are both main heat exchange surfaces thereof, and the heat exchange surfaces are provided with a plurality of heat dissipation grooves, so that the effective heat exchange area can be greatly increased, and the heat exchange efficiency can be improved.

Preferably, the first metal piece 11, the second metal piece 12 and the third metal piece 13 are all made of copper. Copper has excellent electric conductivity and heat conductivity, can enough reduce internal resistance to reduce the joule heating effect, can improve the efficiency of heat transfer again, thereby improve this refrigerating plant's refrigeration effect.

The above description is only for the preferred embodiment of the present invention, and for those skilled in the art, there are variations on the detailed description and the application scope according to the idea of the present invention, and the content of the description should not be construed as a limitation to the present invention.

Claims

1. A semiconductor refrigeration device, comprising:

the refrigeration assembly (1) comprises a first metal piece (11), a second metal piece (12) and a third metal piece (13), wherein an N-type semiconductor (14) is electrically connected between the first metal piece (11) and the second metal piece (12), and a P-type semiconductor (15) is electrically connected between the first metal piece (11) and the third metal piece (13);

the power supply assembly (2) comprises a photoelectric conversion element (21), the photoelectric conversion element (21) converts light energy into electric energy, the positive electrode of the power supply assembly (2) is electrically connected with the second metal piece (12), and the negative electrode of the power supply assembly (2) is electrically connected with the third metal piece (13).

2. A semiconductor cooling device according to claim 1, wherein the power module (2) further comprises a rechargeable battery (22), the photoelectric conversion module (21) charges the rechargeable battery (22), and the rechargeable battery (22) supplies power to the cooling module (1).

3. A semiconductor cooling device according to claim 1, characterized in that the cooling module (1) further comprises a first heat exchanging element (16), the first heat exchanging element (16) being in heat exchanging connection with the first metal element (11).

4. A semiconductor refrigeration device according to claim 3, wherein the first heat exchange element (16) comprises an annular body (161), the first metal element (11) is annular and attached to the body (161), and the second metal element (12) and the third metal element (13) are respectively located at two opposite ends of the first metal element (11).

5. A semiconductor refrigeration device according to claim 4, characterized in that the periphery of the body (161) is provided with a heat exchanging portion (162), the heat exchanging portion (162) and the body (161) being perpendicular to each other.

6. A semiconductor refrigeration device according to claim 5, characterized in that the refrigeration assembly (1) further comprises two second heat exchange elements (17), the two second heat exchange elements (17) being in heat exchange connection with the second metal element (12) and the third metal element (13), respectively.

7. A semiconductor cooling device according to claim 6, wherein one end of the second metal piece (12) and one end of the third metal piece (13) both extend out of the body (161), and the second heat exchanging part (17) and the heat exchanging part (162) are arranged in parallel and at a distance.

8. A semiconductor refrigeration device according to claim 7, characterized in that a heat insulating member (18) is arranged between the second heat exchanging member (17) and the heat exchanging portion (162).

9. A semiconductor cooling device according to claim 6, characterized in that the inner surface of the first heat exchanging element (16) and/or the outer surface of the second heat exchanging element (17) are provided with a plurality of heat dissipating grooves at intervals.

10. A semiconductor cooling device according to any one of claims 1-9, characterized in that the first metal piece (11), the second metal piece (12) and the third metal piece (13) are made of copper.