CN209420220U - A kind of mobile phone dorsal clamp type radiator - Google Patents
A kind of mobile phone dorsal clamp type radiator Download PDFInfo
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- CN209420220U CN209420220U CN201821947472.8U CN201821947472U CN209420220U CN 209420220 U CN209420220 U CN 209420220U CN 201821947472 U CN201821947472 U CN 201821947472U CN 209420220 U CN209420220 U CN 209420220U
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- mobile phone
- heat
- radiator
- circuit board
- mounting portion
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Abstract
The utility model discloses a kind of mobile phone dorsal clamp type radiators, the cold and hot two-sided temperature difference is generated using semiconductor chilling plate, temperature with huyashi-chuuka (cold chinese-style noodles) lower than room temperature is contacted by heat-conductive assembly with mobile phone back, generate heat exchange, to reach cooling purpose, quickly, compared with carrying out heat dissipation merely with fan, cooling effect is more preferable for cooling；The radiator includes upper casing and lower casing, and the two is fixedly connected and is enclosed shell；Radiating subassembly and circuit board are fixedly installed in shell, and the two is electrically connected；The radiator further includes heat-conductive assembly, and heat-conductive assembly is fixedly connected with radiating subassembly and is located at the outer surface of upper casing；Outside heat is transmitted to radiating subassembly to radiate by heat-conductive assembly.Refrigeration radiating component can be controlled by circuit board when in use, after the heat and radiator huyashi-chuuka (cold chinese-style noodles) of mobile phone contact, the temperature difference makes the heat of mobile phone to radiator convection current, carries out heat exchange, reduces the heat of the mobile phone of external connection, realizes cooling and heat dissipation.
Description
Technical field
The utility model relates to mobile phone radiating device technical field, in particular to a kind of mobile phone dorsal clamp type radiator.
Background technique
With the rise of smart phone, the dominant frequency of chip is higher and higher, especially requirement of the game mobile phone to the speed of service,
A large amount of heat can be generated in this way, if heat can not radiate in time, heat source position thermal sensation is strong, and cell-phone heating not only influences
Comfort, fever also will affect handset capability and the speed of service, can also burn out hardware.When mobile phone is run, cell output current leads to
Heat can be all generated when crossing all parts, the heat that machine operation generates mainly is exported by back.The master of mobile phone generation heat
The reason of wanting component is CPU, battery plate and battery etc., and mobile phone overheats mainly has three aspects: first is that section resistance is excessive；Second is that thermally conductive
It is insufficient, it radiates unreasonable, heat is caused to be assembled in interior of mobile phone, so that a certain position overheat of mobile phone；Third is that CPU is transported for a long time
Row, power increase.The heat that these components generate is imported into interlayer with large heat capacity by cooling fin, then passes through phone housing
It sheds with heat release hole, therefore we may feel that mobile phone back generates heat when using mobile phone, feel uncomfortable when holding mobile phone, sternly
Ghost image rings handset capability, and the speed of service is obviously slack-off.
In general, normal temperature when mobile phone is run is 30 degree to 50 degree, the comfort not only held more than 50 degree can be reduced,
And the performance of mobile phone also will receive influence.In addition, usually all habit uses mobile phone protecting case part to user on the outside of mobile phone, still
Existing mobile phone protecting case part, be only simply arranged on protective shell the volume button to match with mobile phone model, switch by
Key, earpiece holes, charging hole etc., in order to operate to mobile phone, but existing protective shell is there is no corresponding radiator structure,
It will protect valve jacket on mobile phone, and reduce mobile phone and directly contacted with extraneous, prevent mobile phone from effectively radiating；Handset processes are big
Measure data when can generate a large amount of heat, if heat dissipated not in time, gently if decline handset capability, the speed of service is obvious
It is slack-off, it is heavy then cause irreversible permanent injury to mobile phone hardware.Therefore, the heat at mobile phone back how is effectively reduced
Amount, the speed of service, comfort and sense of safety when raising mobile phone uses, promotes the service performance of mobile phone, the use of extending cell phone
The problem of service life is urgent need to resolve.
The prior art (CN206533405U) discloses a kind of radiator for mobile phone, including radiator casing, radiator casing
On offer the groove for accommodating mobile phone, the bottom of groove offers a plurality of airflow channel, and the inside of the radiator casing is also set
It is equipped with the dynamic fan of drive gas flow, when mobile phone back adstante febre, opens fan-forced air flows flowing, by air cooling-down, cooling
Air flow direction airflow channel afterwards since airflow channel is close to mobile phone back, thus can effectively reduce the heat at mobile phone back, mention
High mobile phone comforts of use and the sense of security promote the service performance of mobile phone, the service life of extending cell phone.But it is above-mentioned existing
Radiator in technology only makes surface radiating function just with Room temperature Mobil, has a single function, and cannot charge to mobile phone
While can not carry out audio conversion.
Utility model content
To solve the above problems, a kind of the purpose of this utility model is to provide structures simple, good heat dissipation effect, applicable
Various sizes of mobile phone, and radiator support is electrically charged and while opponent's machine charges, and can be carried out audio conversion
Mobile phone dorsal clamp type radiator.
To achieve the above object, the technical solution of the utility model is as follows.
The utility model provides a kind of mobile phone dorsal clamp type radiator, including upper casing and lower casing, and the two is fixedly connected and encloses
Conjunction forms shell；Radiating subassembly and circuit board are fixedly installed in the shell, and the two is electrically connected；The radiator further includes leading
Hot component, and the heat-conductive assembly is fixedly connected with the radiating subassembly and is located at the outer surface of the upper casing；It is led by described
Outside heat is transmitted to the radiating subassembly to radiate by hot component.In the present invention, which includes upper casing
And lower casing, and inside is fixedly installed with radiating subassembly, heat-conductive assembly and circuit board, structure is simple, can simplify production process, drops
Low cost of manufacture is conducive to extensive utilization in practice；Radiating subassembly can be controlled by circuit board when in use, thermally conductive group
Part is contacted with mobile phone back, and the heat of mobile phone is after heat-conductive assembly conduction is entered lower than the radiating subassembly of room temperature, radiating subassembly meeting
Carrying out heat exchange to the heat of external mobile phone reduces the heat of the mobile phone of external connection to achieve the purpose that cooling, realizes
Heat dissipation.Wherein, upper casing and lower casing can be fixed with screw, buckle.
Specifically, the radiating subassembly includes semiconductor chilling plate, cooling fin and radiator fan, and the semiconductor refrigerating
Piece, the cooling fin and the radiator fan with the circuit board electrical connection；The semiconductor chilling plate is fixedly mounted on institute
It states in upper casing and is fixedly connected with the heat-conductive assembly；The cooling fin is fixedly mounted on the inner surface of the upper casing and is close to institute
State semiconductor chilling plate；The lower casing is equipped with the first mounting portion and the second mounting portion, and second installation position is in described
The lower section of first mounting portion；The cooling fin and the radiator fan are respectively positioned in first mounting portion；The radiator fan
The lower section of the cooling fin is fixedly connected with and is located at the cooling fin；The circuit board is fixedly mounted on second mounting portion
It is interior.When in use, the refrigeration modes that the cold and hot temperature difference is generated using semiconductor chilling plate, when the one side of semiconductor chilling plate refrigeration is logical
It crosses heat-conductive assembly to contact with mobile phone back, semiconductor refrigerating sector-meeting absorbs phone housing heat, heat exchange is generated, so as to make
The mobile phone of outside installation achievees the purpose that cooling, cooling are quick rapid；Semiconductor chilling plate constantly carries out heat with mobile phone and exchanges,
Temperature can be promoted, and the heat that cooling fin generates when can act on semiconductor chilling plate radiates, and radiator fan can be blown away
The heat that cooling fin is obtained from semiconductor chilling plate enables the radiator while making mobile phone cool down, itself is not hot, heat dissipation effect
Fruit is good.Wherein, using semiconductor chilling plate, the metal fins such as aluminium alloy are can be used in cooling fin, and radiator fan can be direct current
Radiator fan enhances heat dissipation effect；In addition, radiator fan can design chromatic colour light or breath light effect, make the utensil that radiates
There are fashion, technology sense.
Specifically, mounting hole is provided on the upper casing, and the mounting hole and first mounting portion are laminated；It is described partly to lead
Body cooling piece is fixedly mounted in the mounting hole, and the upper and lower surfaces of the semiconductor chilling plate are led with described respectively
Hot component and cooling fin heat-conducting silicone grease adhesion.Mounting hole is set, is mounted in upper casing convenient for semiconductor chilling plate, also makes
Semiconductor chilling plate contacts well with heat-conductive assembly.
Specifically, the top of first mounting portion is equipped with air inlet；First mounting portion bottom surface is equipped with air outlet；Institute
State formation air-flow flow channel between air inlet, first mounting portion and the air outlet.Radiator fan is from air inlet into cold
Wind blows to cooling fin, and after taking away the heat on cooling fin, heat dissipation effect is can be enhanced from air outlet in hot wind, and will not be because
Hot wind blower and influence feel.
Specifically, the heat-conductive assembly includes the first thermally conductive sheet and the second thermally conductive sheet；First thermally conductive sheet is fixed on institute
State the outer surface of upper casing and with the semiconductor chilling plate adhesion；Second thermally conductive sheet is covered on the table of first thermally conductive sheet
Face.First thermally conductive sheet can use thermally conductive aluminium flake, and the heat of mobile phone is conducted to radiator；Second thermally conductive sheet can use
Heat-conducting silica gel sheet or hydrogel sheet make the heat of mobile phone carry out heat with radiator and exchange, enhance heat-conducting effect.
Specifically, which further includes telescopic component；The telescopic component be fixed on the lower casing bottom and with it is described
Shell surrounds the accommodation space for accommodating external mobile phone.Setting telescopic component can accommodate and support fixed mobile phone.
Specifically, the telescopic component includes telescopic head and flexible clip cover；It is integrally formed and is connected on the telescopic head
Metal guide rail；The metal guide rail and the telescopic head are fixed on the lower casing bottom by the flexible clip cover；It is described
Spring, and the flexible size to control the accommodation space for passing through the spring are fixedly connected in metal guide rail；It is described to stretch
Soft rubber cushion is additionally provided on drop-head.The space for accommodating mobile phone is adjusted using the Telescopic inside telescopic component, first is that making by hand
Facilitate operation when machine and the heat dissipation device combination, second is that in order to make the applicable various sizes of mobile phone of the radiator.Wherein, telescopic clamp
When metal guide rail and telescopic head are fixed on lower casing bottom by skull, it can be screwed；Setting soft rubber cushion protect mobile phone not by
Abrasion.
Specifically, the shell is equipped with MicroUSB audio charging translation interface, and the MicroUSB audio charges
Translation interface and the circuit board electrical connection；The circuit board is equipped with DC3.5 earphone interface and Type-c data line interface, and
The two with the circuit board electrical connection.Circuit board and MicroUSB audio charging translation interface are the fortune to the prior art
With；MicroUSB audio charges Interface Design to be equipped with mobile phone, can carry out audio conversion, can be filled when in use with side
Audio is monitored on electric side, avoids to put outside sound when charging.
Specifically, which is additionally provided with the MicorUSB- being adapted to MicroUSB audio charging translation interface
Type-c data line, and the MicorUSB-Type-c data line and Type-c audio charging translation interface are detachable
Connection.Company when MicroUSB-Type-c data line is charged the phone for radiator and mobile phone progress audio conversion or radiator
Use is connect, is not connected to when not needing charging or audio is converted, connection easy to disassemble uses；Wherein, MicroUSB-Type-c
Data line also uses the prior art.In addition, MicroUSB-Type-c data line can be used for quick charge, enable the radiator that can adopt
Mobile phone power supply is given with fast charge technology, solves the problems, such as to charge the phone power while freezing inadequate, does not need separately to match power supply
Adapter need to only be powered with fast charge adapter to radiator, and fast charge technology is also the prior art.
The advantage of the utility model is: compared with the prior art, in the utility model, using a kind of mobile phone back splint
Formula radiator, including upper casing and lower casing, and the two is fixedly connected and is enclosed shell；Heat dissipation is fixedly installed in the shell
Component and circuit board, and the two is electrically connected；The radiator further includes heat-conductive assembly, and the heat-conductive assembly and the radiating subassembly
It is fixedly connected with and is located at the outer surface of the upper casing；By the heat-conductive assembly by outside heat be transmitted to the radiating subassembly come
It radiates.In the present invention, which includes upper casing and lower casing, and inside is fixedly installed with radiating subassembly, thermally conductive
Component and circuit board, structure is simple, can simplify production process, reduces cost of manufacture, is conducive to extensive utilization in practice；Make
Used time can control radiating subassembly by circuit board, and heat-conductive assembly is contacted with mobile phone back, and the heat of mobile phone is through thermally conductive group
After part conduction enters radiating subassembly, radiating subassembly can be handled the heat of external mobile phone, heat exchange be carried out, to reach
The purpose of cooling reduces the heat of the mobile phone of external connection, realizes heat dissipation.Wherein, upper casing and lower casing can be fixed with screw.
Detailed description of the invention
Fig. 1 is a kind of overall structure diagram of mobile phone dorsal clamp type radiator of the utility model.
Fig. 2 is a kind of explosive view of mobile phone dorsal clamp type radiator of the utility model.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain
The utility model is not used to limit the utility model.
To achieve the above object, the technical solution of the utility model is as follows.
Referring to Fig. 1-2, the utility model provides a kind of mobile phone dorsal clamp type radiator, including upper casing 1 and lower casing 2, and the two
It is fixedly connected and is enclosed shell 3；Radiating subassembly 31 and circuit board 32 are fixedly installed in shell 3, and the two is electrically connected；It should
Radiator further includes heat-conductive assembly 33, and heat-conductive assembly 33 is fixedly connected with and is located at the outer surface of upper casing 1 with radiating subassembly 31；It is logical
It crosses heat-conductive assembly 33 and outside heat is transmitted to radiating subassembly 31 to radiate.In the present invention, which includes
Upper casing 1 and lower casing 2, and inside is fixedly installed with radiating subassembly 31, heat-conductive assembly 33 and circuit board 32, structure is simple, Ke Yijian
Change production process, reduce cost of manufacture, is conducive to extensive utilization in practice；It when in use can be by circuit board 32 to radiating subassembly
31 are controlled, when external mobile phone heat through heat-conductive assembly 33 conduction enter radiating subassembly 31 after, 31 meeting of refrigeration radiating component
The heat of mobile phone is handled, heat exchange is carried out, reduces the heat of the mobile phone of external connection, realizes cooling.Wherein, upper casing
1 and lower casing 2 can be fixed with screw 0.
In the present embodiment, refrigeration radiating component 31 includes semiconductor chilling plate 311, cooling fin 312 and radiator fan
313, and semiconductor chilling plate 311, cooling fin 312 and radiator fan 313 are electrically connected with circuit board 32；Semiconductor chilling plate
311 are fixedly mounted in upper casing 1 and are fixedly connected with heat-conductive assembly 33；Cooling fin 312 is fixedly mounted on the inner surface of upper casing 1 simultaneously
It is close to semiconductor chilling plate 311；Lower casing 2 is equipped with the first mounting portion 21 and the second mounting portion 22, and the second mounting portion 22 is located at
The lower section of first mounting portion 21；Cooling fin 312 and radiator fan 313 are respectively positioned in the first mounting portion 21；Radiator fan 313 and dissipate
Backing 312 is fixedly connected and is located at the lower section of cooling fin 312；Circuit board 32 is fixedly mounted in the second mounting portion 22.It is using
When, the refrigeration modes of the cold and hot temperature difference are generated using semiconductor chilling plate 311, when the cold one side of semiconductor chilling plate 311 is by leading
When hot component 33 is contacted with mobile phone back, semiconductor chilling plate 311 can absorb heat, heat exchange be generated, so as to make outside
The mobile phone of installation achievees the purpose that cooling, cooling are quick rapid；Semiconductor chilling plate 311 constantly carries out heat with mobile phone and exchanges,
Temperature can be promoted, and it is outer that cooling fin 312 can make semiconductor chilling plate 311 that it be kept to absorb to the effect of semiconductor chilling plate 311
Boundary's heat function, radiator fan 313 can blow away the heat that cooling fin 312 is obtained from semiconductor chilling plate 311, and the radiator is enabled to exist
While so that mobile phone is cooled down, not hot, good heat dissipation effect itself.Wherein, semiconductor chilling plate 311 uses semiconductor semiconductor system
Cold, the metal fins such as aluminium alloy can be used in cooling fin 312, and radiator fan 313 can be DC radiation fan, enhancing heat dissipation
Effect；In addition, radiator fan 313 can design chromatic colour light or breath light effect, make radiator that there is fashion, technology sense.
In the present embodiment, mounting hole 11 is provided on upper casing 1, and mounting hole 11 and the first mounting portion 21 are laminated；Semiconductor
Cooling piece 311 is fixedly mounted in mounting hole 11, and the upper and lower surfaces of semiconductor chilling plate 311 respectively with heat-conductive assembly
33 and 312 adhesion of cooling fin.Mounting hole 11 is set, is mounted in upper casing 1 convenient for semiconductor chilling plate 311, also makes semiconductor system
It is contacted with heat-conductive assembly 33 well for cold 311.
In the present embodiment, the top of the first mounting portion 21 is equipped with air inlet 211；First mounting portion, 21 bottom surface is equipped with outlet air
Mouth 212；Air-flow flow channel (not shown) is formed between air inlet 211, the first mounting portion 21 and air outlet 212.Radiator fan
313 from air inlet 211 into cold wind, blows to cooling fin 312, and after taking away the heat on cooling fin 312, hot wind goes out from air outlet 212
Wind can be enhanced heat dissipation effect, and will not influence feel because of hot wind blower.
In the present embodiment, heat-conductive assembly 33 includes the first thermally conductive sheet 331 and the second thermally conductive sheet 332；First thermally conductive sheet 331
Be fixed on the outer surface of upper casing 1 and with 311 adhesion of semiconductor chilling plate；Second thermally conductive sheet 332 is covered on the first thermally conductive sheet 331
Surface.First thermally conductive sheet 331 can use thermally conductive aluminium flake, and the heat of mobile phone is carried out heat with radiator and is exchanged；Second is thermally conductive
Piece 332 can use heat-conducting silica gel sheet or hydrogel sheet, so that the heat of mobile phone is carried out heat with radiator and exchange, enhance thermally conductive effect
Fruit.
In the present embodiment, which further includes telescopic component 4；Telescopic component 4 is fixed on 2 bottom of lower casing and and shell
3 surround the accommodation space (not shown) for accommodating external mobile phone.Setting telescopic component 4 can accommodate and support fixed mobile phone.
In the present embodiment, telescopic component 4 includes telescopic head 41 and flexible clip cover 42；The company of integrated molding on telescopic head 41
It is connected to metal guide rail 43；Metal guide rail 43 and telescopic head 41 are fixed on 2 bottom of lower casing by flexible clip cover 42；Metal guide rail
Spring 44, and the flexible size to control accommodation space for passing through spring 44 are fixedly connected on 43；It is additionally provided on telescopic head 41
Soft rubber cushion 411.The space for accommodating mobile phone is adjusted using the Telescopic inside telescopic component 4, first is that making dissipating mobile phone with this
Hot device facilitates operation when combining, second is that in order to make the applicable various sizes of mobile phone of the radiator.Wherein, stretching clip cover 42 will
It, can be fixed by screw 0 when metal guide rail 43 and telescopic head 41 are fixed on 2 bottom of lower casing；Setting soft rubber cushion 411 protects mobile phone not
It is worn.
In the present embodiment, shell 3 is equipped with MicroUSB audio charging interface 34, and MicroUSB audio charging interface
34 are electrically connected with circuit board 32；Circuit board 32 is equipped with DC3.5 earphone interface 321 and Type-c data line interface 322, and the two
It is electrically connected with circuit board 32.Circuit board 32 and MicroUSB audio charging interface 34 are the utilization to the prior art；
MicroUSB audio charging interface 34 is designed as being equipped with mobile phone, can carry out audio conversion, when in use can be in charging
Audio is listened, avoids to put outside sound when charging.
In the present embodiment, which is additionally provided with the MicroUSB- being adapted to MicroUSB audio charging interface 34
Type-c data line 5, and MicroUSB-Type-c data line 5 and 34 detachable connection of MicroUSB audio charging interface are simultaneously
It is electrically connected with circuit board 32.MicroUSB-Type-c data line 5 carries out audio conversion with mobile phone for radiator or radiator is given
Connection uses when the mobile phone is charging, is not connected to when not needing charging or audio is converted, and connection easy to disassemble uses；Wherein,
MicroUSB-Type-c data line also uses the prior art.
The advantage of the utility model is: compared with the prior art, in the utility model, using a kind of mobile phone back splint
Formula radiator, including upper casing 1 and lower casing 2, and the two is fixedly connected and is enclosed shell 3；Heat dissipation is fixedly installed in shell 3
Component 31 and circuit board 32, and the two is electrically connected；The radiator further includes heat-conductive assembly 33, and heat-conductive assembly 33 and radiating subassembly
31 are fixedly connected with and are located at the outer surface of upper casing 1；Outside heat is radiated with radiating subassembly 31 by heat-conductive assembly 33.
In the present invention, which includes upper casing 1 and lower casing 2, and inside is fixedly installed with radiating subassembly 31, heat-conductive assembly 33
With circuit board 32, structure is simple, can simplify production process, reduces cost of manufacture, is conducive to extensive utilization in practice；It is using
When radiating subassembly 31 can be controlled by circuit board 32, when external mobile phone heat through heat-conductive assembly 33 conduction enter heat dissipation
After component 31, the meeting of radiating subassembly 31 carries out heat exchange to the heat of mobile phone, reduces the heat of the mobile phone of external connection, realizes drop
Temperature.Wherein, upper casing 1 and lower casing 2 can be fixed with screw 0.
The above is only the preferred embodiments of the present utility model only, is not intended to limit the utility model, all practical at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the guarantor of the utility model within novel spirit and principle
Within the scope of shield.
Claims (9)
1. a kind of mobile phone dorsal clamp type radiator, which is characterized in that including upper casing and lower casing, and the two is fixedly connected and is enclosed
Shell；Radiating subassembly and circuit board are fixedly installed in the shell, and the two is electrically connected；The radiator further includes thermally conductive group
Part, and the heat-conductive assembly is fixedly connected with the radiating subassembly and is located at the outer surface of the upper casing；Pass through described thermally conductive group
Outside heat is transmitted to the radiating subassembly to radiate by part.
2. a kind of mobile phone dorsal clamp type radiator as described in claim 1, which is characterized in that the radiating subassembly includes semiconductor
Cooling piece, cooling fin and radiator fan, and the semiconductor chilling plate, the cooling fin and the radiator fan with the electricity
The electrical connection of road plate；The semiconductor chilling plate is fixedly mounted in the upper casing and is fixedly connected with the heat-conductive assembly；It is described
Cooling fin is fixedly mounted on the inner surface of the upper casing and is close to the semiconductor chilling plate；The lower casing is equipped with the first installation
Portion and the second mounting portion, and second installation position is in the lower section of first mounting portion；The cooling fin and the heat dissipation
Fan is respectively positioned in first mounting portion；The radiator fan is fixedly connected with the cooling fin and is located at the cooling fin
Lower section；The circuit board is fixedly mounted in second mounting portion.
3. a kind of mobile phone dorsal clamp type radiator as claimed in claim 2, which is characterized in that it is provided with mounting hole on the upper casing,
And the mounting hole and first mounting portion are laminated；The semiconductor chilling plate is fixedly mounted in the mounting hole, and institute
State the upper and lower surfaces of semiconductor chilling plate respectively with the heat-conductive assembly and the cooling fin adhesion.
4. a kind of mobile phone dorsal clamp type radiator as claimed in claim 2, which is characterized in that set at the top of first mounting portion
There is air inlet；First mounting portion bottom surface is equipped with air outlet；The air inlet, first mounting portion and the air outlet it
Between formed air-flow flow channel.
5. a kind of mobile phone dorsal clamp type radiator as claimed in claim 2, which is characterized in that the heat-conductive assembly is led including first
Backing and the second thermally conductive sheet；First thermally conductive sheet is fixed on the outer surface of the upper casing and glues with the semiconductor chilling plate
Even；Second thermally conductive sheet is covered on the surface of first thermally conductive sheet.
6. a kind of mobile phone dorsal clamp type radiator as described in claim 1, which is characterized in that the radiator further includes flexible group
Part；The telescopic component is fixed on the lower casing bottom and surrounds the accommodation space for accommodating external mobile phone with the shell.
7. a kind of mobile phone dorsal clamp type radiator as claimed in claim 6, which is characterized in that the telescopic component includes telescopic head
With flexible clip cover；It is integrally formed on the telescopic head and is connected with metal guide rail；By the flexible clip cover by the metal
Guide rail and the telescopic head are fixed on the lower casing bottom；It is fixedly connected with spring in the metal guide rail, and passes through the bullet
The flexible size to control the accommodation space of spring；Soft rubber cushion is additionally provided on the telescopic head.
8. a kind of mobile phone dorsal clamp type radiator as claimed in claim 2, which is characterized in that the shell is equipped with MicroUSB
Audio charging translation interface, and MicroUSB audio charging translation interface and the circuit board electrical connection；The circuit board
Be equipped with DC3.5 earphone interface and Type-c data line interface, and the two with the circuit board electrical connection.
9. a kind of mobile phone dorsal clamp type radiator as claimed in claim 8, which is characterized in that the radiator be additionally provided with it is described
The MicorUSB-Type-c data line of MicroUSB audio charging translation interface adaptation, and the MicorUSB-Type-c data
Line and Type-c audio charging translation interface detachable connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821947472.8U CN209420220U (en) | 2018-11-23 | 2018-11-23 | A kind of mobile phone dorsal clamp type radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821947472.8U CN209420220U (en) | 2018-11-23 | 2018-11-23 | A kind of mobile phone dorsal clamp type radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209420220U true CN209420220U (en) | 2019-09-20 |
Family
ID=67935159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821947472.8U Active CN209420220U (en) | 2018-11-23 | 2018-11-23 | A kind of mobile phone dorsal clamp type radiator |
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| Country | Link |
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| CN (1) | CN209420220U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110626288A (en) * | 2019-09-26 | 2019-12-31 | 山东凡迈电子科技有限公司 | Vehicle-mounted temperature control mobile phone supporting device |
| CN111111094A (en) * | 2020-02-26 | 2020-05-08 | 广州市唯赢智能科技有限公司 | Agile response trainer and method |
| CN111712104A (en) * | 2020-06-15 | 2020-09-25 | 维沃移动通信有限公司 | Heat dissipation back splint and electronic equipment subassembly |
| CN112601424A (en) * | 2020-12-15 | 2021-04-02 | 维沃移动通信有限公司 | Heat dissipation back splint |
-
2018
- 2018-11-23 CN CN201821947472.8U patent/CN209420220U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110626288A (en) * | 2019-09-26 | 2019-12-31 | 山东凡迈电子科技有限公司 | Vehicle-mounted temperature control mobile phone supporting device |
| CN111111094A (en) * | 2020-02-26 | 2020-05-08 | 广州市唯赢智能科技有限公司 | Agile response trainer and method |
| CN111712104A (en) * | 2020-06-15 | 2020-09-25 | 维沃移动通信有限公司 | Heat dissipation back splint and electronic equipment subassembly |
| CN111712104B (en) * | 2020-06-15 | 2022-11-18 | 维沃移动通信有限公司 | Heat dissipation back splint and electronic equipment subassembly |
| CN112601424A (en) * | 2020-12-15 | 2021-04-02 | 维沃移动通信有限公司 | Heat dissipation back splint |
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