CN210405997U - Heat dissipation structure of electronic device - Google Patents
Heat dissipation structure of electronic device Download PDFInfo
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- CN210405997U CN210405997U CN201920760435.4U CN201920760435U CN210405997U CN 210405997 U CN210405997 U CN 210405997U CN 201920760435 U CN201920760435 U CN 201920760435U CN 210405997 U CN210405997 U CN 210405997U
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Abstract
The utility model discloses an electron device heat radiation structure, include: assembling a printed circuit board, an upper cover, a lower cover, a first heat-conducting fin and a second heat-conducting fin; the assembly printed circuit board is positioned between the upper cover and the lower cover and is divided into a front surface and a back surface, the front surface is provided with a main chip, and the back surface is provided with a heat dissipation hole penetrating to the front surface; the first heat-conducting fin is positioned between the upper cover and the assembled printed circuit board and is attached to the main chip; the second heat-conducting fin is positioned between the lower cover and the assembly printed circuit board and is attached to the back surface. The utility model discloses an electron device heat radiation structure, through the laminating of first conducting strip and main chip, the laminating of the back of second conducting strip and assembly printed circuit board for the heat dissipation can all be realized to the two sides of assembly printed circuit board, and the two sides all is the mode direct transmission heat through the laminating, and efficiency is higher.
Description
Technical Field
The utility model relates to a heat dissipation technology especially relates to an electron device heat radiation structure.
Background
With the improvement of quality of life and the development of the technological level, more and more electronic products are put into use in various fields.
Taking an automobile as an example, consumers put higher demands on a vehicle-mounted entertainment system, and high-performance power amplifier products are gradually becoming essential conditions for vehicle selection.
High performance power amplifier often increases along with output, and power amplifier calorific capacity increases, but the product volume tends to miniaturized design, and this just puts forward higher requirement to power amplifier product heat radiation structure.
In the prior art, for example, a utility model patent with an issued publication number of CN206851220U is disclosed. The utility model discloses an in the patent, recorded, used the power amplifier radiator of a concave structure, this radiator passes through the structural connection of buckle and draw-in groove with the power amplifier. The heat dissipation chip dissipates heat and conducts the heat to the radiator for heat dissipation through the shell of the power amplifier.
Although the heat of the chip can be led out to a certain degree in the prior art, the heat conduction path is long due to the use mode of the heat conduction device, the conduction rate is low, the heat productivity of the chip can be sharply increased under the high-power use conditions such as large volume adjustment, the concentrated heat cannot be quickly conducted to the whole radiating fin, the radiating effect is poor, and long-time high-power operation cannot be met. The casing of power amplifier itself is not used for the radiating, and the heat of power amplifier chip can be present the internal gathering of casing, and modes such as rethread thermal radiation conduct out, influences the heat dissipation very much. In addition, because heat cannot be quickly conducted out, the temperature near the power amplifier chip is high, and other electronic structures and chips near the power amplifier chip are affected.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing an electron device heat radiation structure can conduct heating element's heat fast.
The utility model discloses an electron device heat radiation structure, include: assembling a printed circuit board, an upper cover, a lower cover, a first heat-conducting fin and a second heat-conducting fin; the assembly printed circuit board is positioned between the upper cover and the lower cover and is divided into a front surface and a back surface, the front surface is provided with a main chip, and the back surface is provided with a heat dissipation hole penetrating to the front surface; the first heat-conducting fin is positioned between the upper cover and the assembled printed circuit board and is attached to the main chip; the second heat-conducting fin is positioned between the lower cover and the assembly printed circuit board and is attached to the back surface.
Preferably, the first heat-conducting fin is a copper sheet with a shape matched with the surface shape of the main chip in an attaching mode, and the second heat-conducting fin is a heat-conducting silica gel pad.
Preferably, the first heat conducting fin includes a body portion, a bonding portion protruding toward the main chip is formed on the body portion, the bonding portion is bonded to the main chip, and the body is bonded to the upper cover.
Preferably, the upper cover is provided with a plurality of groups of radiating fins, and the extending direction of the radiating fins is the same as the length direction of the assembled printed circuit board.
Preferably, the height of the radiating fin is 25mm-35 mm; the thickness is 2mm-3 mm; and the distance between two adjacent groups of radiating fins is 8-9 mm.
Preferably, a boss is formed on the lower cover, and the boss protrudes in a direction close to the assembled printed circuit board; the second heat conducting fin is positioned between the boss and the assembly printed circuit board, one side of the second heat conducting fin is tightly attached to the boss, and the other side of the second heat conducting fin is tightly attached to the assembly printed circuit board.
Preferably, the bosses have a plurality of heat generating areas corresponding to different heat generating areas of the assembled printed circuit board.
Preferably, the upper cover and the lower cover are respectively formed with a locking structure, so that the upper cover and the lower cover are locked and fixed.
Preferably, a cooling liquid flow path is formed in each of the upper cover and the lower cover; the cooling liquid flow path is filled with cooling liquid.
The utility model discloses an electron device heat radiation structure, through the laminating of first conducting strip and main chip, the laminating of the back of second conducting strip and assembly printed circuit board for the heat dissipation can all be realized to the two sides of assembly printed circuit board, and the two sides all is the mode direct transmission heat through the laminating, and efficiency is higher.
Drawings
Fig. 1 is an exploded view of the heat dissipation structure of the electronic device of the present invention;
fig. 2 is a schematic view of an upper cover in the heat dissipation structure of the electronic device of the present invention;
fig. 3 is a schematic view of the lower cover in the heat dissipation structure of the electronic device of the present invention.
Reference numerals:
assembling the printed circuit board 1; an upper cover 2; a lower cover 3; a first thermally conductive sheet 4; a second thermally conductive sheet 5; heat radiating fins 6; a boss 7; and a bonding portion 41.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present invention, and should not be construed as limiting the present invention.
The utility model discloses an electron device heat radiation structure, it includes: a printed circuit Board 1 (PCBA), an upper cover 2, a lower cover 3, a first heat conductive sheet 4, and a second heat conductive sheet 5 are assembled.
The assembled printed circuit board 1 is provided with a plurality of heating elements. The heating element referred to herein may include various electronic elements such as chips, capacitors, and the like. The components provided thereon are different depending on the electronic device. For convenience of explanation, the following description will use a car power amplifier as an example.
The mounting printed circuit board 1 has a main chip thereon, which is a large heat generating component on the mounting printed circuit board 1. Of course, the number of the main chips is not fixed according to different types, for example, the chip for the vehicle-mounted Power Amplifier in this embodiment has two main chips, generally two Power Amplifier chips (PA chip/Power Amplifier) arranged at an interval. In addition to the main chip, the mount printed circuit board 1 may be provided with auxiliary chips and the like, such as a wireless signal transmission chip, a processing chip, and the like, which are also heat generating elements. Meanwhile, the same is a heating element in addition to a structure in which a chip such as a capacitor, a resistor, or the like is mounted on the printed circuit board 1.
The assembled printed circuit board 1 is divided into a front surface and a back surface, and the main chip is mounted on the front surface. The back is formed with the louvre, and this louvre is run through the assembly printed circuit board 1, and the louvre just is run through to the front from the back, can be with the heat of front, quick guide to the back avoids thermal pile up. It is to be understood that references herein to "front" and "back" are not intended to limit the structure of the assembled printed circuit board 1, but merely to distinguish between the two faces. Generally, the surface on which the main chip is mounted is used as the front surface, and other components, such as the capacitor and the signal transmission chip mentioned above, can also be mounted on the front surface. Of course, it is not excluded that in some product designs, components are required to be arranged on both sides of the assembly printed circuit board 1, which does not conflict with the above description of the present application, and either side can be used for arranging components, only the side on which the main chip is arranged is the front side. If the main chip has a plurality of chips and both surfaces on which the printed circuit board 1 is mounted are provided, any one surface may be used as the front surface and the corresponding one surface may be used as the back surface.
The heat dissipation holes are subjected to copper leakage treatment to improve the heat conduction speed.
The assembly printed circuit board 1 is positioned between the upper cover 2 and the lower cover 3, a first heat conducting sheet 4 is arranged between the upper cover 2 and the assembly printed circuit board 1, and heat on the front surface of the assembly printed circuit board 1 is conducted to the upper cover 2 through the first heat conducting sheet 4; in order to achieve a better heat conduction effect, the first heat conduction sheet 4 is attached to the main chip, and directly transfers the heat of the main chip out. A second heat-conducting fin 5 is arranged between the lower cover 3 and the assembly printed circuit board 1, and the heat on the back surface of the assembly printed circuit board 1 is conducted to the lower cover 3 through the second heat-conducting fin 5; the second heat conductive sheet 5 is attached to the back surface of the mounting printed circuit board 1 for better heat conduction.
If the heat generating elements such as the main chip are also provided on the back surface, the second thermally conductive sheet 5 can also be attached to these heat generating elements. As can be understood from the above description, the purpose of the first thermally conductive sheet 4 and the second thermally conductive sheet 5 is to be attached to a heat generating element or a portion having a large amount of heat, thereby directly transferring the heat.
Both the main chip and the back surface of the mounting printed circuit board 1 are high temperature areas, and therefore the first heat conductive sheet 4 and the second heat conductive sheet 5 are preferably attached to these positions, so as to achieve a better heat dissipation effect.
Further, the first heat-conducting fin 4 and the second heat-conducting fin 5 transfer heat to the upper cover 2 and the lower cover 3, and then the upper cover 2 and the lower cover 3 perform subsequent heat dissipation, and the upper cover 2 and the lower cover 3 belong to a terminal for heat dissipation, and also need to transfer heat to the air. Correspondingly, the upper cover 2 and the lower cover 3 should have a heat dissipation structure, or at least one of them. In this embodiment, a plurality of sets of heat dissipating fins 6 are provided on the upper cover 2, and the extending direction of the heat dissipating fins 6 is the same as the longitudinal direction of the printed circuit board 1. The extending direction of the heat dissipation fins 6 can effectively shorten the heat conduction distance and increase the heat dissipation path. The contact area between the main chip and the upper cover 2 is greatly increased through the first heat-conducting fins 4, and the heat of the main chip is quickly and effectively conducted to the whole radiating fins 6; and the temperature of the heating element can be effectively conducted and radiated, so that the high-temperature failure risk of the element is reduced.
For example, in the present embodiment, the upper cover 2 is larger in volume, has a top surface and a side wall, and is formed like a cylindrical structure to be fitted over the printed circuit board 1, and the lower cover 3 is a flat plate-like structure to be fitted over the side wall of the upper cover 2 and fixed to the upper cover 2. With this structure, the upper cover 2 has more space for the heat radiation fins 6. Of course, this does not limit the lower cover 3 from being provided with a heat dissipating structure. Referring to fig. 2, the height, thickness and spacing of the heat dissipating fins 6 are marked by a, b and c, respectively, and specifically, the height of the heat dissipating fins 6 formed on the upper cover 2 is 25mm to 35mm, preferably 30 mm; 2mm to 3mm thick, preferably 2.5 mm; the distance between two adjacent groups of radiating fins 6 is 8mm-9mm, and the optimal distance is 8.5 mm.
It will be appreciated that the above dimensions are the preferred arrangement. Taking a vehicle-mounted power amplifier as an example, when the heat dissipation structure of the electronic device is used, the factors such as the size and the position of the installation control part need to be considered. Under such a condition, the height and thickness of the heat dissipating fins 6 are set to ensure the heat dissipating ability of the upper cover 2 under a natural heat dissipating condition. Further, the spacing between the radiating fins 6 is too wide, so that the number of the radiating fins 6 is reduced, and the radiating area is reduced; and the interval is too narrow between the radiating fin 6, will lead to the air flow not smooth again, leads to the heat to be difficult for being taken away by the air, and good air mobility can be guaranteed to the above-mentioned radiating fin 6's of this application interval, improves the radiating effect.
Preferably, in the upper cover 2 and the lower cover 3, a cooling system may also be provided. For example, a cooling flow path is formed in the upper cover 2 or the lower cover 3, and the cooling fluid is heated in the cooling flow path to achieve a better heat radiation effect. The cooling flow path may be formed in the heat dissipating fin 6.
The cooling liquid in the cooling flow path may or may not be circulated for different products. For example, the amount of heat generated is large, and when cooling needs to be better and faster, a cooling liquid circulation mode can be adopted, corresponding cooling liquid flow paths are formed on the upper cover 2 and the lower cover 3 correspondingly, heat is taken away by cooling liquid in the cooling flow paths, the cooling liquid is discharged from the liquid outlet for heat dissipation, and then the cooling liquid enters from the liquid inlet. And (6) performing circulating cooling in the way. Specific coolant liquid circulation principle to and take away the heat, the coolant liquid that the circulation came out, how to lower the temperature once more, drop into the use again, this application is not repeated. In addition, when the vehicle-mounted product, such as a vehicle-mounted power amplifier, adopts a cooling liquid circulation mode, the vehicle-mounted power amplifier can be communicated with an air conditioning system of a vehicle, and the cooling liquid (refrigerant) of a vehicle-mounted air conditioner can be directly used.
It should be understood that when the amount of heat generation is not so large and ordinary cooling can satisfy the demand, the cooling liquid (or refrigerant) may be charged and discharged only in the cooling liquid flow path, and the cooling effect can be achieved even without circulation.
The cooling flow path may be formed during the manufacturing process of the upper and lower covers 2 and 3, i.e., inside the upper and lower covers 2 and 3, and the cooling flow path may be reserved by casting or using other processes. Of course, the cooling flow path may be separately provided, for example, by using a pipe connection. These pipes may be attached to the outer or inner walls of the upper and lower covers 2 and 3 to take heat away by the coolant.
In addition, even if the cooling liquid flow path is not provided, the present application can achieve a good cooling effect, mainly because good heat dissipation can be achieved both on the front side and the back side of the mounted printed circuit board 1. The structure that both the front side and the back side can radiate heat enables the heat to be led out by two main paths.
The first path is: the heat of heating elements such as main chip is leading-in first conducting strip 4 fast, and this first conducting strip 4 preferred be the copper sheet, has good heat conductivility, and the heat of absorption main chip etc. that can be quick, first conducting strip 4 still with the laminating of upper cover 2, dispel the heat through radiating fin 6 of upper cover 2. The first heat conducting sheet 4 is attached to the main chip for better heat conduction, so the first heat conducting sheet 4 generally has a copper sheet with a specific structural shape, and the specific structural shape includes a shape capable of being attached to and matched with the surface shape of the main chip. The first heat-conducting sheet 4 is also changed in shape correspondingly for different main chips.
The second path is as follows: the back surface of a heat generating component such as a main chip (including both the main chip and other heat generating components), or the back surface of the printed circuit board 1 is mounted, and the heat of the front surface is guided to the back surface through heat dissipation holes. Absorbed by the second heat sink 5 and conducted to the lower cover 3. The second heat sink 5 preferably uses a thermally conductive silicone pad. It should be understood that the heat dissipation holes can communicate the front side and the back side to avoid heat accumulation, so that the second heat dissipation fins 5 absorb the heat of the front side under the action of the heat dissipation holes in addition to absorbing the heat of the back side. Better achieves the heat dissipation effect.
Through the explanation of the above "two paths", it can be known that, on one hand, the heat on the front surface of the main chip is quickly and effectively conducted to the whole heat dissipation fin 6 through the first heat conduction sheet 4; on the other hand, the temperature of the main chip and other elements is effectively conducted and radiated from the back surface, and the risk of high-temperature failure of the main chip and other elements is reduced. The two directions simultaneously radiate heat, and the power amplifier stably operates under the condition of long time and high power.
In addition to the above structure, the upper cover 2 and the lower cover 3 may be made of a material having a good heat dissipation effect, for example, an aluminum material.
In order to ensure better adhesion of the first thermally conductive sheet 4 and the second thermally conductive sheet 5 to the main chip or the back surface. The first thermally conductive sheet 4 may be formed into the attaching portion 41 and the boss 7 may be formed on the lower cover 3. Two structures will be specifically described below.
The bonding portion 41 will be described. The first thermally conductive sheet 4 includes a main body portion, that is, the main body of the first thermally conductive sheet 4, and a bonding portion 41 protruding in the direction of the main chip is formed on the main body portion, the bonding portion 41 is bonded to the main chip, and the main body portion is bonded to the upper cover 2. The whole body of the first heat conduction fin 4 has a flat structure, and the area of the body is larger than that of the attaching portion 41 (or the area of the flat structure portion is larger than that of the attaching portion 41), so that the contact area with the upper cover 2 can be increased, and the heat conduction is accelerated. Of course, for heat dissipation, the first heat-conducting strip 4 is attached to the main chip on one side and to the upper cover 2 on the other side. A bump facing the main chip is formed at a position corresponding to the main chip (of course, other heat generating elements may be used in other embodiments), and the bump is bonded to the main chip as a bonding surface. The convex binding surface is not a solid structure generally, and is convex towards the main chip, a concave pit is formed on the corresponding other surface, and the concave pit can be provided with a sealing cover so as to fill cooling liquid in the concave pit. It is to be understood that the configuration of the dimples is a preferred embodiment and is not intended to limit the present application.
A boss 7 is formed on the lower cover 3, and the boss 7 protrudes towards the direction close to the assembled printed circuit board 1; the second heat conductive sheet 5 is located between the boss 7 and the mount printed circuit board 1. The projection 7 is provided to press the second heat conductive sheet 5 against the back surface of the mounting printed circuit board 1.
In response to the above, the heating element may generate heat not only in the main chip but also in other elements, and the bonding portion 41 may have a plurality of elements each corresponding to a different heating element.
The bosses 7 also have a plurality of heat generating areas corresponding to the different heat generating areas of the printed circuit board 1. In combination with the above, the assembly printed circuit board 1 has heat dissipation holes, and the positions of the heat dissipation holes are set in the heat generation area. The heat generating area is generally defined as a location having a heat generating element. The heating element is arranged on one surface of the assembly printed circuit board 1, and the other surface of the corresponding position is also a heating area. The boss 7 is generally in the "other surface heat generating region". For example, the main chip is mounted on the front surface of the printed circuit board 1, and the corresponding back surface is a heat generating region where the bumps 7 are formed.
Referring to fig. 3, two bosses 7 are shown, and based on the illustration in fig. 3, the upper boss 7 corresponds to the back surface of the main chip, the outer frame of the boss 7 has a size of about 50mm × 40mm, and two long sides, i.e. two sides 50mm long, are shrunk inwards or towards each other, so that the upper boss 7 is shaped like an "H", mainly because the areas on two sides correspond to the back surfaces of the two main chips, and the narrower middle part is provided with screw through holes for connecting the upper cover 2 and the lower cover 3, and the description of the screws and related contents will be expanded below. The boss 7 is arranged to make the heat-conducting silica gel pad, namely the second heat-conducting fin 5, tightly attached to the assembled printed circuit board 1, so as to conduct heat dissipation from the back of the main chip to the lower cover 3.
With continued reference to fig. 3, the lower one of the two bosses 7 has an outer frame with a size of about 66mm x 46mm, and four corners with rounded corners, which correspond to other heat generating components, such as signal transmitting chips, processing chips, and the like. The boss 7 is arranged to make the heat-conducting silicone pad, i.e. the second heat-conducting fin 5, tightly attached to the assembled printed circuit board 1, and conduct the back heat of other heating elements to the lower cover 3 for heat dissipation.
The above two structures of the boss 7 are only preferred structures in certain embodiments, and the size data thereof are also preferred values, and are not intended to limit the present application.
The connection relationship between the upper cover 2 and the lower cover 3 will be described below.
And locking structures are respectively formed on the upper cover 2 and the lower cover 3, so that the upper cover 2 and the lower cover 3 are locked and fixed. Through the locking of the upper cover 2 and the lower cover 3, the boss 7 and the attaching part 41 can be attached to the corresponding position better. Of course, the locking of the upper cover 2 and the lower cover 3 is not only for better working of the boss 7 and the abutting portion 41, but also for use as a housing for internal structures, protecting the printed circuit board 1 and components thereon, or other parts.
Instead of forming the locking structures on the upper cover 2 and the lower cover 3, respectively, external structures such as screws may be used to fix the two. For example, in one embodiment, the assembly printed circuit board 1 has two power amplifier chips spaced apart from each other, the assembly printed circuit board 1 between the two power amplifier chips has a through hole for a screw to pass through, and correspondingly, the first heat conductive sheet 4 and the second heat conductive sheet 5 have a through hole, the upper cover 2 has a screw hole for the screw to be screwed into, and the lower cover 3 also has a through hole for the screw to enter, and the through hole may be formed on the boss 7. In some embodiments, there may be one main chip, and the above-mentioned via hole may bypass the main chip; or a hole position is arranged on the main chip for a screw for subsequent connection to pass through.
Through the setting of above-mentioned screw, with lower cover 3, second conducting strip 5, assembly printed circuit board 1, at first conducting strip 4 and the fixed locking of upper cover 2, guarantee main chip and the contact of closely laminating of first conducting strip 4, second conducting strip 5 and lower cover 3 also contact of closely laminating.
Simultaneously, the preferred heat conduction silica gel pad that uses of second conducting strip 5 can realize heat conduction, has played the protect function of gasket.
It should be understood that the above-mentioned use of the power amplifier chip is an alternative embodiment, and various electronic devices capable of generating heat may be applicable to the heat dissipation structure of the present application.
The structure, features and effects of the present invention have been described in detail above according to the embodiment shown in the drawings, and the above description is only the preferred embodiment of the present invention, but the present invention is not limited to the implementation scope shown in the drawings, and all changes made according to the idea of the present invention or equivalent embodiments modified to the same changes should be considered within the protection scope of the present invention when not exceeding the spirit covered by the description and drawings.
Claims (10)
1. An electronic device heat dissipation structure, comprising:
assembling a printed circuit board (1), an upper cover (2), a lower cover (3), a first heat-conducting fin (4) and a second heat-conducting fin (5);
the assembly printed circuit board (1) is positioned between the upper cover (2) and the lower cover (3), the assembly printed circuit board (1) is divided into a front surface and a back surface, the front surface is provided with a main chip, and the back surface is provided with a heat dissipation hole penetrating to the front surface;
the first heat-conducting fin (4) is positioned between the upper cover (2) and the assembled printed circuit board (1) and is attached to the main chip;
the second heat-conducting fin (5) is positioned between the lower cover (3) and the assembly printed circuit board (1) and is attached to the back surface.
2. The electronic device heat dissipation structure of claim 1,
the first heat-conducting fin (4) is a copper sheet which is matched with the surface shape of the main chip in an attaching mode, and the second heat-conducting fin (5) is a heat-conducting silica gel pad.
3. The electronic device heat dissipation structure according to claim 1 or 2,
the first heat conducting fin (4) comprises a body part, a bonding part (41) protruding towards the main chip direction is formed on the body part, the bonding part (41) is bonded with the main chip, and the body part is bonded with the upper cover (2).
4. The electronic device heat dissipation structure of claim 1,
the upper cover (2) is provided with a plurality of groups of radiating fins (6), and the extending direction of the radiating fins (6) is the same as the length direction of the assembled printed circuit board (1).
5. The electronic device heat dissipation structure of claim 4,
the height of the radiating fin (6) is 25-35 mm; the thickness is 2mm-3 mm;
the distance between two adjacent groups of radiating fins (6) is 8-9 mm.
6. The electronic device heat dissipation structure of claim 1,
a boss (7) is formed on the lower cover (3), and the boss (7) protrudes towards the direction close to the assembled printed circuit board (1);
the second heat conducting fin (5) is located between the boss (7) and the assembly printed circuit board (1), one side of the second heat conducting fin (5) is tightly attached to the boss (7), and the other side of the second heat conducting fin is tightly attached to the assembly printed circuit board (1).
7. The electronic device heat dissipation structure of claim 6,
the bosses (7) are provided with a plurality of heating areas corresponding to different assembling printed circuit boards (1).
8. The electronic device heat dissipation structure of claim 1,
and locking structures are respectively formed on the upper cover (2) and the lower cover (3) to enable the upper cover (2) and the lower cover (3) to be locked and fixed.
9. The electronic device heat dissipation structure of claim 1,
the main chip is two power amplifier chips arranged at intervals.
10. The electronic device heat dissipation structure of claim 1,
a cooling liquid flow path is formed in each of the upper cover (2) and the lower cover (3);
the cooling liquid flow path is filled with cooling liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920760435.4U CN210405997U (en) | 2019-05-24 | 2019-05-24 | Heat dissipation structure of electronic device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920760435.4U CN210405997U (en) | 2019-05-24 | 2019-05-24 | Heat dissipation structure of electronic device |
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| CN210405997U true CN210405997U (en) | 2020-04-24 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113543579A (en) * | 2020-11-10 | 2021-10-22 | 华为技术有限公司 | Heat dissipation assembly, electronic equipment and chip packaging structure |
| CN114599215A (en) * | 2022-05-10 | 2022-06-07 | 远峰科技股份有限公司 | High-efficient radiating intelligent passenger cabin district liquid cooling host computer |
-
2019
- 2019-05-24 CN CN201920760435.4U patent/CN210405997U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113543579A (en) * | 2020-11-10 | 2021-10-22 | 华为技术有限公司 | Heat dissipation assembly, electronic equipment and chip packaging structure |
| CN114599215A (en) * | 2022-05-10 | 2022-06-07 | 远峰科技股份有限公司 | High-efficient radiating intelligent passenger cabin district liquid cooling host computer |
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