CN113783085A - Built-in circulating passive cooling module and method for all-in-one air-cooled low-power solid-state laser - Google Patents
Built-in circulating passive cooling module and method for all-in-one air-cooled low-power solid-state laser Download PDFInfo
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- CN113783085A CN113783085A CN202110688245.8A CN202110688245A CN113783085A CN 113783085 A CN113783085 A CN 113783085A CN 202110688245 A CN202110688245 A CN 202110688245A CN 113783085 A CN113783085 A CN 113783085A
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- 238000001816 cooling Methods 0.000 title claims abstract description 182
- 238000000034 method Methods 0.000 title claims abstract description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 130
- 230000017525 heat dissipation Effects 0.000 claims abstract description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 25
- 229910052782 aluminium Inorganic materials 0.000 claims description 25
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 20
- 239000007864 aqueous solution Substances 0.000 claims description 8
- 239000000243 solution Substances 0.000 claims description 8
- 239000013078 crystal Substances 0.000 description 24
- 239000007787 solid Substances 0.000 description 20
- 238000005057 refrigeration Methods 0.000 description 8
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0404—Air- or gas cooling, e.g. by dry nitrogen
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0407—Liquid cooling, e.g. by water
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/042—Arrangements for thermal management for solid state lasers
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Abstract
本发明涉及一种用于一体机风冷小功率固体激光器的内置循环被动冷却模组及方法，包括模组座，所述模组座顶部设置有用于安装激光器的冷却底板，所述冷却底板内设置有S型水道，所述模组座内设置有与S型水道热水出口连通的水泵和与水泵连通的水冷盘，水冷盘出口与S型水道的冷水入口连通，所述模组座一侧侧壁上设置有出风口，所述模组座内靠近出风口处设置有水冷盘风扇组，所述水冷盘设置在水冷盘风扇组和出风口之间，所述模组座上设置有用于控制水冷盘风扇组工作的供电接口；本发明利用大风量风扇及水冷盘，并加装内置循环水装置，使装有激光器的冷却底板达到有效且均匀的散热，使置于冷却底板上的小功率固体激光器达到动态稳定状态。
The invention relates to a built-in circulating passive cooling module and method for an all-in-one air-cooled low-power solid-state laser. An S-shaped water channel is provided, a water pump connected to the hot water outlet of the S-shaped water channel and a water cooling plate connected to the water pump are arranged in the module seat, and the outlet of the water cooling plate is communicated with the cold water inlet of the S-shaped water channel. An air outlet is arranged on the side wall, and a water-cooled disk fan group is arranged in the module seat near the air outlet, and the water-cooled disk is arranged between the water-cooled disk fan group and the air outlet. It is used to control the power supply interface of the fan group of the water-cooling plate; the present invention uses a large air volume fan and a water-cooling plate, and adds a built-in circulating water device, so that the cooling bottom plate equipped with the laser can achieve effective and uniform heat dissipation, so that the cooling plate placed on the cooling bottom plate can achieve effective and uniform heat dissipation. The low-power solid-state laser reaches a dynamic stable state.
Description
Technical Field
The invention belongs to the technical field of laser beam processing, such as welding, cutting and punching, and particularly relates to a compact passive cooling module of an all-in-one machine suitable for a low-power air-cooled solid laser.
Background
The cooling method for the laser crystal in the all-solid-state laser can be roughly divided into three methods: liquid cooling, semiconductor refrigeration and air cooling conduction heat dissipation.
The liquid cooling can achieve a good cooling effect by controlling the temperature and the flow of the liquid, and the liquid cooling takes constant-temperature water as a cooling mode and needs an independent laser water cooler for cooling; the added laser water cooling machine has no advantages in cost, and can not meet the requirements under the environment with higher humidity requirements.
The semiconductor (TEC) refrigeration needs a cooling mode of adding a cooling fin fan on the basis of a semiconductor refrigeration piece, the cooling temperature precision is better controlled by the mode, but a temperature control circuit and other related equipment are added, the integral volume of the laser is increased, the semiconductor refrigeration piece used for the semiconductor refrigeration has short service time, and the semiconductor refrigeration piece is easy to damage after being used for a long time and is not suitable for the practical application of industrial products.
The cooling temperature of a water cooling and semiconductor cooling mode is generally lower than the room temperature, the local temperature of the surface of the crystal is usually lower than the room temperature in actual use, the crystal is easy to fog when meeting cold air in the air, the surface of the crystal is easy to damage when a laser runs, and the service life of the laser is shortened; in addition, in the end-face pump laser, due to the limitation of various refrigeration modes, only side refrigeration can be relied on, the temperature difference from the middle to the edge of the laser crystal on a section vertical to the laser operation is higher, and the output light mode of the laser beam is deteriorated by the thermal lens effect caused by the temperature difference.
The full air-cooled heat dissipation industrial laser has the advantages of simple structure, stable operation, long service life, particular suitability for long-time operation in a poor environment and high stability; and the full air-cooled heat dissipation mode can reduce the temperature difference from the middle to the edge of the section of the laser rod along the direction vertical to the light path, reduce the adverse effect of the thermal lens effect on laser output beams, and further improve the output quality of the laser beams.
The Chinese invention has the patent application number of ZL200910253670 and the patent name of: the patent discloses a full air-cooled radiating double-pump double-crystal laser, which comprises an air-cooled radiating device, a first laser crystal, a second laser crystal, a first laser crystal clamp, a second laser crystal clamp and a shell with a radiating outlet, wherein the air-cooled radiating device mainly comprises a fan and a radiating fin, the first laser crystal clamp and the second laser crystal clamp are provided with arrangement groove holes for clamping the laser crystals, the first laser crystal clamp and the second laser crystal clamp are fixed on the radiating fin, the longitudinal section of the arrangement groove holes is in a diamond shape, the diagonal of the diamond shape is consistent with the C axis of the laser crystals placed on the arrangement groove holes, the appearance of the first laser crystal and the appearance of the second laser crystal are matched with the arrangement groove holes, the transverse section of the outlet of the arrangement groove holes is in a horn shape, when the laser crystal cooling device works, heat energy generated by the laser crystal is conducted to the crystal clamp through four contact surfaces of the laser crystal in a heat conduction mode, the crystal clamp conducts the heat to the bottom plate of the laser shell, the conducted heat is directly blown to the cooling fins below the bottom plate through the fan at the lower part of the laser shell, the heat is finally taken out of the laser and is transmitted to the surrounding air, and the laser crystal is effectively cooled.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a built-in circulating passive cooling module and a method for an all-in-one air-cooled small-power solid laser, in which a large-air-volume fan and a water-cooling disc are used, and a built-in circulating water device is additionally installed, so that a cooling bottom plate with a laser can dissipate heat effectively and uniformly, and the small-power solid laser placed on the cooling bottom plate can be in a dynamic stable state.
In order to achieve the purpose, the built-in circulating passive cooling module for the all-in-one air-cooled small-power solid laser comprises a module seat, wherein a cooling bottom plate for mounting a laser is arranged at the top of the module seat, an S-shaped water channel is arranged in the cooling bottom plate, a water pump communicated with a hot water outlet of the S-shaped water channel and a water-cooling disc communicated with the water pump are arranged in the module seat, an outlet of the water-cooling disc is communicated with a cold water inlet of the S-shaped water channel, an air outlet is arranged on the side wall of one side of the module seat, a water-cooling disc fan set is arranged in the module seat close to the air outlet, the water-cooling disc is arranged between the water-cooling disc fan set and the air outlet, and a power supply interface for controlling the water-cooling disc fan set to work is arranged on the module seat.
Furthermore, a fan set I which is arranged corresponding to the air outlet is arranged on the side wall of the other side of the module seat, and the fan set I is electrically connected with the power supply interface.
Further, an aluminum fin radiator extending into the module seat is arranged at the bottom of the cooling bottom plate, and the aluminum fin radiator is arranged between the water-cooling disc fan set and the fan set I.
Further, the cooling bottom plate bottom is provided with 1 pair of vertical pipeline of downwardly extending, and wherein the top and the S type water course intercommunication of 1 vertical pipeline, its bottom and cold water inlet intercommunication, the top and the S type water course intercommunication of 1 vertical pipeline in addition, its bottom and hot water outlet intercommunication.
Further, the S-shaped water channel comprises a water cooling circulation section, a cold and heat exchange circulation section and a hot water circulation section, the water cooling circulation section is used for being communicated with the cold water inlet and the vertical pipeline, the cold and heat exchange circulation section is arranged in the middle of the cooling bottom plate, the hot water circulation section is used for being communicated with the vertical pipeline and the hot water outlet, a water inlet which is communicated with the S-shaped water channel and is used for injecting glycol water solution is formed in the side wall of the module seat, and the water inlet is arranged between the water cooling circulation section and the cold and heat exchange circulation section.
Further, the water-cooling circulation section is arranged above the water-cooling disc.
Further, be provided with temperature sensor in the module seat, be provided with the communication interface that is used for being connected with temperature sensor on the module seat.
Furthermore, the side wall of the module seat is provided with a fixed support leg for fixing the module seat on the laser machine frame.
Further, the aluminum fin radiators are aluminum fin radiating fins which are uniformly distributed on the cooling bottom plate, radiating channels are arranged between the adjacent aluminum fin radiating fins, and the radiating channels are uniformly distributed between the water cooling disc fan set and the fan set I.
The invention also discloses a heat dissipation control method of the built-in circulating passive cooling module for the all-in-one air-cooled low-power solid laser, which comprises the following steps,
1) the water inlet of the cooling plate is filled with glycol water solution, the glycol water solution enters a water pump in the module from a hot water outlet after passing through an S-shaped water channel in the cooling plate, and the water pump compresses water pressure into a water cooling disc;
2) the fan set rotates after being electrified to drive external air to enter the module and blow to the water cooling disc; meanwhile, the water cooling disc fan set on the water cooling disc rotates to cool the water cooling disc, and hot air is blown out from the air outlet;
3) the heat of the aqueous solution through the water-cooling dish is taken away in the cooling of water-cooling dish, and the aqueous solution after the cooling flows into the cooling bottom plate through cold water inlet, at cooling bottom plate S type water course inner loop, takes away the heat that gives the cooling bottom plate because of laser work, and it is inside to continue to get into the cooling module again through the hot water export again.
The invention has the beneficial effects that:
1. the built-in circulating passive cooling module and the method for the air-cooled low-power solid laser of the all-in-one machine utilize a large-air-volume fan and a water-cooling disc, and are additionally provided with a built-in circulating water device, so that a cooling bottom plate provided with the laser can achieve effective and uniform heat dissipation, and the low-power solid laser arranged on the cooling bottom plate can achieve a dynamic stable state.
2. The invention relates to a built-in circulating passive cooling module for an air-cooled low-power solid laser of an all-in-one machine and a fan model adopted in the method, wherein the fan model comprises the following components: AFB0624 SH; current: 0.18A; air volume: 38 CFM; the specific heat capacity of the aluminum fin radiator is 900 KJ/kg.K, the specific heat capacity of the aluminum fin radiator in the embodiment is 900 KJ/kg.K, the specific heat capacity of the copper fin radiator is 386 KJ/kg.K, and the specific heat capacity of the aluminum fin radiator is three times that of the copper fin radiator; the medium with high specific heat capacity absorbs or emits more heat when the temperature rises or falls by 1 ℃; an aluminum fin radiator: the radiator has small thermal resistance, proper wind fin spacing and surface area, and large air volume, and the fans are aligned to radiate heat, and the central temperature of the fixed laser is controlled within 29.5 +/-1 ℃ after the embodiment is adopted.
Drawings
FIG. 1 is a schematic structural diagram of a built-in circulating passive cooling module for an all-in-one air-cooled low-power solid laser according to the present invention;
FIG. 2 is a perspective view of an S-shaped water channel of a cooling base plate in the built-in circulating passive cooling module for the all-in-one air-cooled low-power solid laser of the invention;
FIG. 3 is a perspective view of a module seat water channel in the built-in circulating passive cooling module for the all-in-one air-cooled low-power solid laser according to the present invention;
FIG. 4 is a side view of the end of the built-in circulating passive cooling module of the present invention for an all-in-one air-cooled low power solid state laser;
fig. 5 is a temperature detection diagram of the built-in circulating passive cooling module for the all-in-one air-cooled low-power solid laser of the invention after implementation.
Reference numerals: 1-a module seat, 2-a cooling bottom plate, 3-an aluminum fin radiator, 4-a fixed supporting leg, 5-a communication interface, 6-a power supply interface, 7-an air outlet and 8-a fan set I; 9-mounting bolts; 10-a water-cooled disc fan set; 11-water inlet; 12-S shaped water channels; 121-a water-cooled circulation section; 123-hot water outlet; 124-cold water inlet; 13-a water-cooled disc; 131-water cooling disc inlet; 132-water pump outlet; 133-water cooling disc outlet; 14-a water pump; 15-water channel plug.
Detailed Description
The present invention will be described in further detail with reference to examples and embodiments. It should be understood that the scope of the above subject matter of the present invention is not limited to the following examples, and any technique realized based on the summary of the present invention is within the scope of the present invention.
Referring to fig. 1-5, which are schematic structural diagrams of the built-in circulating passive cooling module and the method for the integrated air-cooled small-power solid laser of the present invention, the built-in circulating passive cooling module for the integrated air-cooled small-power solid laser of the present invention comprises a module base 1, a cooling bottom plate 2 for mounting a laser is arranged on the top of the module base 1, an S-shaped water channel 12 is arranged in the cooling bottom plate 2, a water pump 14 communicated with a hot water outlet 123 of the S-shaped water channel 12 and a water cooling disc 13 communicated with the water pump 14 are arranged in the module base 1, an outlet of the water cooling disc 13 is communicated with a cold water inlet 124 of the S-shaped water channel 12, an air outlet 7 is arranged on a side wall of the module base 1, a water cooling disc fan set 10 is arranged in the module base 1 near the air outlet 7, the water cooling disc 12 is arranged between the water cooling disc fan set 10 and the air outlet 7, and a power supply interface 6 for controlling the operation of the water-cooling disc fan set 10 is arranged on the module seat 1.
In the embodiment, a large-air-volume fan and a water cooling disc 13 are utilized, and a built-in circulating water device is additionally arranged, so that the cooling bottom plate 2 provided with the laser achieves effective and uniform heat dissipation, and the low-power solid laser arranged on the cooling bottom plate 2 achieves a dynamic stable state.
In a preferred embodiment, a fan set I8 corresponding to the air outlet is disposed on the side wall on the other side of the module seat 1, and the fan set I8 is electrically connected to the power supply interface 6; the water-cooling disc fan group 10 is independently joined in marriage the fan structure, and module seat 1 establishes fan group I8 in addition and bloies heat dissipation to module seat 1 on the basis of water-cooling disc fan group, and two sets of fans can effectively cool down the water-cooling disc and realize the exchange of cold and hot air in the module, further improve the radiating effect, can make the miniwatt solid laser who arranges on cooling bottom plate 2 in reach dynamic stable state.
In a preferred embodiment, the bottom of the cooling bottom plate 2 is provided with an aluminum fin radiator 3 extending into the module seat, the aluminum fin radiator 3 is arranged between the water-cooling disc fan set 10 and the fan set I8, in this embodiment, the fan set I8 is used for radiating heat of the aluminum fin radiator 3, and the water-cooling disc fan set 10 is used for radiating heat of the water-cooling disc, so that the heat radiation effect is further improved, and the low-power solid laser arranged on the cooling bottom plate 2 can reach a dynamic stable state.
In a preferred embodiment, the bottom of the cooling bottom plate 2 is provided with 1 pair of vertical pipelines extending downwards, wherein the top of 1 vertical pipeline is communicated with the S-shaped water channel 12, the bottom of the vertical pipeline is communicated with the cold water inlet 124, the top of another 1 vertical pipeline is communicated with the S-shaped water channel 12, and the bottom of the vertical pipeline is communicated with the hot water outlet 123.
In a preferred embodiment, the S-shaped water channel 12 includes a water cooling circulation section 121 for communicating with the cold water inlet 124 and the vertical pipe, a heat exchange circulation section disposed in the middle of the cooling bottom plate 2, and a hot water circulation section for communicating with the vertical pipe and the hot water outlet 123, a water inlet 11 for injecting glycol water solution is disposed on the sidewall of the module seat 1, the water inlet 11 is disposed between the water cooling circulation section and the heat exchange circulation section, and the glycol water solution is injected through the water inlet 11 in this embodiment, so that the water inside the water cooling plate is not easy to freeze, and the problem of poor circulation due to too low temperature is effectively prevented.
In a preferred embodiment, the water-cooling circulation section is arranged above the water-cooling disc 13, the built-in circulating water device in this embodiment includes a water pump 14, an S- shaped water channel 12 and 3 water-cooling discs 12 connected in series, an outlet 132 of the water pump is communicated with an inlet 131 of a first water-cooling disc, an outlet 133 of the water-cooling disc is communicated with an inlet of a second water-cooling disc, and an outlet of the second water-cooling disc is communicated with an inlet of a third water-cooling disc; the outlet of the third water cooling disc is communicated with the cold water inlet 124 through a vertical pipeline; the water pump 14 retracts water pressure into the water cooling disc 13, and the heat of the water cooling disc is taken away through the water cooling disc fan 10, so that the purpose of cooling the circulating water is achieved.
In a preferred embodiment, a temperature sensor is arranged in the module seat 1, and a communication interface 5 for connecting with the temperature sensor is arranged on the module seat, and the temperature condition in the module seat is monitored by the temperature sensor in this embodiment.
In a preferred embodiment, the side wall of the module seat 1 is provided with a fixing support leg 4 for fixing the module seat on a laser machine frame, and the structure of the embodiment is beneficial to the installation and fixation of the module seat 1, and is convenient for the passive cooling module to be integrated on the laser machine frame.
In a preferred embodiment, the aluminum fin heat sink 1 is provided as aluminum fin cooling fins uniformly distributed on the cooling bottom plate, and heat dissipation channels are arranged between adjacent aluminum fin cooling fins and uniformly distributed between the water-cooling disc fan group 10 and the fan group I8.
The invention also discloses a heat dissipation control method of the built-in circulating passive cooling module for the all-in-one air-cooled low-power solid laser, which comprises the following steps,
1) the water inlet of the cooling plate is filled with glycol water solution, the glycol water solution enters a water pump in the module from a hot water outlet after passing through an S-shaped water channel in the cooling plate, and the water pump compresses water pressure into a water cooling disc;
2) the fan set rotates after being electrified to drive external air to enter the module and blow to the water cooling disc; meanwhile, the water cooling disc fan set on the water cooling disc rotates to cool the water cooling disc, and hot air is blown out from the air outlet;
3) the heat of the aqueous solution through the water-cooling dish is taken away in the cooling of water-cooling dish, and the aqueous solution after the cooling flows into the cooling bottom plate through cold water inlet, at cooling bottom plate S type water course inner loop, takes away the heat that gives the cooling bottom plate because of laser work, and it is inside to continue to get into the cooling module again through the hot water export again.
The fan model in this embodiment is: AFB0624 SH; current: 0.18A; air volume: 38 CFM; the specific heat capacity of the aluminum fin radiator is 900 KJ/kg.K, the specific heat capacity of the aluminum fin radiator in the embodiment is 900 KJ/kg.K, the specific heat capacity of the copper fin radiator is 386 KJ/kg.K, and the specific heat capacity of the aluminum fin radiator is three times that of the copper fin radiator; the medium with high specific heat capacity absorbs or emits more heat when the temperature rises or falls by 1 ℃; an aluminum fin radiator: the radiator has small thermal resistance, proper wind fin spacing and surface area, and large air volume, and the fans are aligned to radiate heat, and the central temperature of the fixed laser is controlled within 29.5 +/-1 ℃ after the embodiment is adopted.
Finally, it is noted that the above-mentioned preferred embodiments illustrate rather than limit the invention, and that, although the invention has been described in detail with reference to the above-mentioned preferred embodiments, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the scope of the invention as defined by the appended claims.
Claims (10)
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| CN202110688245.8A CN113783085A (en) | 2021-06-22 | 2021-06-22 | Built-in circulating passive cooling module and method for all-in-one air-cooled low-power solid-state laser |
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| CN202110688245.8A CN113783085A (en) | 2021-06-22 | 2021-06-22 | Built-in circulating passive cooling module and method for all-in-one air-cooled low-power solid-state laser |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117595048A (en) * | 2024-01-19 | 2024-02-23 | 安徽华创鸿度光电科技有限公司 | Solid laser |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201430338Y (en) * | 2009-02-17 | 2010-03-24 | 西北大学 | A compact water-air hybrid cooling unit for all-solid-state lasers |
| CN207518047U (en) * | 2017-11-24 | 2018-06-19 | 富通尼激光科技（东莞）有限公司 | Laser Cooling System |
| CN209516297U (en) * | 2018-12-28 | 2019-10-18 | 江苏亮点光电科技有限公司 | A kind of efficient laser heat radiating device special |
-
2021
- 2021-06-22 CN CN202110688245.8A patent/CN113783085A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201430338Y (en) * | 2009-02-17 | 2010-03-24 | 西北大学 | A compact water-air hybrid cooling unit for all-solid-state lasers |
| CN207518047U (en) * | 2017-11-24 | 2018-06-19 | 富通尼激光科技（东莞）有限公司 | Laser Cooling System |
| CN209516297U (en) * | 2018-12-28 | 2019-10-18 | 江苏亮点光电科技有限公司 | A kind of efficient laser heat radiating device special |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117595048A (en) * | 2024-01-19 | 2024-02-23 | 安徽华创鸿度光电科技有限公司 | Solid laser |
| CN117595048B (en) * | 2024-01-19 | 2024-03-26 | 安徽华创鸿度光电科技有限公司 | Solid laser |
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Application publication date: 20211210 |
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