CN209517846U - Heat dissipation system - Google Patents
Heat dissipation system Download PDFInfo
- Publication number
- CN209517846U CN209517846U CN201920010553.3U CN201920010553U CN209517846U CN 209517846 U CN209517846 U CN 209517846U CN 201920010553 U CN201920010553 U CN 201920010553U CN 209517846 U CN209517846 U CN 209517846U
- Authority
- CN
- China
- Prior art keywords
- heat pipe
- heat
- cooling system
- hole
- heat source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 11
- 238000001816 cooling Methods 0.000 claims description 55
- 239000002826 coolant Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 102100030346 Antigen peptide transporter 1 Human genes 0.000 description 3
- 101000652570 Homo sapiens Antigen peptide transporter 1 Proteins 0.000 description 3
- 101001080484 Homo sapiens DNA replication complex GINS protein PSF1 Proteins 0.000 description 3
- 101100365087 Arabidopsis thaliana SCRA gene Proteins 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 101000668165 Homo sapiens RNA-binding motif, single-stranded-interacting protein 1 Proteins 0.000 description 2
- 102100039692 RNA-binding motif, single-stranded-interacting protein 1 Human genes 0.000 description 2
- 101150105073 SCR1 gene Proteins 0.000 description 2
- 101100134054 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) NTG1 gene Proteins 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- CVOFKRWYWCSDMA-UHFFFAOYSA-N 2-chloro-n-(2,6-diethylphenyl)-n-(methoxymethyl)acetamide;2,6-dinitro-n,n-dipropyl-4-(trifluoromethyl)aniline Chemical compound CCC1=CC=CC(CC)=C1N(COC)C(=O)CCl.CCCN(CCC)C1=C([N+]([O-])=O)C=C(C(F)(F)F)C=C1[N+]([O-])=O CVOFKRWYWCSDMA-UHFFFAOYSA-N 0.000 description 1
- 102100030343 Antigen peptide transporter 2 Human genes 0.000 description 1
- 101000652582 Homo sapiens Antigen peptide transporter 2 Proteins 0.000 description 1
- 101000736065 Homo sapiens DNA replication complex GINS protein PSF2 Proteins 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat dissipation system is suitable for a portable electronic device with a shell, and the shell is provided with a through hole. The heat dissipation system comprises a first heat dissipation sheet, a heat pipe and a connector. The first heat sink is used for contacting the first heat source to conduct heat energy of the first heat source. At least a part of the heat pipe is arranged in the shell and is in contact with the first radiating fin so as to conduct heat energy from the first radiating fin. The heat pipe penetrates through the through hole to expose the first flat surface and is used for being in contact with a second flat surface of an external heat pipe of an external heat dissipation system. The connector is arranged in the through hole in a penetrating mode and used for fixing the heat pipe in the through hole.
Description
Technical field
The utility model relates to a kind of cooling systems, and in particular to a kind of heat dissipation system for being built into portable electronic device
System.
Background technique
In portable electronic device (such as laptop), traditional heat dissipation design is to overlap heat using copper heat pipe
Source (such as central processing unit and/or graphics processing unit), the thermal energy of heat source is passed to fin by heat pipe, then by fan
Take thermal energy out of portable electronic device.However, being limited to the space configuration of portable electronic device, built-in heat dissipation is limited
System also limits the efficiency of portable electronic device.
Utility model content
The utility model provides a kind of cooling system, can connect built-in cooling system with external heat removal system, to mention
High whole heat-sinking capability.
The cooling system of the utility model, suitable for the portable electronic device with shell, and shell has through-hole.
Cooling system includes the first cooling fin, heat pipe and connector.First cooling fin is to contact the first heat source to conduct the first heat source
Thermal energy.At least part of heat pipe is configured in shell, and is contacted with the first cooling fin, comes from the first cooling fin with conduction
Thermal energy.Heat pipe break-through crosses through-hole and exposes the first flat surface, flat with the second of the external heat pipe of external heat removal system
Face contact.Connector is arranged in through-hole, heat pipe is fixed on through-hole.
In an embodiment of the utility model, cooling system further includes radiator fan, is radiated to opposite heat tube.
In an embodiment of the utility model, radiator fan is configured at the one end of heat pipe with respect to the first flat surface.
In an embodiment of the utility model, the first fin arrangement is between the first flat surface and radiator fan.
In an embodiment of the utility model, cooling system further includes at least one screw hole locking part, the company of being configured at
It connects on device, to adapt at least one screw locking part of external heat removal system.
In an embodiment of the utility model, the first heat source is central processing unit or graphics processing unit.
In an embodiment of the utility model, cooling system further includes the second cooling fin, to contact Secondary Heat Source and
Heat pipe is to conduct the thermal energy of the first heat source to heat pipe.
In an embodiment of the utility model, the first heat source and Secondary Heat Source are respectively at central processing unit and drawing
Manage unit.
In an embodiment of the utility model, heat pipe has an at least chamber, and chamber is full of coolant liquid.
In an embodiment of the utility model, the first flat surface of heat pipe is to complete with the second flat surface of external heat pipe
The touching of full weight splice grafting.
Based on above-mentioned, in the cooling system of the utility model embodiment, one end of heat pipe can be exposed to the through-hole of shell,
So that in the external heat pipe contact of heat pipe and external heat removal system.Whereby, whole heat-sinking capability can be improved.
In order to make the above-mentioned features and advantages of the utility model more obvious and understandable, special embodiment below, and cooperate attached drawing
It is described in detail below.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the cooling system according to an embodiment of the present invention；
Fig. 2 is that the heat pipe of foundation an embodiment of the present invention is located at the diagrammatic cross-section near through-hole.
Specific embodiment
Fig. 1 is the structural schematic diagram of the cooling system according to an embodiment of the present invention.Fig. 1 is please referred to, in this implementation
In example, cooling system 100 is suitable for the portable electronic device 10 with shell 11, and including the first cooling fin 110, second
Cooling fin 120 and heat pipe 130, wherein shell 11 has through-hole VA1.First cooling fin 110 is to contact the first heat source H S1 to pass
Lead the thermal energy of the first heat source H S1.Second cooling fin 120 is to contact Secondary Heat Source HS2 to conduct the thermal energy of Secondary Heat Source HS2.
At least part of heat pipe 130 is configured in shell 11.The heat pipe 130 being configured inside shell 11 and the first heat dissipation
Piece 110 contacts, and to conduct the thermal energy from the first cooling fin 110, that is, the first cooling fin 110 is to conduct the first heat source H S1
Thermal energy to heat pipe 130；Also, it is configured at the heat pipe 130 inside shell 11 to contact with the second cooling fin 120, be come from conduction
The thermal energy of second cooling fin 120, that is, the second cooling fin 120 is to conduct the thermal energy of Secondary Heat Source HS2 to heat pipe 130.
On the other hand, the heat pipe 130 of part can penetrated through via holes VA1 to be exposed to the outside of shell 11 so that heat pipe 130 can
It is contacted by through-hole VA1 with external heat removal system 20, wherein heat pipe 130 is shown here to protrude through-hole VA1, but in other implementations
In example, heat pipe 130 can non-bulging through-hole VA1.Furthermore, it is understood that one end that heat pipe 130 protrudes from (or being exposed to) through-hole VA1 can
To be contacted with the external heat pipe PHX of external heat removal system 20, extremely by the thermal energy conduction of the first heat source H S1 and Secondary Heat Source HS2
External heat removal system 20.
Radiator fan 140 contact heat pipe 130, radiate to opposite heat tube 130, wherein radiator fan 140 including, for example,
Fan 141 and fin 142.Fin 142 contacts heat pipe 130 to disperse the thermal energy that heat pipe 130 is conducted, and fan 141 is then to fin
142 provide air-flow, to take away the thermal energy that fin 142 is dispersed.Also, radiator fan 140 can correspond in heat pipe 130 relative to
It is configured with the other end of the one end contacted external heat pipe PHX, that is, the first cooling fin 110 and the second cooling fin 120 can match
It is placed between heat pipe 130 and the outside one end contacted heat pipe PHX and radiator fan 140, but the utility model embodiment is not with this
It is limited.
In the present embodiment, the first heat source H S1 can be one of central processing unit and graphics processing unit, the
Two heat source H S2 can be the wherein another of central processing unit and graphics processing unit, but the utility model embodiment is not with this
It is limited.In some embodiments, the first heat source H S1 and/or Secondary Heat Source HS2 can be the storage in portable electronic device 10
Device device (not shown) and/or controller (not shown).As an example it is assumed that portable electronic device 10 is laptop,
Then the first heat source H S1 and/or Secondary Heat Source HS2 can be the platform path controller (PCH) on mainboard and/or be inserted on mainboard
Memory module.
From the point of view of on the other hand, portable electronic device 10 can configure at least one cooling system 100 described above；
Alternatively, the heat pipe 130 of the cooling system 100 in portable electronic device 10 can contact simultaneously three or more cooling fins (such as
First cooling fin 110, the second cooling fin 120), to be carried out simultaneously to more multi-heat source (such as the first heat source H S1, Secondary Heat Source HS2)
Heat dissipation.Certainly, depending on circuit design, the cooling system 100 in portable electronic device 10 can also only use the first heat source H S1
And one of Secondary Heat Source HS2.
Class N shape is presented in the shape of the present embodiment, heat pipe 130, but according to heat source (such as the first heat source H S1, Secondary Heat Source
HS2 position), the shape of heat pipe 130 can be L shape, L like shape, U-shaped, U-like shape, vertical bar shaped or other arbitrary shapes, this is practical
New embodiment is not to be limited.Also, the material of heat pipe 130 can be copper, aluminium, titanium or other high-thermal conductive metals or alloy, sheet
Utility model embodiment is not limited.
In the embodiments of the present invention, external heat removal system 20 can be the cooling system of any type and grade, example
Water-cooled, ventilation type, cold core chip in this way.
Fig. 2 is that the heat pipe of foundation an embodiment of the present invention is located at the diagrammatic cross-section near through-hole.Please refer to Fig. 1 and
Fig. 2, in the present embodiment, heat pipe 130 expose the first flat surface PSF1 by through-hole VA1, with external heat removal system 20
The second flat surface PSF2 of external heat pipe PHX is completely coincident contact.In other words, radiator fan 140 corresponds to opposite in heat pipe 130
It is configured in one end of the first flat surface PSF1, and to be configured at first flat for the first cooling fin 110 and the second cooling fin 120
Between face PSF1 and radiator fan 140.
Also, cooling system 100 may also include connector HPT and screw hole locking part SH1, SH2.Connector HPT is worn
In on through-hole VA1, and heat pipe 130 is fixed on VA1 on through-hole.Screw hole locking part SH1, SH2 configure the connector
On HPT, to adapt to the screw locking part (such as SCR1, SCR2) of external heat removal system 20.Wherein, depending on structure design,
The quantity of screw hole locking part (such as SH1, SH2) can be one or three, and accordingly, the screw of external heat removal system 20
The quantity of locking part (such as SCR1, SCR2) can be one or three.
As shown in Fig. 2, heat pipe 130 is, for example, to have chamber 130S, and chamber 130S can be full of coolant liquid.Certainly, depending on
Depending on structure design, the quantity of chamber (such as 130S) can be multiple.
In conclusion one end of heat pipe can be exposed to the through-hole of shell in the cooling system of the utility model embodiment,
So that can be with the external heat pipe contact of external heat removal system in heat pipe.Whereby therefore, whole heat-sinking capability can be improved.
Although the utility model is disclosed as above with embodiment, so it is not intended to limit the utility model, any affiliated
Technical staff in technical field, in the conception and scope for not departing from the utility model, when can make a little variation and retouching, therefore
The protection scope of the utility model is subject to view those as defined in claim.
Claims (10)
1. a kind of cooling system, suitable for the portable electronic device with shell, and the shell has through-hole, feature
It is, the cooling system includes:
First cooling fin conducts the thermal energy of first heat source to contact the first heat source；
Heat pipe is configured at least partially in the shell, and is contacted with first cooling fin, with conduction from described the
The thermal energy of one cooling fin, the excessively described through-hole of heat pipe break-through and expose the first flat surface, to external heat removal system
The flat face contact of the second of external heat pipe；And
Connector is arranged in the through-hole, the heat pipe is fixed on the through-hole.
2. cooling system according to claim 1, which is characterized in that further include radiator fan, to the heat pipe into
Row heat dissipation.
3. cooling system according to claim 2, which is characterized in that the radiator fan is configured at the heat pipe with respect to institute
State one end of the first flat surface.
4. cooling system according to claim 2, which is characterized in that first fin arrangement is flat in described first
Between face and the radiator fan.
5. cooling system according to claim 1, which is characterized in that it further include at least one screw hole locking part, configuration
In on the connector, to adapt at least one screw locking part of the external heat removal system.
6. cooling system according to claim 1, which is characterized in that first heat source is central processing unit or drawing
Processing unit.
7. cooling system according to claim 1, which is characterized in that further include the second cooling fin, to contact the second heat
Source and the heat pipe are to conduct the thermal energy of first heat source to the heat pipe.
8. cooling system according to claim 7, which is characterized in that first heat source and the Secondary Heat Source are respectively
Central processing unit and graphics processing unit.
9. cooling system according to claim 1, which is characterized in that the heat pipe has an at least chamber, and described
Chamber is full of coolant liquid.
10. cooling system according to claim 1, which is characterized in that first flat surface of the heat pipe to
Second flat surface of the external heat pipe is completely coincident contact.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107200320U TWM560043U (en) | 2018-01-08 | 2018-01-08 | Heat dissipation system |
| TW107200320 | 2018-01-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209517846U true CN209517846U (en) | 2019-10-18 |
Family
ID=62950022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920010553.3U Active CN209517846U (en) | 2018-01-08 | 2019-01-04 | Heat dissipation system |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN209517846U (en) |
| TW (1) | TWM560043U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI662218B (en) * | 2018-06-04 | 2019-06-11 | 訊凱國際股份有限公司 | Connector assembly |
-
2018
- 2018-01-08 TW TW107200320U patent/TWM560043U/en not_active IP Right Cessation
-
2019
- 2019-01-04 CN CN201920010553.3U patent/CN209517846U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWM560043U (en) | 2018-05-11 |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |