TWI658778B - Electronic assembly - Google Patents

Abstract

An electronic assembly includes a heating element, a thermally conductive carrier, and a thermally conductive locking seat. The heat-conducting carrier is used for carrying the heating element and is thermally coupled with the heating element. The thermally conductive lock attachment seat is connected to the thermally conductive carrier and is thermally coupled with the thermally conductive carrier.

Description

Electronic assembly

The present invention relates to an electronic assembly, and more particularly, to an electronic assembly with good heat dissipation performance.

With the development of science and technology, most electronic products have multi-function processing and high-speed computing performance, and in order to facilitate users to carry around, most electronic products are designed to be thin and light. Therefore, during the operation of electronic products, how to quickly dissipate the heat generated by the internal electronic components during operation to the outside has become a part of relevant manufacturers' active research.

The heat dissipation design commonly used in existing electronic products can be roughly divided into two categories: forced cooling and natural cooling. Taking forced cooling as an example, there is a fan inside the electronic product to generate forced convection, and the outer shell of the electronic product is provided with cooling holes, so it can Through the circulation of the airflow, the heat generated during the operation of the electronic components is discharged to the outside through the heat dissipation holes. Although the forced cooling design can achieve better heat dissipation efficiency, it is more difficult to meet the thin and thin design requirements, and foreign objects and water vapor from the outside easily enter the electronic product through the heat dissipation holes of the casing. Taking natural heat dissipation as an example, heat dissipation elements such as heat pipes, fins, or fins are provided inside the electronic product, and the outer shell of the electronic product is provided with heat dissipation holes, and the heat dissipation element is thermally coupled to the electronic component to generate the heat generated by the electronic component during operation The heat is conducted and conducted to the heat dissipation hole, so that the heat is discharged to the outside through the heat dissipation hole by natural convection. Although the design of natural heat dissipation can better meet the design requirements of thin and light, the heat dissipation rate is poor, and foreign objects and moisture from the outside easily enter the electronic product through the heat dissipation holes of the casing.

The invention provides an electronic assembly, which has good heat dissipation efficiency.

An electronic assembly according to an embodiment of the present invention includes a heating element, a thermally conductive carrier, and a thermally conductive locking seat. The heat-conducting carrier is used for carrying the heating element and is thermally coupled with the heating element. The thermally conductive lock attachment seat is connected to the thermally conductive carrier and is thermally coupled with the thermally conductive carrier.

Based on the above, the electronic assembly of the present invention is composed of a thermally conductive carrier and a thermally conductive attachment seat, and a heat conduction path is formed, and the heat generated during the operation of the heating element can be quickly discharged to the outside through this heat conduction path. Therefore, the electronic assembly of the present invention Has good heat dissipation performance.

In order to make the above features and advantages of the present invention more comprehensible, embodiments are hereinafter described in detail with reference to the accompanying drawings.

FIG. 1 is a schematic cross-sectional view of an electronic assembly according to a first embodiment of the present invention. Please refer to FIG. 1. In this embodiment, the electronic assembly 100 is, for example, a smart phone, a camera, a tablet, or a display. The electronic assembly 100 includes a heating element 110, a thermally conductive carrier 120, and a thermally conductive lock base 130. For example, the heating element 110 is, for example, a graphics chip, a central processing unit, a lens module, a circuit board, or other electronic components that generate heat during operation. On the other hand, the thermally conductive carrier 120 is used to carry the heating element 110, wherein the heating element 110 can be fixed on the thermally conductive carrier 120 by means of locking, welding, riveting, snapping or pasting, and the heating element 110 is thermally coupled to heat conduction Carrying member 120. Therefore, the heat generated during the operation of the heating element 110 can be conducted to the thermally conductive carrier 120, wherein the thermally conductive carrier 120 can be made of a thermally conductive metal, a thermally conductive alloy, or other materials with high thermal conductivity.

The thermally conductive lock attachment base 130 is connected to the thermally conductive carrier 120. The thermally conductive lock attachment base 130 can be fixed to one side of the thermally conductive carrier 120 by means of locking, welding, riveting, snapping or pasting, and the thermally conductive lock attachment base 130 is thermally coupled.接 热 载 载 件 120。 Connected thermally conductive member 120. Therefore, the heat generated during the operation of the heating element 110 can be conducted to the thermally conductive carrier 120 and then to the thermally conductive lock base 130. The thermally conductive lock base 130 can be made of thermally conductive metal, thermally conductive alloy, or other materials with high thermal conductivity. Made. Further, the electronic assembly 100 further includes a housing 140 for covering at least a part of the heating element 110, at least a part of the thermally conductive carrier 120 and at least a part of the thermally conductive locking base 130. In this embodiment, the heating element 110 is completely covered by the casing 140, but in other embodiments, a corresponding opening may be opened in the casing according to the setting requirements, so that the heating element is partially exposed outside the casing. On the other hand, the heat conductive lock base 130 is penetrated on one side of the housing 140, that is, the housing 140 is provided with a perforation 141, wherein the perforation 141 is aligned with the lock hole 1301 of the heat conductive lock base 130 to make the lock The internal thread 131 in the hole 1301 is exposed outside the housing 140. Therefore, the heat conducted to the thermally conductive lock base 130 can be further discharged to the outside through the through hole 141 of the housing 140.

In short, based on the thermal conduction path formed by the thermally conductive carrier 120 and the thermally conductive lock base 130, the heat generated during the operation of the heating element 110 can be quickly discharged to the outside via this thermal conduction path, and other components of the housing 140 can be reduced. The number of openings (for example, heat dissipation holes), or other openings (for example, heat dissipation holes) need not be provided in the casing 140, so as to improve the ability of the electronic assembly 100 to block foreign objects and water vapor.

Other embodiments will be listed below for illustration. It must be noted here that the following embodiments use the component numbers and parts of the foregoing embodiments, in which the same reference numerals are used to indicate the same or similar components, and the description of the same technical content is omitted. For the description of the omitted parts, reference may be made to the foregoing embodiments, and the following embodiments are not repeated.

FIG. 2 is a schematic cross-sectional view of an electronic assembly according to a second embodiment of the present invention. Please refer to FIG. 2. In this embodiment, the electronic assembly 100A is slightly different from the electronic assembly 100. The main difference is that the electronic assembly 100A includes a thermally conductive bracket 210, which can be a tripod, a hanger or a support. Further, the heat conductive bracket 210 has a locking portion 211, wherein the locking portion 211 is used to lock into the heat conductive lock base 130, and an external thread 212 of the lock portion 211 is engaged with an internal thread 131 of the heat conductive lock base 130. The thermally conductive bracket 210 can be made of a thermally conductive metal, a thermally conductive alloy, or other materials with a high thermal conductivity, and is thermally coupled to the thermally conductive locking base 130 through the locking portion 211. Therefore, the heat generated during the operation of the heating element 110 can be conducted to the outside through the heat conductive carrier 120, the heat conductive lock base 130, and the lock portion 211 in sequence, and the heat conductive bracket 210 has a large heat exchange area, which helps to improve the electronics. 100A cooling performance.

3 is a schematic cross-sectional view of an electronic assembly according to a third embodiment of the present invention. Please refer to FIG. 3. The electronic assembly 100B of this embodiment is slightly different from the electronic assembly 100 of the first embodiment. The main difference is that the thermally conductive lock base 130 a is embedded in the thermally conductive carrier 120 a. Further, the heat conductive lock base 130a is penetrated on one side of the heat conductive carrier 120a, and the heat conductive carrier 120a has a lock hole 121 for the heat conductive lock base 130a to be locked therein. The lock hole 121 is aligned with the through hole 141 of the housing 140, wherein the thermally conductive lock attachment base 130a also has an external thread 132 relative to the internal thread 131, and the external thread 132 and the lock of the thermally conductive lock attachment base 130a locked in the lock hole 121 The internal thread 122 in the hole 121 is engaged. It is specifically noted that the electronic assembly 100B can also be combined with the heat conducting bracket 210 of the second embodiment.

4 is a schematic cross-sectional view of an electronic assembly according to a fourth embodiment of the present invention. Please refer to FIG. 4. The electronic assembly 100C of this embodiment is slightly different from the electronic assembly 100 of the first embodiment. The main difference is that the thermally conductive lock base 130b is integrally formed on one side of the thermally conductive carrier 120b, that is, The thermally conductive lock attachment base 130b belongs to a part of the thermally conductive carrier 120b. For example, the locking hole 1301 of the thermally conductive lock attachment base 130b and the internal thread 131 therein can be formed on one side of the thermally conductive carrier 120b through mechanical drilling or other drilling methods. It is specifically noted that the electronic assembly 100C can also be combined with the heat conducting bracket 210 of the second embodiment.

To sum up, the electronic assembly of the present invention comprises a thermally conductive carrier and a thermally conductive locking seat to form a heat conduction path, and the heat generated during the operation of the heating element can be quickly discharged to the outside through the aforementioned heat conduction path. Therefore, the electronics of the present invention The assembly has good heat dissipation performance. Based on the design of the heat conduction path, the number of other openings (such as heat dissipation holes) in the housing can be reduced, or no other openings (such as heat dissipation holes) need to be opened in the housing, so that the electronic assembly of the present invention has a good The ability to block foreign objects and water vapor. On the other hand, the electronic assembly can be equipped with a thermally conductive bracket to form another thermal conduction path by a thermally conductive carrier, a thermally conductive lock base, and a thermally conductive bracket. The thermally conductive bracket has a large heat exchange area, which helps improve the electronic assembly's Thermal efficiency.

Although the present invention has been disclosed as above with the examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some modifications and retouching without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be determined by the scope of the attached patent application.

100, 100A ~ 100C‧‧‧Electronic assembly

110‧‧‧Heating element

120, 120a, 120b ‧‧‧ Thermally conductive carrier

121, 1301‧‧‧‧ keyhole

122, 131‧‧‧ Internal thread

130, 130a, 130b ‧‧‧ Thermal lock attachment

132, 133, 212‧‧‧ external thread

140‧‧‧shell

141‧‧‧perforation

210‧‧‧Heat conduction bracket

211‧‧‧Locking Department

FIG. 1 is a schematic cross-sectional view of an electronic assembly according to a first embodiment of the present invention. FIG. 2 is a schematic cross-sectional view of an electronic assembly according to a second embodiment of the present invention. 3 is a schematic cross-sectional view of an electronic assembly according to a third embodiment of the present invention. 4 is a schematic cross-sectional view of an electronic assembly according to a fourth embodiment of the present invention.

Claims (6)

An electronic assembly includes: a heating element; a heat-conducting carrier for carrying the heat-generating element and being thermally coupled with the heating element; a heat-conducting locking base connected to the heat-conducting carrier and connected to the heat-conducting carrier Thermally coupled; and a thermally conductive bracket having a locking portion, wherein the locking portion is used to lock into the thermally conductive locking base, and an external thread of the locking portion is in phase with an internal thread of the thermally conductive locking base Mesh. The electronic assembly according to item 1 of the scope of patent application, further comprises: a casing for covering at least a part of the heating element, the heat-conducting carrier and at least a part of the heat-conducting locking seat. The electronic assembly according to item 2 of the scope of the patent application, wherein the heat conductive lock base is penetrated on one side of the housing, and the internal thread of the heat conductive lock base is exposed outside the housing. The electronic assembly according to item 2 of the scope of the patent application, wherein the thermally conductive locking base is integrally formed on one side of the thermally conductive carrier, and the casing has a perforation for exposing the internal thread. The electronic assembly according to item 1 of the scope of the patent application, wherein the thermally conductive lock attachment base is perforated on one side of the thermally conductive carrier, and the internal thread of the thermally conductive lock attachment base is exposed outside the thermally conductive carrier. The electronic assembly according to item 5 of the scope of patent application, an electronic assembly, comprising: a heating element; a thermally conductive carrier for carrying the heating element and being thermally coupled to the heating element; and a thermally conductive lock An attachment seat is passed through one side of the heat conductive carrier and is thermally coupled with the heat conduction carrier, wherein a first internal thread of the heat conduction lock attachment seat is exposed outside the heat conduction carrier, and the heat conduction carrier is A lock hole is provided on the side, and the thermally conductive lock attachment base has an external thread opposite to the first internal thread. The thermally conductive lock attachment base is locked into the lock hole, and the external thread and the lock hole of the thermally conductive attachment base. A second internal thread is engaged.