CN203645968U - Optical module heat dissipation apparatus - Google Patents
Optical module heat dissipation apparatus Download PDFInfo
- Publication number
- CN203645968U CN203645968U CN201320792652.4U CN201320792652U CN203645968U CN 203645968 U CN203645968 U CN 203645968U CN 201320792652 U CN201320792652 U CN 201320792652U CN 203645968 U CN203645968 U CN 203645968U
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- CN
- China
- Prior art keywords
- optical module
- heat
- radiation device
- heat radiation
- conducting block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 108
- 230000017525 heat dissipation Effects 0.000 title abstract description 10
- 230000005855 radiation Effects 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 12
- 238000001816 cooling Methods 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000009434 installation Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0058—Casings specially adapted for optoelectronic applications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Details Of Aerials (AREA)
Abstract
The utility model discloses an optical module heat dissipation apparatus. The apparatus comprises an optical module radome and a heat dissipation structure. The radome is located above an optical module for providing a plug structure for the optical module and shielding the optical module. The heat dissipation structure is located above the radome for dissipating heat transmitted by the optical module via the radome. The apparatus is simple in structure compared to conventional optical module heat dissipation apparatuses, and can reduce costs.
Description
Technical field
The utility model relates to the communications field, in particular to a kind of optical module heat radiation device.
Background technology
Along with the development of fiber optic network, the network equipment that uses optical module is more and more, and applied environment becomes increasingly complex.Because the power consumption of optical module is larger, and be to be all inserted in optical module radome to work, heat radiation is an important problem always.
Traditional optical module radiating mode is to adopt active air cooling heat radiation, or on optical module radome, installs radiator natural heat dissipation additional, or two kinds of modes are combined with.It is enough that these modes are suitable for optical module superjacent air space, or there is a situation of air-cooled condition, and in the box body of the quiet design of the narrow needs of optical module superjacent air space, or optical module superjacent air space is narrow and separately air-cooled also cannot the box body of efficiently radiates heat in, these two kinds of heat dissipating methods all can not meet radiating requirements.
For in correlation technique at the optical module heat dissipation problem that optical module superjacent air space is narrow cannot installation of heat radiator time, effective solution is not yet proposed at present.
Utility model content
The utility model provides a kind of optical module heat radiation device, at least to solve at optical module superjacent air space is narrow cannot installation of heat radiator time optical module heat dissipation problem.
According to the utility model, a kind of optical module heat radiation device is provided, comprising: optical module radome, be positioned at optical module top position, be used to optical module that pulling/inserting structure is provided, shielded from light module; Radiator structure, is positioned at the top position of optical module radome, the heat passing out by optical module radome for distributing optical module.
Preferably, radiator structure comprises: heat-conducting block and heat conductive pad.
Preferably, the material of heat-conducting block comprises: copper or aluminium.
Preferably, the size of heat conductive pad is identical with the size of heat-conducting block.
Preferably, the material that heat conductive pad adopts has thermal conductivity, pliability, compressibility and surperficial natural tack.
Preferably, the number of heat-conducting block is 1, and the number of heat conductive pad is 2, and wherein, 2 heat conductive pads lay respectively at the above and below of heat-conducting block.
Preferably, optical module heat radiation device also comprises: holster shell, be positioned at the top position of radiator structure, for heat radiation that radiator structure is given out to air.
Preferably, between radiator structure and heat-conducting block, be connected with screw with screw.
Preferably, the material of holster shell is metal.
Preferably, use radiator structure or wind-cooling heat dissipating mode to dispel the heat to optical module simultaneously.
Pass through the utility model, adopt, at the superjacent air space of optical module, a radiator structure is set, the mode that the dissipation of heat that optical module can be passed out by optical module radome by this radiator structure is gone out, solve at optical module superjacent air space is narrow cannot installation of heat radiator time optical module heat dissipation problem, reach relatively conventional optical module radiator and there is simply constructed advantage, the effect that can reduce costs.
Brief description of the drawings
Accompanying drawing described herein is used to provide further understanding of the present utility model, forms the application's a part, and schematic description and description of the present utility model is used for explaining the utility model, does not form improper restriction of the present utility model.In the accompanying drawings:
Fig. 1 is according to the structural representation of the optical module heat radiation device of the utility model embodiment;
Fig. 2 is according to the decomposing schematic representation of each module in the optical module heat radiation device of the utility model preferred embodiment;
Fig. 3 is according to the assembling schematic diagram of each module in the optical module heat radiation device of the utility model preferred embodiment;
Fig. 4 is according to the assembly flow charts of the optical module heat radiation device of the utility model preferred embodiment.
Embodiment
Hereinafter also describe the utility model in detail with reference to accompanying drawing in conjunction with the embodiments.It should be noted that, in the situation that not conflicting, the feature in embodiment and embodiment in the application can combine mutually.
Fig. 1 is according to the structural representation of the optical module heat radiation device of the utility model embodiment, and as shown in Figure 1, this device comprises: optical module radome 1 and radiator structure 2.Wherein, optical module radome 1, is positioned at optical module top position, is used to optical module that pulling/inserting structure is provided, shielded from light module; Radiator structure 2, is positioned at the top position of optical module radome 1, the heat passing out by optical module radome 1 for distributing optical module.
In the present embodiment, radiator structure can comprise: heat-conducting block and heat conductive pad.Wherein, the material of heat-conducting block comprises: copper or aluminium.The size of heat conductive pad is identical with the size of heat-conducting block, and certainly, in actual applications, the size of heat conductive pad and heat-conducting block can exist certain size poor, but is limited with the installation that does not affect other module.
In the present embodiment, the material that heat conductive pad adopts has thermal conductivity, pliability, compressibility and surperficial natural tack.Adopting such material is in order to make heat conductive pad and the heat-conducting block can be in conjunction with tightr, and saves space, is convenient to install and conduction heat.
Preferably, the number of heat-conducting block is 1, and the number of heat conductive pad is 2, and wherein, 2 heat conductive pads lay respectively at the above and below of heat-conducting block.Certainly, this is only one preferred embodiment in actual applications, can arrange according to the superjacent air space of optical module the number of heat-conducting block and heat conductive pad, has reached best heat-conducting effect.
In the present embodiment, optical module heat radiation device can also comprise: holster shell, be positioned at the top position of radiator structure, for heat radiation that radiator structure is given out to air.Preferably, between radiator structure and heat-conducting block, can be connected with screw with screw.
In the present embodiment, the material of holster shell is metal.
Preferably, in actual applications, in order to pursue better radiating effect, also can use radiator structure or wind-cooling heat dissipating mode to dispel the heat to optical module simultaneously.
Pass through the present embodiment, can use heat conductive pad, the heat of optical module, optical module radome is effectively conducted to metal machine frame shell by the heat conducting modules such as heat-conducting block, use the outside radiations heat energy in holster shell surface to be reached for the effect of optical module heat radiation, or use holster shell surface to carry out radiation heat transfer and Natural Heat Convection with external environment condition, reach strengthening optical module heat sinking function, or the better optical module heat sinking function that is effective that simultaneously combines with wind-cooling heat dissipating.
Optical module heat radiation device above-described embodiment being provided below in conjunction with Fig. 2 to Fig. 4 and preferred embodiment is further described in more detail and illustrates.
Fig. 2 is according to the decomposing schematic representation of each module in the optical module heat radiation device of the utility model preferred embodiment, and as shown in Figure 2, the module that this heat abstractor comprises comprises:
Heat conductive pad 104, heat conductive pad also has certain pliability, compressibility and surperficial natural tack except thermal conductivity, can fill the gap between heat-conducting block 105 and optical module radome 103 gap and optical module 102 and the optical module radome 103 while contacting, thereby make heat-conducting block 105 and optical module radome 103, optical module 102 good contacts, be beneficial to the heat of optical module 102 is conducted to heat-conducting block 105.In this preferred embodiment, the size of heat conductive pad 104 can be determined according to heat-conducting block 105 and optical module radome 103 contacts area.
Heat-conducting block 105, in this preferred embodiment, can use the metal derby of the material such as aluminium or copper, and the heat that is used for that optical module 102 is transmitted conducts to holster shell 107.On heat-conducting block 105, there is mounting screw hole, for heat-conducting block being fixed to holster shell 107.The radiating effect that the length and width size of heat-conducting block reaches according to needs and determining, larger heat-conducting block 105 heat-conducting effect are better, but need to consider with other device whether interfere when design, the factor such as processing cost and installation.The height of heat-conducting block 105 is that optical module radome 103 superjacent air space height deduct heat conductive pad 104, the thickness after heat conductive pad 106 compressions.Can ensure so all effective close contacts of each contact-making surface, improve hot conductive performance.
Heat conductive pad 106, material is identical with heat conductive pad 104 with function, and size, with heat-conducting block 105 upper surface sizes, is used for making heat-conducting block 105 and holster shell 107 good contacts, is beneficial to the heat of heat-conducting block 105 is conducted to holster shell 107.The same with heat-conducting block 105 on heat conductive pad 106 have an installation fixing hole, convenient installation.
Holster shell 107, metal material, the shell of whole frame, in this heat sink conception, is also bearing the heat that heat-conducting block 105 is transmitted and is being radiated in air by free convection, due to holster shell and air contact-making surface large, thereby reach good radiating effect.
Fig. 3 is according to the assembling schematic diagram of each module in the optical module heat radiation device of the utility model preferred embodiment, and as shown in Figure 3, the position of each module in this radiating system device is respectively optical module radome 103 from bottom to up, heat conductive pad 104, heat-conducting block 105, heat conductive pad 106, holster shell 107.
Fig. 4 is according to the assembly flow charts of the optical module heat radiation device of the utility model preferred embodiment, and as shown in Figure 4, the installation procedure of this optical module heat radiation device comprises the following steps (step S402-step S406):
Step S402, pastes respectively heat-conducting block 105 upper and lower surfaces by heat conductive pad 106 and 104.
Step S404, is fixed to by screw the heat-conducting block 105 that pastes heat conductive pad on frame casing 107.
Step S406, installation frame casing upper cover, makes heat conductive pad 104 and optical module radome 103 good contacts.
The optical module heat radiation device that adopts this preferred embodiment to provide, solving well optical module top heat-dissipating space, cannot to install radiator additional when narrow be the problem that optical module dispels the heat, this device has simple structure than conventional optical module radiator, lower-cost advantage.
It should be noted that, above-mentioned modules can be realized by hardware.For example: a kind of processor, comprise above-mentioned modules, or above-mentioned modules lays respectively in a processor.
From above description, can find out, the utility model has been realized following technique effect: adopt, at the superjacent air space of optical module, a radiator structure is set, the mode that the dissipation of heat that optical module can be passed out by optical module radome by this radiator structure is gone out, solve at optical module superjacent air space is narrow cannot installation of heat radiator time optical module heat dissipation problem, reach relatively conventional optical module radiator and there is simply constructed advantage, the effect that can reduce costs.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any amendment of doing, be equal to replacement, improvement etc., within all should being included in protection range of the present utility model.
Claims (10)
1. an optical module heat radiation device, is characterized in that, comprising:
Optical module radome, is positioned at optical module top position, is used to optical module that pulling/inserting structure is provided, and shields described optical module;
Radiator structure, is positioned at the top position of described optical module radome, the heat passing out by described optical module radome for distributing described optical module.
2. optical module heat radiation device according to claim 1, is characterized in that, described radiator structure comprises: heat-conducting block and heat conductive pad.
3. optical module heat radiation device according to claim 2, is characterized in that, the material of described heat-conducting block comprises: copper or aluminium.
4. optical module heat radiation device according to claim 2, is characterized in that, the size of described heat conductive pad is identical with the size of described heat-conducting block.
5. optical module heat radiation device according to claim 2, is characterized in that, the material that described heat conductive pad adopts has thermal conductivity, pliability, compressibility and surperficial natural tack.
6. optical module heat radiation device according to claim 2, is characterized in that, the number of described heat-conducting block is 1, and the number of described heat conductive pad is 2, and wherein, 2 described heat conductive pads lay respectively at the above and below of described heat-conducting block.
7. according to the optical module heat radiation device described in any one in claim 2 to 6, it is characterized in that, described optical module heat radiation device also comprises:
Holster shell, is positioned at the top position of described radiator structure, for heat radiation that described radiator structure is given out to air.
8. optical module heat radiation device according to claim 7, is characterized in that, described radiator structure and by being connected with screw with screw between described heat-conducting block.
9. optical module heat radiation device according to claim 7, is characterized in that, the material of described holster shell is metal.
10. optical module heat radiation device according to claim 1, is characterized in that, uses described radiator structure or wind-cooling heat dissipating mode to dispel the heat to described optical module simultaneously.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320792652.4U CN203645968U (en) | 2013-12-04 | 2013-12-04 | Optical module heat dissipation apparatus |
| PCT/CN2014/079985 WO2015081683A1 (en) | 2013-12-04 | 2014-06-16 | Optical module heat dissipation apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320792652.4U CN203645968U (en) | 2013-12-04 | 2013-12-04 | Optical module heat dissipation apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203645968U true CN203645968U (en) | 2014-06-11 |
Family
ID=50877181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320792652.4U Expired - Lifetime CN203645968U (en) | 2013-12-04 | 2013-12-04 | Optical module heat dissipation apparatus |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN203645968U (en) |
| WO (1) | WO2015081683A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015081683A1 (en) * | 2013-12-04 | 2015-06-11 | 中兴通讯股份有限公司 | Optical module heat dissipation apparatus |
| CN105451441A (en) * | 2014-08-12 | 2016-03-30 | 国基电子（上海）有限公司 | Electronic device |
| CN114019622A (en) * | 2021-11-09 | 2022-02-08 | 山东中和光电科技有限公司 | Military module packaged by Mini SFP |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210195801A1 (en) | 2017-12-05 | 2021-06-24 | NetComm Wireless Pty Ltd | Distribution point unit (dpu) with improved thermal management and electrical isolation |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005327855A (en) * | 2004-05-13 | 2005-11-24 | Hitachi Cable Ltd | Communications apparatus with temperature monitoring function and optical transceiver |
| US8449203B2 (en) * | 2010-06-23 | 2013-05-28 | Tellabs Operations, Inc. | Cooling method for CXP active optical transceivers |
| CN103123509B (en) * | 2011-11-18 | 2015-11-25 | 华为技术有限公司 | A kind of single board temperature control device and method |
| CN102612302A (en) * | 2012-03-13 | 2012-07-25 | 华为技术有限公司 | Optical module radiator and optical module communication equipment |
| CN202759716U (en) * | 2012-07-31 | 2013-02-27 | 中兴通讯股份有限公司 | Optical module metal guide rail |
| CN202979542U (en) * | 2012-10-31 | 2013-06-05 | 中兴通讯股份有限公司 | Heat radiation guide rail |
| CN103293608A (en) * | 2013-05-07 | 2013-09-11 | 深圳市易飞扬通信技术有限公司 | Converter modular structure |
| CN103369935B (en) * | 2013-07-23 | 2015-12-30 | 江苏和艺文化创意产业有限公司 | A kind of novel many optical module heat radiation devices |
| CN203645968U (en) * | 2013-12-04 | 2014-06-11 | 中兴通讯股份有限公司 | Optical module heat dissipation apparatus |
-
2013
- 2013-12-04 CN CN201320792652.4U patent/CN203645968U/en not_active Expired - Lifetime
-
2014
- 2014-06-16 WO PCT/CN2014/079985 patent/WO2015081683A1/en active Application Filing
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015081683A1 (en) * | 2013-12-04 | 2015-06-11 | 中兴通讯股份有限公司 | Optical module heat dissipation apparatus |
| CN105451441A (en) * | 2014-08-12 | 2016-03-30 | 国基电子（上海）有限公司 | Electronic device |
| CN105451441B (en) * | 2014-08-12 | 2018-06-26 | 国基电子（上海）有限公司 | Electronic device |
| CN114019622A (en) * | 2021-11-09 | 2022-02-08 | 山东中和光电科技有限公司 | Military module packaged by Mini SFP |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015081683A1 (en) | 2015-06-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140611 |