CN210328410U - Gain amplifier's heat radiation structure - Google Patents
Gain amplifier's heat radiation structure Download PDFInfo
- Publication number
- CN210328410U CN210328410U CN201921182480.2U CN201921182480U CN210328410U CN 210328410 U CN210328410 U CN 210328410U CN 201921182480 U CN201921182480 U CN 201921182480U CN 210328410 U CN210328410 U CN 210328410U
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- CN
- China
- Prior art keywords
- heat dissipation
- box body
- plate
- gain amplifier
- heat radiation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000005855 radiation Effects 0.000 title claims abstract description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000004065 semiconductor Substances 0.000 claims abstract description 15
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 14
- 238000005057 refrigeration Methods 0.000 claims abstract description 13
- 230000007246 mechanism Effects 0.000 claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims abstract description 11
- 239000010949 copper Substances 0.000 claims abstract description 11
- 230000017525 heat dissipation Effects 0.000 claims description 69
- 238000005192 partition Methods 0.000 claims description 19
- 230000035939 shock Effects 0.000 claims description 11
- 239000004519 grease Substances 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 241000883990 Flabellum Species 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 7
- 239000000428 dust Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat radiation structure of a gain amplifier, which comprises a box body, wherein two ends of the box body are connected with side plates, the top surfaces and the back surfaces of the side plates and the box body are provided with meshes, the top surface, the back surface and two sides inside the box body are connected with a heat radiation mechanism, the heat radiation mechanism comprises a copper plate, a nickel layer and a microwave plate, the copper plate is connected with the nickel layer, the nickel layer is attached to the microwave plate, two symmetrical side surfaces inside the box body are provided with grooves, the grooves are connected with a heat radiation baffle plate, the heat radiation baffle plate is provided with a plurality of semiconductor refrigeration sheets, the hot ends of the semiconductor refrigeration sheets are contacted with the heat radiation baffle plate, the bottom surface of the heat radiation baffle plate is fixedly connected with a heat radiation toothed plate, the bottom of the box body is uniformly provided with a plurality of assembly grooves, the assembly grooves, the upper cover and the lower cover are evenly provided with arc-shaped air outlets, and the body is connected with a rotating shaft.
Description
Technical Field
The utility model belongs to the technical field of heat radiation structure, concretely relates to gain amplifier's heat radiation structure.
Background
As the gain amplifier is widely used in communication systems, radar systems, broadcast television equipment, and other various electronic devices and equipments, when the power amplifier works, a large amount of heat is generated, and when the internal circuit of the gain amplifier works in the actual working process, because the power amplifier has small volume of the shell and dense internal parts, the heat generated during the operation of the circuit is difficult to dissipate, the natural heat dissipation through the shell is not enough, and the internal temperature of the amplifier can be reduced by adding an auxiliary heat dissipation mechanism to ensure that the internal components work normally, the poor heat dissipation of the structure can greatly affect the service life of the amplifier, even the normal operation of the whole electronic equipment, the poor heat dissipation structure of the prior gain amplifier, and certain damage can be caused to the inside of the gain amplifier when dust enters the gain amplifier, and the damage to the shell caused by vibration cannot be effectively prevented.
SUMMERY OF THE UTILITY MODEL
To the problem that the above-mentioned background art provided, the utility model aims at: the heat dissipation structure of the gain amplifier is provided. In order to realize the technical purpose, the utility model discloses a technical scheme as follows:
a heat dissipation structure of a gain amplifier comprises a box body, wherein side plates are connected to two ends of the box body, meshes are arranged on the side plates and the top surface and the back surface of the box body, heat dissipation mechanisms are connected to the top surface, the back surface and two sides inside the box body, each heat dissipation mechanism comprises a copper plate, a nickel layer and a microwave plate, the copper plates are connected with the nickel layers, the nickel layers are attached to the microwave plates, grooves are formed in two symmetrical side surfaces inside the box body, each groove is connected with a heat dissipation partition plate, a plurality of semiconductor refrigeration sheets are arranged on the heat dissipation partition plates, hot ends of the semiconductor refrigeration sheets are in contact with the heat dissipation partition plates, heat dissipation exhaust toothed plates are fixedly connected to the bottom surfaces of the heat dissipation partition plates, a plurality of assembly grooves are uniformly formed in the bottom of the box body, exhaust fans are connected in the assembly grooves and comprise a body, an upper cover and a, the body is connected with the pivot, the pivot is connected with the flabellum, the bottom half is equipped with the pilot hole, be equipped with the spring hole on the pilot hole, the pilot hole is connected with the pole setting, the pole setting bottom is connected with the shock pad, the shock pad bottom is equipped with anti-skidding shading, shock pad fixed surface is connected with the spring, spring other end fixed connection is in the spring hole.
Further inject, the mesh is circular louvre, the even densely covered of mesh is on the top surface of box, the back and the curb plate, and such structure makes the more even of heat dissipation, and the fan is hotly effectually.
Further inject, the junction of box and two curb plates is equipped with sealed cushion, and such structure makes the cavity back of installing functional unit in the box sealed, has prevented the entering of dust.
Further inject, heat dissipation baffle and heat dissipation pinion rack junction are equipped with the good silicone grease of heat conductivity, heat dissipation baffle and heat dissipation pinion rack pass through the silicone grease and connect fixedly, and such structure makes the heat energy of heat dissipation baffle can be faster transmit to the heat dissipation pinion rack, faster heat dissipation.
Further, the fan blades are arc-shaped fan blades, and the fan blades 805 are inclined by 25 degrees and uniformly and densely distributed on the surface of the rotating shaft, so that the exhaust effect is better when the exhaust fan works.
The utility model has the advantages of it is following:
1. the utility model has the advantages that by arranging the heat dissipation baffle plate, the functional components carried by the upper cavity are dissipated by the semiconductor refrigeration piece, the heat dissipation effect is good, the lower cavity is provided with the heat dissipation toothed plate, the lower cavity is forcibly dissipated by the exhaust fan, and the hot end of the semiconductor refrigeration piece is effectively cooled, so that the semiconductor refrigeration piece can continuously refrigerate the functional components of the upper cavity;
2. the utility model has the advantages that the heat dissipation mechanism adopts a three-layer structure by arranging the heat dissipation mechanism, and the heat dissipation is fast and the heat dissipation capacity is large;
3. the utility model discloses a set up the spring, when the box receives vibrations, can have the buffering effect to the shock pad bottom is equipped with anti-skidding shading, has anti-skidding effect.
Drawings
The present invention can be further illustrated by the non-limiting examples given in the accompanying drawings;
fig. 1 is a schematic structural diagram of a heat dissipation structure of a gain amplifier according to an embodiment of the present invention;
fig. 2 is a schematic side view of a heat dissipation structure of a gain amplifier according to an embodiment of the present invention;
fig. 3 is a schematic cross-sectional view of a heat dissipation structure of a gain amplifier according to an embodiment of the present invention;
fig. 4 is a schematic view of a heat dissipation partition plate of a heat dissipation structure of a gain amplifier according to an embodiment of the present invention;
fig. 5 is a schematic diagram of an amplifying structure at a position a of a heat dissipation structure of a gain amplifier according to an embodiment of the present invention;
fig. 6 is a schematic view of an exhaust fan of a heat dissipation structure of a gain amplifier according to an embodiment of the present invention;
the main element symbols are as follows:
the refrigerator comprises a box body 1, side plates 2, meshes 3, a heat dissipation mechanism 4, a copper plate 401, a nickel layer 402, a microwave plate 403, a heat dissipation partition plate 5, a semiconductor refrigeration sheet 6, a heat dissipation toothed plate 7, an exhaust fan 8, an upper cover 801, a body 802, a lower cover 803, a rotating shaft 804, fan blades 805, an arc-shaped exhaust outlet 8010, an assembly hole 9, a spring hole 91, an upright rod 10, a shock pad 11 and a spring 12.
Detailed Description
In order to make the present invention better understood by those skilled in the art, the technical solutions of the present invention are further described below with reference to the accompanying drawings and examples.
As shown in fig. 1-6, the utility model discloses a gain amplifier's heat radiation structure, including box 1, its characterized in that: the two ends of the box body 1 are connected with side plates 2, the top surfaces and the back surfaces of the side plates 2 and the box body 1 are respectively provided with a mesh 3, the top surface, the back surface and the two sides in the box body 1 are connected with a heat dissipation mechanism 4, the heat dissipation mechanism 4 comprises a copper plate 401, a nickel layer 402 and a microwave plate 403, the copper plate 401 is connected with the nickel layer 402, the nickel layer 402 is attached with the microwave plate 403, two symmetrical side surfaces in the box body 1 are provided with grooves, the grooves are connected with a heat dissipation partition plate 5, the heat dissipation partition plate 5 is provided with a plurality of semiconductor refrigerating sheets 6, the hot ends of the semiconductor refrigerating sheets 6 are in contact with the heat dissipation partition plate 5, the bottom surface of the heat dissipation partition plate 5 is fixedly connected with a heat dissipation toothed plate 7, the bottom of the box body 1 is uniformly provided with a plurality of assembly grooves, the assembly grooves are connected with exhaust fans 8, each, body 802 is connected with pivot 804, and pivot 804 is connected with flabellum 805, and box 1 bottom is equipped with pilot hole 9, is equipped with spring hole 91 on the pilot hole 9, and pilot hole 9 is connected with pole setting 10, and pole setting 10 bottom is connected with shock pad 11, and shock pad 11 bottom is equipped with anti-skidding shading, and shock pad 11 fixed surface is connected with spring 12, and spring 12 other end fixed connection is in spring hole 91.
During the use, the gain amplifier can produce a large amount of heats at 1 intracavity during operation of box, take away the heat of 1 inside of box through the microwave board 403 of 1 inside of box, the heat finally conducts the heat to copper 401 through nickel layer 402, utilize the characteristics that metal copper is bigger than the hot melt, the heat that will produce is discharged from mesh 3 and is reached the radiating effect, through radiating baffle 5, semiconductor refrigeration piece 6 dispels the heat to the gain amplifier functional component that the top cavity bore, the radiating effect is good, the below cavity sets up cooling toothed plate 7, force the heat dissipation to the cavity of below through exhaust fan 8, the effectual hot junction to semiconductor refrigeration piece 6 cools off, make semiconductor refrigeration piece 6 can continuously refrigerate to the functional component of top cavity.
Preferred mesh 3 is circular louvre, and mesh 3 is even densely covered on top surface, the back and curb plate 2 of box 1, and such structure makes the more even of heat dissipation, and the fan is hotly effectual better. In practice, other mesh 3 configurations are also contemplated, as the case may be.
Preferably, a sealing rubber gasket is arranged at the joint of the box body 1 and the two side plates 2, and the structure enables the cavity for installing the functional component in the box body to be sealed back, so that dust is prevented from entering. In fact, other sealing structures may be used as the case may be.
Preferably, the joint of the heat dissipation partition plate 5 and the heat dissipation toothed plate 7 is provided with silicone grease with good heat conductivity, the heat dissipation partition plate 5 and the heat dissipation toothed plate 7 are fixedly connected through the silicone grease, and the structure enables the heat of the heat dissipation partition plate 5 to be transmitted to the heat dissipation toothed plate 7 more quickly, so that the heat is dissipated more quickly. In fact, other heat dissipation structures may be used as the case may be.
Preferably, the fan blades 805 are arc-shaped fan blades, and the fan blades 805 are inclined by 25 degrees and uniformly and densely distributed on the surface of the rotating shaft 804, so that the exhaust effect is better when the exhaust fan works. In fact, other configurations of fan blades 805 may be used as the case may be.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (5)
1. The utility model provides a gain amplifier's heat radiation structure, includes box (1), its characterized in that: the portable refrigerator is characterized in that the two ends of the box body (1) are connected with side plates (2), the top surfaces and the back surfaces of the side plates (2) and the box body (1) are respectively provided with a mesh (3), the top surface, the back surface and the two sides in the box body (1) are connected with heat dissipation mechanisms (4), each heat dissipation mechanism (4) comprises a copper plate (401), a nickel layer (402) and a microwave plate (403), the copper plate (401) is connected with the nickel layer (402), the nickel layer (402) is attached to the microwave plate (403), two symmetrical side surfaces in the box body (1) are provided with grooves, the grooves are connected with heat dissipation partition plates (5), the heat dissipation partition plates (5) are provided with a plurality of semiconductor refrigeration sheets (6), the hot ends of the semiconductor refrigeration sheets (6) are in contact with the heat dissipation partition plates (5), the bottom surfaces of the heat dissipation partition plates (5) are fixedly connected with heat dissipation toothed, exhaust fan (8) are connected in the assembly groove, exhaust fan (8) include body (802), the end is connected with upper cover (801) and lower cover (803) about body (802), evenly be equipped with convex air exit (8010) on upper cover (801) and lower cover (803), body (802) are connected with pivot (804), pivot (804) are connected with flabellum (805), box (1) bottom is equipped with pilot hole (9), be equipped with spring hole (91) on pilot hole (9), pilot hole (9) are connected with pole setting (10), pole setting (10) bottom is connected with shock pad (11), shock pad (11) bottom is equipped with anti-skidding shading, shock pad (11) fixed surface is connected with spring (12), spring (12) other end fixed connection is in spring hole (91).
2. The heat dissipation structure of a gain amplifier as defined in claim 1, wherein: the mesh (3) is a circular heat dissipation hole, and the mesh (3) is uniformly and densely distributed on the top surface, the back surface and the side plates (2) of the box body (1).
3. The heat dissipation structure of a gain amplifier as defined in claim 2, wherein: and a sealing rubber mat is arranged at the joint of the box body (1) and the side plate (2).
4. A heat dissipating structure of a gain amplifier as set forth in claim 3, wherein: the heat dissipation partition plate (5) and the heat dissipation toothed plate (7) are connected and fixed through silicone grease, and silicone grease with good heat conductivity is arranged at the joint of the heat dissipation partition plate (5) and the heat dissipation toothed plate (7).
5. The heat dissipation structure of a gain amplifier as defined in claim 4, wherein: the fan blades (805) are arc fan blades, and the fan blades (805) are inclined by 25 degrees and are uniformly and densely distributed on the surface of the rotating shaft (804).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921182480.2U CN210328410U (en) | 2019-07-25 | 2019-07-25 | Gain amplifier's heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921182480.2U CN210328410U (en) | 2019-07-25 | 2019-07-25 | Gain amplifier's heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210328410U true CN210328410U (en) | 2020-04-14 |
Family
ID=70125890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921182480.2U Expired - Fee Related CN210328410U (en) | 2019-07-25 | 2019-07-25 | Gain amplifier's heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210328410U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113314993A (en) * | 2021-06-01 | 2021-08-27 | 扬州丰诚电力工程有限公司 | Temperature abnormity alarm device for high-low voltage power distribution cabinet |
-
2019
- 2019-07-25 CN CN201921182480.2U patent/CN210328410U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113314993A (en) * | 2021-06-01 | 2021-08-27 | 扬州丰诚电力工程有限公司 | Temperature abnormity alarm device for high-low voltage power distribution cabinet |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201013 Address after: 13 / F, block B, Xingzhi science and Technology Park, 6-3 Xingzhi Road, Nanjing Economic and Technological Development Zone, Nanjing, Jiangsu Province 210038 Patentee after: NANJING WESTERN BRIDGE TECH. Co.,Ltd. Address before: Nanjing City, Jiangsu province 210037 Longpan Road No. 159 Patentee before: NANJING FORESTRY University |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200414 |