CN215934955U

CN215934955U - Camera with camera lens

Info

Publication number: CN215934955U
Application number: CN202122169699.2U
Authority: CN
Inventors: 李典; 徐麟
Original assignee: Hangzhou Hikvision Digital Technology Co Ltd
Current assignee: Hangzhou Hikvision Digital Technology Co Ltd
Priority date: 2021-09-08
Filing date: 2021-09-08
Publication date: 2022-03-01
Anticipated expiration: 2031-09-08

Abstract

The utility model discloses a camera, which comprises a shell, a circuit board and a radiating piece, wherein the circuit board and the radiating piece are both arranged in the shell, the radiating piece is attached to the circuit board, the radiating piece is provided with a first end and a second end which are opposite to each other, the first end is attached to a first inner side wall of the shell, and the second end is attached to a second inner side wall of the shell; the heat of circuit board is absorbed in the laminating of radiating piece and circuit board to the heat that will gather passes through first end and second end and transmits respectively to two inside walls that the casing is relative, makes casing bulk temperature comparatively even, when improving the radiating effect, has improved the temperature uniformity of casing, has reduced the influence that the casing temperature variation is inhomogeneous to cause.

Description

Camera with camera lens

Technical Field

The utility model relates to the technical field of electronic equipment, in particular to a camera.

Background

The industrial camera is mainly applied to indoor environments including factory production lines and has the advantages of stable and reliable performance, easiness in installation and the like. However, the industrial camera has the characteristics of small size and large power consumption, so that the industrial camera has a temperature rise risk in the working process, and the heat is mainly transferred to the bottom shell of the camera through the heat dissipation piece to dissipate heat in the related technology, so that the industrial camera has the defects of uneven shell temperature and poor heat dissipation effect. Of course, the same problem is also present in other general cameras, not limited to industrial cameras.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a camera, which aims to solve the technical problem of poor temperature uniformity of a shell of an industrial camera in the related art.

In order to solve the problems, the utility model adopts the following technical scheme:

the present invention provides a camera, including:

a housing;

the circuit board is arranged in the shell;

the radiating piece is arranged in the shell, the radiating piece is attached to the circuit board, the radiating piece is provided with a first end and a second end, the first end is attached to a first inner side wall of the shell, and the second end is attached to a second inner side wall of the shell.

The technical scheme adopted by the utility model can achieve the following beneficial effects:

according to the camera disclosed by the embodiment of the utility model, the heat dissipation piece is attached to the circuit board to absorb the heat of the circuit board, and the gathered heat is respectively transferred to the two opposite inner side walls of the shell through the first end and the second end, so that the conditions of uneven temperature rise and overhigh local temperature rise of the shell caused by the heat dissipation contact of the heat dissipation piece and the single side of the shell can be avoided, and the temperature uniformity of the shell is improved. Meanwhile, the heat dissipation piece is in contact with the two inner side walls opposite to the shell, and the heat dissipation effect of the camera can be improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is an exploded schematic view of a camera of an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a bottom case according to an embodiment of the present invention;

FIG. 3 is a schematic structural view of a top case of an embodiment of the present invention;

fig. 4 is a schematic structural view of a heat sink of an embodiment of the present invention;

fig. 5 is a schematic structural diagram of a circuit board according to an embodiment of the present invention.

In the figure:

100-case, 110-front case, 120-back case, 130-bottom case, 131-first protrusion, 140-top case, 141-top case platy substrate, 142-first guard plate, 143-second guard plate;

200-circuit board, 210-spacing groove;

300-a heat dissipation element, 310-a plate-shaped heat dissipation substrate, 320-a first heat dissipation plate, 321-a first through hole, 330-a second heat dissipation plate;

400-thermally conductive sheet.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It is to be understood that the described embodiments are merely exemplary of the utility model, and not restrictive of the full scope of the utility model. All other embodiments, which can be derived by a person skilled in the art from the examples given herein without any inventive step, are within the scope of the present invention.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

The following describes in detail a camera provided in an embodiment of the present application with reference to fig. 1 to 5 through a specific embodiment and an application scenario thereof.

The embodiment of the utility model discloses a camera, which comprises a shell 100, a circuit board 200 and a heat dissipation member 300.

The case 100 is a base component of the camera, and may provide a mounting and protection base for the circuit board 200, the heat sink 300, and other electronic components of the camera. Specifically, the case 100 has an accommodating space in which both the circuit board 200 and the heat sink 300 are disposed, i.e., the accommodating space is a mounting region of the circuit board 200 and the heat sink 300.

The electronic components on the circuit board 200 are heated, so that the temperature of the circuit board 200 is increased, the heat dissipation member 300 is attached to the circuit board 200, and the heat dissipation member 300 can exchange heat with the circuit board 200 to dissipate heat and reduce the temperature of the circuit board 200.

The heat sink 300 has a first end and a second end opposite to each other, the first end is attached to a first inner sidewall of the casing 100, the second end is attached to a second inner sidewall of the casing 100, the first inner sidewall and the second inner sidewall may be two inner sidewalls opposite to the casing 100, and heat collected from the circuit board 200 by the heat sink 300 can be transmitted to the casing 100 through the first end and the second end.

In the camera disclosed in the embodiment of the present invention, the heat dissipating member 300 is attached to the circuit board 200 to absorb the heat of the circuit board 200, and the collected heat is respectively transferred to the two opposite inner side walls of the case 100 through the first end and the second end, so that the situations of uneven temperature rise and over-high local temperature rise of the case 100 caused by the unilateral heat dissipating contact between the heat dissipating member 300 and the case 100 can be avoided. Meanwhile, the heat dissipation member 300 contacts with two inner sidewalls of the case 100, so that the heat dissipation effect of the camera can be improved.

The camera disclosed in the embodiment of the present application can be applied to various types of camera devices, for example, the camera disclosed in the embodiment of the present application can be used as an industrial camera, and the problem of poor heat dissipation effect exists in the industrial camera in the related art due to small volume and compact internal structure, and by combining the foregoing analysis, the two ends of the heat dissipation member 300 in the embodiment can be respectively contacted with the two inner side walls opposite to the industrial camera, so that the heat dissipation effect and the temperature uniformity of the industrial camera are improved.

Of course, this is not meant to limit the scope of the present application to industrial cameras, and products having a structure similar to an industrial camera should be included. In addition to area-array cameras, line-array cameras, board-level cameras, profilometers, and the like in industrial cameras, devices such as notebook computers, smart phones, test equipment, Virtual Reality (VR) devices, Augmented Reality (AR) devices, vehicle-mounted devices, and smart wearable devices are also included.

Specifically, the heat sink 300 includes a plate-shaped heat sink base 310, a first heat sink 320, and a second heat sink 330, and the first heat sink 320 and the second heat sink 330 are connected to both ends of the plate-shaped heat sink base 310, respectively.

Further, the first heat dissipation plate 320 and the second heat dissipation plate 330 may be formed by bending two ends of the plate-shaped heat dissipation substrate 310 in the same direction, in this case, the heat dissipation member 300 is in a U-shaped plate structure, and the heat dissipation member 300 may be integrally formed in a stamping manner, thereby simplifying the production process.

The plate-shaped heat dissipation substrate 310 is attached to the circuit board 200, the first heat dissipation plate 320 is attached to the first inner sidewall, and the second heat dissipation plate 330 is attached to the second inner sidewall. With this arrangement, the plate-shaped heat dissipation substrate 310 absorbs heat of the circuit board 200 and then transfers the heat to the first heat dissipation plate 320 and the second heat dissipation plate 330 at two ends of the heat dissipation member 300, the first heat dissipation plate 320 is attached to the first inner sidewall of the casing 100 to transfer the heat to the first side of the casing 100, and the second heat dissipation plate 330 is attached to the second inner sidewall of the casing 100 to transfer the heat to the second side of the casing 100.

The heat sink 300 may be a structural member made of a heat conductive material such as aluminum alloy, copper alloy, etc., so that the heat sink 300 has excellent heat conduction and heat transfer effects, and the heat dissipation effect of the heat sink 300 is improved.

In order to realize the connection and fixation of the heat dissipation member 300 and the housing 100, in an alternative embodiment, the first inner side wall is provided with a first protrusion 131, the first heat dissipation plate 320 is provided with a first through hole 321, and the first protrusion 131 is in plug-in fit with the first through hole 321 to realize the limit fit of the first heat dissipation plate 320 and the first inner side wall, so as to prevent the heat dissipation member 300 from moving.

Under the condition that the first heat dissipation plate 320 is in limit fit with the first inner side wall, the heat dissipation member 300 may shake in the insertion direction of the first protrusion 131 and the first through hole 321. Based on the situation, the circuit board 200 is provided with the limiting groove 210, at least part of the first heat dissipation plate 320 is located in the limiting groove 210, and the bottom wall and the first inner side wall of the limiting groove 210 clamp the first heat dissipation plate 320 together, so that the heat dissipation member 200 is prevented from shaking.

Further, the first protrusion 131 has a guide portion at an end facing away from the first inner sidewall, and an area of a cross section of the guide portion is gradually reduced in a first direction, the first direction is a direction facing away from the first inner sidewall, and the cross section is a cross section perpendicular to the first direction.

In one embodiment, the first protrusion 131 may be a cylindrical protrusion, a guide portion is disposed at a top of the first protrusion 131, a diameter of the guide portion gradually decreases in a direction away from the first inner side wall, and in the insertion process of the first protrusion 131 and the first through hole 321, the guide portion may be first inserted into the first through hole 321, and plays a guiding role in the insertion of the first protrusion 131, so as to improve the assembly efficiency of the heat sink 300 and the housing 100.

In another alternative embodiment, the heat dissipating member 300 may further be fixed to the chassis 100 by a second heat dissipating plate 330, specifically, the second inner sidewall is provided with a second protrusion, the second heat dissipating plate 330 is provided with a second through hole, the second protrusion is in a limit fit with the second through hole, and the circuit board 200 and the second inner sidewall may jointly clamp the second heat dissipating plate 330.

Of course, the heat sink 300 may be fixed to the case 100 by means of bonding or screwing. In an alternative embodiment, the first heat dissipation plate 320 may be adhered to the first inner sidewall or the first heat dissipation plate 320 may be connected to the first inner sidewall by a screw.

The camera further includes a heat conducting sheet 400, the heat conducting sheet 400 may be disposed on the first inner side wall and/or the second inner side wall, and the first heat dissipation plate 320 is attached to the heat conducting sheet disposed on the first inner side wall when the heat conducting sheet 400 is disposed on the first inner side wall; in the case where the heat conductive sheet 400 is provided on the second inner side wall, the second heat sink 330 is attached to the heat conductive sheet 400 provided on the second inner side wall. The heat-conducting sheet 400 may be a structural member made of heat-conducting materials such as a graphite sheet and a copper sheet, and the heat-conducting sheet 400 may accelerate the heat exchange between the heat-dissipating member 300 and the case 100, thereby improving the heat-dissipating effect of the camera.

In this embodiment, the circuit board 200 is provided with a heat sink, which may be a flexible thermal pad, and the plate-shaped heat dissipation substrate 310 is attached to the heat sink to rapidly absorb heat of the circuit board 200.

The front of the camera view direction is defined as front, and the rear of the camera view direction is defined as rear. In one embodiment, the chassis 100 includes a front case 110, a rear case 120, a bottom case 130, and a top case 140, the front case 110 is connected to a front side of the bottom case 130, and the rear case 120 is connected to a rear side of the bottom case 130. Specifically, the front shell 110 and the rear shell 120 may be detachably connected to the bottom shell 130 through a threaded connector, the front shell 110 or the rear shell 120 may be integrally connected to the bottom shell 130 through a die-casting method, and after the front shell 110 and the rear shell 120 are fixedly connected to the bottom shell 130, the top shell 140 may be fixedly connected to the front shell 110 and the rear shell 120 through a threaded connector.

Further, the top case 140 includes a top case plate-shaped base 141, a first protector 142 and a second protector 143, the first protector 142 and the second protector 143 are connected to both ends of the top case plate-shaped base 141, and the first protector 142 and the second protector 143 may be formed by bending both ends of the top case plate-shaped base 141 in the same direction.

Based on the above scheme, the top case 140 is a U-shaped plate structure, the first inner sidewall may be an inner sidewall of the bottom case 130, the second inner sidewall may be an inner sidewall of the top case plate-shaped base 141, the first end of the heat dissipation member 300 is attached to the inner sidewall of the bottom case 130 to transfer heat to the bottom case 130, and the second end of the heat dissipation member 300 is attached to the inner sidewall of the top case plate-shaped base 141 to transfer heat to the top case 140.

Further, the inner side wall of the first guard plate 142 and the inner side wall of the second guard plate 143 are respectively provided with a heat conducting sheet 400, the heat conducting sheet 400 can rapidly transfer heat in the installation space to the case 100, the case 100 exchanges heat with the outside, and the heat dissipation effect of the camera is improved.

Further, the number of the circuit boards 200 may be one or more, and in the case that the number of the circuit boards 200 is more than one, the circuit boards 200 may be connected to the front case 110 in a stacked manner by a screw connector, and accordingly, the heat dissipation member 300 may be more than one, and the heat dissipation member 300 may be disposed between two adjacent circuit boards 200, that is, one heat dissipation member 300 may be disposed between two adjacent circuit boards 200. So set up, heat dissipation piece 300 can carry out the heat exchange with two circuit boards 200 simultaneously, promotes the radiating effect of camera. Meanwhile, under the condition that the number of the circuit boards 200 is multiple, the heat dissipation effect of the camera can be ensured, and the internal structure of the camera is simplified.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Further, it should be noted that the scope of the methods and apparatus of the embodiments of the present application is not limited to performing the functions in the order illustrated or discussed, but may include performing the functions in a substantially simultaneous manner or in a reverse order based on the functions involved, e.g., the methods described may be performed in an order different than that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention.

Claims

1. A camera, comprising:

a housing (100);

the circuit board (200), the said circuit board (200) locates in the said chassis (100);

heat dissipation member (300), heat dissipation member (300) are located in casing (100), heat dissipation member (300) with circuit board (200) laminate mutually, heat dissipation member (300) have relative first end and second end, first end with the first inside wall of casing (100) laminates mutually, the second end with the second inside wall of casing (100) laminates mutually.

2. The camera according to claim 1, wherein the heat dissipating member (300) includes a plate-shaped heat dissipating base (310), a first heat dissipating plate (320), and a second heat dissipating plate (330); wherein:

first heating panel (320) with second heating panel (330) connect respectively in the both ends of platelike heat dissipation base member (310), platelike heat dissipation base member (310) with circuit board (200) laminate mutually, first heating panel (320) with first inboard wall laminates mutually, second heating panel (330) with second inboard wall laminates mutually.

3. The camera according to claim 2, wherein the first inner side wall is provided with a first protrusion (131), the first heat dissipation plate (320) is provided with a first through hole (321), and the first protrusion (131) is in limit fit with the first through hole (321); and/or the presence of a gas in the gas,

the second inner side wall is provided with a second protrusion, the second heat dissipation plate (330) is provided with a second through hole, and the second protrusion is in limit fit with the second through hole.

4. The camera according to claim 3, wherein the first protrusion (131) has a guide portion at an end facing away from the first inner sidewall, an area of a cross section of the guide portion gradually decreases in a first direction, the first direction being a direction facing away from the first inner sidewall, the cross section being a cross section perpendicular to the first direction.

5. The camera according to claim 2, wherein the circuit board (200) is provided with a limiting groove (210), and the limiting groove (210) is in limiting fit with the first heat dissipation plate (320) or the second heat dissipation plate (330).

6. The camera according to claim 1, further comprising a heat conductive sheet (400), wherein the heat conductive sheet (400) is disposed on the first inner sidewall and/or the second inner sidewall, the first end is attached to the heat conductive sheet (400) disposed on the first inner sidewall, and the second end is attached to the heat conductive sheet (400) disposed on the second inner sidewall.

7. The camera according to claim 1, wherein a heat sink is disposed on the circuit board (200), and the heat sink (300) is attached to the heat sink.

8. The camera according to claim 1, wherein the housing (100) comprises a front shell (110), a rear shell (120), a bottom shell (130), and a top shell (140), the front shell (110) is connected to a front side of the bottom shell (130), the rear shell (120) is connected to a rear side of the bottom shell (130), the top shell (140) is connected between the front shell (110) and the rear shell (120), the first end is connected to an inner sidewall of the bottom shell (130), and the second end is connected to an inner sidewall of the top shell (140).

9. The camera according to claim 8, wherein the top case (140) comprises a top case plate-shaped base (141), a first shield (142) and a second shield (143), the first shield (142) and the second shield (143) are connected to both ends of the top case plate-shaped base (141), the second end is connected to an inner side of the top case plate-shaped base (141), and an inner side wall of the first shield (142) and an inner side wall of the second shield (143) are each provided with a heat conductive sheet (400).

10. The camera according to claim 1, wherein the number of the circuit boards (200) is at least two, and the heat dissipation member (300) is provided between two adjacent circuit boards (200).