CN110913666A

CN110913666A - Low-thermal-resistance channel sealing type standard aviation case

Info

Publication number: CN110913666A
Application number: CN201911254098.2A
Authority: CN
Inventors: 胡凯博; 刘继鹏; 郝刚; 张满宁; 单云飞
Original assignee: Xian Electronic Engineering Research Institute
Current assignee: Xian Electronic Engineering Research Institute
Priority date: 2019-12-10
Filing date: 2019-12-10
Publication date: 2020-03-24

Abstract

The invention discloses a low-thermal resistance channel sealing type standard aviation case, and relates to a case which breaks through the bottleneck that the traditional ATR (attenuated total reflectance) sealing aviation case must rely on case conduction for processing the heat dissipation of a high-power module. The chassis integrates two heat dissipation methods of conduction and convection, adopts a structural form that the module is provided with a radiator and a sealing measure, can directly take away module heat through an outer air duct, solves the heat dissipation problem of a high-power-consumption board card, and simultaneously ensures the air tightness and the electromagnetic compatibility of the chassis. The standard aviation case has the installation structure and the overall dimension of the traditional aviation case, and has the advantages of light weight, good rigidity and strength and the like and simultaneously has good corrosion resistance and protective performance due to the adoption of the magnesium alloy thin-wall processing, splicing and forming and micro-arc oxidation novel magnesium alloy protection technology. The electronic equipment in the case works in a fully-sealed state, so that the environmental adaptability of the electronic equipment is improved.

Description

Low-thermal-resistance channel sealing type standard aviation case

Technical Field

The invention belongs to the three technical fields of machinery, heat and electromagnetism, and relates to electronic equipment with a module capable of directly radiating heat and good sealing performance and an electromagnetic shielding function. The invention provides a solution to the problem that the heat dissipation performance is poor due to the fact that the heat resistance of the closed equipment is large when the closed equipment conducts and dissipates heat by means of the case body, and can be applied to the field of military and civil products with high requirements on the sealing performance, the electromagnetic shielding performance and the heat dissipation performance of electronic equipment.

Background

The chassis is widely used as an important one of electronic devices. Traditional airtight quick-witted case relies on mainly conduction heat dissipation: the inner module conducts heat to the case shell through structures such as locking strips or heat conducting pads, the heat is taken away from the outside of the case through natural convection or forced convection, and the case plays a role of a heat exchanger. There are problems that the contact resistance is large and the heat conduction efficiency is not high. However, the current electronic equipment is continuously developed towards high density and miniaturization, the unit heat flux density value in the electronic equipment is continuously increased, the temperature is also increasingly high, and the requirement cannot be met only by the traditional heat conduction and air cooling method.

Disclosure of Invention

Technical problem to be solved

In order to avoid the defects of the prior art, the invention provides a low-thermal resistance channel sealing type standard aviation case.

Technical scheme

A low-thermal resistance channel sealing type standard aviation case is characterized by comprising a case frame, a first partition plate, a second partition plate, a third partition plate, a fan, an air channel and radiating fins; a first partition plate, a second partition plate and a third partition plate are arranged in the chassis frame to divide the chassis frame into a plurality of parts, wherein the first partition plate plays a role in separating an air duct from an internal electric appliance structure; the module is arranged on a motherboard in the case through a guide rail and locked by a locker, the radiating fin is a cold end of a radiating structure of the module, and the radiating fin is adjacent to the air channel; the fan is arranged on the chassis frame, and the heat is taken out of the system through the air outlet opposite to the chassis frame.

The module comprises a printed board, a cold board, a flexible heat conduction gasket, a heat pipe and a sealing board structure, wherein the printed board and the cold board are installed together; the heat pipe is welded on the cold plate, the radiating fin is welded at the other end of the heat pipe, a sealing plate is arranged between the cold plate and the radiating fin, the sealing plate is inserted into the groove structure on the partition plate along with the module and is matched with the first partition plate to realize the isolation and sealing of the air channel of the case and the electric appliance structure

The heat pipe is common

The sintered heat pipe is flattened to a thickness of 3 mm.

The radiating fins are made of copper, the thickness of the radiating fins is 0.8mm, and the number and the distance of the fins can be adjusted according to the heat consumption of the chip; the outer side of the fin is provided with a protective enclosure frame for protecting the safety of personnel during transportation of the module; each fin is made by local bending process and welded with the heat pipe by aluminum brazing, thus ensuring good heat conductivity.

Advantageous effects

According to the low-thermal resistance channel sealing type standard aviation case provided by the invention, two heat dissipation methods of conduction and convection are integrated, the heat of the module can be directly taken away through the outer air channel, and the bottleneck that the traditional ATR (attenuated total reflection) sealing aviation case must rely on the case for heat dissipation when processing a high-power module is broken through. Because the inner cavity and the outer cavity are isolated, and the inner cavity is closed. Therefore, the components and the printed board in the case have good environmental adaptability and have the advantages of corrosion resistance, dust prevention and the like. The chassis frame is made of magnesium alloy and is subjected to micro-arc oxidation, and the single plug-in module is made of aluminum alloy plated with high-phosphorus nickel and welded with copper heat pipes and fins, so that the chassis frame has the advantages of light weight, good protection and the like. The external installation interface of the case is the same as that of the traditional ATR case, and the case has universality and interchangeability. The low-thermal resistance channel sealing type standard aviation case is already adopted in products, and meets the heat dissipation requirement of high-density electronic equipment.

Drawings

FIG. 1 is a diagram of the inner cavity of a low thermal resistance channel sealed case

FIG. 2 block diagram

FIG. 3 sectional view of a module

FIG. 4 schematic view of a sealing structure

FIG. 5 Low thermal resistance channel sealed chassis

Detailed Description

The invention will now be further described with reference to the following examples and drawings:

the working principle of the low-thermal resistance channel closed case is as follows: based on the module cold plate with a heat conduction structure and a sealing structure capable of being matched with a chassis, the cooling is carried out by adopting a method of combining conduction and forced air cooling. Specifically, the method comprises the following steps: the heat of the module chip is conducted to the cold plate main body structure, the heat of the cold plate main body is conducted to the radiating fin at the other end of the cold plate by virtue of the heat pipe structure, the fin is arranged in the air channel outside the case, and the heat is taken away from the air channel outside the case by the fan.

The chassis mainly comprises a frame, a fan, a panel, a cover plate and a module cold plate. Compared with the traditional closed case, the invention has the innovation points that: the module cold plate is provided with a heat conduction structure (a heat sink, a heat pipe and radiating fins) to directly conduct the heat of the chip to the air duct of the case, so that the bottleneck of high heat resistance (small conduction area and low conduction rate) that the module in the traditional sealed case is pressed by a locking strip to conduct the heat to the case shell and then the shell radiates is broken through, and the heat is radiated by a mode of combining more direct conduction and convection; meanwhile, the module cold plate is used as one part of the chassis and is matched with the chassis frame to play a sealing role. In the actual use process, the module with smaller heat productivity can use a standard cold plate, and the module is used in cooperation with the cold plate of the module in the invention by adopting the mode of cold plate conduction and heat exchange of the radiating fins on the side wall of the case.

The chassis frame 1 is a mounting carrier for modules, mother boards and other components in the chassis and is formed by processing, splicing and molding magnesium alloy. The chassis frame is connected with the general aviation frame through a rear pin shaft 12 and a front hanging piece 13, so that the chassis and the aviation frame can be quickly disassembled and assembled. The front panel 2 is provided with an external connector of the case, and the front panel is detachable with the case. The partition plate 3 plays a role in isolating the air duct 8 from internal electrical structures, and the partition plates 4 and 5 play a role in isolating strong electricity and weak electricity in the case. A strong current (analog circuit) board card plug-in unit in the case is arranged in the area 6, and a weak current (digital circuit) board card is arranged in the area 7, so that the electromagnetic compatibility and the air tightness of the system to the outside are improved. The module 9 is installed on a motherboard in the case through a guide rail and locked by a locker, and the fin 10 is a cold end of a heat dissipation structure of the module 9. The fan 11 is installed on the chassis frame, and the heat is taken out of the system through the air outlet opposite to the chassis frame.

The printed board 16 and the cold plate 18 are installed together, the printed board heating device is pressed with the cold plate through the flexible heat conducting gasket 17, and the heat conducting gasket is used for reducing the contact thermal resistance between the shell of the printed board heating chip and the heat transfer surface of the cold plate. The cold plate is welded with a heat pipe 14, and the other end of the heat pipe is welded with a radiating fin 10, which is a 'cold end'. The heat of the chip is conducted to the cold plate and then rapidly conducted to the fins through the heat pipe, and the heat of the fins is taken away through forced air in the air duct. A sealing plate structure 15 is arranged between the cold plate main body and the radiating fins, and the sealing plate and the partition plate 3 are matched to realize the isolation and sealing of the case air channel and the electric appliance structure.

The heat pipe 14 is conventional

The sintered heat pipe is flattened into a thickness of 3mm, the fins 10 are made of copper and have a thickness of 0.8mm, and the number and the distance of the fins can be adjusted according to the heat consumption of the chip. And a protective enclosure frame is arranged outside the fins and used for protecting the safety of personnel during transportation of the module. Each fin is made by local bending process and welded with the heat pipe by aluminum brazing, thus ensuring good heat conductivity. The sealing plate 15 is inserted into the groove structure on the partition plate 3 along with the module and is screwed down by screws, so that the sealing performance and the reliability of the frame are ensured.

Claims

1. A low-thermal resistance channel sealing type standard aviation case is characterized by comprising a case frame (1), a first partition plate (3), a second partition plate (4), a third partition plate (5), a fan (11), an air duct (8) and radiating fins (10); a first partition plate (3), a second partition plate (4) and a third partition plate (5) are arranged in a case frame (1) to divide the case frame (1) into a plurality of parts, wherein the first partition plate (3) plays a role in isolating an air duct (8) from an internal electric appliance structure, a strong electric board card plug-in unit in the case is installed in an area (6) partitioned by the second partition plate (4) and the third partition plate (5), and a weak electric board card is installed in an area (7) partitioned by the second partition plate (4) and the third partition plate (5), so that the external electromagnetic compatibility and the air tightness of the system are improved; the module (9) is installed on a mother board in the case through a guide rail and locked by a locker, the radiating fins (10) are cold ends of radiating structures of the module (9), and the radiating fins (10) are adjacent to the air duct (8); the fan (11) is arranged on the chassis frame, and the heat is taken out of the system through the air outlet opposite to the chassis frame (1).

2. The low-thermal resistance channel sealing type standard aircraft case as claimed in claim 1, wherein the module (9) comprises a printed board (16), a cold board (18), a flexible heat conducting gasket (17), a heat pipe (14) and a sealing board structure (15), the printed board (16) and the cold board (18) are installed together, a printed board heating device is pressed against the cold board (18) through the flexible heat conducting gasket (17), and the heat conducting gasket is used for reducing the contact thermal resistance between a printed board heating chip shell and a cold board heat transfer surface; the cooling plate is welded with the heat pipe (14), the other end of the heat pipe (14) is welded with the radiating fin (10), a sealing plate (15) is arranged between the cooling plate (18) and the radiating fin (10), and the sealing plate (15) is inserted into a groove structure on the partition plate (3) along with the module (9) and is matched with the first partition plate (3) to realize the isolation and sealing of the case air channel and the electric appliance structure.

3. The hermetically sealed standard aircraft casing of claim 1, wherein said heat pipes (14) are conventional

The sintered heat pipe is flattened to a thickness of 3 mm.

4. The low thermal resistance channel sealing type standard aircraft case as claimed in claim 1, wherein the heat dissipation fins (10) are made of copper, the thickness is 0.8mm, and the number and spacing of the fins can be adjusted according to the heat consumption of the chip; the outer side of the fin is provided with a protective enclosure frame for protecting the safety of personnel during transportation of the module; each fin through heat pipe is manufactured by local bending process and is welded with the heat pipe (14) by aluminum brazing, thus ensuring good heat conductivity.