CN218570764U

CN218570764U - BDU integrated heat abstractor and electric vehicle

Info

Publication number: CN218570764U
Application number: CN202222819123.0U
Authority: CN
Inventors: 邓善庆; 谢应芳; 邢大龙; 陈伟; 叶斌
Original assignee: GAC Aion New Energy Automobile Co Ltd
Current assignee: GAC Aion New Energy Automobile Co Ltd
Priority date: 2022-10-24
Filing date: 2022-10-24
Publication date: 2023-03-03
Anticipated expiration: 2032-10-24

Abstract

The embodiment of the application provides an integrated heat abstractor of BDU and electric vehicle relates to battery technical field. The BDU integrated heat dissipation device comprises a liquid cooling plate assembly, a BDU body assembly and a fixing mechanism; the liquid cooling plate assembly comprises a liquid cooling runner plate and a liquid cooling plate substrate, and the liquid cooling runner plate and the liquid cooling plate substrate are installed in a matched mode; the liquid cooling plate substrate is fixedly arranged on the surface of the BDU body assembly, and the BDU body assembly, the liquid cooling plate substrate and the liquid cooling runner plate are arranged in a stacked mode; the liquid cooling plate substrate and the BDU body assembly are installed through the fixing mechanism. The BDU integrated heat dissipation device can achieve the technical effect of improving the arrangement flexibility and the heat dissipation efficiency.

Description

BDU integrated heat abstractor and electric vehicle

Technical Field

The application relates to the technical field of batteries, in particular to a BDU integrated heat dissipation device and an electric vehicle.

Background

At present, for heat dissipation of a Battery pack disconnection Unit (BDU), one is to add a heat dissipation boss in the BDU, and a heat dissipation groove is arranged at the top of the heat dissipation boss for heat dissipation, which is a traditional passive heat dissipation structure, heat is conducted to the heat dissipation groove, and the heat dissipation groove exchanges heat with surrounding air, because the heat exchange coefficient of the air is low, the BDU heat dissipation structure in the form is low in efficiency, and the defect that the heat is accumulated in the BDU and cannot be dissipated exists; the other type is that a phase change material or a high specific heat capacity material is arranged in the heat dissipation groove and is used as a heat dissipation medium; however, the heat dissipation is still passive, and the heat still has the disadvantage of being accumulated inside the BDU; the other is to place the BDU on the water-cooling board of battery package, and this scheme needs to set up the runner for the BDU specially on the water-cooling board of battery package, and the water-cooling board runner setting of battery package is for battery module heat dissipation service, if consider that the BDU dispels the heat and arrange the runner and can cause the water-cooling board to arrange the degree of difficulty big, and be subject to the arrangement of water-cooling runner and other structures of battery package, arrange the flexibility poor. It can be seen that in each scheme in the prior art, BDUs with natural heat dissipation have poor heat dissipation, performance degradation and potential safety risk; the BDU with passive heat dissipation also influences the peripheral parts; the heat dissipation related components have difficulty in arrangement and poor arrangement flexibility.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the application is to provide a BDU integrated heat dissipation device and an electric vehicle, which can realize the technical effects of improving the arrangement flexibility and the heat dissipation efficiency.

In a first aspect, an embodiment of the application provides a BDU integrated heat dissipation device, which includes a liquid cooling plate assembly, a BDU body assembly, and a fixing mechanism;

the liquid cooling plate assembly comprises a liquid cooling runner plate and a liquid cooling plate substrate, and the liquid cooling runner plate and the liquid cooling plate substrate are installed in a matched mode;

the liquid cooling plate substrate is fixedly arranged on the surface of the BDU body assembly, and the BDU body assembly, the liquid cooling plate substrate and the liquid cooling runner plate are arranged in a stacked mode;

the liquid cooling plate substrate and the BDU body assembly are installed through the fixing mechanism.

In the implementation process, the liquid cooling plate assembly and the BDU body assembly are assembled and fixed together through the fixing mechanism by the BDU integrated heat dissipation device, heat generated by the BDU body assembly is sequentially transmitted to the liquid cooling plate substrate and the liquid cooling runner plate, and active heat dissipation is carried out by the liquid cooling plate substrate, so that the problems that the traditional BDU naturally or passively dissipates heat slowly and the heat is accumulated in the plastic shell and is difficult to discharge are solved, the problem that the temperature of the BDU is quickly raised under a high-power working condition, particularly under a quick-charging working condition is solved, and the problem that the temperature difference of the whole package module is caused by the influence of the traditional BDU naturally or passively dissipates heat on peripheral parts, particularly close modules is solved; in addition, the BDU integrated heat dissipation device is in an active heat dissipation mode, and can be flexibly and independently arranged at any position of the battery pack so as to control the temperature of heat source equipment; therefore, the BDU integrated heat dissipation device can achieve the technical effect of improving the arrangement flexibility and the heat dissipation efficiency.

Further, the device also comprises a battery damping mechanism, and the battery damping mechanism is fixedly installed with the BDU body assembly.

In the implementation process, the BDU body assembly can be fixedly arranged on the battery through the battery damping mechanism, and the arrangement flexibility is increased.

Further, the liquid cooling runner plate is provided with a liquid cooling pipeline assembly, the liquid cooling pipeline assembly comprises a first liquid cooling pipeline and a second liquid cooling pipeline, the first liquid cooling pipeline is connected with the inlet liquid cooling, and the second liquid cooling pipeline is connected with the inlet liquid cooling.

In the implementation process, the first liquid cooling pipeline and the second liquid cooling pipeline are communicated with the flow channel of the liquid cooling flow channel plate, so that liquid cooling circulation of the cooling liquid is realized.

Further, the device also comprises a heat conduction interface mechanism, wherein the heat conduction interface mechanism is arranged between the liquid cooling plate substrate and the BDU body assembly, and the surface of the heat conduction interface mechanism is respectively contacted with the surface of the liquid cooling plate substrate and the surface of the BDU body assembly.

In the implementation process, the heat generated by the BDU body assembly can be more efficiently transferred to the liquid cooling plate substrate by the surface contact of the heat conducting interface mechanism and the BDU body assembly.

Further, the heat-conducting interface mechanism is one or more of a heat-conducting insulating silica gel pad, a heat-conducting insulating foam pad, heat-conducting gel and heat-conducting structural adhesive.

Further, the liquid cooling runner of the liquid cooling runner plate is provided with a turbulence mechanism.

In the implementation process, the flow channel is provided with the turbulence mechanism, laminar flow of liquid cooling can be destroyed, and turbulence effect is artificially manufactured, so that the convection heat transfer coefficient is improved, and the heat transfer effect is maximized.

Furthermore, the turbulence mechanism is a circular turbulence mechanism, the diameter of the circular turbulence mechanism is 8-16mm, the height of the circular turbulence mechanism is 3-5mm, and the circular turbulence mechanisms are arranged in a cross mode, and the arrangement distance is 10-20mm.

Further, BDU body subassembly includes BDU shell and copper bar heat dissipation mechanism, copper bar heat dissipation mechanism install in the BDU shell, liquid cooling board base plate with the surface laminating installation of BDU shell.

Further, the fixing mechanism is a bolt mechanism.

In a second aspect, embodiments of the present application provide an electric vehicle including the BDU integrated heat sink of any one of the first aspects.

Additional features and advantages of the disclosure will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the above-described techniques.

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.

Fig. 1 is a schematic view illustrating a first perspective structure of a BDU integrated heat dissipation device according to an embodiment of the present disclosure;

fig. 2 is a schematic view of a second perspective structure of the BDU integrated heat dissipation device according to the embodiment of the present disclosure;

FIG. 3 is a schematic structural diagram of a liquid cooling plate assembly according to an embodiment of the present application;

fig. 4 is a schematic structural diagram of a liquid-cooled runner plate and a heat-conducting interface mechanism according to an embodiment of the present disclosure;

fig. 5 is a schematic structural view of a liquid cooling runner plate according to an embodiment of the present disclosure;

fig. 6 is a schematic diagram of a first series connection structure of a liquid cooling plate and a liquid cooling runner plate of a battery pack according to an embodiment of the present disclosure;

fig. 7 is a schematic diagram of a second series structure of a liquid cooling plate and a liquid cooling runner plate for a battery pack according to an embodiment of the present disclosure;

fig. 8 is a schematic diagram of a parallel structure of a battery pack liquid cooling plate and a liquid cooling runner plate according to an embodiment of the present application.

Icon: a liquid cooled plate assembly 100; a liquid-cooled runner plate 110; a liquid cooling flow passage 111; a liquid cooled substrate 120; a liquid cooling line assembly 130; the first liquid cooling line 131; a second liquid-cooled line 132; a spoiler 140; a BDU body assembly 200; a fixing mechanism 300; a battery damper mechanism 400; a thermally conductive interface mechanism 500; the battery wraps the liquid cooling plate 600.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. The components of the embodiments of the present application, as generally described and illustrated in the figures herein, could be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present application without making any creative effort, shall fall within the protection scope of the present application.

In this application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.

Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or a point connection; either directly or indirectly through intervening media, or may be an internal communication between two devices, elements or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

Furthermore, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific nature and configuration may be the same or different), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.

The embodiment of the application provides a BDU integrated heat dissipation device and an electric vehicle, which can be applied to a battery system of a pure electric/plug-in hybrid electric vehicle; the BDU integrated heat dissipation device assembles and fixes the liquid cooling plate component and the BDU body component together through the fixing mechanism, heat generated by the BDU body component is sequentially transferred to the liquid cooling plate substrate and the liquid cooling runner plate, and active heat dissipation is carried out by the liquid cooling plate substrate, so that the problems that the traditional natural heat dissipation or passive heat dissipation BDU is slow in heat dissipation and difficult to discharge when heat is accumulated in a plastic shell are solved, the problem that the temperature of the BDU is fast under a high-power working condition, particularly a fast-charging working condition is solved, and the problem that the temperature difference of a whole package module is caused by the influence of the traditional natural heat dissipation or passive heat dissipation BDU on peripheral components, particularly modules close to each other is solved; in addition, the BDU integrated heat dissipation device is in an active heat dissipation mode, and can be flexibly and independently arranged at any position of the battery pack so as to control the temperature of heat source equipment; therefore, the BDU integrated heat dissipation device can achieve the technical effect of improving the arrangement flexibility and the heat dissipation efficiency.

An object of the embodiment of the application is to provide a BDU integrated heat dissipation device and an electric vehicle, can realize improving the technical effect who arranges flexibility and radiating efficiency.

Referring to fig. 1, fig. 1 is a schematic view illustrating a first perspective structure of a BDU integrated heat sink device according to an embodiment of the present disclosure, where the BDU integrated heat sink device includes a liquid cooling plate assembly 100, a BDU body assembly 200, and a fixing mechanism 300.

Illustratively, the liquid cooling plate assembly 100 includes a liquid cooling runner plate 110 and a liquid cooling plate substrate 120, and the liquid cooling runner plate 110 and the liquid cooling plate substrate 120 are installed in a matching manner.

Illustratively, liquid cooling is circulated within the liquid cooling runner plate 110.

Illustratively, the liquid cooling plate substrate 120 is fixedly mounted on the surface of the BDU body assembly 200, and the BDU body assembly 200, the liquid cooling plate substrate 120, and the liquid cooling runner plate 110 are mounted in a stacked manner.

Illustratively, heat generated by the BDU body assembly 200 is transferred from the liquid-cooled plate substrate 120 to the liquid-cooled runner plate 110, and finally is carried away by the liquid-cooled runner plate 110; thus, active heat dissipation of the BDU body assembly 200 is achieved.

Illustratively, the liquid cooled plate substrate 120 and BDU body assembly 200 are mounted via a securing mechanism 300.

In some embodiments, the liquid cooled plate substrate 120 and the BDU body assembly 200 are mounted in connection by the fastening mechanism 300, thereby forming an active BDU cooling device and system with self-cooling.

Exemplarily, the BDU integrated heat dissipation device assembles and fixes the liquid cooling plate assembly and the BDU body assembly together through a fixing mechanism, heat generated by the BDU body assembly is sequentially transferred to the liquid cooling plate substrate and the liquid cooling runner plate, and active heat dissipation is carried out by the liquid cooling plate substrate, so that the problems that the traditional BDU naturally or passively dissipates heat slowly and the heat is accumulated in a plastic shell and is difficult to discharge are solved, the problem that the temperature rise of the BDU under a high-power working condition, particularly under a fast-charging working condition, is fast is solved, and the problem that the temperature difference of a whole package module is caused by the influence of the traditional BDU naturally or passively dissipates heat on peripheral parts, particularly close modules is solved; in addition, the BDU integrated heat dissipation device is in an active heat dissipation mode, and can be flexibly and independently arranged at any position of the battery pack so as to control the temperature of heat source equipment; therefore, the BDU integrated heat dissipation device can achieve the technical effect of improving the arrangement flexibility and the heat dissipation efficiency.

Referring to fig. 2, fig. 2 is a schematic view illustrating a second perspective structure of the BDU integrated heat dissipation device according to the embodiment of the present disclosure.

Illustratively, the BDU integrated heat sink further includes a battery damping mechanism 400, and the battery damping mechanism 400 is fixedly mounted to the BDU body assembly 200.

Illustratively, the BDU body assembly 200 may be fixedly mounted to the battery via the battery dampening mechanism 400, increasing flexibility of arrangement.

Optionally, the battery cushioning mechanism 400 is a cushion.

Illustratively, the liquid cooling runner plate 110 is provided with a liquid cooling pipe assembly 130, the liquid cooling pipe assembly 130 includes a first liquid cooling pipe 131 and a second liquid cooling pipe 132, the first liquid cooling pipe 131 is connected to the inlet liquid cooling, and the second liquid cooling pipe 132 is connected to the inlet liquid cooling.

Illustratively, the liquid cooling channels 111 of the liquid cooling channel plate 110 are communicated through the first liquid cooling pipeline 131 and the second liquid cooling pipeline 132, so as to realize the liquid cooling circulation of the cooling liquid.

Referring to fig. 3, fig. 3 is a schematic structural diagram of a liquid cooling plate assembly according to an embodiment of the present disclosure.

Illustratively, the BDU integrated heat sink further includes a heat conducting interface mechanism 500, wherein the heat conducting interface mechanism 500 is installed between the liquid cooling board substrate 120 and the BDU body assembly 200, and a surface of the heat conducting interface mechanism 500 is in contact with a surface of the liquid cooling board substrate 120 and a surface of the BDU body assembly 200, respectively.

Illustratively, by having the thermally conductive interface mechanism 500 in contact with a surface of the BDU body assembly 200, heat generated by the BDU body assembly 200 may be more efficiently transferred to the liquid-cooled plate substrate 120.

Illustratively, the thermal interface mechanism 500 is one or more of a thermal conductive and insulating silicone pad, a thermal conductive and insulating foam pad, a thermal conductive gel, and a thermal conductive structural adhesive.

In some embodiments, other types of materials may be used for the thermal interface mechanism 500, and are not limited herein.

Referring to fig. 4 and 5, fig. 4 is a schematic structural view of a liquid-cooling flow channel plate and a heat conducting interface mechanism according to an embodiment of the present application, and fig. 5 is a schematic structural view of the liquid-cooling flow channel plate according to the embodiment of the present application.

Illustratively, the liquid-cooling flow passage of the liquid-cooling flow passage plate 110 is provided with a flow disturbing mechanism 140.

Illustratively, the flow perturbation mechanism 140 can enhance the heat dissipation of the liquid cooling flow channel plate 110; the liquid cooling channel of the liquid cooling channel plate 110 can disturb the flow of liquid in the liquid cooling channel by arranging the disturbing mechanism 140, thereby enhancing the heat dissipation function.

Illustratively, in order to maximize the heat exchange effect, a flow-disturbing mechanism 140, such as a circular flow-disturbing mechanism shown in fig. 5, may be disposed on the flow channel to break down the laminar flow of the liquid cooling, artificially create a turbulent flow effect, and increase the heat convection coefficient.

It should be noted that the turbulence mechanism 140 is a cylindrical structure, which is only an example, and may be a rectangular transition with round corners, a kidney-shaped transition, a square transition with round corners, a polygonal transition with round corners, or the like. In order to reduce the flow resistance and the power consumption of the water pump, the flow disturbance mechanism 140 is optimally arranged below the heat conduction interface mechanism 500, and the flow disturbance mechanism 140 is not arranged at other positions such as an inlet or an outlet.

In some embodiments, the turbulence mechanism 140 is a circular turbulence mechanism, the diameter of the circular turbulence mechanism is 8-16mm, the height of the circular turbulence mechanism is 3-5mm, and the plurality of circular turbulence mechanisms are arranged in a crossed manner at an arrangement interval of 10-20mm.

Illustratively, the BDU body assembly 200 includes a BDU housing and a copper bar heat dissipation mechanism, the copper bar heat dissipation mechanism is installed in the BDU housing, and the liquid cooling board substrate is installed with the surface of the BDU housing in a fitting manner.

Optionally, the BDU body assembly 200 further includes a fuse, a relay, a shunt, a control unit, and a sampling unit, all mounted inside the BDU housing.

Illustratively, the securing mechanism 300 is a bolt mechanism.

Illustratively, the embodiment of the application provides an electric vehicle, and the electric vehicle comprises the BDU integrated heat dissipation device shown in fig. 1 to 5.

In some embodiments, as shown in fig. 1, when the entire working condition of the electric vehicle is running, the current passes through the fuse, the relay, and the like in the BDU body assembly 200, the current generates joule heat and is transmitted to the copper bar heat dissipation mechanism, and the heat conduction interface mechanism is arranged below the copper bar heat dissipation mechanism, the heat conduction interface mechanism is in contact with the liquid cooling plate, and the heat is taken away through the refrigerating fluid of the liquid cooling runner plate 110.

Alternatively, the liquid cooling flow channel plate 110 is made of an aluminum alloy (such as 3-series or 6-series aluminum alloy), and the forming process may be friction stir welding, brazing, laser welding, argon arc welding, blowing, or the like. The liquid cooling plate assembly 100 is an integrated liquid cooling plate and is integrally matched with the BDU shell, the installation mode is bolts, the number of the bolts can be 4-8 and can be M4, M5 or M6 bolts which are symmetrically distributed, and the torsion is recommended to be 5-9 NM.

In some embodiments, the first liquid cooling line 131 and the second liquid cooling line 132 are fast plug structures, and the materials may be aluminum alloy (3 series or 6 series) and plastic (PA 12, PA66, with or without glass fiber).

In some embodiments, the integrated liquid cooling of the BUD body assembly 100 is installed in the battery pack through a shock pad, and the general body is installed with 4 shock pads and bolts. Because of taking integrated liquid cooling certainly, this application embodiment, the integrated heat abstractor of BDU can be installed in the battery package at will in the arbitrary place, and the maximize is solved space arrangement's Shu Bo, can directly install the shell optional position under the battery package, also can directly hang the crossbeam in the battery package, the longeron, or play a support installation alone (especially to the installation of special-shaped battery package arrange very friendly).

Referring to fig. 6 to 8, fig. 6 is a schematic view of a first series structure of a battery liquid-cooled plate and a liquid-cooled runner plate according to an embodiment of the present disclosure, fig. 7 is a schematic view of a second series structure of a battery liquid-cooled plate and a liquid-cooled runner plate according to an embodiment of the present disclosure, and fig. 8 is a schematic view of a parallel structure of a battery liquid-cooled plate and a liquid-cooled runner plate according to an embodiment of the present disclosure.

Illustratively, the liquid cooling plate assembly 100 is formed by combining the liquid cooling runner plate 110 and the liquid cooling plate substrate 120, and the liquid cooling runner plate 110 arranges the runners according to the position of the heat conducting interface mechanism 500, so as to optimize or eliminate the flow disturbing mechanism, thereby achieving the best temperature control effect. Compared with the traditional scheme, the BDU integrated heat dissipation device is more flexible in arrangement, only the quick-charging liquid cooling connector with the inlet and the outlet is required to be inserted, the BDU integrated heat dissipation device can be connected with the battery pack liquid cooling plate 600 (a liquid cooling plate for dissipating heat of a battery module) in series, and can be connected in series at the inlet position or the outlet position, but in order to maximize the utilization of energy and reduce the requirement for heat dissipation of the battery module, the BDU integrated heat dissipation device is generally suggested to be arranged at the outlet in series or in parallel, and the BDU integrated heat dissipation device is an arrangement scheme with the maximum heat dissipation capability.

Generally, a flow channel is required to be disposed below the interface heat conducting mechanism 500, and the flow channel needs to cover the area of the interface heat conducting material. The thermal conductivity coefficient of the interface thermal conductive material is at least selected to be more than 4w/mk, the thickness is 1-5 mm, and the requirement of UV 94V 0 is met.

Illustratively, an integrated liquid cold plate is typically selected from a 3-series or 6-series aluminum alloy for manufacturing process feasibility. The liquid cooling substrate and the runner plate can be combined through brazing, friction stir welding or a blowing process, and the substrate and the liquid cooling pipeline can be combined through laser welding, brazing and argon arc welding.

Exemplarily, the BDU integrated heat dissipation device provided in the embodiment of the present application is an active cooling system, and after the BDU integrated heat dissipation device is installed and connected according to different temperature control architectures, the inside of the integrated liquid cooling plate is driven by the water pump to realize the circulation flow of the cooling liquid. If at driving operating mode or fill the operating mode soon, the heat that electric appliance structures such as relay, fuse produced passes through the copper bar and transmits interface heat conduction material, then through the cold drawing heat transfer, takes away the heat through the refrigerating fluid. The active liquid cooling device solves the defect that natural cooling and passive cooling BDU heat are accumulated inside the plastic shell and are difficult to dissipate, improves the electrical reliability of the BDU and better deals with the working condition of high-rate quick charging.

In all embodiments of the present application, the terms "large" and "small" are relatively speaking, and the terms "upper" and "lower" are relatively speaking, so that descriptions of these relative terms are not repeated herein.

It should be appreciated that reference throughout this specification to "in this embodiment," "in an embodiment of the present application," or "as an alternative implementation" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in this embodiment," "in the examples of the present application," or "as an alternative embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. Those skilled in the art should also appreciate that the embodiments described in this specification are all alternative embodiments and that the acts and modules involved are not necessarily required for this application.

In various embodiments of the present application, it should be understood that the size of the serial number of each process described above does not mean that the execution sequence is necessarily sequential, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A BDU integrated heat dissipation device is characterized by comprising a liquid cooling plate assembly, a BDU body assembly and a fixing mechanism;

2. The BDU integrated heat sink device of claim 1, further comprising a battery shock absorbing mechanism fixedly mounted with the BDU body assembly.

3. The BDU integrated heat sink of claim 1, wherein the liquid cooling runner plate is configured with a liquid cooling pipe assembly, the liquid cooling pipe assembly comprising a first liquid cooling pipe and a second liquid cooling pipe, the first liquid cooling pipe being connected to the inlet liquid cooling, the second liquid cooling pipe being connected to the inlet liquid cooling.

4. The integrated BDU heat sink of claim 1, further comprising a thermal interface mechanism disposed between the liquid cooling plate substrate and the BDU body assembly, wherein a surface of the thermal interface mechanism is in contact with a surface of the liquid cooling plate substrate and a surface of the BDU body assembly.

5. The BDU integrated heat dissipation device of claim 4, wherein the heat conducting interface mechanism is one or more of a heat conducting and insulating silica gel pad, a heat conducting and insulating foam pad, a heat conducting gel, and a heat conducting structural adhesive.

6. The BDU integrated heat sink of claim 1, wherein the liquid cooling channels of the liquid cooling channel plate are provided with a flow disturbing mechanism.

7. The BDU integrated heat dissipation device of claim 6, wherein the turbulence mechanisms are circular turbulence mechanisms, the diameter of each circular turbulence mechanism is 8-16mm, the height of each circular turbulence mechanism is 3-5mm, and the circular turbulence mechanisms are arranged in a crossed manner at an arrangement interval of 10-20mm.

8. The integrated heat sink of BDU of claim 1, wherein said BDU body assembly includes a BDU shell and a copper bar heat sink mechanism, said copper bar heat sink mechanism is mounted on said BDU shell, said liquid cooling board substrate is mounted on the surface of said BDU shell.

9. The BDU integrated heat sink of claim 1, wherein the securing mechanism is a bolt mechanism.

10. An electric vehicle comprising the BDU integrated heat sink of any one of claims 1 to 9.