CN114599215A - High-efficient radiating intelligent passenger cabin district liquid cooling host computer - Google Patents

Abstract

The invention discloses an efficient heat-dissipation intelligent cabin area liquid cooling host, which comprises an upper cover, a bottom shell, a main circuit board and a water cooling plate, wherein the upper cover and the bottom shell are connected in a sealing manner; an inlet and an outlet are arranged on the side wall of the upper cover or the bottom shell; the water cooling plate is hermetically arranged on the upper cover or the bottom shell, a cooling liquid cavity communicated with the inlet and the outlet is formed between the water cooling plate and the upper cover or the bottom shell, at least one circulation channel is formed in the cooling liquid cavity, and a plurality of first radiating fins positioned in the circulation channel are convexly arranged on the water cooling plate. This host computer passes through coolant liquid cavity, first heat radiation fin's design for the radiating efficiency is high, and the noise is little, and electrical property is better, and in addition, structural design space requires lowly, stability is higher, and life is longer.

Description

High-efficient radiating intelligent passenger cabin district liquid cooling host computer

Technical Field

The invention relates to the technical field of vehicle-mounted host heat dissipation, in particular to an intelligent cabin area liquid cooling host capable of dissipating heat efficiently.

Background

The automobile industry is developing towards the direction of multi-functionalization, so that the power consumption of a part of chips used in an automobile exceeds the traditional cooling requirement, the single aluminum alloy, fan cooling and the like cannot meet the heat dissipation requirement, and the liquid cooling technology is needed to dissipate heat of the chips so as to meet the industry requirements of normal work, structural design space, stability, service life and the like of the chips.

At present, the heat dissipation of a large-power-consumption host in the industry generally adopts a mode of matching a copper pipe and an aluminum alloy, the copper pipe is pressed into a groove on the aluminum alloy after being bent, and two ends of the copper pipe are provided with a cooling liquid inlet and a cooling liquid outlet which are connected with an original vehicle cooling system. The disadvantages of this structure are: the cooling liquid has low flowing speed and low cooling efficiency, the copper pipe is easy to crack after being flattened, so that the problem of cooling liquid leakage is caused, the needed copper pipe is long, and the material consumption is large; the shape of the aluminum alloy is limited, the copper pipe can be pressed in only by being relatively flat, the space modeling design of the product is not facilitated, and the popularization of the liquid cooling technology is also not facilitated; in addition, the heat dissipation effect is affected when the contact between the copper pipe and the aluminum alloy is not good.

Therefore, it is necessary to provide an intelligent liquid cooling host with high heat dissipation efficiency, low noise, better electrical performance, low requirement on structural design space, higher stability, longer service life and more convenient installation, so as to solve the above problems.

Disclosure of Invention

The invention aims to provide the intelligent cabin area liquid cooling host machine with high heat dissipation efficiency, low noise, better electrical performance, low structural design space requirement, higher stability, longer service life and simpler and more convenient installation.

In order to achieve the purpose, the technical scheme of the invention is as follows: the intelligent cabin area liquid cooling host machine comprises an upper cover, a bottom shell, a main circuit board and a water cooling board, wherein the upper cover and the bottom shell are connected in a sealing mode; the side wall of the upper cover or the bottom shell is provided with an inlet and an outlet; the water cooling plate is installed in the upper cover or the bottom shell in a sealing mode, a cooling liquid cavity communicated with the inlet and the outlet is formed between the water cooling plate and the upper cover or the bottom shell, at least one circulating channel is formed in the cooling liquid cavity, and a plurality of first radiating fins located in the circulating channel are arranged on the water cooling plate in a protruding mode.

Preferably, the water-cooling plate is convexly provided with at least one flow guide wall, the flow guide wall divides the cooling liquid cavity into at least two circulation channels, the shape of the flow guide wall is designed according to the shape of the cooling liquid cavity and the positions of the inlet and the outlet, and the arrangement of the plurality of circulation channels can enable flowing cooling liquid to more fully take away heat of chips in the host machine, so that the heat dissipation effect of the host machine is optimized.

Preferably, the inner side surface of the upper cover or the bottom shell is convexly provided with a mounting boss corresponding to the water cooling plate in shape, the water cooling plate is hermetically mounted on the mounting boss, a cooling liquid cavity is formed between the water cooling plate and the mounting boss, and the outer side surface of the upper cover or the bottom shell is provided with a plurality of second heat dissipation fins corresponding to the mounting boss; the mounting bosses and the water cooling plates can be designed into different shapes according to actual product requirements so as to save the space of a host machine and facilitate technical popularization, and the cooling liquid cavity can enable the liquid storage space to be larger and is beneficial to improving the heat dissipation efficiency; in addition, the second radiating fins increase the radiating surface area and improve the radiating efficiency; moreover, seamless welding is carried out between the water-cooling plate and the upper cover or the bottom shell by adopting a friction welding technology mature in the industry, so that the leakage of cooling liquid is avoided, and the reliability is better.

Preferably, at least one heating element is arranged on the main circuit board; the water-cooling plate is provided with a plurality of first heat dissipation bosses corresponding to the heating elements in a protruding mode, the first heat dissipation bosses are in contact with the heating elements in a laminating mode through heat conducting glue, heat generated by the heating elements is directly transmitted to the water-cooling plate through the first heat dissipation bosses to dissipate heat, the heat dissipation speed is higher, and the heat dissipation capacity is improved.

Preferably, a plurality of second heat dissipation bosses are further convexly arranged on the inner side surfaces of the upper cover or/and the bottom shell, the second heat dissipation bosses are attached to and contact with the main circuit board through heat conducting glue, a plurality of third heat dissipation fins are further convexly arranged on the outer side surface of one of the upper cover and the bottom shell, which is far away from the water cooling plate, heat generated by the main circuit board is transferred to the upper cover or/and the bottom shell through the second heat dissipation bosses to be directly dissipated, heat accumulation in the host is reduced, the heat dissipation surface area is increased through the third heat dissipation fins, and the heat dissipation efficiency is improved.

Preferably, the first heat dissipation boss and the second heat dissipation boss respectively comprise a top surface and a plurality of inclined surfaces connected to the top surface, the top surface is attached to and contacted with the heating element or the main circuit board through heat conducting glue, and the inclined surfaces increase the heat dissipation surface area, so that the heat dissipation efficiency is improved.

Preferably, high-efficient radiating intelligent passenger cabin district liquid cooling host computer still includes at least one first circuit board, the lateral surface of upper cover is still concave to be equipped with at least one signal chamber, the protruding flange that is equipped with in edge in signal chamber, first circuit board are located the top in signal chamber and edge butt in block the flange, first circuit board sealing connection in the upper cover, signal transmission and shielding demand have been satisfied in setting up of signal chamber, have still reduced spare part, and block the flange and then be used for waterproofly, and water-proof effects is better.

Preferably, the medial surface of upper cover still protruding first shielding muscle that is equipped with, the medial surface of drain pan is protruding to be equipped with the second shielding muscle, first shielding muscle the second shielding muscle pass through the conducting resin with the contact of dew copper district of main circuit board, consequently, need not design a plurality of shield covers in addition on the main circuit board, make the structure more simplify to the signal shielding effect that makes the host computer is better, each high-speed signal does not influence each other, makes host computer electrical property better, reduce cost.

Preferably, a flow guiding and dust blocking structure is arranged between the upper cover and the bottom shell, so that the dustproof and waterproof effect is better, and the service life of the host is longer.

Preferably, the edge of the bottom shell is also convexly provided with a plurality of mounting lugs which are used for being fast locked with the supports of the automobile, so that the host does not need to additionally design a left mounting support, a right mounting support and the like to be fixed with the automobile, and the mounting lugs and the supports of the automobile are directly locked by screws, compared with the existing mode, two supports and two sets of hardware molds are saved, and the structure is simplified; meanwhile, the mounting lug can also play a role in heat dissipation, so that the heat dissipation efficiency is improved.

Compared with the prior art, the intelligent cabin area liquid cooling host machine with high-efficiency heat dissipation is provided with the water cooling plate, the water cooling plate is hermetically arranged on the upper cover or the bottom shell, a cooling liquid cavity is formed between the water cooling plate and the upper cover or the bottom shell, the side wall of the upper cover or the bottom shell is provided with an inlet and an outlet which are communicated with the cooling liquid cavity, at least one circulation channel is formed in the cooling liquid cavity, and the water cooling plate is convexly provided with a plurality of first heat dissipation fins positioned in the circulation channel. This high-efficient radiating intelligent passenger cabin territory liquid cooling host computer has following effect: firstly, the cooling liquid cavity can be designed into different shapes according to the actual product requirements, the structural design space requirement is low, the host space can be saved, the technical popularization is facilitated, and the cooling liquid cavity is designed to enable the storage space of the cooling liquid to be larger, so that the heat dissipation efficiency is improved; secondly, a circulating channel can be designed according to the shape of the cooling liquid cavity, the positions and the directions of the inlet and the outlet, so that the heat of the chip can be more fully taken away by the flowing cooling liquid, and the first radiating fins are uniformly and alternately arranged, so that the flowing resistance of the cooling liquid can be reduced, the radiating area is larger, and the radiating effect of the host is optimized; moreover, the upper cover, the bottom shell and the water cooling plate are all designed by die-casting aluminum alloy, and can perform auxiliary heat dissipation on the chip; in addition, the main machine of the invention has smaller noise, solves the problem of noise generated by high-speed operation of the traditional fan and improves the user experience.

Drawings

Fig. 1 is a schematic front structural view of an intelligent cabin area liquid cooling host with efficient heat dissipation according to the invention.

Fig. 2 is a schematic view of the backside structure of fig. 1.

Fig. 3 is a top view of fig. 1.

Fig. 4 is a sectional view taken along line a-a of fig. 3.

Fig. 5 is a sectional view taken along line B-B of fig. 3.

Fig. 6 is an exploded view of fig. 3.

Fig. 7 is a schematic structural view of the water cooling plate and the upper cover in fig. 6 after being installed in a matching manner.

Fig. 8 is an exploded view of fig. 7.

FIG. 9 is a schematic view of another angle of the water cooling plate of FIG. 8.

Fig. 10 is a schematic view of the upper cover of fig. 8 at another angle.

Fig. 11 is a schematic view of the water cooling plate and the main circuit board in fig. 6.

Fig. 12 is a schematic view of the bottom shell of fig. 6 at another angle.

Fig. 13 is a front plan view of the main circuit board of fig. 6.

Fig. 14 is a back plan view of the main circuit board of fig. 6.

Detailed Description

Embodiments of the present invention will now be described with reference to the drawings, wherein like element numerals represent like elements. It should be noted that the orientation descriptions of the present invention, such as the directions or positional relationships indicated above, below, left, right, front, rear, etc., are all based on the directions or positional relationships shown in the drawings, and are only for convenience of describing the technical solutions of the present application or simplifying the description, but do not indicate or imply that the devices or elements referred to must have specific orientations, be constructed in specific orientations, and operate, and therefore, should not be construed as limiting the present application. The description of first, second, etc. merely serves to distinguish technical features and should not be interpreted as indicating or implying a relative importance or implying a number of indicated technical features or implying a precedence relationship between indicated technical features.

Referring to fig. 1 to 14, the intelligent liquid-cooled cabin host 100 with high heat dissipation efficiency according to the present invention includes an upper cover 110, a bottom case 120, a main circuit board 130, and a water-cooled plate 140. The upper cover 110 and the bottom case 120 are hermetically connected, the water cooling plate 140 is hermetically installed on the upper cover 110 or the bottom case 120, a cooling liquid cavity 140a (see fig. 4-5) is formed between the water cooling plate 140 and the upper cover 110 or the bottom case 120, an inlet 111 and an outlet 112 communicating with the cooling liquid cavity 140a are disposed on a sidewall of the upper cover 110 or the bottom case 120, at least one circulation channel 141 is formed in the cooling liquid cavity 140a, and a plurality of first heat dissipation fins 143 located in the circulation channel 141 are further convexly disposed on the water cooling plate 140. The main circuit board 130 is installed between the upper cover 110 and the bottom case 120, the chips on the main circuit board 130 are reasonably arranged according to the power consumption and the electrical requirements, and the chips with high power consumption on the main circuit board 130 are intensively arranged at the position corresponding to the water cooling plate 140, so that heat can be quickly led out.

In the invention, the upper cover 110, the bottom shell 120 and the water cooling plate 140 are all designed by die-casting aluminum alloy, so that the chips can be subjected to auxiliary heat dissipation. Of course, the three components are not limited to the above materials, and can also be made of other materials with better heat dissipation effect.

More specifically, the inner side surface of the upper cover 110 or the bottom shell 120 is convexly provided with the mounting boss 113 corresponding to the shape of the water cooling plate 140, the shapes of the mounting boss 113 and the water cooling plate 140 are not specifically limited in the present invention, and can be designed into different shapes according to actual product requirements, so as to save the space of the host computer and facilitate technical popularization; the water cooling plate 140 is hermetically installed on the installation boss 113, and the cooling liquid cavity 140a is formed between the water cooling plate 140 and the installation boss 113, seamless welding is preferably performed between the water cooling plate 140 and the installation boss 113 by using a friction welding technology mature in the industry, so that no leakage of cooling liquid is ensured, the reliability is better, and the cooling liquid cavity 140a is designed to enable the storage space of the cooling liquid to be larger, thereby being beneficial to improving the heat dissipation efficiency; a plurality of second heat dissipation fins 114 are disposed on the outer side of the upper cover 110 or the bottom shell 120 corresponding to the mounting bosses 113, and the heat dissipation surface area is increased by the second heat dissipation fins 114, so as to further improve the heat dissipation efficiency.

As shown in fig. 4-8, in an embodiment of the present invention, the water-cooling plate 140 is hermetically installed on the upper cover 110, the top wall of the upper cover 110 is recessed downward to form the installation boss 113, and the second heat dissipation fins 114 are disposed in the recessed area of the upper cover 110. An inlet 111 and an outlet 112 are provided on one side wall of the upper cover 110. The main circuit board 130 is installed between the upper cover 110 and the bottom case 120 and is located below the water cooling plate 140. Of course, the arrangement is not limited to this, and the water cooling plate 140 may be hermetically mounted on the bottom case 120 as needed, so that the cooling liquid cavity 140a is formed between the water cooling plate 140 and the bottom case 120, and the main circuit board 130 is mounted between the water cooling plate 140 and the upper cover 110.

Referring to fig. 4 to 8, in the present invention, at least one flow guiding wall 142 is convexly disposed on an inner side surface of the water cooling plate 140, specifically, the shape of the flow guiding wall 142 is designed according to the shape of the water cooling plate 140 and the positions of the inlet 111 and the outlet 112, the flow guiding wall 142 divides the cooling liquid cavity 140a into at least two circulation channels 141, and the first heat dissipation fins 143 are disposed in the circulation channels 141, and the plurality of circulation channels 141 and the first heat dissipation fins 143 therein are disposed, so that the heat of the chip in the host can be sufficiently taken away by the flowing cooling liquid, and the heat dissipation effect of the host is optimized.

Referring to fig. 3, 8 and 11, in a specific embodiment, a bent flow guiding wall 142 is convexly disposed on the water cooling plate 140, the flow guiding wall 142 divides the cooling liquid cavity 140a into two circulation channels 141, the two circulation channels 141 correspond to regions of the main circuit board 130 where heat dissipation chips are to be emphasized, specifically, one of the circulation channels 141 is disposed along the edge of the water cooling plate 140, the other circulation channel 141 passes through the approximate middle of the water cooling plate 140, and a plurality of first heat dissipation fins 143 are convexly disposed in each circulation channel 141, the first heat dissipation fins 143 correspond to regions 131 (see fig. 3) of the main circuit board 130 where heat dissipation chips are to be emphasized (see fig. 3), and the first heat dissipation fins 143 are preferably in an elliptical structure and are uniformly staggered. Referring to fig. 8, a boss 145 is further disposed at one end of the water-cooled plate 140, the boss 145 separates a channel inlet 141a and a channel outlet 141b on the water-cooled plate 140, the two circulation channels 141 are respectively connected to the channel inlet 141a and the channel outlet 141b, the channel inlet 141a is connected to the inlet 111, and the channel outlet 141b is connected to the outlet 112. After the cooling liquid flows into the cooling liquid cavity 140a from the inlet 111 and the flow channel inlet 141a, the cooling liquid respectively flows into the two circulation channels 141 under the action of the flow guide wall 142, flows through the two circulation channels 141, is converged by the flow channel outlet 141b, and then flows out from the outlet 112, wherein the first heat dissipation fins 143 are beneficial to reducing the flow resistance of the cooling liquid, so that the heat dissipation area is larger, the cooling liquid more fully takes away the heat of the chip, and the heat dissipation effect of the host is optimized.

With continued reference to FIG. 8, the edge of the mounting boss 113 is protruded with a rib 1131, and the water-cooled plate 140 is hermetically connected to the rib 1131, so that the cooling liquid cavity 140a is formed between the water-cooled plate 140 and the mounting boss 113. Furthermore, the projection 145 of the water cooling plate 140 is provided with a substantially T-shaped protrusion 146, and the guide wall 142 is also provided with a protrusion 146, wherein at least a portion of the protrusion 146 of the guide wall 142 extends thereon as required. Correspondingly, a groove 1132 matched with the protrusion 146 is concavely arranged on the mounting boss 113, and after the water cooling plate 140 and the mounting boss 113 are mounted, the protrusion 146 is correspondingly clamped in the groove 1132, so that the connection between the two is enhanced.

Understandably, the number and shape of the circulation channels 141 are not limited in this embodiment, but of course, the number and shape can be flexibly designed according to the position of the chip on the main circuit board 130, the shape of the water-cooling plate 140, and the directions of the inlet and outlet 112; the shape of the first heat radiation fins 143 is not limited to the embodiment, and may be any other shape that can increase the heat radiation area.

Referring to fig. 4-7 and 9, in a preferred embodiment of the present invention, a plurality of first heat dissipation bosses 144 are protruded from positions of the water cooling plate 140 corresponding to main heat generating elements (e.g., chips with larger heat generation amount and requiring important heat dissipation) on the main circuit board 130, that is, the first heat dissipation bosses 144 and the first heat dissipation fins 143 are respectively protruded from two sides of the water cooling plate 140, in other words, the first heat dissipation bosses 144 are protruded from the outer side of the water cooling plate 140, and the first heat dissipation bosses 144 are in contact with the chips by the heat conductive adhesive 160 with high thermal conductivity, as shown in fig. 4-5, heat generated by the chips is directly transferred to the water cooling plate 140 through the first heat dissipation bosses 144, and is dissipated by the cooling liquid flowing through the cooling liquid cavity 140a, so that the heat dissipation speed is faster and the heat dissipation capability is improved.

As shown in fig. 4-5 and 9, the first heat dissipation projection 144 preferably includes a top surface 1441 and a plurality of inclined surfaces 1442 connected between the top surface 1441 and the water cooling plate 140, and the top surface 1441 is preferably parallel to the water cooling plate 140, but not limited thereto, the top surface 1441 contacts the chip by the thermal conductive adhesive 160, and the inclined surfaces 1442 increase the heat dissipation surface area, thereby improving the heat dissipation efficiency. Of course, the first heat dissipation projection 144 is not limited to this shape, and may be provided in any other shape to increase the heat dissipation area.

Referring to fig. 4-6 and 10, in the present invention, a plurality of second heat dissipation bosses are further convexly disposed on inner sides of the upper cover 110 or/and the bottom case 120, the second heat dissipation bosses contact the main circuit board 130 through the heat conductive adhesive 160 with a high thermal conductivity, and a plurality of third heat dissipation fins are further convexly disposed on an outer side of one of the upper cover 110 and the bottom case 120 away from the water cooling plate 140, heat generated by the main circuit board 130 is transferred to the upper cover 110 or/and the bottom case 120 through the second heat dissipation bosses to directly dissipate heat, so as to reduce heat accumulation inside the host, and the third heat dissipation fins increase a heat dissipation surface area and improve heat dissipation efficiency.

As shown in fig. 4-5 and 10, in an embodiment, a plurality of second heat dissipation bosses 121 are convexly disposed on an inner side surface of the bottom case 120, and a plurality of third heat dissipation fins 122 are convexly disposed on an outer side surface of the bottom case 120, so that heat generated by the main circuit board 130 is directly dissipated by transferring the heat to the bottom case 120 through the second heat dissipation bosses 121, and the third heat dissipation fins 122 increase a heat dissipation surface area and improve heat dissipation efficiency.

With reference to fig. 5 and 10, the second heat dissipating protrusion 121 includes a top surface 1211 and a plurality of inclined surfaces 1212 connected between the top surface 1211 and the bottom case 120, the top surface 1211 contacts the main circuit board 130 through the thermal conductive adhesive 160, and the inclined surfaces 1212 increase a heat dissipating surface area, thereby improving heat dissipating efficiency. It is understood that the second heat dissipation projection 121 is not limited to this shape, and may be provided in any other shape to increase the heat dissipation area.

Referring now to fig. 3, 5-6 and 12, in an embodiment of the present invention, the smart cabin liquid-cooled host 100 with efficient heat dissipation further includes a first circuit board 150 for mounting an antenna, and the first circuit board 150 is mounted on the upper cover 110. Specifically, at least one signal cavity 115 is concavely arranged on the outer side surface of the upper cover 110, a blocking edge 116 is convexly arranged on the edge of each signal cavity 115, the shape of the blocking edge 116 corresponds to that of the first circuit board 150, and a through hole 117 communicated with the inside of the upper cover 110 is formed in the bottom of each signal cavity 115. The first circuit board 150 is disposed above the signal cavity 115, and the edge of the first circuit board 150 abuts against the blocking edge 116, that is, the first circuit board 150 is embedded in the blocking edge 116, and the first circuit board 150 is connected to the upper cover 110 in a sealing manner, in this embodiment, the first circuit board 150 is directly adhered to the surface of the upper cover 110 by using 3M glue, and the adhered first circuit board 150 is as shown in fig. 1 and 4-5, which reduces the number of parts and facilitates installation, and the wires electrically connected to the first circuit board 150 penetrate into the upper cover 110 through the through holes 117 to electrically connect the main circuit board 130, which is a conventional manner in the art. The signal cavity 115 meets the signal transmission and shielding requirements of the antenna, and the blocking edge 116 is used for water prevention, so that a better waterproof effect is achieved.

Referring to fig. 7-8, 10, and 13-14, in a preferred embodiment of the present invention, the inner side surface of the upper cover 110 is further protruded with a first shielding rib 118 (see fig. 8), the inner side surface of the bottom cover 120 is protruded with a second shielding rib 123 (see fig. 10), and the shapes of the first shielding rib 118 and the second shielding rib 123 correspond to the exposed copper area on the surface of the main circuit board 130. Referring specifically to fig. 13-14, the main circuit board 130 has a front surface with a copper exposed area 132, the shape of the copper exposed area 132 is the same as the shape of the first shielding rib 118, and a back surface with a copper exposed area 133, the shape of the copper exposed area 133 is the same as the shape of the second shielding rib 123. After the main circuit board 130 is installed, the copper exposing area 132 on the main circuit board is in contact with the first shielding rib 118 through the flexible conductive adhesive, and the copper exposing area 133 is in contact with the second shielding rib 123 through the flexible conductive adhesive, so that a plurality of shielding covers are not required to be additionally designed on the main circuit board 130, the structure is simplified, the signal shielding effect of the host is better, high-speed signals are not influenced by each other, the electrical performance of the host is better, and the cost is reduced.

As shown in fig. 8 and 10, a plurality of first connecting posts 119 connected to the first shielding ribs 118 are further protruded from the inner side surface of the upper cover 110, and the first connecting posts 119 are provided with first connecting holes. Correspondingly, the bottom case 120 is provided with a plurality of second connecting posts 124 connected to the second shielding ribs 123, and the second connecting posts 124 are provided with second connecting holes in a penetrating manner. In addition, a third connection hole (not numbered) corresponding to the first connection hole and the second connection hole is further penetratingly formed in the main circuit board 130. During installation, the screws sequentially penetrate through the first connecting hole, the third connecting hole and the second connecting hole to fixedly connect the first shielding rib 118, the second shielding rib 123 and the main circuit board 130, after the host is used for a long time, the first shielding rib 118 and the second shielding rib 123 are not easy to deform, and then the influence of the deformation of the first shielding rib 118 and the second shielding rib 123 on the signal shielding effect of the main circuit board 130 is reduced.

Referring to fig. 4-5 again, in an embodiment of the present invention, a flow guiding and dust blocking structure is disposed between the upper cover 110 and the bottom case 120, so that the dustproof and waterproof effect of the host is better, and the service life of the host is longer.

More specifically, the airflow guiding and dust blocking structure includes a first rib 110a protruding from the edge of the sidewall of the upper cover 110, and the first rib 110a protrudes downward and is stepped with the first shielding rib 118, as shown in fig. 5; the airflow guiding and dust blocking structure further includes a second protruding rib 120a protruding from the edge of the sidewall of the bottom case 120, the second protruding rib 120a protrudes outward along the radial direction of the bottom case 120 and is stepped with the second shielding rib 123, specifically, the second shielding rib 123 is higher than the second protruding rib 120a, as shown in fig. 5. When the upper cover 110 and the bottom cover 120 are fitted, the first shielding rib 118 and the second shielding rib 123 are clamped and abutted against the main circuit board 130, the first rib 110a surrounds the main circuit board 130 from the outside and protrudes downward, and the first rib 110a abuts against the second rib 120a of the bottom cover 120, see the enlarged part in fig. 5, thereby achieving the dustproof and waterproof effect.

It is understood that the flow guiding and dust blocking structure is not limited to the above structure, but may be configured in other structures to achieve the purpose.

As shown in fig. 1-3, 6, and 10, a plurality of mounting tabs 125 are further convexly disposed on the edge of the bottom case 120, and the mounting tabs 125 are used to quickly lock the host 100 to the bracket of the vehicle, so that the host 100 of the present invention does not need to additionally design a left mounting bracket and a right mounting bracket to fix to the vehicle, but directly locks the mounting tabs 125 to the bracket of the vehicle with screws, which saves two brackets and two sets of hardware molds compared to the prior art, thereby simplifying the structure of the host 100. In addition, the mounting lug 125 can also play a role in heat dissipation, so that the heat dissipation efficiency is improved, only heat dissipation fins can dissipate heat in the traditional host, and only other parts of the electrolytic galvanized steel Sheet (SECC) can be mounted, so that the heat dissipation effect of the invention is better.

The cooling principle of the intelligent liquid-cooled cabin host 100 with efficient heat dissipation according to the present invention will be described with reference to fig. 1 to 14 again.

As shown in fig. 1-3, 4-5, and 11, when the host 100 is cooled during operation, the cooling liquid flows into the cooling liquid cavity 140a from the inlet 111 and the flow channel inlet 141a, and then flows into the two circulation channels 141 respectively under the action of the flow guide wall 142, as shown by the arrow in fig. 11, because the first heat dissipation fins 143 in the circulation channels 141 correspond to the region 131 (see fig. 3) of the main circuit board 130 where the chip is located, where heat is to be dissipated, and the cooling liquid flows in the circulation channels 141 and passes through the first heat dissipation fins 143, the first heat dissipation fins 143 reduce the flow resistance of the cooling liquid, increase the heat dissipation area, and improve the heat dissipation efficiency of the main circuit board 130; meanwhile, heat generated by the chip requiring important heat dissipation on the main circuit board 130 is directly transferred to the water cooling plate 140 through the first heat dissipation boss 144, and then is dissipated through the cooling liquid flowing in the circulating channel 141, so that the heat dissipation speed of the main circuit board 130 is higher, the heat dissipation capability is improved, the heat of the chip is more sufficiently taken away by the cooling liquid, and the heat dissipation effect of the host is optimal.

As shown in fig. 4-5, the heat generated by the main circuit board 130 is also transferred to the bottom case 120 through the second heat dissipation bosses 121, and is directly dissipated from the bottom case 120, and meanwhile, the plurality of third heat dissipation fins 122 protruding from the outer side surface of the bottom case 120 further increase the heat dissipation surface area, thereby improving the heat dissipation efficiency.

In the above process, since the upper cover 110, the bottom case 120 and the water cooling plate 140 are all designed by die-casting aluminum alloy, the chips can be subjected to auxiliary heat dissipation, and the heat dissipation efficiency is further improved.

In summary, the intelligent liquid-cooled cabin area host 100 with high heat dissipation efficiency of the present invention includes a water-cooled plate 140, the water-cooled plate 140 is hermetically mounted on the upper cover 110 or the bottom case 120, a cooling liquid cavity 140a is formed between the water-cooled plate 140 and the upper cover 110 or the bottom case 120, an inlet 111 and an outlet 112 communicating with the cooling liquid cavity 140a are disposed on a sidewall of the upper cover 110 or the bottom case 120, at least one circulation channel 141 is formed in the cooling liquid cavity 140a, and a plurality of first heat dissipation fins 143 disposed in the circulation channel 141 are convexly disposed on the water-cooled plate 140. The intelligent cabin area liquid cooling host 100 with high-efficiency heat dissipation has the following effects: firstly, the cooling liquid cavity 140a can be designed into different shapes according to actual product requirements, the structural design space requirement is low, the host space can be saved, the technical popularization is facilitated, and the cooling liquid cavity 140a is designed to enable the storage space of the cooling liquid to be larger, so that the heat dissipation efficiency is improved; secondly, the circulating channel 141 can be designed according to the shape of the cooling liquid cavity 140a, the positions and the directions of the inlet 111 and the outlet 112, so that the heat of the chip can be taken away by the flowing cooling liquid more fully, and the first radiating fins 143 are arranged in a uniform and staggered manner, so that the flowing resistance of the cooling liquid can be reduced, the radiating area is larger, and the radiating effect of the host is optimized; moreover, the upper cover 110, the bottom shell 120 and the water cooling plate 140 are all designed by die-casting aluminum alloy, and can perform auxiliary heat dissipation on the chip; in addition, the main unit 100 of the present invention has less noise, solves the problem of noise caused by high-speed operation of the conventional fan, and improves user experience.

Other structures of the intelligent cabin area liquid-cooled host 100 with efficient heat dissipation according to the present invention are conventional and well known to those skilled in the art, and will not be described in detail herein.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, therefore, the present invention is not limited by the appended claims.

Claims (10)

1. An intelligent cabin area liquid cooling host capable of efficiently dissipating heat comprises an upper cover, a bottom shell and a main circuit board, wherein the upper cover and the bottom shell are connected in a sealing manner;

the side wall of the upper cover or the bottom shell is provided with an inlet and an outlet;

the water cooling plate is hermetically arranged on the upper cover or the bottom shell, a cooling liquid cavity communicated with the inlet and the outlet is formed between the water cooling plate and the upper cover or the bottom shell, at least one circulation channel is formed in the cooling liquid cavity, and a plurality of first heat dissipation fins positioned in the circulation channel are convexly arranged on the water cooling plate.

2. The intelligent high-efficiency heat-dissipation cabin area liquid-cooled host computer of claim 1, wherein at least one flow guide wall is protruded on the water-cooled plate, and the flow guide wall divides the cooling liquid cavity into at least two circulation channels.

3. The intelligent high-efficiency heat-dissipation cabin area liquid cooling host computer as claimed in claim 1 or 2, wherein a mounting boss corresponding to the water cooling plate in shape is protruded from an inner side surface of the upper cover or the bottom case, the water cooling plate is hermetically mounted on the mounting boss to form the cooling liquid cavity therebetween, and a plurality of second heat dissipation fins are disposed on an outer side surface of the upper cover or the bottom case at positions corresponding to the mounting boss.

4. The intelligent high-efficiency heat-dissipation cabin area liquid-cooled host computer as claimed in claim 1 or 2, wherein at least one heating element is arranged on the main circuit board; the water cooling plate is convexly provided with a plurality of first heat dissipation bosses corresponding to the heating elements, and the first heat dissipation bosses are in contact with the heating elements in a laminating manner through heat-conducting glue.

5. The intelligent high-efficiency heat-dissipation cabin area liquid cooling host computer as claimed in claim 4, wherein a plurality of second heat dissipation bosses are further provided on an inner side of the upper cover or/and the bottom case in a protruding manner, the second heat dissipation bosses are in contact with the main circuit board through heat-conducting glue in a bonding manner, and a plurality of third heat dissipation fins are further provided on an outer side of one of the upper cover and the bottom case, which is far away from the water cooling plate, in a protruding manner.

6. The liquid-cooled host computer of claim 5, wherein each of the first and second heat-dissipating bosses comprises a top surface and a plurality of inclined surfaces connected to the top surface, and the top surface contacts the heat-generating component or the main circuit board by heat-conducting glue.

7. The intelligent high-efficiency heat-dissipation cabin area liquid-cooled host computer of claim 1, further comprising at least one first circuit board, wherein at least one signal cavity is further concavely arranged on the outer side surface of the upper cover, a blocking edge is convexly arranged on the edge of the signal cavity, the first circuit board is arranged above the signal cavity, the edge of the first circuit board abuts against the blocking edge, and the first circuit board is hermetically connected to the upper cover.

8. The intelligent high-efficiency heat-dissipation cabin area liquid cooling host computer as claimed in claim 1, wherein a first shielding rib is further protruded on an inner side surface of the upper cover, a second shielding rib is protruded on an inner side surface of the bottom shell, and the first shielding rib and the second shielding rib are in contact with a copper exposed area of the main circuit board through conductive adhesive.

9. The intelligent high-efficiency heat-dissipation liquid-cooled host computer of any one of claims 1 and 7-8, wherein a flow-guiding dust-blocking structure is arranged between the upper cover and the bottom shell.

10. The intelligent high-efficiency heat-dissipation liquid-cooled host computer in passenger cabin area according to any one of claims 1 and 7-8, wherein a plurality of mounting lugs are further protruded from the edge of the bottom shell, and the mounting lugs are used for being quickly locked with the support of the automobile.

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