CN213754110U - Wireless charger with cooling device - Google Patents
Wireless charger with cooling device Download PDFInfo
- Publication number
- CN213754110U CN213754110U CN202022819809.0U CN202022819809U CN213754110U CN 213754110 U CN213754110 U CN 213754110U CN 202022819809 U CN202022819809 U CN 202022819809U CN 213754110 U CN213754110 U CN 213754110U
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- heat
- cooling device
- shell
- wireless charger
- seat
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- 238000001816 cooling Methods 0.000 title claims abstract description 49
- 239000004065 semiconductor Substances 0.000 claims abstract description 60
- 230000017525 heat dissipation Effects 0.000 claims abstract description 49
- 238000005057 refrigeration Methods 0.000 claims abstract description 25
- 230000005855 radiation Effects 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims description 52
- 239000007769 metal material Substances 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 17
- 229910010293 ceramic material Inorganic materials 0.000 description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000005679 Peltier effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model relates to a wireless charger with a cooling device, which is provided with a shell; a wireless charging module and a cooling module are arranged in the shell; the wireless charging module sequentially comprises a charging coil and a PCBA (printed circuit board assembly) from top to bottom, and the charging coil is fixedly arranged on the upper surface of the PCBA; a charging position corresponding to the charging coil is arranged on the shell; the cooling module comprises a semiconductor refrigeration piece, a heat dissipation seat and a heat dissipation fan which are electrically connected with the controller; the heat radiation fan is fixedly connected with the lower surface of the PCBA board; the heat dissipation seat is fixedly arranged in the shell; the semiconductor refrigerating sheet comprises a cold end and a hot end; the hot end of the semiconductor refrigerating sheet is assembled and connected with a heat radiating seat for absorbing heat from the hot end; the cold end of the semiconductor refrigerating sheet is in contact with the charging potential of the shell and forms heat conduction; the air outlet of the heat radiation fan faces the heat radiation seat; the shell is provided with an air inlet and an air outlet. The utility model discloses the radiating effect is outstanding, can fine solution wireless charging problem of generating heat to improve charge efficiency.
Description
Technical Field
The utility model relates to a wireless battery charging outfit, in particular to wireless charger with cooling device.
Background
Wireless charger on the market all can produce more heat at transmitting terminal and receiving terminal because conversion efficiency's problem in charging process, leads to charging power to be restricted on the one hand, and direct influence on the other hand is used and is experienced. The wireless charger that has magnetism function of inhaling on the market mainly used promotes charge efficiency on the one hand, satisfies the demand of usefulness while filling on the other hand, and calorific capacity can further increase. Meanwhile, the wireless charger with the cooling function generally adopts a heat conduction block to conduct heat or is additionally provided with a cooling fan to dissipate heat. The scheme of conducting heat by utilizing the heat conducting block is low in heat conducting efficiency, and the problem that the existing wireless charger is more and more prone to higher heat productivity is solved. The scheme of radiating through the radiating fan has larger integral volume.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a wireless charger with a cooling device, which has outstanding heat dissipation effect and can well solve the problem of heating during wireless charging, thereby improving the charging efficiency; meanwhile, under the condition of integrating the cooling module, the wireless charger can be used to the maximum extent in space, and the thickness of the wireless charger is effectively controlled.
Realize the utility model discloses the technical scheme of purpose is: the utility model is provided with a shell; a wireless charging module and a cooling module are arranged in the shell; the wireless charging module sequentially comprises a charging coil and a PCBA (printed circuit board assembly) from top to bottom, wherein the charging coil is fixedly arranged on the upper surface of the PCBA and is electrically connected with a controller on the PCBA; a charging position corresponding to the charging coil is arranged on the shell; the cooling module comprises a semiconductor refrigeration piece, a heat dissipation seat and a heat dissipation fan which are electrically connected with the controller; the heat dissipation fan is fixedly connected with the lower surface of the PCBA board and is electrically connected with the controller on the PCBA board; the heat dissipation seat is fixedly arranged in the shell; the semiconductor refrigerating sheet comprises a cold end and a hot end; the hot end of the semiconductor refrigerating sheet is assembled and connected with a heat radiating seat for absorbing heat from the hot end; the cold end of the semiconductor refrigerating sheet is in contact with the charging potential of the shell and forms heat conduction; the air outlet of the heat radiation fan faces the heat radiation seat; the shell is provided with an air inlet and an air outlet. The semiconductor refrigerating sheet is a refrigerating module which forms a thermocouple pair by arranging a P-N junction formed by semiconductor materials between substrates facing each other and realizes a Peltier effect by direct current so as to realize a cooling effect.
The semiconductor refrigerating sheet is in a ring shape, the center of the semiconductor refrigerating sheet is provided with a first accommodating cavity for accommodating and placing the wireless charging module; the wireless charging module is arranged in the first accommodating cavity.
The heat dissipation seat is also annular; the upper surface of the heat radiating seat is attached and fixedly connected with the hot end of the semiconductor refrigerating sheet; the lower surface of the heat radiating seat is provided with a heat radiating fin group formed by a plurality of heat radiating fins; the air outlet of the heat radiation fan faces the heat radiation fin group.
Each radiating fin forming the radiating fin group is distributed annularly, and a second accommodating cavity is formed in the center of each radiating fin group; the heat radiation fan is positioned in the second accommodating cavity; the heat dissipation fan is a centrifugal heat dissipation fan, and the radial air outlet of the centrifugal heat dissipation fan is opposite to each heat dissipation fin.
The first accommodating cavity and the second accommodating cavity are coaxially arranged.
As a deformation design, the upper surface of the heat radiating seat is attached and fixedly connected with the hot end of the semiconductor refrigerating sheet; the radiating seat and the semiconductor refrigerating piece are connected to form an integral piece located on one side of the wireless charging module.
The upper surface of the heat radiating seat is fixedly connected with the hot end of the semiconductor refrigerating sheet through heat conducting glue.
The shell comprises a lower shell and an upper cover; the upper cover is fixedly connected with the lower shell to form a closed installation cavity for installing the wireless charging module and the cooling module; the upper cover comprises a first heat conduction cover body and a second heat conduction cover body which are connected to form a whole and form heat conduction; the first heat-conducting cover body corresponds to the charging coil; the second heat conduction cover body is in contact with the cold end of the semiconductor refrigeration sheet and forms heat conduction.
The first heat-conducting cover body is made of high heat-conducting non-metallic material; the second heat-conducting cover body is made of a high-heat-conducting metal material (such as aluminum alloy).
Above-mentioned wireless module of charging still includes the permanent magnet that is used for adsorbing charging device.
The permanent magnet is annular and is coaxially arranged with the charging coil. The permanent magnet ring is arranged on the periphery of the charging coil, and the upper surface of the permanent magnet ring is flush with the top surface of the coil. The permanent magnet is a magnetic module including Magsafe standard.
As the optimized deformation design, the first heat-conducting cover body and the second heat-conducting cover body are integrated and are made of high-heat-conducting ceramic.
The semiconductor refrigeration device comprises an upper substrate and a lower substrate, wherein a P-N junction is arranged between the upper substrate and the lower substrate; the upper substrate is a charging position of the shell or a part of the shell.
As an optimized design, the lower substrate of the semiconductor refrigerating sheet is a heat radiating seat.
As an optimized design, the radiating fins extend from the upper base plate to the lower surface of the radiating seat.
The utility model discloses has positive effect: (1) the utility model discloses utilize semiconductor refrigeration piece and radiator fan to effectively realize two heat conductivities, improve initiative radiating effect greatly to can fine solve the wireless problem that generates heat that charges, improve charge efficiency.
(2) The utility model discloses set up the semiconductor refrigeration piece and circularize to for the wireless module that charges provides installation space, reduce the thickness of wireless charger greatly, thereby reach the purpose that reduces wireless charger volume.
(3) The radiating fins are arranged on the radiating seat, so that the radiating effect can be further improved; and through radiator fan direct-blow radiating fin, can improve the radiating effect more.
(4) The heat dissipation seat in the utility model is designed into a ring shape, which can provide a placing space for the heat dissipation fan and further reduce the volume of the product; and the centrifugal cooling fan is adopted as the cooling fan, so that the cooling direction is outward diffusion (namely, the heat is blown outward from the center of the heat source), and the cooling effect is further improved.
(5) The utility model discloses well wireless module and the cooling module of charging take vertical setting to adopt annular layout, radiator fan put in with radiating fin, increase cold junction heat radiating area on the one hand, on the other hand improves the hot junction heat-sinking capability.
(6) The utility model discloses well radiating seat passes through the heat conduction with the hot junction of semiconductor refrigeration piece and is connected, can realize fine linkage effect, can further increase the heat conduction effect moreover.
(7) The utility model arranges the whole body formed by the heat radiation seat and the semiconductor refrigeration piece at one side of the wireless charging module, which can further reduce the thickness of the product; along with the popularization of large-screen mobile phones, the thickness of the wireless charger is reduced, the bearing area is increased, and the using effect is better.
(8) The utility model discloses fine heat conduction effect can be played to the upper cover to further improve the radiating effect.
(9) The utility model discloses well upper cover makes integrative through high heat conduction pottery, has replaced conventional metal and nonmetal combination upper cover, when satisfying the EMI demand, and temperature homogeneity also obtains optimizing.
(10) The utility model discloses carry out the optimal design to the semiconductor refrigeration piece, be about to casing and radiating seat and become the partly of semiconductor refrigeration piece, not only further improved the degree of integrating, further promote heat transfer performance moreover, improve the radiating effect.
(11) The utility model discloses in extend to the infrabasal plate with radiating fin from the upper substrate of semiconductor refrigeration piece and can further promote the heat-sinking capability, except that the refrigeration of peltier promptly, still combine radiating fin's physics heat dissipation.
Drawings
In order that the present invention may be more readily and clearly understood, the following detailed description of the present invention is given in conjunction with the accompanying drawings, in which
Fig. 1 is a schematic structural diagram of embodiment 1 of the present invention;
fig. 2 is an exploded schematic view of embodiment 1 of the present invention;
fig. 3 is a schematic structural view of an upper cover in embodiment 1 of the present invention;
fig. 4 is a schematic structural diagram of embodiment 2 of the present invention;
fig. 5 is an exploded view of embodiment 2 of the present invention;
fig. 6 is a schematic diagram of the electrical connection of the present invention.
Detailed Description
(example 1)
See fig. 1, 2, 3 and 6, the present invention has a housing 1; the housing 1 comprises a lower housing 11 and an upper cover 12; the upper cover 12 is fixedly connected with the lower shell 11 to form a closed installation cavity for installing the wireless charging module 2 and the cooling module 3; the upper cover 12 includes a first heat-conducting cover 121 and a second heat-conducting cover 122 connected to form a whole; wireless module 2 that charges includes charging coil 21 and PCBA board 22 from last to down in proper order, and charging coil 21 is fixed to be set up on PCBA board 22's upper surface to form the electricity with the controller on the PCBA board 22 and be connected. The cooling module 3 comprises a semiconductor chilling plate 31, a heat dissipation seat 32 and a heat dissipation fan 33 which are electrically connected with the controller. The semiconductor cooling plate 31 is a cooling module which forms a thermocouple pair by arranging a P-N junction made of a semiconductor material between substrates facing each other, and realizes a peltier effect by a direct current to realize a cooling effect. Wherein the casing 1 can wholly adopt the aluminum alloy material, increases the radiating effect.
The heat dissipation fan 33 is fixedly connected with the lower surface of the PCBA board 22 and is electrically connected with a controller on the PCBA board 22; the heat dissipation seat 32 is fixedly arranged in the shell 1; the semiconductor chilling plate 31 comprises a cold end 311 and a hot end 312; the hot end 312 of the semiconductor refrigeration sheet 31 is directly connected with the upper surface of the heat dissipation seat 32 through the heat-conducting glue; the first heat-conducting cover 121 is directly attached to and in contact with the charging coil 21 (or may be in heat-conducting connection through a heat-conducting adhesive); the second heat conducting cover 122 contacts with the cold end 311 of the semiconductor chilling plate 31 and forms heat conduction (or forms heat conduction connection through heat conducting glue). That is, the first heat conducting cover 121 absorbs heat and then conducts the heat to the second heat conducting cover 122, and then the heat on the second heat conducting cover 122 is conducted through the semiconductor refrigeration sheet; an air inlet and an air outlet are arranged on the shell 1.
The semiconductor refrigeration piece 31 is in a ring shape with a first accommodating cavity at the center for accommodating and placing the wireless charging module 2, namely the semiconductor refrigeration piece 31 comprises an annular upper substrate and an annular lower substrate, and a P-N junction is arranged between the upper substrate and the lower substrate; the wireless charging module 2 is arranged in the first accommodating cavity.
The heat dissipation seat 32 is also annular; a heat radiating fin group 321 formed by a plurality of heat radiating fins is arranged on the lower surface of the heat radiating seat 32; the outlet of the heat dissipation fan 33 faces the heat dissipation fin set 321.
The heat dissipation fins forming the heat dissipation fin group 321 are distributed annularly, and a second accommodating cavity is formed in the center of the heat dissipation fin group 321; the heat dissipation fan 33 is located in the second accommodating cavity; the heat dissipation fan 33 is a centrifugal heat dissipation fan, and the radial air outlet of the centrifugal heat dissipation fan faces each heat dissipation fin. The first accommodating cavity and the second accommodating cavity are coaxially arranged.
The first heat-conducting cover body 121 is made of a high heat-conducting non-metallic material; the second heat conductive cover 122 is made of a high heat conductive metal material, such as aluminum alloy.
The wireless charging module 2 further comprises a permanent magnet 4 for adsorbing charging equipment; the permanent magnet 4 is annular and is coaxially arranged with the charging coil; the permanent magnet 4 is annularly arranged on the periphery of the charging coil 21, and the upper surface of the permanent magnet is flush with the top surface of the coil. When wireless charging equipment's receiving terminal set can inhale the accessory of absorption with 4 magnetism of permanent magnet, wireless charging equipment's receiving terminal can carry out position control and locking through adsorbing, and the receiving terminal can carry out better charging and cooling simultaneously.
The working principle of the utility model is as follows:
during wireless charging, the first heat-conducting cover 121 of the upper cover 12 absorbs heat generated by wireless charging, the second heat-conducting cover 122 absorbs heat on the first heat-conducting cover 121, the cold end 311 of the semiconductor refrigeration chip 31 absorbs heat on the second heat-conducting cover 122 and transmits the heat to the hot end 312 in a power-on state, and the heat sink 32 absorbs heat on the hot end 312. The radial outlet of the heat dissipation fan 33 blows heat from the heat dissipation fin set 321 out of the housing.
(example 2)
Referring to fig. 4 to 6, the upper surface of the heat dissipating seat 32 of the present invention is connected to the hot end 312 of the semiconductor cooling fin 31 through a heat conducting adhesive; the heat dissipation seat 32 and the semiconductor cooling plate 31 are connected to form an integral piece located on one side of the wireless charging module 2.
Other technical features are the same as those of embodiment 1.
(example 3)
The upper cover 12 of the present invention may be a unitary piece made of aluminum nitride ceramic material. The aluminum nitride ceramic material has high heat conduction effect. When the charging device with the unfixed heating source is used, the heat can be quickly taken away by utilizing the heat conduction principle.
Other technical features are the same as those of embodiment 1.
(example 4)
The upper cover 12 of the present invention may be a unitary piece made of aluminum nitride ceramic material. The aluminum nitride ceramic material has high heat conduction effect. When the charging device with the unfixed heating source is used, the heat can be quickly taken away by utilizing the heat conduction principle.
Other technical features are the same as those of embodiment 2.
(example 5)
The semiconductor refrigerating plate 31 of the utility model comprises an upper substrate and a lower substrate, and a P-N junction is arranged between the upper substrate and the lower substrate; the upper substrate is the upper cover 12; the lower substrate is the heat sink 32. The heat dissipation fins extend from the upper substrate up to the lower surface of the heat sink 32.
Other technical features are the same as those of embodiment 3.
(example 6)
The semiconductor refrigerating plate 31 in the utility model comprises an upper substrate and a lower substrate, and a P-N junction is arranged between the upper substrate and the lower substrate; the upper substrate is the upper cover 12; the lower substrate of the semiconductor chilling plate 31 is the heat dissipation seat 32.
The heat dissipation fins extend from the upper substrate up to the lower surface of the heat sink 32.
Other technical features are the same as those of embodiment 4.
The above-mentioned embodiments, further detailed description of the objects, technical solutions and advantages of the present invention, it should be understood that the above-mentioned embodiments are only specific embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (19)
1. A wireless charger with a cooling device, having a housing (1); a wireless charging module (2) and a cooling module (3) are arranged in the shell (1); the method is characterized in that: the wireless charging module (2) sequentially comprises a charging coil (21) and a PCBA (printed circuit board assembly) board (22) from top to bottom, and the charging coil (21) is fixedly arranged on the upper surface of the PCBA board (22) and is electrically connected with a controller on the PCBA board (22); a charging potential corresponding to the charging coil (21) is arranged on the shell (1); the cooling module (3) comprises a semiconductor refrigeration piece (31), a heat dissipation seat (32) and a heat dissipation fan (33) which are electrically connected with the controller; the heat radiation fan (33) is fixedly connected with the lower surface of the PCBA board (22) and is electrically connected with a controller on the PCBA board (22); the heat dissipation seat (32) is fixedly arranged in the shell (1); the semiconductor refrigeration piece (31) comprises a cold end (311) and a hot end (312); the hot end (312) of the semiconductor refrigeration piece (31) is assembled and connected with a heat radiation seat (32) used for absorbing heat from the hot end (312); the cold end (311) of the semiconductor refrigeration sheet (31) is in contact with the charging potential of the shell (1) and forms heat conduction; the air outlet of the heat radiation fan (33) is opposite to the heat radiation seat (32); an air inlet and an air outlet are arranged on the shell (1).
2. The wireless charger with the cooling device as claimed in claim 1, wherein: the semiconductor refrigerating sheet (31) is in a ring shape, and the center of the semiconductor refrigerating sheet is provided with a first accommodating cavity for accommodating and placing the wireless charging module (2); the wireless charging module (2) is arranged in the first accommodating cavity.
3. The wireless charger with the cooling device as claimed in claim 2, wherein: the heat dissipation seat (32) is also annular; the upper surface of the heat radiating seat (32) is attached and fixedly connected with the hot end (312) of the semiconductor refrigerating sheet (31); the lower surface of the heat radiating seat (32) is provided with a heat radiating fin group (321) formed by a plurality of heat radiating fins; the air outlet of the heat radiation fan (33) is opposite to the heat radiation fin group (321).
4. A wireless charger having a cooling device according to claim 3, wherein: each radiating fin forming the radiating fin group (321) is distributed annularly, and a second accommodating cavity is formed in the center of each radiating fin group (321); the heat radiation fan (33) is positioned in the second accommodating cavity; the heat radiation fan (33) is a centrifugal heat radiation fan, and the radial air outlet of the centrifugal heat radiation fan is opposite to each heat radiation fin.
5. The wireless charger with the cooling device as claimed in claim 4, wherein: the first accommodating cavity and the second accommodating cavity are coaxially arranged.
6. The wireless charger with the cooling device as claimed in claim 1, wherein: the upper surface of the heat radiating seat (32) is attached and fixedly connected with the hot end (312) of the semiconductor refrigerating sheet (31); the heat dissipation seat (32) and the semiconductor refrigeration piece (31) are connected to form an integral piece which is positioned on one side of the wireless charging module (2).
7. The wireless charger with the cooling device as claimed in claim 1 or 6, wherein: the upper surface of the heat radiating seat (32) is fixedly connected with the hot end (312) of the semiconductor refrigerating sheet (31) through heat conducting glue.
8. The wireless charger with the cooling device as claimed in claim 1 or 6, wherein: the shell (1) comprises a lower shell (11) and an upper cover (12); the upper cover (12) is fixedly connected with the lower shell (11) and forms a closed installation cavity for installing the wireless charging module (2) and the cooling module (3); the upper cover (12) comprises a first heat conduction cover body (121) and a second heat conduction cover body (122) which are connected into a whole and form heat conduction; the first heat-conducting cover body (121) corresponds to a charging coil (21); the second heat-conducting cover body (122) is in contact with the cold end (311) of the semiconductor refrigeration sheet (31) and forms heat conduction.
9. The wireless charger with the cooling device as claimed in claim 8, wherein: the first heat-conducting cover body (121) is made of a high-heat-conducting non-metallic material; the second heat-conducting cover body (122) is made of a high heat-conducting metal material.
10. The wireless charger with the cooling device as claimed in claim 1 or 6, wherein: the wireless charging module (2) further comprises a permanent magnet (4) used for adsorbing charging equipment.
11. The wireless charger with the cooling device as claimed in claim 10, wherein: the permanent magnet (4) is annular and is coaxially arranged with the charging coil (21); the permanent magnet (4) is annularly arranged on the periphery of the charging coil (21), and the upper surface of the permanent magnet is flush with the top surface of the coil.
12. The wireless charger with the cooling device as claimed in claim 8, wherein: the first heat conduction cover body (121) and the second heat conduction cover body (122) are integrated and are made of high heat conduction ceramics.
13. The wireless charger with the cooling device as claimed in claim 1, 2, 3, 4 or 5, wherein: the semiconductor refrigerating sheet (31) comprises an upper substrate and a lower substrate, and a P-N junction is arranged between the upper substrate and the lower substrate; the upper substrate is a charging position of the shell (1).
14. The wireless charger with the cooling device as claimed in claim 13, wherein: the lower substrate of the semiconductor refrigeration sheet (31) is a heat dissipation seat (32).
15. A wireless charger with a cooling device according to claim 3 or 4, wherein: the semiconductor refrigerating sheet (31) comprises an upper substrate and a lower substrate, and a P-N junction is arranged between the upper substrate and the lower substrate; the upper substrate is a charging position of the shell (1); the lower substrate of the semiconductor refrigerating sheet (31) is a heat radiating seat (32); the heat dissipation fins extend from the upper base plate to the lower surface of the heat dissipation seat (32).
16. The wireless charger with the cooling device as claimed in claim 6, wherein: the lower surface of the heat radiating seat (32) is provided with a heat radiating fin group (321) formed by a plurality of heat radiating fins.
17. A wireless charger having a cooling device according to claim 6 or 16, wherein: the semiconductor refrigerating sheet (31) comprises an upper substrate and a lower substrate, and a P-N junction is arranged between the upper substrate and the lower substrate; the upper substrate is a part of the shell (1).
18. The wireless charger with the cooling device as claimed in claim 17, wherein: the lower substrate of the semiconductor refrigeration sheet (31) is a heat dissipation seat (32).
19. The wireless charger with the cooling device as claimed in claim 16, wherein: the semiconductor refrigerating sheet (31) comprises an upper substrate and a lower substrate, and a P-N junction is arranged between the upper substrate and the lower substrate; the upper substrate is a part of the shell (1); the lower substrate of the semiconductor refrigerating sheet (31) is a heat radiating seat (32); the heat dissipation fins extend from the upper substrate to the lower surface of the heat dissipation base (32).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022819809.0U CN213754110U (en) | 2020-11-30 | 2020-11-30 | Wireless charger with cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022819809.0U CN213754110U (en) | 2020-11-30 | 2020-11-30 | Wireless charger with cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213754110U true CN213754110U (en) | 2021-07-20 |
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ID=76832194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022819809.0U Active CN213754110U (en) | 2020-11-30 | 2020-11-30 | Wireless charger with cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213754110U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023109472A1 (en) * | 2021-12-13 | 2023-06-22 | 夯歌东莞科技有限公司 | Side-blowing heat dissipation device and wireless charger |
-
2020
- 2020-11-30 CN CN202022819809.0U patent/CN213754110U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023109472A1 (en) * | 2021-12-13 | 2023-06-22 | 夯歌东莞科技有限公司 | Side-blowing heat dissipation device and wireless charger |
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