CN220964044U - Heat dissipation system and photoelectric device - Google Patents

Abstract

The utility model relates to the technical field of lasers, in particular to a heat dissipation system and photoelectric equipment. The heat dissipation system comprises a shell, a semiconductor refrigerating piece and a heat pipe, wherein the shell is provided with an inner cavity, and the semiconductor refrigerating piece and the heat pipe are both arranged in the inner cavity; the semiconductor refrigerating piece comprises a refrigerating surface and a radiating surface, wherein the refrigerating surface is close to the top plate of the shell, and the heat pipe is connected to the radiating surface. The photoelectric device comprises the heat dissipation system. The utility model provides a heat dissipation system and photoelectric equipment, which are used for solving the technical problem that the heat dissipation mode of the photoelectric equipment in the prior art is single.

Description

Heat dissipation system and photoelectric device

Technical Field

The utility model relates to the technical field of lasers, in particular to a heat dissipation system and photoelectric equipment.

Background

In recent years, with the continuous development of the field of photoelectric detection, the integration level of photoelectric equipment is higher and higher, the number of internal devices is higher and higher, the structural layout is more and more compact, and the photoelectric equipment is developed towards the high integration level, miniaturization and engineering. The high integration of the photoelectric device causes higher and higher power per unit volume or heat flux density, and higher requirements on heat control of high-power devices, especially the heat dissipation of a laser, and the heat dissipation performance of the laser directly influences the performance of the photoelectric device.

As a high-efficiency photon-electron conversion component, the laser inevitably has various losses in the application process, such as free carrier absorption loss, non-radiative recombination loss and the like, which causes a part of input power to be converted into heat and dissipated, and further causes the temperature of the laser to rise. The temperature rise can reduce the output power of the laser, increase the threshold current, drift of wavelength (0.2-0.3 nm/DEG C) and the like, so that the temperature of the laser needs to be controlled within a proper range to ensure the stable and reliable operation of the laser.

However, in the prior art, the conventional heat dissipation manner is mostly based on natural conduction heat dissipation of the structural shell, and the heat dissipation manner is single, so that the heat dissipation requirement of the high-integration-level and high-power photoelectric device is difficult to be met. In order to ensure the thermal reliability and the normal operation thermal control requirement of the high-integration photoelectric device, a diversified heat dissipation mode suitable for the high-integration photoelectric device needs to be further researched.

Accordingly, the present application is directed to a novel heat dissipation system and an optoelectronic device.

Disclosure of utility model

The utility model aims to provide a heat dissipation system which at least relieves the technical problem that the heat dissipation mode of photoelectric equipment in the prior art is single.

The utility model also aims to provide the photoelectric equipment so as to further solve the technical problem that the radiating mode of the photoelectric equipment in the prior art is single.

Based on the first object, the present utility model provides a heat dissipation system, which comprises a housing, a semiconductor refrigeration member and a heat pipe, wherein the housing is provided with an inner cavity, and the semiconductor refrigeration member and the heat pipe are both arranged in the inner cavity;

The semiconductor refrigerating piece comprises a refrigerating surface and a radiating surface, wherein the refrigerating surface is close to the top plate of the shell, and the heat pipe is connected to the radiating surface.

Further, the heat dissipation system further comprises a temperature equalizing plate, and the heat pipe is connected with the heat dissipation surface through the temperature equalizing plate.

Further, the heat pipes are arranged in a plurality, and the heat pipes are arranged at intervals along the length direction of the temperature equalization plate.

Further, the heat pipe is a coiled pipe, a spherical pipe or a spiral pipe.

Further, the heat dissipation system further comprises a heat dissipation fan embedded in the inner cavity, and the heat dissipation fan is arranged close to the heat pipe.

Further, the shell comprises a side plate and a bottom plate, wherein the side plate and the bottom plate are mutually connected in a surrounding mode, the bottom plate is arranged at the bottom end of the side plate, the side plate is far away from the bottom plate, and the side plate, the top plate and the bottom plate jointly form the inner cavity;

the radiating fan is embedded in the inner cavity through the bottom plate.

Further, the heat dissipation system further comprises a temperature sensor arranged between the top plate and the refrigerating surface, and the temperature sensor is connected with the semiconductor refrigerating piece.

Further, the heat dissipation system further comprises a first thermal interface material disposed between the top plate and the temperature sensor;

And/or, the heat dissipation system further comprises a second thermal interface material arranged between the temperature sensor and the refrigerating surface, and a third thermal interface material arranged between the heat dissipation surface and the heat pipe.

Further, the thickness of the housing is no greater than 20mm.

By adopting the technical scheme, the heat dissipation system has at least the following beneficial effects:

When the heat dissipation system of the embodiment is used, the heat sources such as the laser and the like needing to be cooled are connected to the top plate, so that the cooling surface of the semiconductor refrigeration piece is cooled, the heat sources such as the laser and the like are cooled through the top plate of the shell, stable and reliable operation of the laser is guaranteed, meanwhile, the temperature of the cooling surface is increased, and the higher temperature of the cooling surface is conducted to the heat pipe, so that cooling liquid in the heat pipe absorbs heat and is vaporized, the purpose of cooling the cooling surface is achieved, and the refrigeration effect of the semiconductor refrigeration piece is maintained.

The heat radiation system combines the active heat radiation cooling mode of the semiconductor refrigerating piece and the passive heat conduction heat radiation mode of the heat pipe to form an active-passive composite heat radiation scheme, and the heat radiation of the heat source is more efficient and reliable through diversified and comprehensive heat radiation design, so that the heat radiation system is particularly suitable for high-integration-level and high-power photoelectric equipment, can meet the heat radiation requirement, and relieves the technical problem that the heat radiation mode of the photoelectric equipment in the prior art is single.

Based on the second object, the utility model provides an optoelectronic device, which comprises a housing, a laser and the heat dissipation system, wherein the laser and the heat dissipation system are both arranged in the housing, a shell of the heat dissipation system is connected with the housing, and the laser is connected with a top plate of the shell.

By adopting the technical scheme, the photoelectric equipment has at least the following beneficial effects:

by arranging the heat dissipation system in the optoelectronic device, the optoelectronic device has all advantages of the heat dissipation system, and will not be described in detail herein.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a heat dissipation system according to an embodiment of the present utility model;

FIG. 2 is a second schematic diagram of a heat dissipation system according to an embodiment of the present utility model;

FIG. 3 is an exploded view of a heat dissipating system according to an embodiment of the present utility model;

Fig. 4 is a schematic structural diagram of an optoelectronic device according to an embodiment of the present utility model.

Reference numerals:

1-a heat dissipation system;

2-a housing; 21-side plates; 22-top plate;

3-semiconductor refrigerating element;

4-a heat pipe;

5-a temperature equalizing plate;

6-a heat radiation fan;

7-a temperature sensor;

81-a first thermal interface material; 82-a second thermal interface material; 83-a third thermal interface material;

91-a housing; 92-laser.

Detailed Description

The following description of the embodiments of the present utility model will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the utility model are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Example 1

Referring to fig. 1 in combination with fig. 3, the present embodiment provides a heat dissipation system 1, where the heat dissipation system 1 includes a housing 2, a semiconductor refrigeration member 3 and a heat pipe 4, the housing 2 is provided with an inner cavity, and the semiconductor refrigeration member 3 and the heat pipe 4 are both disposed in the inner cavity; the semiconductor refrigeration unit 3 includes a refrigeration surface and a heat radiation surface, the refrigeration surface is disposed near the top plate 22 of the housing 2, and the heat pipe 4 is connected to the heat radiation surface.

It should be noted that, the semiconductor refrigeration piece 3 is the prior art, the semiconductor refrigeration piece 3 is also called a thermoelectric refrigeration piece, and is a heat pump, it uses the Peltier effect of semiconductor material, when the direct current passes through the couple formed by two different semiconductor materials in series, the heat can be absorbed and released respectively at the both ends of the couple, forming the refrigeration surface and the heat dissipation surface of the semiconductor refrigeration piece 3, its characteristics are no moving parts, and the reliability is also relatively high.

When the heat dissipation system 1 of this embodiment is used, the heat source such as a laser and the like needing to be cooled is connected to the top plate 22, so that the cooling surface of the semiconductor refrigeration piece 3 is cooled, and the heat source such as the laser and the like is cooled through the top plate 22 of the housing 2, so as to ensure the stable and reliable operation of the laser, and meanwhile, the temperature of the cooling surface is increased, and the higher temperature of the cooling surface is conducted to the heat pipe 4, so that the cooling liquid in the heat pipe 4 absorbs heat and is vaporized, thereby achieving the purpose of dissipating heat for the cooling surface, and maintaining the refrigeration effect of the semiconductor refrigeration piece 3.

The heat dissipation system 1 combines an active heat dissipation cooling mode of the semiconductor refrigeration piece 3 and a passive heat conduction heat dissipation mode of the heat pipe 4 to form an active-passive composite heat dissipation scheme, and the heat dissipation of a heat source is more efficient and reliable through diversified and comprehensive heat dissipation design, so that the heat dissipation system is particularly suitable for high-integration-level and high-power photoelectric equipment, can meet heat dissipation requirements, and relieves the technical problem that the heat dissipation mode of the photoelectric equipment in the prior art is single.

Preferably, referring to fig. 3, in the present embodiment, the heat dissipation system 1 further includes a temperature equalizing plate 5, and the heat pipe 4 is connected to the heat dissipation surface through the temperature equalizing plate 5.

By such arrangement, the high temperature of the radiating surface can be uniformly conducted to the heat pipe 4 through the temperature equalizing plate 5, and the local overheating phenomenon of the heat pipe 4 is prevented to a certain extent.

Preferably, referring to fig. 3, in the present embodiment, a plurality of heat pipes 4 are provided, and the plurality of heat pipes 4 are arranged at intervals along the length direction of the temperature equalizing plate 5.

Alternatively, the number of the heat pipes 4 is two, three, four, five, or the like, and preferably, the plurality of heat pipes 4 are uniformly distributed along the length direction of the temperature equalizing plate 5.

By means of the arrangement, heat of the radiating surface of the semiconductor refrigerating piece 3 can be simultaneously conducted to the heat pipes 4 through the temperature equalizing plate 5, so that radiating efficiency of the radiating surface is improved, and refrigerating effect of the semiconductor refrigerating piece 3 is further guaranteed.

As other ways that can be achieved, the heat pipe 4 may also be a serpentine, bulb or spiral pipe. By the arrangement, the contact area between the heat pipe 4 and the temperature equalizing plate 5 is increased, so that the heat exchange efficiency is improved.

Preferably, referring to fig. 2 and 3, in the present embodiment, the heat dissipation system 1 further includes a heat dissipation fan 6 embedded in the inner cavity, the heat dissipation fan 6 is disposed near the heat pipe 4, and the heat of the heat pipe 4 is rapidly dissipated through the heat dissipation fan 6 to dissipate heat of the heat pipe 4, so as to facilitate maintaining the refrigeration effect of the semiconductor refrigeration unit 3.

It should be noted that, the heat dissipation system 1 utilizes the active heat dissipation and cooling mode of the heat dissipation fan 6, and combines the active heat dissipation and cooling mode of the semiconductor refrigeration piece 3 and the passive heat conduction heat dissipation mode of the heat pipe 4, so as to further improve the heat dissipation efficiency and reliability of the heat source.

Preferably, the heat dissipation fan 6 is an ultra-thin turbo-charging fan, which can sufficiently and rapidly conduct and dissipate the heat of the heat pipe 4, further improves the heat dissipation efficiency of the heat pipe 4, and the ultra-thin structure is also beneficial to the miniaturized design of the heat dissipation system 1, so that the heat dissipation system 1 occupies a smaller space.

Preferably, referring to fig. 3, in the present embodiment, the housing 2 includes a side plate 21 and a bottom plate disposed at the bottom end of the side plate 21, a top plate 22 is disposed at one end of the side plate 21 away from the bottom plate, and the side plate 21, the top plate 22 and the bottom plate together form an inner cavity; the bottom plate is provided with the louvre, and radiator fan 6 inlays through the bottom plate and locates the inner chamber. For example, the bottom plate is provided with an opening, the opening is communicated with the inner cavity, and the cooling fan 6 is arranged at the opening and is embedded in the inner cavity through the opening.

That is, the heat pipe 4 is disposed close to the bottom plate, and the heat of the heat pipe 4 can be dissipated through the heat dissipation holes by the heat dissipation fan 6.

Preferably, referring to fig. 3, in the present embodiment, the heat dissipation system 1 further includes a temperature sensor 7 disposed between the top plate 22 and the cooling surface, and the temperature sensor 7 is connected to the semiconductor cooling element 3.

In this arrangement, the temperature sensor 7 is used to monitor the temperature of the heat source, alternatively, the temperature sensor 7 is connected to the semiconductor refrigeration unit 3 via a controller, and the cooling fan 6 is also connected to the controller.

Specifically, the temperature of the heat source is monitored by the temperature sensor 7, when the temperature of the heat source reaches the preset highest temperature, a signal is sent to the controller, the controller correspondingly controls the cooling fan 6 and the semiconductor refrigerating piece 3 to start, the semiconductor refrigerating piece 3 is used for cooling the heat source, and the cooling fan 6 is used for cooling the semiconductor refrigerating piece 3; after the cooling fan 6 and the semiconductor refrigerating piece 3 are started for a period of time, the temperature of the heat source is reduced, and a signal is sent to the controller when the temperature sensor 7 detects that the temperature of the heat source reaches the preset minimum temperature, and the controller correspondingly controls the cooling piece 3 and the cooling fan 6 to be closed.

Optionally, the heat dissipation system 1 further comprises a first thermal interface material 81 disposed between the top plate 22 and the temperature sensor 7; or the heat dissipation system 1 further comprises a second thermal interface material 82 arranged between the temperature sensor 7 and the cooling surface, and a third thermal interface material 83 arranged between the heat dissipation surface and the heat pipe 4.

Preferably, referring to fig. 3, in the present embodiment, the heat dissipation system 1 further includes a first thermal interface material 81 disposed between the top plate 22 and the temperature sensor 7; and the heat dissipation system 1 further comprises a second thermal interface material 82 disposed between the temperature sensor 7 and the cooling surface, and a third thermal interface material 83 disposed between the heat dissipation surface and the heat pipe 4.

Optionally, the first thermal interface material 81, the second thermal interface material 82, and the third thermal interface material 83 may be a thermal conductive adhesive, a silicone gel, a silicone grease, or a heat dissipation pad.

In this arrangement, the first thermal interface material 81 is used to reduce the thermal contact resistance between the top plate 22 and the temperature sensor 7, the second thermal interface material 82 is used to reduce the thermal contact resistance between the temperature sensor 7 and the cooling surface, and the third thermal interface material 83 is used to reduce the thermal contact resistance between the cooling surface and the heat pipe 4, so as to improve the heat dissipation performance.

In summary, the heat dissipation system 1 of the embodiment realizes accurate temperature control of the laser, ensures that the wavelength range is within the temperature drift range, and is particularly suitable for narrow linewidth lasers with higher requirements on the temperature range.

Preferably, in the present embodiment, the thickness of the housing 2 is not more than 20mm, for example, the thickness of the housing 2 is 20mm, 19mm, 18mm, 17mm, 16mm, or the like.

By such arrangement, the space occupied by the heat dissipation system 1 is smaller, and the miniaturization is advanced, so that the installation space of the heat dissipation system 1 can be greatly reduced for high-integration photoelectric equipment.

Example two

The second embodiment provides an optoelectronic device, where the optoelectronic device includes the heat dissipation system 1 of the first embodiment, and technical features of the heat dissipation system 1 disclosed in the first embodiment are also applicable to the first embodiment, and technical features of the heat dissipation system 1 disclosed in the first embodiment are not repeated. Embodiments of the optoelectronic device are described in further detail below with reference to the accompanying drawings.

Referring to fig. 4, the optoelectronic device provided in this embodiment includes a housing 91, a laser 92 and the heat dissipation system 1, wherein the laser 92 and the heat dissipation system 1 are disposed in the housing 91, a casing 2 of the heat dissipation system 1 is connected to the housing 91, and the laser 92 is connected to a top plate 22 of the casing 2.

In such a setting, after the laser 92 is connected to the top plate 22, the cooling surface of the semiconductor cooling element 3 of the heat dissipation system 1 is cooled, and the heat sources such as the laser 92 are cooled by the top plate 22, so as to ensure the stable and reliable operation of the laser 92, meanwhile, the temperature of the cooling surface is increased, and the higher temperature of the cooling surface is conducted to the heat pipe 4, so that the cooling liquid in the heat pipe 4 absorbs heat and evaporates, the purpose of dissipating heat for the cooling surface is achieved, and the cooling effect of the semiconductor cooling element 3 is maintained.

In the photoelectric device, the heat dissipation system 1 combines the active heat dissipation and cooling mode of the semiconductor refrigeration piece 3 and the passive heat conduction heat dissipation mode of the heat pipe 4 to form an active-passive composite heat dissipation scheme, so that heat dissipation of a heat source is more efficient and reliable, the heat dissipation system is particularly suitable for the photoelectric device with high integration level and high power, the heat dissipation requirement can be met, and the technical problem that the heat dissipation mode of the photoelectric device in the prior art is single is solved.

The photovoltaic apparatus of the present embodiment has the advantage of the heat dissipation system 1 of the first embodiment, which has been described in detail in the first embodiment, and is not repeated here.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the utility model.

Claims (10)

1. The heat dissipation system is characterized by comprising a shell (2), a semiconductor refrigerating piece (3) and a heat pipe (4), wherein the shell (2) is provided with an inner cavity, and the semiconductor refrigerating piece (3) and the heat pipe (4) are arranged in the inner cavity;

The semiconductor refrigerating piece (3) comprises a refrigerating surface and a radiating surface, the refrigerating surface is arranged close to a top plate (22) of the shell (2), and the heat pipe (4) is connected to the radiating surface.

2. The heat dissipation system according to claim 1, wherein the heat dissipation system (1) further comprises a temperature equalizing plate (5), and the heat pipe (4) is connected to the heat dissipation surface through the temperature equalizing plate (5).

3. The heat dissipation system according to claim 2, wherein a plurality of heat pipes (4) are provided, and a plurality of the heat pipes (4) are arranged at intervals along the length direction of the temperature equalizing plate (5).

4. The heat dissipation system according to claim 2, characterized in that the heat pipe (4) is a serpentine pipe, a bulb pipe or a spiral pipe.

5. The heat dissipation system according to any one of claims 1-4, wherein the heat dissipation system (1) further comprises a heat dissipation fan (6) embedded in the inner cavity, the heat dissipation fan (6) being arranged close to the heat pipe (4).

6. The heat dissipation system according to claim 5, wherein the housing (2) includes a side plate (21) and a bottom plate disposed at a bottom end of the side plate (21), the top plate (22) is disposed at an end of the side plate (21) away from the bottom plate, and the side plate (21), the top plate (22) and the bottom plate together form the inner cavity;

The radiating fan (6) is embedded in the inner cavity through the bottom plate.

7. The heat dissipation system according to any one of claims 1-4, characterized in that the heat dissipation system (1) further comprises a temperature sensor (7) arranged between the top plate (22) and the cooling surface, the temperature sensor (7) being connected to the semiconductor cooling element (3).

8. The heat dissipation system according to claim 7, wherein the heat dissipation system (1) further comprises a first thermal interface material (81) disposed between the top plate (22) and the temperature sensor (7);

And/or the heat dissipation system further comprises a second thermal interface material (82) arranged between the temperature sensor (7) and the refrigerating surface, and a third thermal interface material (83) arranged between the heat dissipation surface and the heat pipe (4).

9. A heat dissipation system according to any one of claims 1-4, characterized in that the thickness of the housing (2) is not more than 20mm.

10. An optoelectronic device, comprising a housing (91), a laser (92) and the heat dissipation system (1) according to any one of claims 1-9, wherein the laser (92) and the heat dissipation system (1) are both arranged in the housing (91), a casing (2) of the heat dissipation system (1) is connected to the housing (91), and the laser (92) is connected to a top plate (22) of the casing (2).