CN112714601B - A heat radiation structure and intelligent terminal for intelligent terminal - Google Patents
A heat radiation structure and intelligent terminal for intelligent terminal Download PDFInfo
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- CN112714601B CN112714601B CN202011620042.7A CN202011620042A CN112714601B CN 112714601 B CN112714601 B CN 112714601B CN 202011620042 A CN202011620042 A CN 202011620042A CN 112714601 B CN112714601 B CN 112714601B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a heat radiation structure for an intelligent terminal and the intelligent terminal, wherein the heat radiation structure comprises: a heat generating member; the heating element is in contact heat conduction with the heat conduction element; the cold end of the semiconductor refrigeration module is in contact with the heat conduction piece for heat conduction; the first heat dissipation piece is in contact heat conduction with the semiconductor refrigeration module; the fan assembly is used for forming an air inlet end and an air outlet end which are positioned at two sides of the fan assembly when in operation; the partition board, the heating element, the semiconductor refrigeration module, the first heat dissipation element and the fan assembly are arranged between the partition board and the heat conduction element; a support plate; an air inlet is formed in the partition plate or the supporting plate, and an air outlet is formed in the partition plate or the supporting plate, so that a heat dissipation path from the air inlet, the heating piece, the first heat dissipation piece or the semiconductor refrigeration module, the air inlet end of the fan assembly and the air outlet end of the fan assembly to the air outlet is formed. After the technical scheme is adopted, the heat dissipation effect can be improved, and the temperature inside the intelligent terminal is greatly reduced.
Description
Technical Field
The present invention relates to the field of electronic devices, and in particular, to a heat dissipation structure for an intelligent terminal and an intelligent terminal.
Background
The advent of large-scale integrated circuits has driven the proliferation and development of the smart terminal industry over the last decades. When the intelligent terminal runs a high-load game or other applications for a long time, the temperature of the intelligent terminal is higher and higher, the heat dissipation of a heating device (PU or a charging chip) is poor, the phenomenon of frequency-reducing blocking can occur, the game or other applications cannot run smoothly, even the intelligent terminal is halted, and the use experience of a user is seriously affected.
The existing intelligent terminal heat dissipation scheme is mainly realized by a superheater tube and a hot plate, or by adding a fan inside the intelligent terminal. However, with the increase of intelligent terminal software, especially game software, improvement of screen refresh rate, use of 5G network, and the like, the requirements of the intelligent terminal on heat dissipation are higher and higher. For such higher heat dissipation requirements, a stronger heat dissipation performance and finer heat dissipation management are required to meet the higher heat dissipation requirements.
Therefore, a novel heat dissipation structure for an intelligent terminal is needed, and the heat dissipation effect can be improved.
Disclosure of Invention
In order to overcome the technical defects, the invention aims to provide a heat dissipation structure for an intelligent terminal and the intelligent terminal, which can improve the heat dissipation effect and greatly reduce the temperature inside the intelligent terminal.
The invention discloses a heat radiation structure for an intelligent terminal, which comprises:
the heating piece is arranged in the intelligent terminal and generates heat;
the heat conducting piece is used for providing a heat conducting surface for supporting the heating piece, so that the heating piece is arranged on the heat conducting surface and is in contact with the heat conducting piece for conducting heat;
the semiconductor refrigeration module is arranged on the heat conducting surface, and the cold end of the semiconductor refrigeration module is in contact with the heat conducting piece for heat conduction;
the first heat dissipation piece is arranged on the hot end of the semiconductor refrigeration module and is in contact with the semiconductor refrigeration module for heat conduction;
the fan assembly is arranged on the heat conducting piece, and when the fan assembly works, an air inlet end and an air outlet end which are positioned at two sides of the fan assembly are formed;
the partition plate is arranged opposite to the heat conducting piece, and the heating piece, the semiconductor refrigeration module, the first heat radiating piece and the fan assembly are arranged between the partition plate and the heat conducting piece;
the support plate is arranged between the partition plate and the heat conducting piece to support the partition plate;
at least one air inlet is formed in the partition plate or the supporting plate, at least one air outlet is formed in the partition plate or the supporting plate, the air inlet is communicated with the heating piece, the first heat dissipation piece or the semiconductor refrigerating module, and the air outlet is communicated with the air outlet end of the fan assembly to form a heat dissipation path from the air inlet, the heating piece, the first heat dissipation piece or the semiconductor refrigerating module, the air inlet end of the fan assembly and the air outlet end of the fan assembly to the air outlet.
Preferably, the heat conducting member is arranged along the length direction of the partition plate, such that the heat generating member, the semiconductor refrigeration module, the first heat dissipating member and the fan assembly are arranged in parallel on the heat conducting surface of the heat conducting member, wherein
The heating element, the semiconductor refrigeration module and the fan assembly are arranged along the direction from the starting point to the end point of the heat dissipation path.
Preferably, the heat dissipation structure further includes:
the second heat dissipation piece is arranged on one side of the heating piece opposite to the heat conduction plate and is in contact with the heating piece for heat conduction;
the second heat dissipation piece is arranged beside the air inlet and is positioned at the starting point of the heat dissipation path.
Preferably, the top surface of the second heat sink is flush with the top surface of the hot end of the semiconductor refrigeration module and the top surface of the fan assembly such that the portion of the heat dissipation path from the air inlet to the air inlet end of the fan assembly is substantially linear.
Preferably, the plurality of air inlets comprise at least one air inlet formed in the partition plate and at least one air inlet formed in the supporting plate, wherein the air inlet formed in the partition plate is rectangular and the air inlet formed in the supporting plate is strip-shaped;
the air outlet is one, set up in the backup pad, and air outlet and air intake are located the both sides limit of backup pad.
Preferably, the air inlet and the air outlet are horn-shaped;
the radial width of the air inlet gradually decreases along the direction from the outer side to the inner side of the air inlet;
the radial width of the air outlet gradually decreases along the direction from the inner side to the outer side of the air outlet.
The invention also discloses an intelligent terminal comprising the heat dissipation structure.
Preferably, the intelligent terminal further comprises a power supply module electrically connected with the fan assembly and the semiconductor refrigeration module;
the power supply module comprises a power supply interface, receives electric energy after being connected with an external power supply, and supplies energy to the fan assembly and the semiconductor refrigeration module.
After the technical scheme is adopted, compared with the prior art, the method has the following beneficial effects:
1. through simulation and actual measurement of a model for simulating the environment of the whole machine, the intelligent terminal can be cooled by about 10 ℃ in a normal working state of the whole machine (the temperature of the whole machine is 42 ℃ and the ambient temperature is 25 ℃), and the temperature inside the whole machine can be effectively reduced;
2. fully utilizing the internal space of the intelligent terminal and basically keeping the thickness of the intelligent terminal;
3. the original electric energy of the intelligent terminal is not utilized to support the work of the semiconductor refrigeration module and the fan assembly, and the cruising ability of the intelligent terminal is improved.
Drawings
FIG. 1 is a cross-sectional view of a heat dissipating structure according to a preferred embodiment of the present invention;
fig. 2 is a cross-sectional view of a heat dissipating structure according to a preferred embodiment of the present invention.
Reference numerals:
1-heating element, 2-heat conduction element, 3-semiconductor refrigeration module, 4-first heat dissipation element, 5-fan assembly, 6-partition plate, 7-support plate, 8-air inlet, 9-air outlet, 10-second heat dissipation element and 11-intelligent terminal
Detailed Description
Advantages of the invention are further illustrated in the following description, taken in conjunction with the accompanying drawings and detailed description.
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present disclosure as detailed in the accompanying claims.
The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any or all possible combinations of one or more of the associated listed items.
It should be understood that although the terms first, second, third, etc. may be used in this disclosure to describe various information, these information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure. The word "if" as used herein may be interpreted as "at … …" or "at … …" or "responsive to a determination", depending on the context.
In the description of the present invention, it should be understood that the terms "longitudinal," "transverse," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
In the description of the present invention, unless otherwise specified and defined, it should be noted that the terms "mounted," "connected," and "coupled" are to be construed broadly, and may be, for example, mechanical or electrical, or may be in communication with each other between two elements, directly or indirectly through intermediaries, as would be understood by those skilled in the art, in view of the specific meaning of the terms described above.
In the following description, suffixes such as "module", "component", or "unit" for representing elements are used only for facilitating the description of the present invention, and are not of specific significance per se. Thus, "module" and "component" may be used in combination.
Referring to fig. 1 and 2, a schematic structural diagram of a heat dissipation structure for an intelligent terminal 11 according to a preferred embodiment of the present invention is shown, in which the heat dissipation structure is used for dissipating heat generated inside the intelligent terminal 11, and specifically includes:
-heating element 1
The heating element 1 is mainly used for processing information and generating instructions in the intelligent terminal 11, such as a CPU and a GPU, and when the intelligent terminal 11 is used, large-scale game software is run, a large amount of data is processed, and a fine picture is displayed, the device generates a large amount of heat because the device is in a high-speed working state, once the heat is accumulated in the intelligent terminal 11, the service life of the device is reduced because the device is in a high-temperature state for a long time, and on the other hand, the overheated intelligent terminal 11 is poor in experience when a user holds the intelligent terminal 11, so that the cooling requirement is always a hard requirement of the intelligent terminal 11.
-heat conducting element 2
In order to discharge the heat generated by the heating element 1 as soon as possible, the heat dissipation structure further comprises a heat conduction element 2, wherein the heat conduction element 2 is provided with a heat conduction surface, and the heat conduction surface faces the heating element 1 and is in contact heat conduction with the heating element 1, so that the heat generated by the heating element 1 is conducted to the heat conduction element 2 through contact. In order to improve the heat conduction efficiency between the heating element 1 and the heat conducting element 2, heat dissipation glue (such as heat conduction silicone grease) may be used to bond the heating element 1 and the heat conducting element 2.
Semiconductor refrigeration module 3
After heat is conducted to the heat conducting member 2, since the heat conducting member 2 has a certain heat absorption limitation, if the heat of the heat conducting member 2 is not timely discharged, the heat absorption effect of the heat conducting member on the heat generating member 1 is reduced. Therefore, in order to dissipate heat from the heat conducting member 2, the heat dissipation structure further includes a semiconductor refrigeration module 3, which is mounted on the heat conducting surface of the heat conducting member 2 and contacts with the heat conducting member 2 to conduct heat. The semiconductor refrigeration module 3, for example a TEC (thermoelectric semiconductor refrigeration device), has a cold end and a hot end, and in operation the cold end will be cooled very rapidly, so that for a thermally conductive member 2 having a higher temperature, the heat thereon will be conducted rapidly to the semiconductor refrigeration module 3 and subsequently to the hot end of the semiconductor refrigeration module 3. The semiconductor refrigeration module 3 is adopted for heat dissipation, and the heat dissipation effect and the heat dissipation duration can be finely controlled by the working state and the working current of the semiconductor refrigeration module 3.
First heat sink 4
With the above configuration, heat has been conducted from the heat generating element 1 to the hot end of the semiconductor refrigeration module 3. In turn, the first heat sink 4 is mounted on the hot side of the semiconductor refrigeration module 3 and is in thermal contact with the hot side, thereby further conducting heat to the first heat sink 4. The first heat sink 4 may be a heat sink fin, and the heat dissipation effect is improved by the arrangement of a plurality of heat sinks.
Fan assembly 5
After having first radiating member 4, the heat that the conduction was gone out will encircle on first radiating member 4, if not in time will heat outside the intelligent terminal 11, the inside high temperature environment that still is in of intelligent terminal 11 is not good to the cooling effect of heating member 1. Therefore, the heat dissipation structure further includes a fan assembly 5, the fan assembly 5 is disposed on the heat conducting member 2, and after the fan assembly 5 works, the heat dissipation structure will have an air inlet end and an air outlet end, it will be understood that the air inlet end is a surface of the fan for sucking air, and the air outlet end is a surface of the fan for exhausting air. After the fan assembly 5 works, heat discharged by the first heat radiating member 4 is extracted and discharged from the air outlet end.
Separator 6
On the opposite side of the heat conducting member 2, for example, a heat conducting plate, a partition plate 6 is provided, and the heat generating member 1, the semiconductor refrigeration module 3, the first heat dissipating member 4 and the fan assembly 5 are disposed between the partition plate 6 and the heat conducting member 2, so that the heat generating member 1, the semiconductor refrigeration module 3, the first heat dissipating member 4 and the fan assembly 5 are separated from other devices inside the intelligent terminal 11, and heat generated by the heat generating member 1 will not affect the other devices. The partition plate 6 is provided so as not to serve as a heat conduction function, and thus the partition plate 6 is partitioned from the heat generating member 1, the semiconductor refrigeration module 3, the first heat dissipating member 4, and the fan assembly 5, forming an air layer therebetween.
-a support plate 7
A support plate 7 is also provided between the partition plate 6 and the heat-conducting plate to support the partition plate 6 on the heat-conducting plate. The support plate 7 may be formed of a bracket inside the smart terminal 11 and may be integrally formed with a housing of the smart terminal 11.
At least one air inlet 8 and at least one air outlet 9 are respectively formed in the partition plate 6 or the support plate 7, the air inlet 8 and the air outlet 9 are communicated with an air layer between the partition plate 6 and the heating element 1, the semiconductor refrigeration module 3, the first heat dissipation element 4 and the fan assembly 5, and after the fan assembly 5 works, the air outlet end discharges sucked air out of the air outlet 9 to the outside of the intelligent terminal 11, so that other parts of the air layer are in a negative pressure state, the air outside the partition plate 6 is sucked in from the air inlet 8 by utilizing the negative pressure state, the air circulates between the air inlet 8, the heating element 1, the first heat dissipation element 4 or the semiconductor refrigeration module 3, the air inlet end of the fan assembly 5 and the air outlet 9, and along with the circulation of the air, a heat dissipation path from the air inlet 8, the heating element 1, the first heat dissipation element 4 or the semiconductor refrigeration module 3, the air inlet end of the fan assembly 5 to the air outlet 9 is formed, and heat is discharged from the heat dissipation path to the intelligent terminal 11.
By the configuration, the heat dissipation efficiency in the intelligent terminal 11 is greatly improved by utilizing the common heat dissipation of the first heat dissipation element 4, the semiconductor refrigeration module 3 and the fan assembly 5.
In a preferred embodiment, the heat conducting member 2 is disposed along the length direction of the partition 6, and the length of the heat conducting member may be the same as that of the partition 6, that is, the entire width of the intelligent terminal 11, so that the heat generating member 1, the semiconductor refrigeration module 3, the first heat dissipating member 4 and the fan assembly 5 are arranged in parallel on the heat conducting surface of the heat conducting member 2, and a manufacturer of the intelligent terminal 11 does not need to provide additional space for placing the above devices. And the heat conducting pieces 2 are arranged in parallel in a large area, so that heat is accumulated in a limited space while the heat radiating efficiency is improved, and the heat can be discharged together during heat radiation, so that the heat radiating effect is further enhanced. The heat generating element 1, the semiconductor refrigeration module 3 and the fan assembly 5 are arranged along the direction from the start point to the end point of the heat dissipation path, and the heat of the heat generating element 1 is completely discharged, so that the heat is not maintained in the intelligent terminal 11.
Preferably or alternatively, the heat dissipation structure further comprises: the second heat dissipation element 10, the second heat dissipation element 10 is located the one side of heating element 1 relative to the heat conduction board, and with heating element 1 contact heat conduction. By the arrangement of the second heat dissipation element 10, the heat of the heat generation element 1 can be further dispersed, and the pressure of the heat conduction element 2 is reduced. The second heat dissipation element 10 is disposed beside the air inlet 8 to be located at the start point of the heat dissipation path, i.e. when air is sucked into the air inlet 8, heat on the second heat dissipation element 10 will be taken away first, and when the second heat dissipation element 10 is cooled, heat of the heat generating element 1 can be further sucked. It is understood that the width of the second heat dissipation element 10 may be as long as possible, and the second heat dissipation element may be in the shape of heat dissipation fins, so as to improve the heat dissipation effect of the second heat dissipation element 10.
Further, the top surface of the second heat sink 10 is flush with the top surface of the hot end of the semiconductor refrigeration module 3 and the top surface of the fan assembly 5, so that for the configuration of the air layer, the air layer is formed to be entirely planar without such as a bend or a curve. Under the planar configuration, the part of the heat dissipation path from the air inlet 8 to the air inlet end of the fan assembly 5 is basically straight, and the fan assembly 5 can absorb air only by small-power rotation.
Preferably or alternatively, the plurality of air inlets 8 includes at least one air inlet 8 formed on the partition plate 6 and at least one air inlet 8 formed on the support plate 7, for example, 2 air inlets 8 formed on the partition plate 6 and 1 air inlet 8 formed on the support plate 7, wherein the air inlets 8 formed on the partition plate 6 are rectangular and the air inlets 8 formed on the support plate 7 are strip-shaped, so as to satisfy air inlet directions in the relative positional relationship between different air inlet positions and air layers. For example, the direction of the air entering from the air inlet 8 on the partition plate 6 is perpendicular to the air layer, the opening of the air inlet 8 on the partition plate 6 should be larger, and the direction of the air entering from the air inlet 8 on the support plate 7 is the same as the air layer, the opening of the air inlet 8 on the support plate 7 may be smaller. On the other hand, the number of the air outlets 9 is one, the air outlets 9 are arranged on the supporting plate 7, and the air outlets 9 and the air inlets 8 are positioned on two side edges of the supporting plate 7. The opening of the air outlet 9 is also smaller to save space occupation in the intelligent terminal 11.
Further, the air inlet 8 and the air outlet 9 are horn-shaped; the radial width of the air inlet 8 gradually decreases along the direction from the outer side to the inner side of the air inlet 8; the radial width of the air outlet 9 gradually decreases in the direction from the inside to the outside of the air outlet 9. With the above configuration, the flow rate of air will be increased when it enters the air inlet 8 from the outside due to the different widths, and the flow rate of air will be increased when it is discharged from the air outlet 9, so that the heat dissipation effect is improved by increasing the flow rate of air.
With any of the above-described embodiments, it may be applied to the smart terminal 11 and the heat dissipation structure is enclosed in the housing of the smart terminal 11.
Since the semiconductor refrigeration module 3 and the fan assembly 5 have certain energy consumption during operation, the intelligent terminal 11 further comprises a power supply module, which is different from a battery or a driving module built in the intelligent terminal 11, and is dedicated to driving elements of the semiconductor refrigeration module 3 and the fan assembly 5, and is electrically connected with the fan assembly 5 and the semiconductor refrigeration module 3. The power supply module is provided with a power supply interface, and can be externally connected with an external power supply, such as a charging head, to supply power to the fan assembly 5 and the semiconductor refrigeration module 3. When the intelligent terminal is used, the power supply module is electrically connected with the control module of the intelligent terminal 11 and is configured to start the fan assembly 5 and the semiconductor refrigeration module 3 to refrigerate when the temperature of the intelligent terminal 11 or the heating element 1 reaches a threshold value, and the fan assembly 5 and the semiconductor refrigeration module 3 do not consume electric energy of a battery when working in cooperation with an external power supply mode, so that the influence on the cruising of the battery can be reduced.
The intelligent terminal may be implemented in various forms. For example, the terminals described in the present invention may include smart terminals such as mobile phones, smart phones, notebook computers, PDAs (personal digital assistants), PADs (tablet computers), PMPs (portable multimedia players), navigation devices, and the like, and fixed terminals such as digital TVs, desktop computers, and the like. In the following, it is assumed that the terminal is an intelligent terminal. However, it will be understood by those skilled in the art that the configuration according to the embodiment of the present invention can be applied to a fixed type terminal in addition to elements particularly used for a moving purpose.
It should be noted that the embodiments of the present invention are preferred and not limited in any way, and any person skilled in the art may make use of the above-disclosed technical content to change or modify the same into equivalent effective embodiments without departing from the technical scope of the present invention, and any modification or equivalent change and modification of the above-described embodiments according to the technical substance of the present invention still falls within the scope of the technical scope of the present invention.
Claims (7)
1. A heat radiation structure for intelligent terminal, its characterized in that, heat radiation structure includes:
the heating piece is arranged in the intelligent terminal and generates heat;
the heat conduction piece is used for providing a heat conduction surface for supporting the heating piece, so that the heating piece is arranged on the heat conduction surface and is in contact heat conduction with the heat conduction piece;
the semiconductor refrigeration module is arranged on the heat conducting surface, and the cold end of the semiconductor refrigeration module is in contact with the heat conducting piece for heat conduction;
the first heat dissipation piece is arranged on the hot end of the semiconductor refrigeration module and is in contact heat conduction with the semiconductor refrigeration module;
the fan assembly is arranged on the heat conducting piece, and when the fan assembly works, an air inlet end and an air outlet end which are positioned at two sides of the fan assembly are formed;
a partition plate provided opposite to the heat conductive member, and the heat generating member, the semiconductor refrigeration module, the first heat dissipating member, and the fan assembly are provided between the partition plate and the heat conductive member;
the support plate is arranged between the partition plate and the heat conducting piece to support the partition plate;
the air inlet is communicated with the heating element, the first heat dissipation element or the semiconductor refrigeration module, and the air outlet is communicated with the air outlet end of the fan assembly to form a heat dissipation path from the air inlet, the heating element, the first heat dissipation element or the semiconductor refrigeration module, the air inlet end of the fan assembly and the air outlet end of the fan assembly to the air outlet;
the heat dissipation structure further includes:
the second heat dissipation piece and the heat conduction piece are respectively arranged at two sides of the heating piece, and the second heat dissipation piece is in contact heat conduction with the heating piece;
the second heat dissipation piece is arranged beside the air inlet and is positioned at the starting point of the heat dissipation path.
2. The heat dissipating structure of claim 1,
the heat conducting piece is arranged along the length direction of the partition board, so that the heating piece, the semiconductor refrigeration module, the first heat dissipation piece and the fan assembly are arranged on the heat conducting surface of the heat conducting piece in parallel, wherein
The heating element, the semiconductor refrigeration module and the fan assembly are arranged along the direction from the starting point to the end point of the heat dissipation path.
3. The heat dissipating structure of claim 1,
the top surface of the second heat dissipation piece is flush with the top surface of the hot end of the semiconductor refrigeration module and the top surface of the fan assembly, so that the part from the air inlet to the air inlet end of the fan assembly of the heat dissipation path is basically in a straight line.
4. The heat dissipating structure of claim 1,
the plurality of air inlets comprise at least one air inlet formed in the partition plate and at least one air inlet formed in the supporting plate, wherein the air inlets formed in the partition plate are rectangular, and the air inlets formed in the supporting plate are strip-shaped;
the air outlet is one, is arranged on the supporting plate, and the air outlet and the air inlet are positioned on two side edges of the supporting plate.
5. The heat dissipating structure of claim 4, wherein,
the air inlet and the air outlet are horn-shaped;
the radial width of the air inlet is gradually reduced along the direction from the outer side to the inner side of the air inlet;
the radial width of the air outlet gradually decreases along the direction from the inner side to the outer side of the air outlet.
6. An intelligent terminal, characterized by comprising the heat dissipation structure as recited in any one of claims 1-5.
7. The intelligent terminal of claim 6, further comprising a power module electrically connected to the fan assembly and the semiconductor refrigeration module;
the power supply module comprises a power supply interface, receives electric energy after being connected with an external power supply, and supplies energy to the fan assembly and the semiconductor refrigeration module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011620042.7A CN112714601B (en) | 2020-12-31 | 2020-12-31 | A heat radiation structure and intelligent terminal for intelligent terminal |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011620042.7A CN112714601B (en) | 2020-12-31 | 2020-12-31 | A heat radiation structure and intelligent terminal for intelligent terminal |
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| CN112714601A CN112714601A (en) | 2021-04-27 |
| CN112714601B true CN112714601B (en) | 2024-01-02 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113534906A (en) * | 2021-09-15 | 2021-10-22 | 深圳市海邻科信息技术有限公司 | Tablet personal computer |
| CN113873803B (en) * | 2021-09-18 | 2023-03-31 | 科陆国际技术有限公司 | Composite heat dissipation structure and electronic electric energy meter box |
| CN113939160B (en) * | 2021-10-25 | 2024-02-27 | 国网山东省电力公司东营市垦利区供电公司 | A heat dissipation and ventilation device for electric power devices |
| CN114025578A (en) * | 2021-11-15 | 2022-02-08 | Oppo广东移动通信有限公司 | Heat dissipation assembly and electronic equipment |
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