TWM560043U - Heat dissipation system - Google Patents

Abstract

A heat dissipation system suited to a portable electronic device having a housing is provided, and the housing has a through hole. The heat dissipation system includes a first heat sink, a heat pipe and a connector. The first heat sink is configured to contact a first heat source to conduct thermal energy of the first heat source. The heat pipe is disposed in the housing and is partially in contact with the first heat sink to conduct thermal energy from the first heat sink. The heat pipe penetrates through the through hole to expose a first flat surface which touches a second flat surface of an external heat pipe of an external heat dissipation system. The connector is inserted through the through hole to fix the heat pipe to the through hole.

Description

cooling system

The present invention relates to a heat dissipation system, and more particularly to a heat dissipation system built into a portable electronic device.

In a portable electronic device (such as a notebook computer), the conventional heat dissipation design uses a copper heat pipe to connect a heat source (such as a central processing unit and/or a graphics processing unit) to transmit heat energy of the heat source to the fins through the heat pipe. The fan then carries the thermal energy out of the portable electronic device. However, limited by the space configuration of the portable electronic device, the built-in heat dissipation system is limited, and the performance of the portable electronic device is also limited.

The novel creation provides a heat dissipation system that connects the built-in heat dissipation system to an external heat dissipation system to improve overall heat dissipation.

The heat dissipation system created by the present invention is suitable for a portable electronic device having a housing, and the housing has a through hole. The heat dissipation system includes a first heat sink, a heat pipe, and a connector. The first heat sink is configured to contact the first heat source to conduct thermal energy of the first heat source. The heat pipe is disposed in the housing and is in contact with the first heat sink to conduct heat energy from the first heat sink. The heat pipe penetrates the through hole to expose the first flat surface that is in full contact with the second flat surface of the outer heat pipe of the external heat dissipation system. The connector is disposed through the through hole for fixing the heat pipe to the through hole.

Based on the above, in the heat dissipation system of the present creative embodiment, one end of the heat pipe may be exposed to the through hole of the casing to bring the heat pipe into contact with the external heat pipe of the external heat dissipation system. Thereby, the overall heat dissipation capability can be improved.

The above described features and advantages of the present invention will become more apparent and understood from the following description.

1 is a schematic structural view of a heat dissipation system according to an embodiment of the present invention. Referring to FIG. 1 , in the embodiment, the heat dissipation system 100 is applicable to the portable electronic device 10 having the housing 11 , and includes a first heat sink 110 , a second heat sink 120 , and a heat pipe 130 , wherein the housing 11 has Through hole VA1. The first heat sink 110 is configured to contact the first heat source HS1 to conduct heat energy of the first heat source HS1. The second heat sink 120 is configured to contact the second heat source HS2 to conduct heat energy of the second heat source HS2.

At least a portion of the heat pipe 130 is disposed within the housing 11. The heat pipe 130 disposed in the inner portion of the housing 11 is in contact with the first heat sink 110 to conduct heat energy from the first heat sink HS1, that is, the first heat sink 110 is configured to conduct heat energy of the first heat source HS1 to 130 heat pipes; The heat pipe 130 disposed in the inner portion of the casing 11 is in contact with the second heat sink 120 to conduct heat energy from the second heat sink HS2, that is, the second heat sink 120 is configured to conduct heat energy of the second heat source HS2 to 130 heat pipes.

On the other hand, a portion of the heat pipe 130 can penetrate the through hole VA1 to be exposed to the outside of the casing 11 so that the heat pipe 130 can be in contact with the external heat dissipation system 20 through the through hole VA1, wherein the heat pipe 130 is shown as a convex passage. Hole VA1, but in other embodiments, heat pipe 130 may not protrude through hole VA1. Further, one end of the heat pipe 130 protruding (or exposed) to the through hole VA1 may be in contact with the external heat pipe PHX of the external heat dissipation system 20 to conduct the heat energy of the first heat source HS1 and the second heat source HS2 to the external heat dissipation system 20 .

The heat dissipation fan 140 contacts the heat pipe 130 for dissipating heat from the heat pipe 130. The heat dissipation fan 140 includes, for example, a fan 141 and fins 142. The fins 142 contact the heat pipe 130 to dissipate the heat energy conducted by the heat pipe 130, and the fan 141 provides an air flow to the fins 142 to take away the heat energy dispersed by the fins 142. Moreover, the heat dissipating fan 140 may be disposed corresponding to the other end of the heat pipe 130 opposite to the end of the heat pipe PHX, that is, the first heat sink 110 and the second heat sink 120 may be disposed in the heat pipe 130 in contact with the external heat pipe PHX. Between one end and the heat dissipation fan 140, the embodiment of the present invention is not limited thereto.

In this embodiment, the first heat source HS1 may be one of a central processing unit and a graphics processing unit, and the second heat source HS2 may be one of the central processing unit and the graphics processing unit, but the embodiment of the present invention does not Limited. In some embodiments, the first heat source HS1 and/or the second heat source HS2 may be a memory device (not shown) and/or a controller (not shown) in the portable electronic device 10. For example, if the portable electronic device 10 is a notebook computer, the first heat source HS1 and/or the second heat source HS2 may be a platform path controller (PCH) on the motherboard and/or inserted on the motherboard. Memory module.

On the other hand, the portable electronic device 10 can be configured with at least one of the heat dissipation systems 100 described above; or the heat pipe 130 of the heat dissipation system 100 in the portable electronic device 10 can simultaneously contact three or more heat dissipation systems. A sheet (such as the first heat sink 110 and the second heat sink 120) is used to dissipate heat from more heat sources (such as the first heat source HS1 and the second heat source HS2). Of course, depending on the circuit design, the heat dissipation system 100 in the portable electronic device 10 can also use only one of the first heat source HS1 and the second heat source HS2.

In this embodiment, the shape of the heat pipe 130 is N-shaped, but according to the position of the heat source (such as the first heat source HS1 and the second heat source HS2), the shape of the heat pipe 130 may be L-shaped, L-shaped, U-shaped, or U-like. The embodiment of the present invention is not limited to a shape, a straight strip shape or any other shape. Moreover, the material of the heat pipe 130 may be copper, aluminum, titanium or other high thermal conductivity metal or alloy, which is not limited thereto.

In an embodiment of the invention, the external heat dissipation system 20 can be any type and class of heat dissipation systems, such as water-cooled, air-cooled, and refrigerated wafers.

2 is a schematic cross-sectional view of a heat pipe in the vicinity of a through hole according to an embodiment of the present invention. Referring to FIG. 1 and FIG. 2 , in the present embodiment, the heat pipe 130 exposes the first flat surface PSF1 through the through hole VA1 to completely coincide with the second flat surface PSF2 of the external heat pipe PHX of the external heat dissipation system 20 . In other words, the heat dissipation fan 140 is disposed corresponding to one end of the heat pipe 130 with respect to the first flat surface PSF1 , and the first heat dissipation fins 110 and the second heat dissipation fins 120 are disposed between the first flat surface PSF1 and the heat dissipation fan 140 .

Moreover, the heat dissipation system 100 can further include a connector HPT and screw hole locks SH1, SH2. The connector HPT is disposed on the through hole VA1 and is used to fix the heat pipe 130 to the through hole VA1. The screw hole locks SH1, SH2 are configured on the connector HPT for fitting the screw locks (such as SCR1, SCR2) of the external heat dissipation system 20. Wherein, depending on the structural design, the number of screw hole locks (such as SH1, SH2) may be one or three, and correspondingly, the number of screw locks (such as SCR1, SCR2) of the external heat dissipation system 20 may be one. Or three.

As shown in FIG. 2, the heat pipe 130 has, for example, a chamber 130S, and the chamber 130S can be filled with a coolant. Of course, depending on the structural design, the number of chambers (such as 130S) can be multiple.

In summary, in the heat dissipation system of the present creative embodiment, one end of the heat pipe can be exposed to the through hole of the casing so that the heat pipe can be in contact with the external heat pipe of the external heat dissipation system. Thereby, the overall heat dissipation capability can be improved.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the novel creation, and any person skilled in the art can make some changes without departing from the spirit and scope of the novel creation. Retouching, the scope of protection of this new creation is subject to the definition of the scope of the patent application attached.

10‧‧‧Portable electronic devices
11‧‧‧Shell
20‧‧‧External heat dissipation system
100‧‧‧heating system
110‧‧‧First heat sink
120‧‧‧second heat sink
130‧‧‧heat pipe
130S‧‧‧室
140‧‧‧ cooling fan
141‧‧‧Fan
142‧‧‧Fins
HPT‧‧‧ connector
HS1‧‧‧ first heat source
HS2‧‧‧second heat source
PHX‧‧‧External heat pipe
PSF1‧‧‧ first flat surface
PSF2‧‧‧Second flat surface
SCR1, SCR2‧‧‧ screw lock firmware
SH1, SH2‧‧‧ screw hole lock column
VA1‧‧‧through hole

1 is a schematic structural view of a heat dissipation system according to an embodiment of the present invention. 2 is a schematic cross-sectional view of a heat pipe in the vicinity of a through hole according to an embodiment of the present invention.

Claims (10)

A heat dissipation system is applicable to a portable electronic device having a housing, and the housing has a through hole, including: a first heat sink for contacting a first heat source to conduct heat energy of the first heat source; a heat pipe disposed at least in the housing and in contact with the first heat sink to conduct heat energy from the first heat sink, the heat pipe penetrating through the through hole to expose a first flat surface for a second flat surface of an external heat pipe of the external heat dissipation system; and a connector disposed through the through hole for fixing the heat pipe to the through hole. The heat dissipation system of claim 1, further comprising a heat dissipation fan for dissipating heat from the heat pipe. The heat dissipation system of claim 2, wherein the heat dissipation fan is disposed at one end of the heat pipe opposite to the first flat surface. The heat dissipation system of claim 2, wherein the first heat sink is disposed between the first flat surface and the heat dissipation fan. The heat dissipation system of claim 1, further comprising at least one screw hole locking member disposed on the connector for adapting to at least one screw lock of the external heat dissipation system. The heat dissipation system of claim 1, wherein the first heat source is a central processing unit or a graphics processing unit. The heat dissipation system of claim 1, further comprising a second heat sink for contacting a second heat source and the heat pipe to conduct heat energy of the first heat source to the heat pipe. The heat dissipation system of claim 7, wherein the first heat source and the second heat source are a central processing unit and a graphics processing unit, respectively. The heat dissipation system of claim 1, wherein the heat pipe has at least one chamber, and the chamber is filled with a coolant. The heat dissipation system of claim 1, wherein the first flat surface of the heat pipe is in full contact with the second flat surface of the outer heat pipe.