CN203645968U - Optical module heat dissipation apparatus - Google Patents

Optical module heat dissipation apparatus Download PDF

Info

Publication number
CN203645968U
CN203645968U CN201320792652.4U CN201320792652U CN203645968U CN 203645968 U CN203645968 U CN 203645968U CN 201320792652 U CN201320792652 U CN 201320792652U CN 203645968 U CN203645968 U CN 203645968U
Authority
CN
China
Prior art keywords
optical module
heat
radiation device
heat radiation
conducting block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201320792652.4U
Other languages
Chinese (zh)
Inventor
翟厚明
么东升
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZTE Corp
Original Assignee
ZTE Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZTE Corp filed Critical ZTE Corp
Priority to CN201320792652.4U priority Critical patent/CN203645968U/en
Application granted granted Critical
Publication of CN203645968U publication Critical patent/CN203645968U/en
Priority to PCT/CN2014/079985 priority patent/WO2015081683A1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/0058Casings specially adapted for optoelectronic applications
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4266Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268Cooling
    • G02B6/4269Cooling with heat sinks or radiation fins
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4274Electrical aspects
    • G02B6/4277Protection against electromagnetic interference [EMI], e.g. shielding means

Abstract

The utility model discloses an optical module heat dissipation apparatus. The apparatus comprises an optical module radome and a heat dissipation structure. The radome is located above an optical module for providing a plug structure for the optical module and shielding the optical module. The heat dissipation structure is located above the radome for dissipating heat transmitted by the optical module via the radome. The apparatus is simple in structure compared to conventional optical module heat dissipation apparatuses, and can reduce costs.

Description

Optical module heat radiation device
Technical field
The utility model relates to the communications field, in particular to a kind of optical module heat radiation device.
Background technology
Along with the development of fiber optic network, the network equipment that uses optical module is more and more, and applied environment becomes increasingly complex.Because the power consumption of optical module is larger, and be to be all inserted in optical module radome to work, heat radiation is an important problem always.
Traditional optical module radiating mode is to adopt active air cooling heat radiation, or on optical module radome, installs radiator natural heat dissipation additional, or two kinds of modes are combined with.It is enough that these modes are suitable for optical module superjacent air space, or there is a situation of air-cooled condition, and in the box body of the quiet design of the narrow needs of optical module superjacent air space, or optical module superjacent air space is narrow and separately air-cooled also cannot the box body of efficiently radiates heat in, these two kinds of heat dissipating methods all can not meet radiating requirements.
For in correlation technique at the optical module heat dissipation problem that optical module superjacent air space is narrow cannot installation of heat radiator time, effective solution is not yet proposed at present.
Utility model content
The utility model provides a kind of optical module heat radiation device, at least to solve at optical module superjacent air space is narrow cannot installation of heat radiator time optical module heat dissipation problem.
According to the utility model, a kind of optical module heat radiation device is provided, comprising: optical module radome, be positioned at optical module top position, be used to optical module that pulling/inserting structure is provided, shielded from light module; Radiator structure, is positioned at the top position of optical module radome, the heat passing out by optical module radome for distributing optical module.
Preferably, radiator structure comprises: heat-conducting block and heat conductive pad.
Preferably, the material of heat-conducting block comprises: copper or aluminium.
Preferably, the size of heat conductive pad is identical with the size of heat-conducting block.
Preferably, the material that heat conductive pad adopts has thermal conductivity, pliability, compressibility and surperficial natural tack.
Preferably, the number of heat-conducting block is 1, and the number of heat conductive pad is 2, and wherein, 2 heat conductive pads lay respectively at the above and below of heat-conducting block.
Preferably, optical module heat radiation device also comprises: holster shell, be positioned at the top position of radiator structure, for heat radiation that radiator structure is given out to air.
Preferably, between radiator structure and heat-conducting block, be connected with screw with screw.
Preferably, the material of holster shell is metal.
Preferably, use radiator structure or wind-cooling heat dissipating mode to dispel the heat to optical module simultaneously.
Pass through the utility model, adopt, at the superjacent air space of optical module, a radiator structure is set, the mode that the dissipation of heat that optical module can be passed out by optical module radome by this radiator structure is gone out, solve at optical module superjacent air space is narrow cannot installation of heat radiator time optical module heat dissipation problem, reach relatively conventional optical module radiator and there is simply constructed advantage, the effect that can reduce costs.
Brief description of the drawings
Accompanying drawing described herein is used to provide further understanding of the present utility model, forms the application's a part, and schematic description and description of the present utility model is used for explaining the utility model, does not form improper restriction of the present utility model.In the accompanying drawings:
Fig. 1 is according to the structural representation of the optical module heat radiation device of the utility model embodiment;
Fig. 2 is according to the decomposing schematic representation of each module in the optical module heat radiation device of the utility model preferred embodiment;
Fig. 3 is according to the assembling schematic diagram of each module in the optical module heat radiation device of the utility model preferred embodiment;
Fig. 4 is according to the assembly flow charts of the optical module heat radiation device of the utility model preferred embodiment.
Embodiment
Hereinafter also describe the utility model in detail with reference to accompanying drawing in conjunction with the embodiments.It should be noted that, in the situation that not conflicting, the feature in embodiment and embodiment in the application can combine mutually.
Fig. 1 is according to the structural representation of the optical module heat radiation device of the utility model embodiment, and as shown in Figure 1, this device comprises: optical module radome 1 and radiator structure 2.Wherein, optical module radome 1, is positioned at optical module top position, is used to optical module that pulling/inserting structure is provided, shielded from light module; Radiator structure 2, is positioned at the top position of optical module radome 1, the heat passing out by optical module radome 1 for distributing optical module.
In the present embodiment, radiator structure can comprise: heat-conducting block and heat conductive pad.Wherein, the material of heat-conducting block comprises: copper or aluminium.The size of heat conductive pad is identical with the size of heat-conducting block, and certainly, in actual applications, the size of heat conductive pad and heat-conducting block can exist certain size poor, but is limited with the installation that does not affect other module.
In the present embodiment, the material that heat conductive pad adopts has thermal conductivity, pliability, compressibility and surperficial natural tack.Adopting such material is in order to make heat conductive pad and the heat-conducting block can be in conjunction with tightr, and saves space, is convenient to install and conduction heat.
Preferably, the number of heat-conducting block is 1, and the number of heat conductive pad is 2, and wherein, 2 heat conductive pads lay respectively at the above and below of heat-conducting block.Certainly, this is only one preferred embodiment in actual applications, can arrange according to the superjacent air space of optical module the number of heat-conducting block and heat conductive pad, has reached best heat-conducting effect.
In the present embodiment, optical module heat radiation device can also comprise: holster shell, be positioned at the top position of radiator structure, for heat radiation that radiator structure is given out to air.Preferably, between radiator structure and heat-conducting block, can be connected with screw with screw.
In the present embodiment, the material of holster shell is metal.
Preferably, in actual applications, in order to pursue better radiating effect, also can use radiator structure or wind-cooling heat dissipating mode to dispel the heat to optical module simultaneously.
Pass through the present embodiment, can use heat conductive pad, the heat of optical module, optical module radome is effectively conducted to metal machine frame shell by the heat conducting modules such as heat-conducting block, use the outside radiations heat energy in holster shell surface to be reached for the effect of optical module heat radiation, or use holster shell surface to carry out radiation heat transfer and Natural Heat Convection with external environment condition, reach strengthening optical module heat sinking function, or the better optical module heat sinking function that is effective that simultaneously combines with wind-cooling heat dissipating.
Optical module heat radiation device above-described embodiment being provided below in conjunction with Fig. 2 to Fig. 4 and preferred embodiment is further described in more detail and illustrates.
Fig. 2 is according to the decomposing schematic representation of each module in the optical module heat radiation device of the utility model preferred embodiment, and as shown in Figure 2, the module that this heat abstractor comprises comprises:
Optical fiber cable 101, for the transceiving data of transmission light module.
Optical module 102, pluggable optical module, self cannot meet heat radiation requirement.
Optical module radome 103, for optical module provides plug guide rail and optical module is had to shielding action.
Heat conductive pad 104, heat conductive pad also has certain pliability, compressibility and surperficial natural tack except thermal conductivity, can fill the gap between heat-conducting block 105 and optical module radome 103 gap and optical module 102 and the optical module radome 103 while contacting, thereby make heat-conducting block 105 and optical module radome 103, optical module 102 good contacts, be beneficial to the heat of optical module 102 is conducted to heat-conducting block 105.In this preferred embodiment, the size of heat conductive pad 104 can be determined according to heat-conducting block 105 and optical module radome 103 contacts area.
Heat-conducting block 105, in this preferred embodiment, can use the metal derby of the material such as aluminium or copper, and the heat that is used for that optical module 102 is transmitted conducts to holster shell 107.On heat-conducting block 105, there is mounting screw hole, for heat-conducting block being fixed to holster shell 107.The radiating effect that the length and width size of heat-conducting block reaches according to needs and determining, larger heat-conducting block 105 heat-conducting effect are better, but need to consider with other device whether interfere when design, the factor such as processing cost and installation.The height of heat-conducting block 105 is that optical module radome 103 superjacent air space height deduct heat conductive pad 104, the thickness after heat conductive pad 106 compressions.Can ensure so all effective close contacts of each contact-making surface, improve hot conductive performance.
Heat conductive pad 106, material is identical with heat conductive pad 104 with function, and size, with heat-conducting block 105 upper surface sizes, is used for making heat-conducting block 105 and holster shell 107 good contacts, is beneficial to the heat of heat-conducting block 105 is conducted to holster shell 107.The same with heat-conducting block 105 on heat conductive pad 106 have an installation fixing hole, convenient installation.
Holster shell 107, metal material, the shell of whole frame, in this heat sink conception, is also bearing the heat that heat-conducting block 105 is transmitted and is being radiated in air by free convection, due to holster shell and air contact-making surface large, thereby reach good radiating effect.
Fig. 3 is according to the assembling schematic diagram of each module in the optical module heat radiation device of the utility model preferred embodiment, and as shown in Figure 3, the position of each module in this radiating system device is respectively optical module radome 103 from bottom to up, heat conductive pad 104, heat-conducting block 105, heat conductive pad 106, holster shell 107.
Fig. 4 is according to the assembly flow charts of the optical module heat radiation device of the utility model preferred embodiment, and as shown in Figure 4, the installation procedure of this optical module heat radiation device comprises the following steps (step S402-step S406):
Step S402, pastes respectively heat-conducting block 105 upper and lower surfaces by heat conductive pad 106 and 104.
Step S404, is fixed to by screw the heat-conducting block 105 that pastes heat conductive pad on frame casing 107.
Step S406, installation frame casing upper cover, makes heat conductive pad 104 and optical module radome 103 good contacts.
The optical module heat radiation device that adopts this preferred embodiment to provide, solving well optical module top heat-dissipating space, cannot to install radiator additional when narrow be the problem that optical module dispels the heat, this device has simple structure than conventional optical module radiator, lower-cost advantage.
It should be noted that, above-mentioned modules can be realized by hardware.For example: a kind of processor, comprise above-mentioned modules, or above-mentioned modules lays respectively in a processor.
From above description, can find out, the utility model has been realized following technique effect: adopt, at the superjacent air space of optical module, a radiator structure is set, the mode that the dissipation of heat that optical module can be passed out by optical module radome by this radiator structure is gone out, solve at optical module superjacent air space is narrow cannot installation of heat radiator time optical module heat dissipation problem, reach relatively conventional optical module radiator and there is simply constructed advantage, the effect that can reduce costs.
The foregoing is only preferred embodiment of the present utility model, be not limited to the utility model, for a person skilled in the art, the utility model can have various modifications and variations.All within spirit of the present utility model and principle, any amendment of doing, be equal to replacement, improvement etc., within all should being included in protection range of the present utility model.

Claims (10)

1. an optical module heat radiation device, is characterized in that, comprising:
Optical module radome, is positioned at optical module top position, is used to optical module that pulling/inserting structure is provided, and shields described optical module;
Radiator structure, is positioned at the top position of described optical module radome, the heat passing out by described optical module radome for distributing described optical module.
2. optical module heat radiation device according to claim 1, is characterized in that, described radiator structure comprises: heat-conducting block and heat conductive pad.
3. optical module heat radiation device according to claim 2, is characterized in that, the material of described heat-conducting block comprises: copper or aluminium.
4. optical module heat radiation device according to claim 2, is characterized in that, the size of described heat conductive pad is identical with the size of described heat-conducting block.
5. optical module heat radiation device according to claim 2, is characterized in that, the material that described heat conductive pad adopts has thermal conductivity, pliability, compressibility and surperficial natural tack.
6. optical module heat radiation device according to claim 2, is characterized in that, the number of described heat-conducting block is 1, and the number of described heat conductive pad is 2, and wherein, 2 described heat conductive pads lay respectively at the above and below of described heat-conducting block.
7. according to the optical module heat radiation device described in any one in claim 2 to 6, it is characterized in that, described optical module heat radiation device also comprises:
Holster shell, is positioned at the top position of described radiator structure, for heat radiation that described radiator structure is given out to air.
8. optical module heat radiation device according to claim 7, is characterized in that, described radiator structure and by being connected with screw with screw between described heat-conducting block.
9. optical module heat radiation device according to claim 7, is characterized in that, the material of described holster shell is metal.
10. optical module heat radiation device according to claim 1, is characterized in that, uses described radiator structure or wind-cooling heat dissipating mode to dispel the heat to described optical module simultaneously.
CN201320792652.4U 2013-12-04 2013-12-04 Optical module heat dissipation apparatus Expired - Lifetime CN203645968U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201320792652.4U CN203645968U (en) 2013-12-04 2013-12-04 Optical module heat dissipation apparatus
PCT/CN2014/079985 WO2015081683A1 (en) 2013-12-04 2014-06-16 Optical module heat dissipation apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320792652.4U CN203645968U (en) 2013-12-04 2013-12-04 Optical module heat dissipation apparatus

Publications (1)

Publication Number Publication Date
CN203645968U true CN203645968U (en) 2014-06-11

Family

ID=50877181

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320792652.4U Expired - Lifetime CN203645968U (en) 2013-12-04 2013-12-04 Optical module heat dissipation apparatus

Country Status (2)

Country Link
CN (1) CN203645968U (en)
WO (1) WO2015081683A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015081683A1 (en) * 2013-12-04 2015-06-11 中兴通讯股份有限公司 Optical module heat dissipation apparatus
CN105451441A (en) * 2014-08-12 2016-03-30 国基电子(上海)有限公司 Electronic device
CN114019622A (en) * 2021-11-09 2022-02-08 山东中和光电科技有限公司 Military module packaged by Mini SFP

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019109129A1 (en) 2017-12-05 2019-06-13 Netcomm Wireless Limited A distribution point unit (dpu) with improved thermal management and electrical isolation

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005327855A (en) * 2004-05-13 2005-11-24 Hitachi Cable Ltd Communications apparatus with temperature monitoring function and optical transceiver
US8449203B2 (en) * 2010-06-23 2013-05-28 Tellabs Operations, Inc. Cooling method for CXP active optical transceivers
CN103123509B (en) * 2011-11-18 2015-11-25 华为技术有限公司 A kind of single board temperature control device and method
CN102612302A (en) * 2012-03-13 2012-07-25 华为技术有限公司 Optical module radiator and optical module communication equipment
CN202759716U (en) * 2012-07-31 2013-02-27 中兴通讯股份有限公司 Optical module metal guide rail
CN202979542U (en) * 2012-10-31 2013-06-05 中兴通讯股份有限公司 Heat radiation guide rail
CN103293608A (en) * 2013-05-07 2013-09-11 深圳市易飞扬通信技术有限公司 Converter modular structure
CN103369935B (en) * 2013-07-23 2015-12-30 江苏和艺文化创意产业有限公司 A kind of novel many optical module heat radiation devices
CN203645968U (en) * 2013-12-04 2014-06-11 中兴通讯股份有限公司 Optical module heat dissipation apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015081683A1 (en) * 2013-12-04 2015-06-11 中兴通讯股份有限公司 Optical module heat dissipation apparatus
CN105451441A (en) * 2014-08-12 2016-03-30 国基电子(上海)有限公司 Electronic device
CN105451441B (en) * 2014-08-12 2018-06-26 国基电子(上海)有限公司 Electronic device
CN114019622A (en) * 2021-11-09 2022-02-08 山东中和光电科技有限公司 Military module packaged by Mini SFP

Also Published As

Publication number Publication date
WO2015081683A1 (en) 2015-06-11

Similar Documents

Publication Publication Date Title
US20130301221A1 (en) Thermal management system and method between heat generating chip and housing in electronic apparatus
CN203645968U (en) Optical module heat dissipation apparatus
CN101600325A (en) A kind of combination heat abstractor of closed shell electronic equipment
CN107787167B (en) A kind of mobile terminal
CN105828571A (en) Shielding and heat-dissipation structure of electronic device chip and electronic device
CN201467613U (en) Combined radiator for electronic device with enclosed shell
CN106413335B (en) Heat dissipation buffering shielding composite structure of mobile electronic device
CN206118266U (en) Heat abstractor , remote radio head unit and communication base station
CN218122567U (en) Improved case structure based on VPX cold conduction
CN214504355U (en) Integrated heat dissipation device and Mini intelligent box
CN212181406U (en) Electronic device
EP4081006A1 (en) Heat dissipation device, circuit board assembly, and electronic apparatus
CN204929519U (en) Integration heat radiation structure
US9414528B2 (en) Thermal spreading for an externally pluggable electronic module
CN202455710U (en) Hot-fluid channel heat conduction device and electronic product
CN112994411A (en) Power adapter heat radiation structure
CN106714504A (en) Remote radio unit, mounting element, and radio-frequency communication system
CN215647962U (en) Mobile phone heat dissipation mainboard based on copper material
CN220733348U (en) Heat conductor for heat dissipation of circuit board, heat dissipation structure and infrared imaging equipment
CN213244759U (en) Heat dissipation device and electronic equipment
CN205356936U (en) Box heat radiation structure and emergency command case
CN215934955U (en) Camera with camera lens
CN219552948U (en) Heat radiation structure and electronic equipment
CN218337018U (en) Anti-interference shielding cover plate
CN217721807U (en) Plug-in box and magnetic resonance system

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20140611