CN215344761U - Imaging device and electronic apparatus - Google Patents

Abstract

The utility model relates to a camera device and electronic equipment, camera device include casing, functional device, heat pipe and radiator unit, have heat dissipation chamber and working chamber in the inner chamber of casing for heat dissipation chamber and working chamber are kept apart relatively, can guarantee the waterproof sealing and the dustproof sealing of working chamber to a certain extent. The work intracavity is located to the functional device, radiator unit locates the heat dissipation intracavity, the one end and the work chamber intercommunication of heat pipe, the other end and heat dissipation chamber intercommunication, so that the heat that the functional device operation produced is led to the heat dissipation intracavity through the heat pipe, be formed with the louvre with heat dissipation chamber intercommunication on the casing, radiator unit will get into to the heat in the heat dissipation intracavity arrange to the casing outside through the louvre, so as to avoid the heat can not in time discharge the performance that leads to the functional device to receive the influence, and can effectively discharge the heat through radiator unit, make the camera device of this embodiment can carry out high-efficient heat dissipation in order to deal with the great scene of heat dissipation capacity.

Description

Imaging device and electronic apparatus

Technical Field

The present disclosure relates to the field of electronic terminal technologies, and in particular, to an image capturing apparatus and an electronic device.

Background

The electronic equipment comprises a shell, a control chip and the like, wherein the control chip and the like are arranged in the shell, and a large amount of heat can be generated when devices such as the control chip and the like in the shell work.

Specifically, the heat dissipated by the control chip is transferred to the shell and is conducted out through the shell. However, such heat dissipation is slow, which results in high heat in the casing, and the heat of the devices such as the control chip cannot be dissipated in time, thereby causing damage to the devices such as the control chip, and causing great influence on the performance of the electronic device.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem described above or at least partially solve the technical problem described above, the present disclosure provides an image pickup apparatus and an electronic device.

In one aspect, the present disclosure provides an image pickup apparatus including a housing, a functional device, a heat pipe, and a heat dissipation assembly;

the inner cavity of the shell is internally provided with a heat dissipation cavity and a working cavity, the functional device is arranged in the working cavity, the heat dissipation assembly is positioned in the heat dissipation cavity, one end of the heat conduction pipe is communicated with the working cavity and is close to the functional device, and the other end of the heat conduction pipe is communicated with the heat dissipation cavity so as to guide heat dissipated by the functional device into the heat dissipation cavity through the heat conduction pipe;

the position of the shell corresponding to the heat dissipation cavity is provided with heat dissipation holes, and the heat dissipation assembly discharges the heat in the heat dissipation cavity to the outside of the shell through the heat dissipation holes.

According to an embodiment of the present disclosure, the heat dissipation assembly includes a heat dissipation fan, and the other end of the heat pipe is close to an air suction side of the heat dissipation fan, so that the heat dissipation fan blows heat entering the heat dissipation chamber out of the heat dissipation hole.

According to an embodiment of the present disclosure, the heat dissipation assembly further includes a heat dissipation fin, the heat dissipation fin is disposed on an air suction side of the heat dissipation fan, the other end of the heat conduction pipe faces the heat dissipation fin, and the heat dissipation fin is used for diffusing heat entering the heat dissipation cavity.

According to an embodiment of the present disclosure, a layer of heat conductive material is disposed between one end of the heat conductive pipe and the functional device.

According to an embodiment of the present disclosure, the heat dissipation chamber is separate and hermetically disposed with respect to the working chamber.

According to one embodiment of the disclosure, a sealing bottom plate and a sealing side plate are arranged in the shell, the sealing side plate is positioned on one side of the sealing bottom plate, and the sealing bottom plate, the sealing side plate and part of the inner wall of the shell are enclosed together to form the heat dissipation cavity;

the sealing side plate is provided with a communicating hole, the other end of the heat conduction pipe is communicated with the communicating hole, and the heat conduction pipe is arranged between the hole wall of the communicating hole in a sealing mode.

According to an embodiment of the present disclosure, the functional device includes a functional element and a power supply element, and a heat insulator is disposed between the functional element and the power supply element;

one end of the heat conductive pipe faces the functional element.

According to an embodiment of the present disclosure, a damping member is disposed between the heat dissipation assembly and the housing, the damping member has a fixing groove thereon, one side of the heat dissipation fan, which is close to the damping member, is provided with a connection column matched with the fixing groove, and the connection column is used for being inserted into the fixing groove.

According to an embodiment of the present disclosure, the connection column and the fixing groove are in interference fit.

In another aspect, an embodiment of the present disclosure provides an electronic device including a housing and an image pickup apparatus disposed in the housing.

Compared with the prior art, the technical scheme provided by the embodiment of the disclosure has the following advantages:

the utility model provides a camera device and electronic equipment, camera device include casing, functional device, heat pipe and radiator unit, have heat dissipation chamber and working chamber in the inner chamber of casing for heat dissipation chamber and working chamber are kept apart relatively, can guarantee the waterproof sealing and the dustproof sealing of working chamber to a certain extent. The work intracavity is located to the functional device, radiator unit locates the heat dissipation intracavity, the one end and the work chamber intercommunication of heat pipe, the other end and heat dissipation chamber intercommunication, so that the heat that the functional device operation produced is led to the heat dissipation intracavity through the heat pipe, be formed with the louvre with heat dissipation chamber intercommunication on the casing, radiator unit will get into to the heat in the heat dissipation intracavity arrange to the casing outside through the louvre, so as to avoid the heat can not in time discharge the performance that leads to the functional device to receive the influence, and can discharge the heat high efficiency through radiator unit, in order to deal with the great scene of heat dissipation capacity.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.

In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present disclosure, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.

Fig. 1 is an external schematic view of an image pickup apparatus according to an embodiment of the present disclosure;

fig. 2 is a schematic partial cross-sectional view of an image capturing apparatus according to an embodiment of the disclosure;

fig. 3 is a schematic structural view of a heat dissipation chamber of the image pickup apparatus according to the embodiment of the present disclosure;

fig. 4 is an exploded schematic structural view of a cooling fan and a shock absorbing member of the image pickup apparatus according to the embodiment of the present disclosure;

fig. 5 is a schematic partial front view structure diagram of an image capturing apparatus according to an embodiment of the disclosure.

Wherein, 1, a shell; 11. a heat dissipation cavity; 111. sealing the bottom plate; 112. sealing the side plate; 113. an air inlet; 114. a fixing hole; 12. a working chamber; 13. heat dissipation holes; 14. a power supply connector; 15. a shock absorbing member; 151. fixing grooves; 2. a functional device; 21. a chip; 22. a control panel; 23. a metal middle frame; 24. a layer of thermally conductive material; 25. sealing the waterproof strip; 26. a power supply element; 27. a thermal insulation member; 28. fixing a bracket; 3. a heat conducting pipe; 4. a heat dissipating component; 41. a heat radiation fan; 411. connecting columns; 42. a heat dissipating fin; 5. an upper cover plate; 6. a lower cover plate; 7. a screen; 8. a camera is provided.

Detailed Description

In order that the above objects, features and advantages of the present disclosure may be more clearly understood, aspects of the present disclosure will be further described below. It should be noted that the embodiments and features of the embodiments of the present disclosure may be combined with each other without conflict.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure, but the present disclosure may be practiced in other ways than those described herein; it is to be understood that the embodiments disclosed in the specification are only a few embodiments of the present disclosure, and not all embodiments.

As shown in fig. 1 to 5, the present disclosure provides an image pickup apparatus, including a housing 1, a functional device 2, a heat pipe 3, and a heat dissipation assembly 4, where a heat dissipation chamber 11 and a working chamber 12 are provided in an inner cavity of the housing 1, so that the heat dissipation chamber 11 and the working chamber 12 are relatively isolated, and waterproof sealing and dustproof sealing of the working chamber 12 can be ensured to some extent. In functional device 2 located working chamber 12, radiator unit 4 located in heat dissipation chamber 11, the one end and the working chamber 12 intercommunication of heat pipe 3, the other end and heat dissipation chamber 11 intercommunication, so that the heat that functional device 2 operation produced leads to in heat dissipation chamber 11 through heat pipe 3, be formed with the louvre 13 with heat dissipation chamber 11 intercommunication on the casing 1, radiator unit 4 will get into to the heat in heat dissipation chamber 11 arrange to casing 1 outside through louvre 13, so as to avoid the heat can not in time discharge and lead to the performance of functional device 2 to receive the influence, and can discharge the heat high efficiency fast through radiator unit 4, make the camera device of this embodiment can carry out high-efficient heat dissipation in order to deal with the great scene of heat dissipation capacity.

Specifically, as shown in fig. 2, the functional device 2 may specifically include a chip 21, a control board 22, a metal middle frame 23, and the like, where the chip 21, the control board 22, and the metal middle frame 23 are all disposed in the working chamber 12, and the chip 21 is a main heat source, and its operation may generate a large amount of heat, one end of the heat pipe 3 with two-phase liquid cooling characteristics is communicated with the working chamber 12, and the other end is communicated with the heat dissipation chamber 11, so that the heat generated by the operation of the chip 21 is quickly conducted to the heat dissipation chamber 11 through the heat pipe 3, and the performance of the chip 21 is prevented from being affected by the heat.

As shown in fig. 2 to 4, the heat dissipation assembly 4 includes a heat dissipation fan 41, and the other end of the heat conduction pipe 3 is close to the air suction side of the heat dissipation fan 41, so that the heat dissipation fan 41 blows out the heat entering the heat dissipation cavity 11 from the heat dissipation hole 13, compared with the problem of low heat dissipation efficiency caused by naturally dissipating the heat generated by the chip through the housing in the prior art, in this embodiment, the heat dissipation fan 41 is arranged to blow out the heat generated by the chip 21 or other functional devices to the outside of the housing 1 quickly and efficiently, so as to cope with the scene with large heat dissipation capacity.

Specifically, the heat dissipation fan 41 may be a centrifugal fan or an axial fan, and the centrifugal fan and the axial fan may perform waterproof processing, so that the camera device provided with the heat dissipation assembly 4 of the present embodiment may be used for shooting in the rain or underwater. In addition, the power of the heat radiation fan 41 may be determined according to the heat generated by the functional device 2.

Further, the heat dissipation assembly 4 further includes a heat dissipation fin 42, the heat dissipation fin 42 is disposed on the air suction side of the heat dissipation fan 41, the other end of the heat conduction pipe 3 faces the heat dissipation fin 42, and the heat dissipation fin 42 is used for diffusing the heat entering the heat dissipation cavity 11 to increase the heat exchange area. Specifically, the heat dissipation fins 42 may be provided in plurality, and the heat exchange area may be further increased by the plurality of heat dissipation fins 42, and then the heat may be blown to the outside of the housing 1 by the heat dissipation fan 41 to achieve efficient heat dissipation. Therefore, the camera device of the embodiment can not only increase the heat dissipation surface area, but also perform quick and efficient heat dissipation on scenes with large heat dissipation capacity.

Specifically, as shown in fig. 2, 3, and 5, the plurality of heat dissipation fins 42 are distributed in an array in the heat dissipation cavity 11, or the plurality of heat dissipation fins 42 are distributed in parallel in the heat dissipation cavity 11, for example, are sequentially arranged in parallel along the length direction (x direction shown in fig. 2) of the image pickup apparatus, or are sequentially arranged in parallel along the width direction of the image pickup apparatus. The number of the specific heat dissipation fins 42 can be set according to actual needs. In addition, a base may be disposed at the bottom of the heat dissipating fin 42, so that the heat dissipating fin 42 is fixed on the base, and a fixing hole 114 is disposed on the base to be connected to the housing 1 through a fastener, such as a screw or a bolt, and the other end of the heat conducting pipe 3 is coupled to the base to quickly dissipate heat of the heat conducting pipe 3.

In addition, as shown in fig. 1 and fig. 2, the image pickup apparatus of this embodiment includes an upper cover plate 5, a lower cover plate 6, a screen 7 and a camera 8, the upper cover plate 5 and the lower cover plate 6 are disposed oppositely, the housing 1, the upper cover plate 5 and the lower cover plate 6 enclose together to form an inner cavity, and the upper cover plate 5, the lower cover plate 6 and the housing 1 can be bonded together by a high-strength waterproof sealant, so as to ensure the structural strength and waterproof sealing performance of the image pickup apparatus. In addition, the upper cover plate 5 and the shell 1, or the lower cover plate 6 and the shell 1 can be detachably connected by adopting a buckle connection or a fastener, so that the camera device is convenient to assemble.

Specifically, the upper cover plate 5 is provided with two different openings, and the different openings are respectively matched with the sizes and the outlines of the screen 7 and the camera 8, so that the screen 7 and the camera 8 are respectively arranged in the different openings and exposed out of the openings to display images or pick up images.

Further, as shown in fig. 2 and 5, a heat conductive material layer 24 is disposed between the chip 21 and the heat conductive pipes 3, so that heat generated by the chip 21 is conducted to the heat conductive pipes 3, is transferred to the heat dissipation chamber 11 through the heat conductive pipes 3, is diffused by the heat dissipation fins 42, and is rapidly blown to the outside of the housing 1 of the image pickup apparatus by the heat dissipation fan 41. Specifically, the heat conductive material layer 24 is a heat conductive silicone layer or a liquid metal layer, and may also be set according to actual needs without being limited to the example of the embodiment.

In this embodiment, the heat dissipation fins 42 are heat conduction aluminum fins or heat conduction copper fins, so that the heat dissipation fins 42 have strong heat conduction capability, and further quickly and uniformly diffuse the heat in the heat conduction pipe 3 to the heat dissipation cavity 11 through the heat dissipation fins 42, so as to discharge the heat under the action of the heat dissipation fan 41, thereby avoiding the influence of the heat collected in the housing 1 on the performance of the image pickup device.

As shown in fig. 2, the heat dissipation chamber 11 and the working chamber 12 formed in the internal cavity of the imaging device are relatively independent, and the heat dissipation chamber 11 is hermetically disposed with respect to the working chamber 12. Because the heat dissipation chamber 11 mainly used conveys the heat to the camera device outside, consequently heat dissipation chamber 11 and outside intercommunication, and the functional device 2 that sets up in the working chamber 12, for example chip 21 etc. need possess dustproof and waterproof performance, consequently make keep apart and sealed setting relatively between heat dissipation chamber 11 and the working chamber 12, guarantee working chamber 12 can not communicate with the outside when can making heat dissipation chamber 11 and outside intercommunication, with the seal of guaranteeing working chamber 12, satisfy the waterproof requirement and the dustproof requirement of working chamber 12. Specifically, the inner cavity of the camera device can be divided into a heat dissipation cavity 11 communicated with the outside, and the rest cavities in the inner cavity form a working cavity 12 for placing functional devices and the like commonly used by the camera device.

As shown in fig. 2, the heat dissipation chamber 11 is enclosed by a sealing bottom plate 111, a sealing side plate 112, an upper cover plate 5 and a part of the housing 1, referring to the z direction (i.e. vertical direction) shown in fig. 2, the sealing bottom plate 111 is parallel to the upper cover plate 5 and can be located below the upper cover plate 5, the sealing side plate 112 is located at one side of the sealing bottom plate 111 close to the working chamber 12, i.e. the sealing side plate 112 is located at the left side of the sealing bottom plate 111, and an air inlet 113 communicated with the heat dissipation chamber 11 is formed on the upper cover plate 5 or the housing 1, so that the heat dissipation fan 41 sucks outside cold air into the heat dissipation chamber 11 through the air inlet 113, and discharges heat guided into the heat dissipation chamber 11 through the heat dissipation holes 13, thereby achieving rapid and effective heat dissipation.

Specifically, the air inlet 113 may be disposed on the upper cover plate 5, or may be disposed on the housing 1, and the position of the air inlet 113 is set according to actual requirements.

As shown in fig. 2 and fig. 3, in this embodiment, the sealing side plate 112 is provided with a communication hole, and the other end of the heat conducting pipe 3 is communicated with the communication hole, so that one end of the heat conducting pipe 3 can extend into the heat dissipation chamber 11 or can not extend into the heat dissipation chamber 11 and is only communicated with the heat dissipation chamber 11 through the communication hole, and further, the heat in the working chamber 12 is conducted to the heat dissipation chamber 11 through the heat conducting pipe 3 for diffusion and heat dissipation.

Further, as shown in fig. 5, in order to ensure the waterproof performance and the dustproof performance of the working chamber 12, the space between the sealing bottom plate 111 and the sealing side plate 112, and/or the space between the heat conducting pipe 3 and the communication hole, and/or the space between the sealing bottom plate 111 and the housing 1 is sealed by the sealing waterproof strip 25, and the specific material and size of the sealing waterproof strip 25 may be set according to actual needs.

In the present embodiment, the sealing side plate 111 is integrally formed with the upper cover plate 5, and/or the sealing bottom plate 111 is integrally formed with the housing 1, so as to save the manufacturing process and ensure the sealing performance between the two.

In summary, the image pickup apparatus of the present embodiment has good waterproof sealing performance, and therefore can be used in a usage scene such as rain or underwater, for example, the image pickup apparatus of the present embodiment can be used in a panoramic camera to perform outdoor or underwater shooting, or used in an open-air monitoring camera, or used in a waterproof notebook, or used in military electronic equipment used in some extreme environments.

As shown in fig. 1 to 5, the functional device 2 of the present embodiment includes a functional element and a power supply element, a heat insulator 27 is disposed between the functional element and the power supply element 26, and since the functional element is a generating member of a main heat source, which generates a large amount of heat, one end of the heat pipe 3 is directed to the functional element, so that the heat generated by the functional element can be quickly conducted to the heat dissipation chamber 11 for discharge.

As shown in fig. 2 and 5, the functional element may specifically include a chip 21, a control board 22, a metal middle frame 23, the control board 22, the metal middle frame 23, and a power supply element 26 are all located on a side of the core 21 away from the heat pipe 3, that is, in a z direction (i.e., a vertical direction) as shown in fig. 2, the control board 22, the metal middle frame 23, and the power supply element 26 are all located below the chip 21, the control board 22 is located between the metal middle frame 23 and the chip 21, the power supply element 26 is located on a side of the metal middle frame 23 away from the control board 22, a heat insulator 27 is disposed between the metal middle frame 23 and the power supply element 26, so that a part of heat generated during operation of the control board 22 is conducted to the metal middle frame 23, and in order to ensure safety of the power supply element 26, the heat insulator 27 is disposed between the metal middle frame 23 and the power supply element 26 to reduce heat transfer to the power supply element 26, thereby forming a sparse heat transfer channel, so that more heat is conducted into the heat dissipation chamber 11 through the heat conductive pipe 3, and the heat insulating member 27 can also play a role of shock absorption protection for the power supply element 26.

Specifically, the heat insulating member 27 may be made of a material having a poor heat conductivity, such as rubber, and may have a certain shock absorbing and buffering performance.

As shown in fig. 5, the image capturing apparatus further includes a fixing bracket 28, and the heat pipe 3 located in the working chamber 12 is fixed on the control board 22 through the fixing bracket 28, so that the chip 21 and the heat pipe 3 are tightly attached to each other, and therefore, heat generated by the chip 21 is effectively transferred to the heat pipe 3, and is transferred to the heat dissipation chamber 11 through the heat pipe 3 for heat dissipation. Specifically, the fixing bracket 28 may be a snap, a hinge, a bolt, or the like.

In addition, as shown in fig. 3, a power connector 14 is further disposed in the heat dissipation cavity 11, and the power connector 14 adopts a waterproof cable interface, so that the power connector 14 can be used in underwater or in rain. The waterproof flat cable interface is connected with the power supply element 26 in the working chamber or connected with an external power supply for supplying power to the heat dissipation fan 41. The power supply element 26 may be a storage battery.

In order to ensure the shockproof performance of the camera device, as shown in fig. 4, the camera device further includes a shock absorbing member 15, the shock absorbing member 15 is located between the cooling fan 41 and the housing 1, and particularly, may be located at a side of the cooling fan 41 away from the upper cover plate 5, that is, as shown in fig. 4, the shock absorbing member 15 is located at the bottom of the cooling fan 41, and the shock absorbing member 15 has a fixing groove 151, a connection column 411 matched with the fixing groove 151 is located at a side of the cooling fan 41 close to the shock absorbing member 15, that is, the bottom of the cooling fan 41 is provided with a connection column 411, the connection column 411 is used for being inserted into the fixing groove 151, and the connection column 411 and the fixing groove 151 are in interference fit, so that the cooling fan 41 is inserted into the shock absorbing member 15 through the connection column 411 to absorb the vibration noise generated during the operation of the cooling fan 41 to reduce the noise, and the cooling fan 41 is separated from the cooling cavity 11 by the shock absorbing member 15 to avoid the impact or friction caused by the direct contact, thereby serving the purpose of protecting the heat dissipation fan 41.

In addition, in this embodiment, a plurality of shock absorbing members 15 may be provided, and the shock absorbing members 15 are distributed in an array to uniformly absorb the operation noise of the heat dissipating fan 41. For example, as shown in fig. 4, four shock absorbing members 15 may be disposed at four corners of the heat dissipating fan 41, or the shock absorbing members 15 may have a profile adapted to the shape and size of the heat dissipating fan 41, and the number and profile of the shock absorbing members 15 are set according to actual requirements.

The damping member 15 may be a rubber damping member, a silicone damping member, or other elastic material with a damping property, and the material is selected according to actual requirements.

In another aspect, an embodiment of the present disclosure provides an electronic device including a housing and an image pickup apparatus disposed in the housing. The imaging device has the same structure and the same performance as the imaging device.

The electronic device of this embodiment may be a monitoring camera, a mobile phone terminal, a panoramic camera, a notebook computer, or the like.

It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The foregoing are merely exemplary embodiments of the present disclosure, which enable those skilled in the art to understand or practice the present disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the disclosure. Thus, the present disclosure is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. The camera device is characterized by comprising a shell (1), a functional device (2), a heat conducting pipe (3) and a heat radiating component (4);

the heat dissipation device is characterized in that a heat dissipation cavity (11) and a working cavity (12) are arranged in an inner cavity of the shell (1), the functional device (2) is arranged in the working cavity (12), the heat dissipation component (4) is located in the heat dissipation cavity (11), one end of the heat conduction pipe (3) is communicated with the working cavity (12) and is close to the functional device (2), and the other end of the heat conduction pipe (3) is communicated with the heat dissipation cavity (11) so as to guide heat dissipated by the functional device (2) into the heat dissipation cavity (11) through the heat conduction pipe (3);

the position of the shell (1) corresponding to the heat dissipation cavity (11) is provided with heat dissipation holes (13), and the heat dissipation assembly (4) discharges the heat in the heat dissipation cavity (11) to the outside of the shell (1) through the heat dissipation holes (13).

2. The image pickup apparatus according to claim 1, wherein said heat dissipating component (4) includes a heat dissipating fan (41), and the other end of said heat conductive pipe (3) is close to a suction side of said heat dissipating fan (41) so that said heat dissipating fan (41) blows out heat entered into said heat dissipating chamber (11) from said heat dissipating hole (13).

3. The image pickup apparatus according to claim 2, wherein the heat dissipating assembly (4) further comprises a heat dissipating fin (42), the heat dissipating fin (42) is disposed on a suction side of the heat dissipating fan (41), the other end of the heat pipe (3) faces the heat dissipating fin (42), and the heat dissipating fin (42) is configured to dissipate heat entering the heat dissipating chamber (11).

4. The image pickup apparatus according to claim 2, wherein a heat conductive material layer (24) is provided between one end of the heat conductive pipe (3) and the functional device (2).

5. The camera device according to any one of claims 1 to 4, wherein the heat dissipation chamber (11) is provided separately and hermetically with respect to the working chamber (12).

6. The image pickup device according to claim 5, wherein a sealing bottom plate (111) and a sealing side plate (112) are arranged in the housing (1), the sealing side plate (112) is located at one side of the sealing bottom plate (111), and the sealing bottom plate (111), the sealing side plate (112) and a part of the inner wall of the housing (1) jointly enclose the heat dissipation cavity (11);

the sealing side plate (112) is provided with a communicating hole, the other end of the heat conduction pipe (3) is communicated with the communicating hole, and the heat conduction pipe (3) is hermetically arranged between the hole walls of the communicating hole.

7. The imaging apparatus according to any one of claims 1 to 4, wherein the functional device (2) includes a functional element and a power supply element (26), and a heat insulator (27) is provided between the functional element and the power supply element (26);

one end of the heat conductive pipe (3) faces the functional element.

8. The camera device according to any one of claims 2 to 4, wherein a damping member (15) is disposed between the heat dissipating assembly (4) and the housing (1), a fixing groove (151) is disposed on the damping member (15), a connecting column (411) engaged with the fixing groove (151) is disposed on a side of the heat dissipating fan (41) close to the damping member (15), and the connecting column (411) is configured to be inserted into the fixing groove (151).

9. The image pickup apparatus as set forth in claim 8, wherein the connection post (411) is interference-fitted with the fixing groove (151).

10. An electronic apparatus comprising a housing and the imaging device according to any one of claims 1 to 9 provided in the housing.

Images