CN203645968U - Optical module heat dissipation apparatus - Google Patents

Abstract

The utility model discloses a cooling device for an optical module. The optical module heat dissipation device includes: an optical module shielding cover, located above the optical module, for providing a plug-and-plug structure for the optical module, and shielding the optical module; a heat dissipation structure, located above the optical module shielding cover, for dissipating The heat transmitted by the shielding cover of the optical module. Through the utility model, compared with conventional light module heat sinks, the structure is simple and the cost can be reduced.

Description

Optical module cooling device

technical field

The utility model relates to the communication field, in particular to an optical module cooling device.

Background technique

With the continuous development of optical fiber networks, more and more network devices use optical modules, and the application environment is becoming more and more complex. Since the power consumption of the optical module is large, and it is inserted into the shielding cover of the optical module to work, heat dissipation has always been an important issue.

The traditional optical module heat dissipation method is to use active air cooling, or install a heat sink on the optical module shield to naturally dissipate heat, or use the two methods in combination. These methods are suitable for situations where the space above the optical module is sufficient, or there are air-cooled conditions, and in the case where the space above the optical module is narrow and needs a quiet design, or the space above the optical module is narrow and the air cooling alone cannot effectively dissipate heat However, neither of these two heat dissipation methods can meet the heat dissipation requirements.

For the heat dissipation problem of the optical module in the related art when the space above the optical module is too narrow to install a heat sink, no effective solution has been proposed so far.

Utility model content

The utility model provides a heat dissipation device for an optical module to at least solve the heat dissipation problem of the optical module when the space above the optical module is narrow and the heat sink cannot be installed.

According to the utility model, a heat dissipation device for an optical module is provided, comprising: an optical module shielding cover, located above the optical module, for providing a plug-in structure for the optical module, and shielding the optical module; a heat dissipation structure, located at the top of the optical module shielding cover The upper position is used to dissipate the heat transmitted by the optical module through the optical module shield.

Preferably, the heat dissipation structure includes: a heat conduction block and a heat conduction pad.

Preferably, the material of the heat conduction block includes: copper or aluminum.

Preferably, the size of the thermal pad is the same as that of the thermal block.

Preferably, the material used for the heat conduction pad has thermal conductivity, flexibility, compressibility and natural stickiness on the surface.

Preferably, the number of heat conduction blocks is 1, and the number of heat conduction pads is 2, wherein the two heat conduction pads are respectively located above and below the heat conduction block.

Preferably, the heat dissipation device for the optical module further includes: a rack housing, located above the heat dissipation structure, for radiating the heat emitted by the heat dissipation structure into the air.

Preferably, the heat dissipation structure and the heat conduction block are connected by screws.

Preferably, the rack shell is made of metal.

Preferably, a heat dissipation structure or an air-cooled heat dissipation method is used to dissipate heat from the optical module.

Through the utility model, a heat dissipation structure is arranged in the space above the optical module, and the heat transmitted from the optical module through the optical module shielding cover can be dissipated through the heat dissipation structure, which solves the problem that the space above the optical module is narrow and cannot be installed for heat dissipation The heat dissipation problem of the optical module in the heat sink has achieved the advantage of simple structure compared with the conventional optical module heat sink, and the effect of reducing the cost can be achieved.

Description of drawings

The drawings described here are used to provide a further understanding of the utility model and constitute a part of the application. The schematic embodiments of the utility model and their descriptions are used to explain the utility model and do not constitute improper limitations to the utility model. In the attached picture:

Fig. 1 is a schematic structural view of an optical module cooling device according to an embodiment of the present invention;

Fig. 2 is an exploded schematic diagram of each module in the optical module cooling device according to a preferred embodiment of the present invention;

3 is a schematic diagram of the assembly of each module in the optical module cooling device according to a preferred embodiment of the present invention;

Fig. 4 is an assembly flowchart of the heat dissipation device for the optical module according to the preferred embodiment of the present invention.

Detailed ways

Hereinafter, the utility model will be described in detail with reference to the accompanying drawings and embodiments. It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

FIG. 1 is a schematic structural diagram of an optical module cooling device according to an embodiment of the present invention. As shown in FIG. 1 , the device includes: an optical module shielding cover 1 and a cooling structure 2 . Among them, the optical module shielding cover 1 is located above the optical module, and is used to provide a plug-in structure for the optical module and shield the optical module; The heat transferred from the shield 1.

In this embodiment, the heat dissipation structure may include: a heat conduction block and a heat conduction pad. Wherein, the material of the heat conduction block includes: copper or aluminum. The size of the heat conduction pad is the same as that of the heat conduction block. Of course, in practical applications, there may be a certain size difference between the heat conduction pad and the heat conduction block, but only if it does not affect the installation of other modules.

In this embodiment, the material used for the thermal pad has thermal conductivity, flexibility, compressibility and natural stickiness on the surface. The purpose of using such a material is to make the heat conduction pad and the heat conduction block more tightly combined, save space, and facilitate installation and heat conduction.

Preferably, the number of heat conduction blocks is 1, and the number of heat conduction pads is 2, wherein the two heat conduction pads are respectively located above and below the heat conduction block. Of course, this is only a preferred implementation manner. In practical applications, the number of heat conduction blocks and heat conduction pads can be set according to the space above the optical module to achieve the best heat conduction effect.

In this embodiment, the heat dissipation device for the optical module may further include: a rack housing, located above the heat dissipation structure, for radiating the heat emitted by the heat dissipation structure into the air. Preferably, the heat dissipation structure and the heat conduction block can be connected by screws.

In this embodiment, the material of the frame shell is metal.

Preferably, in practical applications, in order to pursue a better heat dissipation effect, a heat dissipation structure or an air-cooled heat dissipation method may also be used to dissipate heat from the optical module.

Through this embodiment, heat conduction modules such as heat conduction pads and heat conduction blocks can be used to effectively conduct the heat of the optical module and the optical module shield to the metal rack shell, and use the surface of the rack shell to radiate heat outward to achieve the effect of heat dissipation for the optical module , or use the surface of the rack shell to perform radiation heat exchange and natural convection heat dissipation with the external environment to enhance the heat dissipation function of the optical module, or combine it with air-cooled heat dissipation at the same time to achieve a better optical module heat dissipation function.

The optical module cooling device provided by the above embodiments will be described and illustrated in more detail below with reference to FIGS. 2 to 4 and preferred embodiments.

Fig. 2 is an exploded schematic view of each module in the optical module cooling device according to a preferred embodiment of the present invention. As shown in Fig. 2, the modules included in the cooling device include:

The optical fiber cable 101 is used for transmitting and receiving data of the optical module.

The optical module 102 is a pluggable optical module, which cannot meet heat dissipation requirements by itself.

The optical module shielding cover 103 provides a plug-in guide rail for the optical module and has a shielding effect on the optical module.

The heat conduction pad 104, in addition to thermal conductivity, the heat conduction pad also has a certain degree of flexibility, compressibility and surface natural viscosity, which can fill the gap between the heat conduction block 105 and the optical module shield 103 and the gap between the optical module 102 and the optical module shield 103 There is a gap between them, so that the heat conduction block 105 is in good contact with the optical module shield 103 and the optical module 102 , which is beneficial to conduct the heat of the optical module 102 to the heat conduction block 105 . In this preferred embodiment, the size of the heat conduction pad 104 can be determined according to the contact area between the heat conduction block 105 and the optical module shield 103 .

The heat conduction block 105 , in this preferred embodiment, may be a metal block made of aluminum or copper, and is used to conduct heat from the optical module 102 to the rack housing 107 . There are mounting screw holes on the heat conduction block 105 for fixing the heat conduction block to the frame shell 107 . The length and width of the heat conduction block depends on the heat dissipation effect to be achieved. The larger the heat conduction block 105, the better the heat conduction effect. However, factors such as interference with other devices, processing costs, and installation need to be considered during design. The height of the heat conduction block 105 is the height of the space above the optical module shielding cover 103 minus the thickness of the heat conduction pad 104 and the heat conduction pad 106 after compression. This can ensure that all contact surfaces are in effective and close contact and improve heat conduction performance.

The heat conduction pad 106 has the same material and function as the heat conduction pad 104, and its size is the same as that of the upper surface of the heat conduction block 105. It is used to make the heat conduction block 105 and the frame shell 107 in good contact, which is beneficial to conduct the heat of the heat conduction block 105 to the frame shell 107 . The heat conduction pad 106 has the same installation and fixing holes as the heat conduction block 105, which is convenient for installation.

The rack shell 107 is made of metal, and the shell of the entire rack, in this heat dissipation solution, also undertakes to radiate the heat from the heat conduction block 105 into the air through natural convection. Since the rack shell and the air contact surface are large, thus To achieve a good heat dissipation effect.

Fig. 3 is a schematic diagram of the assembly of each module in the optical module cooling device according to a preferred embodiment of the present invention. As shown in Fig. pad 104 , heat conduction block 105 , heat conduction pad 106 , and rack shell 107 .

Fig. 4 is an assembly flowchart of the optical module cooling device according to a preferred embodiment of the present invention. As shown in Fig. 4, the installation process of the optical module cooling device includes the following steps (step S402-step S406):

Step S402 , pasting the heat conduction pads 106 and 104 on the upper and lower surfaces of the heat conduction block 105 respectively.

Step S404, fixing the heat conduction block 105 with the heat conduction pad pasted on the rack case 107 by screws.

Step S406 , installing the upper cover of the rack case so that the thermal pad 104 is in good contact with the optical module shield 103 .

The optical module cooling device provided by this preferred embodiment can well solve the problem that a radiator cannot be installed to dissipate heat for the optical module when the heat dissipation space above the optical module is narrow. Compared with conventional optical module radiators, the device has a simpler structure. , the advantage of lower cost.

It should be noted that each of the above modules can be realized by hardware. For example: a processor includes the above-mentioned modules, or the above-mentioned modules are respectively located in one processor.

From the above description, it can be seen that the utility model achieves the following technical effects: a heat dissipation structure is arranged in the space above the optical module, and the heat transmitted by the optical module through the optical module shielding cover can be dissipated through the heat dissipation structure The method solves the heat dissipation problem of the optical module when the space above the optical module is too narrow to install the heat sink, and achieves the advantage of simple structure compared with the conventional optical module heat sink, which can reduce the cost.

The above descriptions are only preferred embodiments of the utility model, and are not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present utility model shall be included in the protection scope of the present utility model.

Claims (10)

1. an optical module heat radiation device, is characterized in that, comprising:

Optical module radome, is positioned at optical module top position, is used to optical module that pulling/inserting structure is provided, and shields described optical module;

Radiator structure, is positioned at the top position of described optical module radome, the heat passing out by described optical module radome for distributing described optical module.

2. optical module heat radiation device according to claim 1, is characterized in that, described radiator structure comprises: heat-conducting block and heat conductive pad.

3. optical module heat radiation device according to claim 2, is characterized in that, the material of described heat-conducting block comprises: copper or aluminium.

4. optical module heat radiation device according to claim 2, is characterized in that, the size of described heat conductive pad is identical with the size of described heat-conducting block.

5. optical module heat radiation device according to claim 2, is characterized in that, the material that described heat conductive pad adopts has thermal conductivity, pliability, compressibility and surperficial natural tack.

6. optical module heat radiation device according to claim 2, is characterized in that, the number of described heat-conducting block is 1, and the number of described heat conductive pad is 2, and wherein, 2 described heat conductive pads lay respectively at the above and below of described heat-conducting block.

7. according to the optical module heat radiation device described in any one in claim 2 to 6, it is characterized in that, described optical module heat radiation device also comprises:

Holster shell, is positioned at the top position of described radiator structure, for heat radiation that described radiator structure is given out to air.

8. optical module heat radiation device according to claim 7, is characterized in that, described radiator structure and by being connected with screw with screw between described heat-conducting block.

9. optical module heat radiation device according to claim 7, is characterized in that, the material of described holster shell is metal.

10. optical module heat radiation device according to claim 1, is characterized in that, uses described radiator structure or wind-cooling heat dissipating mode to dispel the heat to described optical module simultaneously.

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