CN220733348U - Heat conductor for heat dissipation of circuit board, heat dissipation structure and infrared imaging equipment - Google Patents
Heat conductor for heat dissipation of circuit board, heat dissipation structure and infrared imaging equipment Download PDFInfo
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- CN220733348U CN220733348U CN202322406712.0U CN202322406712U CN220733348U CN 220733348 U CN220733348 U CN 220733348U CN 202322406712 U CN202322406712 U CN 202322406712U CN 220733348 U CN220733348 U CN 220733348U
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- heat
- circuit board
- heat conduction
- heat dissipation
- shell
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 46
- 238000003331 infrared imaging Methods 0.000 title claims abstract description 32
- 239000004020 conductor Substances 0.000 title claims abstract description 20
- 238000010438 heat treatment Methods 0.000 claims abstract description 49
- 238000009434 installation Methods 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 230000006978 adaptation Effects 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 13
- 230000005855 radiation Effects 0.000 description 8
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- FPWNLURCHDRMHC-UHFFFAOYSA-N 4-chlorobiphenyl Chemical group C1=CC(Cl)=CC=C1C1=CC=CC=C1 FPWNLURCHDRMHC-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000004861 thermometry Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of infrared imaging heat dissipation, in particular to a heat conductor, a heat dissipation structure and infrared imaging equipment for heat dissipation of a circuit board, which comprise a heat conduction shell matched with the shape of the circuit board, wherein the edge of the heat conduction shell is provided with a mounting part for mounting the circuit board, the inner side surface of the heat conduction shell is provided with a heat conduction bulge corresponding to the position of a first heating element, the bulge height of the heat conduction bulge is equal to the distance from the surface of the first heating element to the inner side surface of the heat conduction shell, so that heat generated by the first heating element of the circuit board can be directly transferred to the heat conduction shell, and then the heat generated by the heat conduction bulge is directly contacted with and clung to the first heating element, thereby increasing the heat dissipation area, and being capable of transmitting the heat generated by the operation of the heating element more quickly, and improving the heat dissipation effect of the equipment.
Description
Technical Field
The utility model relates to the technical field of infrared imaging heat dissipation, in particular to a heat conductor for heat dissipation of a circuit board, a heat dissipation structure and infrared imaging equipment.
Background
In a device for handheld infrared imaging thermometry, it is generally desirable that the device be capable of miniaturization and weight reduction; however, the work of the infrared imaging internal components increases along with the energizing time, and the heat radiated by the power consumption condition of the components is accumulated in the infrared equipment, so that the performances of the CPU and other main core devices are affected, and a heat dissipation structure is added between the CPU and other core devices; in general, heat dissipation is realized by controlling the overall power consumption of the device in a manner of reducing the power consumption of components, or the heat is balanced by exchanging the inside of the device with air, or a heat dissipation fan is additionally arranged at the CPU end of a similar computer. However, in terms of power consumption, the data volume required to be processed by the device is too large, which can cause larger occupancy rate of development resources of the device, so that the power consumption is large; in the sealed space, the heat transfer efficiency by air is too low, and on the premise of miniaturization, light weight and the like of equipment, a cooling fan is additionally arranged on a device with high power consumption and high heat quantity, so that the occupied space is too much.
Disclosure of Invention
The technical problems to be solved by the utility model are as follows: the utility model provides a heat conductor, heat radiation structure and infrared imaging device for circuit board heat dissipation can be with inside heat transfer away fast to the radiating effect of equipment has been improved.
In order to solve the technical problems, the first technical scheme adopted by the utility model is as follows:
be used for radiating heat conductor of circuit board, be equipped with first components and parts that generate heat on the circuit board, its characterized in that includes the heat conduction casing with circuit board shape looks adaptation, the border department of heat conduction casing is equipped with the installation department that is used for installing the circuit board, the medial surface of heat conduction casing just corresponds the heat conduction protruding that the components and parts position set up generates heat, the protruding protrusion height of heat conduction equals with the distance of first components and parts surface to the medial surface of heat conduction casing.
Further, the first heating element comprises a heating chip, the surface of the heat conduction protrusion is a plane, and the heat conduction protrusion is in contact with the heating chip.
Further, the cross-sectional area of the contact surface of the heat conduction protrusion is larger than or equal to the cross-sectional area of the contact surface of the first heating element.
Further, the installation portion comprises a plurality of installation protruding blocks, and the installation protruding blocks are distributed at the edge of the heat conduction shell in an equal angle mode.
Further, the circuit board is provided with a second heating element, the height of the second heating element is larger than the thickness of the heat conducting shell, and the heat conducting shell is provided with a through groove for avoiding the second heating element.
The second technical scheme adopted by the utility model is as follows:
the heat dissipation structure comprises a circuit board and the heat conductor for heat dissipation of the circuit board, wherein the circuit board is a PCB.
Further, a flexible heat conducting pad is arranged between the first heating element and the heat conducting bulge.
Further, the flexible heat conducting pad is a heat conducting pad or a heat conducting insulating silica gel pad filled with a liquid heat conducting medium.
The third technical scheme adopted by the utility model is as follows:
the utility model provides an infrared imaging equipment, includes CPU board, heat conduction support and the foretell heat radiation structure of setting inside infrared imaging casing, heat conduction support and infrared imaging casing contact, heat radiation structure installs on heat conduction support, heat conduction casing is located between CPU board and the PCB board, be connected through the copper post between CPU board and the heat conduction casing.
The utility model has the beneficial effects that:
through setting up a heat conduction casing with circuit board shape looks adaptation, the border department of heat conduction casing is equipped with the installation department that is used for installing the circuit board, heat conduction casing's medial surface just corresponds the heat conduction arch that the first components and parts position set up that generates heat, the protruding protrusion height of heat conduction equals with the first heat component surface to the medial surface of heat conduction casing's distance for the heat that the first components and parts that generate heat of circuit board produced can both directly transmit for heat conduction casing, the heat that will produce by heat conduction casing again is gone out, heat conduction arch and first components and parts direct contact that generates heat and hugs closely, increased radiating area, consequently can be faster with the heat transmission that the components and parts work produced to the radiating effect of equipment has been improved.
Drawings
Fig. 1 is a schematic structural view of a heat conductor for heat dissipation of a circuit board according to the present utility model;
fig. 2 is a schematic structural view of a heat conductor for heat dissipation of a circuit board according to the present utility model;
FIG. 3 is a schematic view of a portion of an infrared imaging device according to the present utility model;
fig. 4 is a schematic view of a part of an infrared imaging apparatus according to the present utility model;
description of the reference numerals:
1. a thermally conductive bracket; 2. a CPU board; 3. a PCB board; 4. a thermally conductive housing; 401. a heat conduction protrusion; 402. a through groove; 403. mounting the protruding blocks; 5. copper pillars.
Detailed Description
In order to describe the technical contents, the achieved objects and effects of the present utility model in detail, the following description will be made with reference to the embodiments in conjunction with the accompanying drawings.
Referring to fig. 1 and 2, a first technical scheme adopted by the present utility model is as follows:
be used for radiating heat conductor of circuit board, be equipped with first heating element on the circuit board, include the heat conduction casing with circuit board shape looks adaptation, the border department of heat conduction casing is equipped with the installation department that is used for installing the circuit board, the medial surface of heat conduction casing just corresponds the heat conduction arch that first heating element position set up, the protruding protrusion height of heat conduction equals with the distance of first heating element surface to the medial surface of heat conduction casing.
From the above description, the beneficial effects of the utility model are as follows:
through setting up a heat conduction casing with circuit board shape looks adaptation, the border department of heat conduction casing is equipped with the installation department that is used for installing the circuit board, heat conduction casing's medial surface just corresponds the heat conduction arch that the first components and parts position set up that generates heat, the protruding protrusion height of heat conduction equals with the first heat component surface to the medial surface of heat conduction casing's distance for the heat that the first components and parts that generate heat of circuit board produced can both directly transmit for heat conduction casing, the heat that will produce by heat conduction casing again is gone out, heat conduction arch and first components and parts direct contact that generates heat and hugs closely, increased radiating area, consequently can be faster with the heat transmission that the components and parts work produced to the radiating effect of equipment has been improved.
Further, the first heating element comprises a heating chip, the surface of the heat conduction protrusion is a plane, and the heat conduction protrusion is in contact with the heating chip.
As is apparent from the above description, the surface of the heat conduction protrusion is a plane, which can increase the contact area between the heat conduction protrusion and the heat generating chip, thereby further improving the heat dissipation effect.
Further, the cross-sectional area of the contact surface of the heat conduction protrusion is larger than or equal to the cross-sectional area of the contact surface of the first heating element.
As is clear from the above description, the cross-sectional area of the contact surface of the heat conduction protrusion is greater than or equal to the cross-sectional area of the contact surface of the first heat generation component, so that the first heat generation component can be ensured to be in contact with the heat conduction protrusion as much as possible, and therefore the heat dissipation effect can be further improved.
Further, the installation portion comprises a plurality of installation protruding blocks, and the installation protruding blocks are distributed at the edge of the heat conduction shell in an equal angle mode.
According to the above description, the circuit board can be stably mounted on the heat conducting shell through the plurality of mounting lugs, so that the first heating element on the circuit board can be tightly attached to the heat conducting bulge, and the heat dissipation effect can be further improved.
Further, the circuit board is provided with a second heating element, the height of the second heating element is larger than the thickness of the heat conducting shell, and the heat conducting shell is provided with a through groove for avoiding the second heating element.
Referring to fig. 1 and 2, a second technical scheme adopted by the present utility model is as follows:
the heat dissipation structure comprises a circuit board and the heat conductor for heat dissipation of the circuit board, wherein the circuit board is a PCB.
From the above description, the beneficial effects of the utility model are as follows:
through setting up a heat conduction casing with circuit board shape looks adaptation, the border department of heat conduction casing is equipped with the installation department that is used for installing the circuit board, heat conduction casing's medial surface just corresponds the heat conduction arch that the first components and parts position set up that generates heat, the protruding protrusion height of heat conduction equals with the first heat component surface to the medial surface of heat conduction casing's distance for the heat that the first components and parts that generate heat of circuit board produced can both directly transmit for heat conduction casing, the heat that will produce by heat conduction casing again is gone out, heat conduction arch and first components and parts direct contact that generates heat and hugs closely, increased radiating area, consequently can be faster with the heat transmission that the components and parts work produced to the radiating effect of equipment has been improved.
Further, a flexible heat conducting pad is arranged between the first heating element and the heat conducting bulge.
It can be seen from the above description that, by providing the flexible heat conducting pad between the first heating element and the heat conducting protrusion, the heat conductivity between the first heating element and the heat conducting protrusion can be improved while the buffer protection effect is achieved on the first heating element, so that the heat dissipation effect is further improved.
Further, the flexible heat conducting pad is a heat conducting pad or a heat conducting insulating silica gel pad filled with a liquid heat conducting medium.
Referring to fig. 1 to 4, a third technical scheme adopted by the present utility model is as follows:
the utility model provides an infrared imaging equipment, includes CPU board, heat conduction support and the foretell heat radiation structure of setting inside infrared imaging casing, heat conduction support and infrared imaging casing contact, heat radiation structure installs on heat conduction support, heat conduction casing is located between CPU board and the PCB board, be connected through the copper post between CPU board and the heat conduction casing.
From the above description, the beneficial effects of the utility model are as follows:
through the CPU board, the heat conduction support and the heat dissipation structure in the infrared imaging shell, the heat conduction support is in contact with the infrared imaging shell, the heat dissipation structure is arranged on the heat conduction support, the heat conduction shell is positioned between the CPU board and the PCB, the CPU board is connected with the heat conduction shell through the copper column, the heat conduction shell is in contact with the heat conduction support, the heat conduction support is in contact with the inner side wall of the infrared imaging shell, heat generated by a heating source of the CPU board and a heating source of the PCB can be directly transferred to the heat conduction shell, and then transferred to the heat conduction support through the heat conduction shell, and finally, the generated heat is transferred to the infrared imaging shell through the heat conduction support; because the heating source of the CPU board and the heating source of the PCB board are directly contacted with the heat conducting shell, the heat radiating area is increased, so that heat generated by the operation of components can be transmitted more quickly, and the heat radiating effect of the equipment is improved; compared with the prior art which utilizes the heat dissipation mode of the fan, the fan power supply is reduced, and noise processing on the operation of the fan is avoided.
Referring to fig. 1 and 2, a first embodiment of the utility model is as follows:
referring to fig. 1 and fig. 2, a heat conductor for heat dissipation of a circuit board is provided with a first heating element, which includes a heat conductive housing 4 adapted to the shape of the circuit board, an installation portion for installing the circuit board is provided at the edge of the heat conductive housing 4, and a heat conductive protrusion 401 is provided on the inner side surface of the heat conductive housing 4 and corresponds to the position of the first heating element, and the protrusion height of the heat conductive protrusion 401 is equal to the distance from the surface of the first heating element to the inner side surface of the heat conductive housing 4.
The first heating component comprises a heating chip, the surface of the heat conduction protrusion 401 is a plane, and the heat conduction protrusion 401 is in contact with the heating chip.
The cross-sectional area of the contact surface of the heat conduction protrusion 401 is greater than or equal to the cross-sectional area of the contact surface of the heat generating component.
Referring to fig. 1, the mounting portion includes a plurality of mounting protrusions 403, and the plurality of mounting protrusions 403 are equiangularly distributed at the edge of the heat conductive housing 4.
The circuit board is provided with a second heating element, the height of the second heating element is larger than the thickness of the heat conducting shell 4, and the heat conducting shell 4 is provided with a through groove 402 for avoiding the second heating element.
Referring to fig. 1 and 2, a second embodiment of the present utility model is as follows:
the heat dissipation structure comprises a circuit board and the heat conductor for heat dissipation of the circuit board, wherein the circuit board is a PCB 3.
A flexible heat conducting pad is arranged between the first heating element and the heat conducting protrusion 401.
The flexible heat conducting pad is a heat conducting pad or a heat conducting insulating silica gel pad filled with liquid heat conducting medium.
Referring to fig. 1 to 4, a third embodiment of the present utility model is as follows:
the utility model provides an infrared imaging equipment, includes CPU board 2, heat conduction support 1 and foretell heat radiation structure of setting inside infrared imaging casing, heat conduction support 1 and infrared imaging casing contact, heat radiation structure installs on heat conduction support 1, heat conduction casing 4 is located between CPU board 2 and PCB board 3, connect through copper post 5 between CPU board 2 and the heat conduction casing 4.
The heat radiation structure designed by the scheme can meet the internal space requirement of equipment and is matched with the whole structural design; because the heating source of the CPU board 2 and the heating source of the PCB board 3 are directly contacted with the heat conduction shell 4, the heat dissipation area is increased, and thus, the heat generated by the operation of components can be transmitted more quickly; compared with the prior art which utilizes the heat dissipation mode of the fan, the fan power supply is reduced, and noise processing on the operation of the fan is avoided.
In summary, according to the heat conductor, the heat dissipation structure and the infrared imaging device for heat dissipation of the circuit board, the CPU board, the heat conduction support and the heat dissipation structure are arranged in the infrared imaging shell, the heat conduction support is in contact with the infrared imaging shell, the heat dissipation structure is arranged on the heat conduction support, the heat conduction shell is arranged between the CPU board and the PCB, the CPU board is connected with the heat conduction shell through the copper column, the heat conduction shell is in contact with the heat conduction support, the heat conduction support is in contact with the inner side wall of the infrared imaging shell, heat generated by a heat generation source of the CPU board and a heat generation source of the PCB can be directly transferred to the heat conduction shell, and then transferred to the heat conduction support through the heat conduction shell, and finally the generated heat is transferred to the infrared imaging shell through the heat conduction support; because the heating source of the CPU board and the heating source of the PCB board are directly contacted with the heat conducting shell, the heat radiating area is increased, so that heat generated by the operation of components can be transmitted more quickly, and the heat radiating effect of the equipment is improved; compared with the prior art which utilizes the heat dissipation mode of the fan, the fan power supply is reduced, and noise processing on the operation of the fan is avoided.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent changes made by the specification and drawings of the present utility model, or direct or indirect application in the relevant art, are included in the scope of the present utility model.
Claims (9)
1. Be used for radiating heat conductor of circuit board, be equipped with first components and parts that generate heat on the circuit board, its characterized in that includes the heat conduction casing with circuit board shape looks adaptation, the border department of heat conduction casing is equipped with the installation department that is used for installing the circuit board, the medial surface of heat conduction casing just corresponds the heat conduction protruding that the components and parts position set up generates heat, the protruding protrusion height of heat conduction equals with the distance of first components and parts surface to the medial surface of heat conduction casing.
2. The heat conductor for heat dissipation of a circuit board according to claim 1, wherein the first heat generating component includes a heat generating chip, the surface of the heat conducting boss is a plane, and the heat conducting boss is in contact with the heat generating chip.
3. The heat conductor for heat dissipation of a circuit board according to claim 1, wherein a cross-sectional area of the contact surface of the heat conduction protrusion is greater than or equal to a cross-sectional area of the contact surface of the first heat generating component.
4. The heat conductor for heat dissipation of a circuit board according to claim 1, wherein the mounting portion comprises a plurality of mounting bumps equiangularly distributed at an edge of the heat conductive housing.
5. The heat conductor for heat dissipation of a circuit board according to claim 1, wherein the circuit board is provided with a second heating element, the height of the second heating element is greater than the thickness of the heat conducting shell, and the heat conducting shell is provided with a through groove for avoiding the second heating element.
6. A heat dissipation structure comprising a circuit board and the heat conductor for dissipating heat from the circuit board according to any one of claims 1 to 5, wherein the circuit board is a PCB.
7. The heat dissipating structure of claim 6, wherein a flexible thermal pad is disposed between the first heat generating component and the thermal bump.
8. The heat dissipating structure of claim 7, wherein the flexible thermal pad is a thermal pad or a thermal insulating silicone pad filled with a liquid thermal medium.
9. The infrared imaging device is characterized by comprising a CPU board, a heat conduction support and the heat dissipation structure, wherein the CPU board is arranged inside an infrared imaging shell, the heat conduction support is in contact with the infrared imaging shell, the heat dissipation structure is arranged on the heat conduction support, the heat conduction shell is located between the CPU board and a PCB, and the CPU board is connected with the heat conduction shell through a copper column.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322406712.0U CN220733348U (en) | 2023-09-05 | 2023-09-05 | Heat conductor for heat dissipation of circuit board, heat dissipation structure and infrared imaging equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322406712.0U CN220733348U (en) | 2023-09-05 | 2023-09-05 | Heat conductor for heat dissipation of circuit board, heat dissipation structure and infrared imaging equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220733348U true CN220733348U (en) | 2024-04-05 |
Family
ID=90490433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322406712.0U Active CN220733348U (en) | 2023-09-05 | 2023-09-05 | Heat conductor for heat dissipation of circuit board, heat dissipation structure and infrared imaging equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220733348U (en) |
-
2023
- 2023-09-05 CN CN202322406712.0U patent/CN220733348U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |