CN212463859U

CN212463859U - Heat dissipation mechanism of 5G electronic device

Info

Publication number: CN212463859U
Application number: CN202021157795.4U
Authority: CN
Inventors: 王芳云
Original assignee: Zhejiang Jiechuang Ark Digital Technology Co ltd
Current assignee: Zhejiang Jiechuang Ark Digital Technology Co ltd
Priority date: 2020-06-19
Filing date: 2020-06-19
Publication date: 2021-02-02
Anticipated expiration: 2030-06-19

Abstract

The utility model discloses a heat dissipation mechanism of 5G electronic device, including casing, the integration PCB board that remains the heat dissipation part, the PCB board is fixed to be set up in the casing, and the casing is pressed close to one side that the PCB board integration remains the heat dissipation part, waits to be provided with the heat-conducting piece between heat dissipation part and the casing, and the heat-conducting piece is laminated with waiting to dissipate heat part, casing; the advantage is the inboard surface that the casing is pressed close to one side that the PCB board integration remains the radiating part, can save the space in the casing, and be provided with the heat-conducting piece waiting to be provided with between radiating part and the casing, the heat of waiting to produce the radiating part passes through the heat-conducting piece and transmits to the casing, and through the outside heat dissipation of casing, thereby avoid traditional setting up in the casing and wait radiating part fixed mutually fin, and then reduce the inside volume of casing by a wide margin, make the shell more frivolous. And the heat conducting piece and the shell directly radiate heat outwards, so that the heat radiating performance can be greatly improved, and the stable work of electronic devices in the shell is guaranteed.

Description

Heat dissipation mechanism of 5G electronic device

Technical Field

The utility model particularly relates to a 5G electron device's heat dissipation mechanism.

Background

The 5G or 5G technology, which is collectively referred to as the fifth generation mobile communication technology, is the latest generation cellular mobile communication technology, and is also an extension following the 4G, 3G, and 2G communication technologies. The performance goals of 5G are high data rates, reduced latency, energy savings, reduced cost, increased system capacity, and large-scale device connectivity. The development of the 5G technology gradually becomes the focus of people attention, more scenes which cannot be realized in the 4G or 3G communication technology environment can be realized through the 5G technology, if the 5G technology is applied to the field of unmanned driving, the quick response to the surrounding environment of an automobile can be realized through the quick transmission performance of the 5G technology, and therefore the reliability of the unmanned driving technology is improved; and in the aspects of remote education and remote control, the remote control and display which are rapidly implemented can be realized by utilizing the characteristics of 5G transmission. Especially in the aspect of industrial remote control, such as application on a port terminal, the 5G signal can be fully covered on the port terminal by laying the 5G equipment, remote low-delay control of an operator is realized by the transmission characteristic of 5G, and intellectualization and unmanned control of the port terminal can be realized by matching with artificial intelligence vigorously popularized by the country.

The 5G technology is rapidly developed without the support of a hardware circuit (integrated circuit), the 5G technology promotes the innovation of the technology, the requirements for supporting hardware are higher when the transmission speed is increased and the performances such as delay are reduced, in order to ensure reliable transmission and rapid processing of 5G communication, corresponding electronic components supporting the hardware also need rapid processing, and more heat is generated when the hardware is rapidly processed compared with the traditional hardware.

An integrated circuit is a miniature electronic device or component, typically comprising a plurality of semiconductor elements represented in an IC layout. With the development of industrial informatization, an integrated circuit becomes an indispensable part of electronic products, and with the improvement of processing capacity and the long-term high-intensity work, the integrated circuit generates more and more heat, and the problem of heat dissipation becomes a difficult point. At present, most integrated circuits are covered by a shell, so that heat dissipation is difficult.

As shown in fig. 1, a conventional heat dissipation method is to attach a heat sink 8 to a chip by using a heat conductive silicone, and heat generated by the chip is dissipated by the heat sink, which has a certain heat dissipation effect. The problem of heat dissipation in the mode is that the heat dissipation capability is not enough, and the heat dissipation requirement of a high-performance high-heat-productivity chip cannot be met; because the heat conduction silicon is liquid, the production process is complicated when heat dissipation is carried out by adopting a heat conduction silicon coating mode in the production process, and the solidification needs time, so that the production efficiency is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: the heat dissipation mechanism of the 5G electronic device can effectively dissipate heat of the electronic component, is high in heat dissipation efficiency and can effectively reduce the size of the shell.

The utility model provides a technical scheme that above-mentioned technical problem adopted does: a heat dissipation mechanism of a 5G electronic device comprises a shell and a PCB integrated with a part to be dissipated, wherein the PCB is fixedly arranged in the shell, one side of the part to be dissipated, which is integrated with the PCB, is close to the shell, a heat conducting part is arranged between the part to be dissipated and the shell, and the heat conducting part is attached to the part to be dissipated and the shell.

Furthermore, the heat conducting piece is a soft heat conducting silica gel sheet, and the lower end surface of the part to be radiated is completely attached to the heat conducting piece; the heat conducting member has the advantage that the heat conducting efficiency of the heat conducting member is higher than that of air, so that heat generated by the part to be radiated can be conducted outwards more quickly when the heat conducting member is tightly attached to the part to be radiated and the shell.

Furthermore, a heat dissipation groove is formed in the outer side face of the shell; the advantage lies in can transmit to the casing through the heat-conducting piece when treating the heat dissipation part during operation heat that the part produced, and the speed of the outside conduction of heat can be accelerated in the setting of radiating groove to improve the speed of the outside transmission of inside heat of casing, ensure electronic device's reliable operation.

Furthermore, a fixing column is arranged in the shell, and the PCB is fixed with the shell through the fixing column; the advantage lies in can reliably fixing the PCB board through the fixed column to prevent that the PCB board from rocking, reduce because of rocking the production treat the clearance between radiating part and the heat-conducting member, thereby guarantee radiating efficiency.

Furthermore, the lateral wall of casing be provided with the mounting groove, the fixed setting of PCB board in the mounting groove.

Furthermore, the distance between the part to be radiated and the close shell is 2 mm-4 mm; the advantage lies in treating that the heat dissipation part presses close to the casing inboard can make the thickness of required heat-conducting member reduce, reduces the life cost of enterprise, still can reduce the volume of casing simultaneously, saves the usage space for the user.

Furthermore, the upper end and the lower end surface of the shell are respectively provided with a plurality of uniformly arranged radiating grooves.

Compared with the prior art, the utility model has the advantages that the medial surface of casing is pressed close to one side that the PCB board integration remained the radiating part, can save the space in the casing, and treat the radiating part with the casing between be provided with the heat-conducting piece, treat that the heat that the radiating part produced passes through the heat-conducting piece and transmits to the casing to through the outside heat dissipation of casing, thereby avoid traditional setting up in the casing and treating the radiating part fixed fin mutually, and then reduce the inside volume of casing by a wide margin, make the shell more frivolous, traditional radiating mode passes through the fin transmission with the heat in to the casing and then through the air, the casing dispels the heat mutually outward simultaneously, the radiating efficiency of this mode is lower. The utility model discloses a heat-conducting piece, casing direct outside heat dissipation can improve heat dispersion greatly to guarantee the steady operation of electron device in the casing, prolong electron device's life. And the heat conducting piece is tightly attached to the part to be cooled and the shell, and the heat conducting property of the heat conducting piece is superior to that of air, so that the heat radiating efficiency can be further improved after the heat conducting piece is tightly attached. Meanwhile, the traditional liquid heat-conducting silicon smearing process is reduced, and the assembling and production speed of enterprises can be greatly improved.

Drawings

FIG. 1 is a schematic diagram of a prior art heat dissipation of a hardware circuit;

FIG. 2 is a schematic view of the overall structure of the present invention;

FIG. 3 is a side view of FIG. 1;

FIG. 4 is a schematic cross-sectional view taken along line A-A of FIG. 3;

FIG. 5 is a schematic sectional view of the inside of example 2;

FIG. 6 is a schematic sectional view of the inside of example 3.

Detailed Description

The present invention will be described in further detail with reference to the following embodiments.

Embodiment 1, a heat dissipation mechanism of a 5G electronic device, including a housing 1, a PCB 3 integrated with a component 2 to be heat dissipated, a fixing column 5 is provided in the housing 1, the PCB 3 is fixed with the housing 1 through the fixing column 5, one side of the PCB 3 integrated with the component 2 to be heat dissipated is close to the housing 1, a heat conducting member 4 is provided between the component 2 to be heat dissipated and the housing 1, and the heat conducting member 4 is attached to the component 2 to be heat dissipated and the housing 1; the heat conducting piece 4 is a soft heat conducting silica gel sheet, and the heat conducting piece 4 is tightly attached to the part 2 to be cooled and the shell 1. The distance between the heat dissipation part 2 and the inner side surface of the shell 1 is 3mm, the soft heat conduction silica gel sheet is 4mm, the heat dissipation part compresses the soft heat conduction silica gel sheet and is tightly attached to the soft heat conduction silica gel sheet, and the lower end surface (namely, the heat dissipation surface) of the heat dissipation part is completely attached to the heat conduction part, so that the heat dissipation efficiency is ensured. And a heat dissipation groove 6 is formed on the outer side surface of the housing 1. The up end of casing 1 and lower terminal surface all are provided with a plurality of align to grid's radiating groove 6, and the radiating groove has the contained angle with the side of casing. The heat dissipation effect of the shell 1 is improved, the whole shell 1 is used as a heat dissipation medium to dissipate heat outwards, and the heat dissipation efficiency of the electronic device can be effectively improved. Under the operation of electron device full power state, obtain through actual measurement, adopt the utility model discloses this structure dispels the heat corresponding traditional heat dissipation to electron device can realize the temperature about 15 degrees and fall the width of cloth, can effectively improve the radiating efficiency, the reliability of electron device work in the guarantee casing 1.

Embodiment 2, a heat dissipation mechanism of a 5G electronic device, including a housing 1, a PCB board 3 integrated with a component 2 to be heat dissipated, wherein the component 2 to be heat dissipated is a processing chip, a power chip, etc. with a large heat generation amount during operation; the shell 1 is also internally provided with a fixed column 5, the PCB 3 is fixed with the shell 1 through the fixed column 5, one side of the PCB 3 integrating the components 2 to be radiated is close to the shell 1, when a plurality of components 2 to be radiated are integrated on the PCB 3, the component 2 to be radiated with the largest height is close to the inner side surface of the shell 1, heat conducting pieces 4 are arranged between the plurality of components 2 to be radiated and the shell 1, and the heat conducting pieces 4 are attached to the components 2 to be radiated and the shell 1; the heat conducting piece 4 is a soft heat conducting silica gel sheet, and the heat conducting piece 4 is tightly attached to the part 2 to be cooled and the shell 1. Wherein the distance of the heat dissipation part of treating that highly the biggest and casing 1 medial surface is 2mm, and soft heat conduction silica gel piece is 3mm, should treat that heat dissipation part 2 compresses tightly soft heat conduction silica gel piece and closely laminates rather than, and treat that the lower terminal surface (the cooling surface promptly) of heat dissipation part and heat conduction piece are laminated completely to ensure radiating efficiency, the thickness of the soft heat conduction silica gel piece between remaining heat dissipation part 2 of treating and casing 1 can carry out thickness selection according to actual need. And a heat dissipation groove 6 is formed on the outer side surface of the housing 1. The upper end surface and the lower end surface of the shell 1 are both provided with a plurality of uniformly arranged radiating grooves 6. The heat dissipation effect of the shell 1 is improved, the whole shell 1 is used as a heat dissipation medium to dissipate heat outwards, and the heat dissipation efficiency of the electronic device can be effectively improved.

Embodiment 3, a heat dissipation mechanism of a 5G electronic device, including a housing 1, a PCB board 3 integrated with a component 2 to be heat dissipated, wherein the component 2 to be heat dissipated is a processing chip, a power chip, etc. with a large heat generation amount during operation; the shell 1 is also internally provided with a fixed column 5, the PCB 3 is fixed with the shell 1 through the fixed column 5, one side of the PCB 3 integrating the components 2 to be radiated is close to the shell 1, when a plurality of components 2 to be radiated are integrated on the PCB 3, the component 2 to be radiated with the largest height is close to the inner side surface of the shell 1, heat conducting pieces 4 are arranged between the plurality of components 2 to be radiated and the shell 1, and the heat conducting pieces 4 are attached to the components 2 to be radiated and the shell 1; the heat conducting piece 4 is a soft heat conducting silica gel sheet, and the heat conducting piece 4 is tightly attached to the part 2 to be cooled and the shell 1. Wherein the distance of the heat dissipation part of treating that highly the biggest and casing 1 medial surface is 2mm, and soft heat conduction silica gel piece is 3mm, should treat that heat dissipation part 2 compresses tightly soft heat conduction silica gel piece and closely laminates rather than, and treat that the lower terminal surface (the cooling surface) of heat dissipation part and heat conduction piece are laminated completely to ensure radiating efficiency. The distance between the rest of the components 2 to be radiated and the shell 1 can be changed by arranging the convex parts 7 in the shell 1, so that the distance between the inner side surface of the shell 1 and the plurality of the components 2 to be radiated can be changed. The thickness of the soft heat-conducting silicone sheet can be selected according to actual needs, so that the part to be cooled 2 compresses the soft heat-conducting silicone sheet. And a heat dissipation groove 6 is formed on the outer side surface of the housing 1. The upper end surface and the lower end surface of the shell 1 are both provided with a plurality of uniformly arranged radiating grooves 6. The heat dissipation effect of the shell 1 is improved, the whole shell 1 is used as a heat dissipation medium to dissipate heat outwards, and the heat dissipation efficiency of the electronic device can be effectively improved.

Embodiment 4, a heat dissipation mechanism of a 5G electronic device, including a housing 1, a PCB 3 integrated with a component to be heat dissipated 2, wherein an inner side wall of the housing 1 is provided with a mounting groove for mounting the PCB 3, the PCB 3 is fixedly disposed in the mounting groove, one side of the PCB 3 integrated with the component to be heat dissipated 2 is close to the housing 1, a heat conducting member 4 is disposed between the component to be heat dissipated 2 and the housing 1, and the heat conducting member 4 is attached to the component to be heat dissipated 2 and the housing 1; the heat conducting piece 4 is a soft heat conducting silica gel sheet, and the heat conducting piece 4 is tightly attached to the part 2 to be cooled and the shell 1. The distance between the heat dissipation part 2 and the inner side surface of the shell 1 is 4mm, the soft heat conduction silica gel sheet is 5mm, the heat dissipation part compresses the soft heat conduction silica gel sheet and is tightly attached to the soft heat conduction silica gel sheet, and the lower end surface (namely, the heat dissipation surface) of the heat dissipation part is completely attached to the heat conduction part, so that the heat dissipation efficiency is ensured. And a heat dissipation groove 6 is formed on the outer side surface of the housing 1. The upper end surface and the lower end surface of the shell 1 are both provided with a plurality of uniformly arranged radiating grooves 6. The heat dissipation effect of the shell 1 is improved, the whole shell 1 is used as a heat dissipation medium to dissipate heat outwards, and the heat dissipation efficiency of the electronic device can be effectively improved.

The above-described embodiments are only preferred embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several changes and modifications can be made, which are within the scope of the present invention.

Claims

1. The heat dissipation mechanism of the 5G electronic device comprises a shell (1) and a PCB (3) integrated with a part to be dissipated (2), wherein the PCB (3) is fixedly arranged in the shell (1), and is characterized in that one side of the part to be dissipated (2) integrated with the PCB (3) is close to the shell (1), a heat conducting piece (4) is arranged between the part to be dissipated (2) and the shell (1), and the heat conducting piece (4) is attached to the part to be dissipated (2) and the shell (1).

2. The heat dissipation mechanism of a 5G electronic device as claimed in claim 1, wherein the heat conductive member (4) is a flexible heat conductive silicone sheet, and the lower end surface of the member (2) to be heat dissipated is fully attached to the heat conductive member (4).

3. The heat dissipating mechanism for a 5G electronic device as claimed in claim 1, wherein the housing (1) is provided with heat dissipating grooves (6) on an outer side thereof.

4. The heat dissipation mechanism for 5G electronic devices as claimed in claim 1, wherein a fixing post (5) is disposed in the housing (1), and the PCB (3) is fixed to the housing (1) via the fixing post (5).

5. The heat dissipating mechanism of a 5G electronic device as claimed in claim 1, wherein the side wall of the housing (1) is provided with a mounting groove, and the PCB board (3) is fixedly disposed in the mounting groove.

6. The heat dissipation mechanism for 5G electronic devices as claimed in claim 2, wherein the distance between the component (2) to be dissipated and the adjacent housing (1) is 2mm to 4 mm.

7. A heat dissipating mechanism for a 5G electronic device as claimed in claim 3, wherein the housing (1) is provided at both the upper and lower end surfaces thereof with a plurality of heat dissipating grooves (6) arranged uniformly.