CN214954891U

CN214954891U - Heat radiation module for notebook computer

Info

Publication number: CN214954891U
Application number: CN202120998287.7U
Authority: CN
Inventors: 熊何; 徐建平; 叶继丰; 杨国军
Original assignee: Shenzhen Chuangzhicheng Technology Co ltd
Current assignee: Shenzhen Chuangzhicheng Technology Co ltd
Priority date: 2021-05-11
Filing date: 2021-05-11
Publication date: 2021-11-30
Anticipated expiration: 2031-05-11

Abstract

The utility model relates to a consolidate the computer field, disclose a heat dissipation module for notebook computer, notebook computer includes the source that generates heat, and heat dissipation module includes basic shell, two kinds at least radiator unit and thermal conductivity module. The base housing includes a bottom wall; the heat dissipation efficiency of at least two heat dissipation components is different, and the at least two heat dissipation components are replaceably arranged on the base shell; the heat conducting component is arranged on the base shell and is used for conducting the heat emitted by the heating source to one of the at least two heat radiating components arranged on the base shell. According to actual needs, the heat dissipation assembly with the matched heat dissipation efficiency is selected to be installed, so that the technical problems that in the prior art, different types of ruggedized computers need to be provided with corresponding heat dissipation systems, the production period of the ruggedized computers is long, and the cost is high are solved.

Description

Heat radiation module for notebook computer

Technical Field

The utility model relates to a consolidate the computer field, especially relate to a heat dissipation module for notebook computer.

Background

Ruggedized computers are computers that take appropriate measures to account for various factors that affect the performance of the computer, such as system architecture, electrical characteristics, and mechanical and physical structures, during the design of the computer, and are also known as rugged-environment resistant computers. The method is characterized in that: the method has strong environmental adaptability, high reliability and high maintainability; stronger real-time processing capacity; serialization, standardization and modularization.

The ruggedized computer is equipped with a heat dissipation system for dissipating heat for power devices of the ruggedized computer, such as a CPU, a graphics card, and the like. However, the types of ruggedized computers applied to different environments are different, and the required heat dissipation performance is also different, so a corresponding heat dissipation system needs to be configured to meet the heat dissipation requirement of the computer, and designing and producing the corresponding heat dissipation system results in a longer production cycle and higher cost of the ruggedized computer.

Disclosure of Invention

The embodiment of the utility model provides a aim at providing a heat dissipation module and reinforcement computer to the reinforcement computer that solves among the prior art different grade type need dispose the corresponding cooling system and lead to the longer, the higher technical problem of cost of production cycle of reinforcing the computer.

The embodiment of the utility model provides a solve its technical problem and adopt following technical scheme: the utility model provides a heat dissipation module for notebook computer, notebook computer includes the source that generates heat, heat dissipation module includes:

a base housing including a bottom wall;

at least two kinds of heat dissipation components, the heat dissipation efficiency of the at least two kinds of heat dissipation components are different, and one kind of the at least two kinds of heat dissipation components is installed on the base shell; and

and the heat conduction assembly is arranged on the base shell and is used for conducting the heat emitted by the heating source to one of the at least two heat dissipation assemblies arranged on the base shell.

In some embodiments, the base shell further comprises a thermal dissipation cartridge body at least partially protruding from the top surface of the bottom wall, one of the at least two thermal dissipation assemblies mounted on the base shell being received within the thermal dissipation cartridge body.

In some embodiments, the thermally conductive assembly comprises at least one heat pipe;

the at least one heat pipe is laid on the top surface of the bottom wall.

In some embodiments, the base case includes at least two first support portions protrudingly provided on the bottom surface of the bottom wall, the at least two first support portions being disposed side by side, every adjacent two of the first support portions being disposed at an interval.

In some embodiments, a heat dissipation bin opening is formed in the bottom surface of the heat dissipation bin body, and the heat dissipation bin opening is communicated with the inside of the heat dissipation bin body;

one of the at least two radiating assemblies comprises a radiator, the radiator comprises a main body part and at least two second supporting parts, the at least two second supporting parts are arranged side by side, and every two adjacent second supporting parts are arranged at intervals;

when the radiator is arranged on the base shell, the main body part is accommodated in the radiating cabin body, the bottom surface of the main body part is flush with the bottom surface of the bottom wall, and the arrangement directions of the at least two first supporting parts and the at least two second supporting parts are consistent.

one of the at least two radiating assemblies comprises a radiating fan, radiating fins and a housing, wherein the radiating fan is provided with a first air inlet and a first air outlet, and the housing is provided with a second air inlet and a second air outlet;

the casing is used for being installed on the bottom surface of the heat dissipation bin body so as to seal the interior of the heat dissipation bin body;

the first air inlet is used for aligning with the second air inlet, the first air outlet is used for aligning with the second air outlet, and the heat dissipation fins are used for being arranged between the first air outlet and the second air outlet and connected with the heat conduction assembly.

In some embodiments, one of the at least two heat dissipation assemblies comprises an active heat dissipation element and another of the at least two heat dissipation assemblies comprises a passive heat dissipation element.

In some embodiments, a containing cavity is formed on the base shell;

the accommodating cavity is arranged on the top side of the bottom wall and is used for accommodating the heat conduction assembly and the heating source.

In some embodiments, the base housing comprises an enclosing wall surrounding the receiving cavity;

the heat dissipation module also comprises a cover body;

the bottom surface of the cover body is attached to the top surface of the surrounding wall and used for sealing the containing cavity.

In some embodiments, an annular groove is formed in the bottom surface of the cover for receiving a sealing ring, and the top surface of the surrounding wall closes the annular groove.

In some embodiments, at least one screw hole is formed on the bottom surface of the cover body, at least one through hole is formed on the top surface of the surrounding wall, the position of the at least one screw hole corresponds to the position of the at least one through hole, and the at least one screw hole is outside the range surrounded by the annular groove.

Compared with the prior art, the embodiment of the utility model provides an among the heat dissipation module, through two kinds at least radiator unit that the configuration radiating efficiency is different, two kinds at least radiator unit alternatives are installed on basic shell, the heat conduction subassembly will generate heat the heat that the source gived off and to the conduction of installing on basic shell among two kinds at least radiator unit, according to actual need, select the radiator unit that the installation radiating efficiency matches to the production cycle that the ruggedized computer of having avoided the different grade type among the prior art need dispose corresponding cooling system and lead to the ruggedized computer is longer, the higher technical problem of cost.

Drawings

One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.

Fig. 1 is a schematic structural diagram of a heat dissipation module for a notebook computer according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a base housing of the heat dissipation module shown in fig. 1;

FIG. 3 is a schematic structural view of the base housing of the heat dissipation module shown in FIG. 1 at another angle;

FIG. 4 is a schematic structural view of the heat dissipation module shown in FIG. 1 at another angle;

FIG. 5 is a schematic cross-sectional view taken along line A-A of FIG. 1;

fig. 6 to 8 are schematic structural views of the heat dissipation module shown in fig. 1 in a state in which a base housing of the heat dissipation module is mounted with a first heat dissipation assembly;

fig. 9 to 11 are schematic structural views of the heat dissipation module shown in fig. 1 in another state, wherein a second heat dissipation assembly is mounted on a base housing of the heat dissipation module;

fig. 12 to 14 are schematic structural views of the heat dissipation module in other embodiments.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described in more detail with reference to the accompanying drawings and specific embodiments. It will be understood that when an element is referred to as being "connected" to another element, it can be directly on the other element or intervening elements may be present. The terms "upper", "lower", "left", "right", "upper", "lower", "top" and "bottom" used in the present specification indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

Referring to fig. 1, an embodiment of the present invention provides a heat dissipation module for a notebook computer, where the notebook computer may be a ruggedized computer. The notebook computer includes a heat generating source 100. The heat source 100 may be a display card, a processor, or the like of the notebook computer.

The heat dissipation module includes a base housing 10, a heat conduction assembly 20, and at least two kinds of heat dissipation assemblies 30.

The heat dissipation efficiency of the at least two heat dissipation assemblies 30 is different from each other. The at least two kinds of heat dissipation assemblies 30 are replaceably mounted on the base case 10. The heat conducting assembly 20 is mounted on the base case 10, the heat conducting assembly 20 is configured to conduct heat emitted from the heat generating source 100 to a designated heat dissipating assembly, which is one of the at least two heat dissipating assemblies 30 mounted on the base case 10.

Referring to fig. 2 and 3, the base housing 10 may be a bottom housing of the notebook computer, that is, a housing where a D-side of the notebook computer is located.

The base housing 10 may be made of aluminum, copper, or other material having a good thermal conductivity.

The base housing 10 is provided with a receiving cavity 11, and the receiving cavity 11 is used for receiving the heat source 200 and the heat conducting assembly 20.

The base housing 10 comprises a bottom wall 12 and a surrounding wall 13. The surrounding wall 13 surrounds the receiving cavity 11 and is disposed together with the receiving cavity 11 on the top side of the bottom wall 12.

The base housing 10 further comprises at least two first support parts 14. The at least two first supporting portions 14 are protrudingly provided on the bottom surface of the bottom wall 12. The at least two first supporting portions 14 are arranged side by side, and every two adjacent first supporting portions 14 are spaced apart. The at least two first supports 14 are adapted to support the bottom wall 12 in a plane, which may be the ground, a table top, etc. The first supporting parts 14 are spaced apart from each other, so that an air duct is formed between each two adjacent first supporting parts 14. The duct is capable of allowing air to pass therethrough to carry away heat from the bottom wall 12.

The base housing 10 includes a thermal dissipation chamber body 15. The top of the cabin body 15 is arranged on the top surface of the bottom wall 12 in a protruding manner, and the bottom of the cabin body 15 is arranged on the bottom surface of the bottom wall 12 in a protruding manner. A heat dissipation bin opening 150 leading to the inside of the heat dissipation bin body 15 is formed in the bottom of the heat dissipation bin body 15. The interior of the thermal dissipation bin body 16 is used for accommodating the specified thermal dissipation assembly.

A communication port 152 is arranged on the top of the heat dissipation bin body 15. The communicating opening 152 communicates the interior of the cabin body 15 with the containing cavity 11, and a part of the heat conducting element 20 passes through the communicating opening 152 to connect with the designated heat dissipating element.

The base housing 10 includes a mounting cartridge body 16. The mounting bin body 16 is convexly arranged on the bottom surface of the bottom wall 12. An installation bin opening 160 leading to the inside of the installation bin 16 is opened on the top surface of the bottom wall 12, that is, the inside of the installation bin 16 is communicated with the receiving cavity 11 through the installation bin opening 160. The mounting bin 16 is used for accommodating a circuit board of the notebook computer.

The base shell 10 includes a boss structure 17. The boss structure 17 is protruded on the bottom surface of the bottom wall 12, and is used for supporting the bottom wall 12 together with the at least two first supporting parts 14. The boss structure 17 comprises the bottom of the thermal dissipation bin body 15 and the mounting bin body 16.

The surrounding wall 13 is arranged along the periphery of the bottom wall 12 and is convexly arranged on the top surface of the bottom wall 12.

The surrounding wall 13 is substantially stepped and includes a first side wall 130, a second side wall 131 and a connecting wall 132. The first sidewall 130 surrounds the bottom of the receiving slot 11, the second sidewall 131 surrounds the top of the receiving slot 11, the top circumference of the first sidewall 130 is within the bottom circumference of the second sidewall 131, and the connecting wall 132 connects the top circumference of the first sidewall 130 and the bottom circumference of the second sidewall 131.

The second sidewall 131 is configured to be mounted on a main body of the notebook computer.

At least one through hole 133 is disposed on the second sidewall 131, the at least one through hole 130 penetrates through the top surface and the bottom surface of the second sidewall 131, the at least one through hole 133 is distributed in the surrounding direction of the second sidewall 131, and each through hole 133 is used for passing a screw.

Referring to fig. 4 and 5, the heat conducting assembly 20 is accommodated in the accommodating cavity 11.

The heat conductive member 20 is disposed on a side of the bottom wall 12 toward which the top surface faces.

The heat conducting assembly 20 includes at least one heat pipe. The at least one heat pipe is laid on the top surface of the bottom wall 12, and the at least one heat pipe can conduct a first part of heat emitted by the heat-generating source 200 to the designated heat-dissipating component and conduct a second part of heat emitted by the heat-generating source 200 to the base housing 10. By laying the at least one heat pipe on the top surface of the bottom wall 12, in the first aspect, the at least one heat pipe can conduct the second part of the heat emitted from the heat generating source 200 to the base case 10, which can reduce the burden of the designated heat dissipating component and improve the overall heat dissipating efficiency. In the second aspect, the at least one heat pipe can perform a heat-equalizing function, so that the second portion of heat emitted by the heat-generating source 200 is uniformly distributed on the bottom wall 12, thereby avoiding generating a hot spot on the bottom wall 12, and improving the heat-dissipating efficiency of the bottom wall 12.

In this embodiment, three of the at least one heat pipe are taken as an example for explanation, and the three of the at least one heat pipe are the first heat pipe 21, the second heat pipe 22 and the third heat pipe 23 respectively.

The first end of the first heat pipe 21 is used for connecting the heat generating source 200, and the second end of the first heat pipe 21 is connected with the specified heat dissipation assembly.

The thermally conductive assembly 20 includes a first silicone layer 24. The first silicone layer 24 is disposed at a first end of the first heat pipe 21, and the first end of the first heat pipe 21 is used for connecting the heat generating source 100 through the first silicone layer 24. The first silicone grease layer 24 can be filled in a gap between the first end of the first heat pipe 21 and the heat generating source 100 to increase the speed of heat conduction to the first heat pipe 21.

It is understood that the first silicone layer 24 may be omitted, depending on the actual requirements.

The heat conducting assembly 20 includes a second silicone layer 25. The second silicone layer 25 is disposed at a second end of the first heat pipe 21, and the second end of the first heat pipe 21 is connected to the designated heat sink through the second silicone layer 25. The second silicone layer 24 can be filled in the gap between the second end of the first heat pipe 21 and the designated heat dissipation component to increase the speed of heat conduction to the designated heat dissipation component.

The second silicone layer 25 is accommodated in the communication port 152.

It will be appreciated that the second silicone layer 25 may be omitted, depending on the actual requirements.

The first heat pipe 21 includes a first heat pipe section 210, a second heat pipe section 211, a third heat pipe section 212, and a fourth heat pipe section 213 connected in series. The first heat pipe section 210 is disposed on one side of the top of the thermal dissipation bin body 15, the first heat pipe section 210 is used for connecting the heat generation source 100, and the first heat pipe section 210 is a first end of the first heat pipe 21. The second heat pipe section 211 extends from the first heat pipe section 210 in a direction toward the top of the thermal pod body 15. The second heat pipe section 211 is perpendicular to the first heat pipe section 210. The first and second

heat pipe segments

210, 211 are laid on the top surface of the bottom wall 12. The third heat pipe section 212 extends obliquely from the second heat pipe section 211 towards the top side of the bottom wall 12. The fourth heat pipe section 213 is used for connecting the designated heat dissipation component, and the fourth heat pipe section 213 is a second end of the first heat pipe 21. The fourth heat pipe segment 213 is tiled on the top surface of the thermal pod body.

The fourth heat pipe section 213 is connected to the designated heat sink assembly through the second silicone layer 25. The first heat pipe 21 is used for conducting the heat emitted from the heat generating source 100 to the bottom wall 12 and the designated heat dissipation component.

The second heat pipe 22 and the third heat pipe 23 are laid on the top surface of the bottom wall 12. Wherein, the second heat pipe 22 is arranged on one side of the first heat pipe section 210 facing the top of the thermal dissipation cabin body 15, and the third heat pipe 23 is arranged on the other side of the first heat pipe section 210 facing away from the top of the thermal dissipation cabin body 15. The second heat pipe 22 is used to soak the bottom wall 12. The third heat pipe 22 is connected to the heat generating source 100 through the first silicone layer 24, and the third heat pipe 22 is used for conducting heat emitted from the heat generating source 100 to the bottom wall 12.

Referring to fig. 6 to 8, the designated heat dissipation assembly is disposed inside the cabin body 15.

In the present embodiment, two of the at least two heat dissipation assemblies 30 are taken as an example for description, and the two of the at least two heat dissipation assemblies are a first heat dissipation assembly and a second heat dissipation assembly respectively.

The first heat dissipation assembly comprises an active heat dissipation element.

The first heat dissipation assembly includes a heat dissipation fan 31, heat dissipation fins 32, and a housing 33. The heat dissipation fan 31 is an active heat dissipation element.

The heat dissipation fan 31 is arranged inside the heat dissipation bin body 15.

The heat dissipation fan 31 includes a fan case 310, an impeller 311, and a motor. The fan case 310 is provided with a first air inlet 312 and a first air outlet 313. The first air inlet 312 and the first air outlet 313 are both communicated with the inside of the fan housing 310.

The impeller 311 is installed inside the fan housing 310, the motor is installed in the fan housing 310, and a rotating shaft of the motor is connected to the impeller 311 and is used for driving the impeller 311 to rotate.

The motor can be powered by the mainboard of the notebook computer.

The heat dissipation fins 32 are disposed at the first air outlet 313.

The cover casing 33 is used for being mounted on the bottom of the heat dissipation bin body 15 so as to seal the heat dissipation bin opening 150.

The housing 33 is provided with a second air inlet 330 and a second air outlet 331. The second air inlet 330 is configured to align with the first air inlet 312, the second air outlet 331 is configured to align with the first air outlet 313, and the heat dissipation fin 32 is configured to be disposed between the second air outlet 331 and the first air outlet 313.

The first heat dissipation assembly includes a shock absorbing member. The shock absorbing member is disposed between the fan casing 310 and the inner wall of the thermal dissipation chamber 15 to reduce the vibration transmitted from the thermal dissipation fan 31 to the bottom wall 12.

The shock absorbing member may be made of a sponge material.

When the first heat dissipation assembly is mounted on the base housing 10, the second silicone layer 25 is connected between the first end of the first heat pipe 21 and the heat dissipation fins 32.

Referring to fig. 9 to 11, the second heat dissipation assembly includes a passive heat dissipation element.

The second heat dissipation assembly includes a heat sink 34, and the heat sink 34 is a passive heat dissipation element.

The heat sink 34 may be made of a material with good thermal conductivity, such as aluminum and copper.

The heat sink 34 includes a main body portion 340 and at least two second supporting portions 341. The at least two second supporting portions 341 are protruded on the bottom surface of the main body portion 340. The at least two second supporting portions 341 are arranged side by side. Every two adjacent second supporting portions 341 are disposed at intervals.

The main body 340 is used for connecting the heat conducting assembly 20.

When the second heat dissipation assembly is mounted on the base housing 10, the second silicone layer 25 is connected between the main body 340 and the first end of the first heat conduction pipe, the bottom surface of the main body 340 is flush with the bottom surface of the bottom wall 12, and the arrangement direction of the at least two second supporting portions 341 is the same as the arrangement direction of the at least two first supporting portions 14.

Referring to fig. 12 to 14, the heat dissipation module includes a cover 40. The cover 40 is mounted on the base housing 10 and used for closing the accommodating cavity 11. The cover 40 may be a top cover of the notebook computer, that is, a case where the C-side of the notebook computer is located.

At least one screw hole 41 is formed on the bottom surface of the cover 40. Each of the screw holes 41 may be formed by tapping screws or pre-embedded nuts embedded in the cover 40. The at least one screw hole 41 is distributed along the periphery of the cover 40. The at least one screw hole 41 is used for mounting the base shell.

An annular groove 42 is opened on the bottom surface of the cover 40. The annular groove 42 is disposed substantially along the periphery of the cover 40, and the at least one screw hole 41 is disposed outside the surrounding range of the annular groove 42.

The heat dissipation module further comprises a sealing ring. The seal ring is received in the annular groove 42 for sealing performance between the base housing 10 and the cover 40.

When the cover 40 is assembled with the base housing 10, the bottom surface of the cover 40 is attached to the top surface of the surrounding wall 13. The position of the at least one screw hole 41 corresponds to the position of the at least one through hole 133, and at least one screw penetrates through the at least one through hole 133 and is screwed with the at least one screw hole 41 respectively, so as to fix the cover body 40 on the base shell 10. The top surface of the surrounding wall 13 closes the annular groove 42, and the top surface of the surrounding wall 13 and the groove wall of the annular groove 42 jointly press the sealing ring.

Compared with the prior art, the embodiment of the utility model provides an among the heat dissipation module, through two kinds of at least radiator unit that configuration radiating efficiency is different, two kinds of at least radiator unit are installed on basic shell replaceably, and heat-conducting component

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; within the idea of the invention, also technical features in the above embodiments or in different embodiments can be combined, steps can be implemented in any order, and there are many other variations of the different aspects of the invention as described above, which are not provided in detail for the sake of brevity; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.

Claims

1. The utility model provides a heat dissipation module for notebook computer, notebook computer includes the source that generates heat, its characterized in that, heat dissipation module includes:

a base housing including a bottom wall;

2. The heat dissipation module of claim 1, wherein the base housing further comprises a thermal dissipation chamber body at least partially protruding from the top surface of the bottom wall, and one of the at least two types of heat dissipation assemblies mounted on the base housing is received inside the thermal dissipation chamber body.

3. The heat dissipation module of claim 2, wherein the thermally conductive assembly comprises at least one heat pipe;

the at least one heat pipe is laid on the top surface of the bottom wall.

4. The heat dissipating module of claim 3, wherein the base housing includes at least two first supporting portions, the at least two first supporting portions are protruded on the bottom surface of the bottom wall, the at least two first supporting portions are disposed side by side, and every two adjacent first supporting portions are disposed at an interval.

5. The heat dissipation module of claim 4, wherein a heat dissipation bin opening is formed in the bottom surface of the heat dissipation bin body, and the heat dissipation bin opening is open to the inside of the heat dissipation bin body;

6. The heat dissipation module of claim 2, wherein a heat dissipation bin opening is formed in a bottom surface of the heat dissipation bin body, and the heat dissipation bin opening opens into the interior of the heat dissipation bin body;

7. The heat dissipation module of claim 1, wherein one of the at least two heat dissipation assemblies comprises an active heat dissipation element and another of the at least two heat dissipation assemblies comprises a passive heat dissipation element.

8. The heat dissipation module of any one of claims 1 to 7, wherein a receiving cavity is formed on the base housing;

9. The thermal module of claim 8, wherein the base housing comprises a surrounding wall surrounding the receiving cavity;

the heat dissipation module also comprises a cover body;

10. The heat dissipating module of claim 9, wherein an annular groove is formed on the bottom surface of the cover for receiving the sealing ring, and the top surface of the surrounding wall closes the annular groove.

11. The heat dissipating module of claim 10, wherein at least one screw hole is formed on the bottom surface of the cover, and at least one through hole is formed on the top surface of the surrounding wall, the at least one screw hole corresponding to the at least one through hole, the at least one screw hole being outside the range surrounded by the annular groove.