JP3225738U - Electronics - Google Patents

Abstract

Provided is an electronic device which is formed so as to obtain a high cooling effect by a cooling mechanism having a reduced thickness, makes a housing thinner, and can effectively cool an electronic component (GPU) that generates heat. An electronic device (1) includes a GPU (41) disposed on a heat conductive material plate, a heat sink (20) disposed on a bottom plate (11) adjacent to the GPU, and a heat sink provided on the heat sink and receiving air from outside. And a housing that houses a GPU, a heat sink, and a cooling fan therein and uses the heat conductive plate as a bottom plate. The housing has an intake hole 13a on the back surface, and the cooling fan draws air from the intake hole to cool the heat sink. In addition, the housing includes heat-dissipating fins 21 coupled to the heat-conducting plate, and both side walls of a heat-conducting member having exhaust holes 14a and 15a for exhausting air that has cooled the heat sink. [Selection diagram] FIG.

Description

  The present invention relates to an electronic device equipped with a cooling mechanism for cooling electronic components that generate heat therein.

  In recent years, in artificial intelligence, the use of performing processing using a GPU (Graphic Processing Unit) has been rapidly increasing. GPUs have a high processing capability in the field of artificial intelligence, and use 100 to 500 or more GPUs in one chip. In the past, computers using a CPU (Central Processing Unit) were the mainstream, but in the field of using artificial intelligence, computers using a CPU combined with a GPU are increasing.

The problem with electronic devices that use GPUs is that the GPU devices generate a very large amount of heat and develop a structure that shows how to perform effective heat treatment, miniaturize the electronic device, and keep it at a safe temperature. Is the thing.
That is, a technique is used in which a sufficiently large heat sink is installed for an electronic component that generates heat, or a heat sink is integrated with a heat sink, and a heated air is exhausted to the outside of the housing. Have been.

  For example, Patent Literature 1 discloses a cooling mechanism including a radiation fin, an airflow adjustment frame attached to the radiation fin, and a cooling fan attached to the airflow adjustment frame. According to the cooling mechanism of Patent Literature 1, the cooling fan rotates with respect to the radiation fins by the airflow adjusting frame, and the air inflow angle of the cooling fan can be adjusted.

Japanese Utility Model Registration No. 3172184

However, in the invention of Patent Literature 1, since the heat sink with the heat dissipation fan is provided on the GPU, the thickness of the housing is increased, and there is a disadvantage that the electronic device having the increased thickness restricts the installation place. .
Therefore, the present invention provides an electronic device that is formed so as to obtain a high cooling effect by a cooling mechanism having a reduced thickness, reduces the thickness of a housing, and effectively cools a GPU that generates heat. Make it an issue.

  The present invention provides a signal processing circuit disposed on a heat conductive plate, a heat sink disposed on the heat conductive plate adjacent to the signal processing circuit, and cooling provided for the heat sink and cooling the heat sink with air from outside. The housing includes a fan, a signal processing circuit, a cooling fan, and a heat sink housed therein, and a heat conductive plate serving as a bottom plate.

  With the configuration in which the signal processing circuit and the heat sink are arranged on the heat conductive plate, the thickness of the housing can be reduced.

  It is preferable that the housing has an intake hole on the back surface for inducting air into the inside, and the cooling fan intake air from the intake hole to cool the heat sink.

  With the above-described configuration having an intake hole for allowing air to be sucked into the inside of the rear surface, air can be sucked from the intake hole even when there is no gap between the electronic device and other electronic devices in the vertical direction depending on the installation location. .

  It is preferable that the housing includes both side walls of a heat conducting member having a radiation fin coupled to the heat conducting plate and an exhaust hole for exhausting air cooled from the heat sink.

  The above-mentioned housing is provided with both side walls of the heat conduction member having the heat radiation fins coupled to the heat conduction plate and the exhaust hole for exhausting the air that has cooled the heat sink. Even when there is no gap between the device and the like, air can be exhausted from the exhaust hole.

  It is preferable that the heat sink has a substantially concave shape when viewed from the front and has a concave groove in which a cooling fan can be arranged.

  Since the above-mentioned heat sink is formed with the concave groove portion in which the cooling fan can be arranged in a substantially concave shape when viewed from the front, the cooling fan can be accommodated and arranged in the concave groove portion, and the housing can be made thin.

  It is preferable that the heat sink provided with the cooling fan disposed in the housing has the rear side facing the intake hole and the left and right side surfaces facing the exhaust hole.

  Due to the configuration in which the rear of the heat sink provided with the cooling fan arranged in the above-mentioned housing faces the intake hole and the left and right sides face the exhaust hole, there is a gap between other electronic devices in the vertical direction depending on the installation location. Even when there is no air, the air can be efficiently sucked from the intake hole, the sucked air can be efficiently exhausted from the exhaust hole, and the heat can be discharged.

  It is preferable to provide a partition plate that prevents the air that has cooled the heat sink from flowing toward the signal processing circuit.

  With the configuration including the partition plate for preventing the air cooled from the heat sink from flowing to the signal processing circuit side, the air flowing out of the heat sink can be prevented from flowing to the signal processing circuit side, and the cooling effect by the cooling mechanism can be enhanced. it can.

  The partition plate preferably includes an upright wall portion that partitions between the signal processing circuit and the heat sink, and a top plate portion that extends horizontally from an upper end of the upright wall portion.

  With the configuration in which the partition plate includes the upright wall portion separating the signal processing circuit and the heat sink and the top plate portion extending horizontally from the upper end of the upright wall portion, the air flowing out of the heat sink by the upright wall portion flows to the signal processing circuit side. Can be prevented, and the heat released from the heat sink to the upper surface of the housing by the top plate portion can be prevented from being transferred.

  It is preferable that a board including a communication modem is provided on the signal processing circuit.

  The housing preferably has a USB terminal on the front.

  According to the present invention, it is possible to provide an electronic device that is formed so as to obtain a high cooling effect by a cooling mechanism having a reduced thickness, reduces the thickness of a housing, and can effectively cool a GPU that generates heat. it can.

FIG. 1 is a front perspective view of the electronic device of the present embodiment. FIG. 2 is an exploded perspective view of the electronic device of FIG. 1. FIG. 2 is a rear view of the electronic device of FIG. 1. FIG. 2 is a right side view of the electronic device in FIG. 1. FIG. 2 is a left side view of the electronic device in FIG. 1. FIG. 2 is a partially exploded perspective view for explaining a cooling mechanism of the electronic device of FIG. 1. FIG. 2 is another partially exploded perspective view for explaining a cooling mechanism of the electronic device of FIG. 1. FIG. 2 is an explanatory diagram for explaining a cooling mechanism of the electronic device in FIG. 1. FIG. 4 is an explanatory diagram of a comparative example of a cooling mechanism of the electronic device of the embodiment. FIG. 9 is an explanatory diagram of another comparative example of the cooling mechanism of the electronic device of the embodiment.

Hereinafter, an electronic device according to an embodiment of the present invention will be described with reference to FIGS.
The electronic device 1 according to the present embodiment performs face authentication and the like in a signal processing circuit based on image data from a connected digital camera, and transmits the authenticated metadata to a server. A housing 10, a first substrate 40 on which a signal processing circuit and a communication modem 42 are mounted, and a second substrate 50 on which connection terminals such as USB terminals 51 are mounted. .

The electronic device 1 has a cooling mechanism for cooling a signal processing circuit, particularly a heat-generating component such as the GPU 41 included in the signal processing circuit, inside the housing 10. Hereinafter, the GPU 41 will be described as an example of the heat generating member included in the signal processing circuit.
In the electronic device 1, the bottom plate 11 constituting the housing 10 is a heat conductive plate, and the GPU 41 is disposed on the bottom plate 11. Further, the heat sink 20 is disposed adjacent to the GPU 41 (adjacent to the rear side of the housing 10 in the example in the figure) and disposed on the bottom plate 11 and has a substantially concave shape in a front view, and the heat sink 20 is cooled by air from the outside. For this purpose, a cooling fan 30 arranged in the concave groove portion 22 of the heat sink 20 and a partition plate 60 for shutting off the GPU 41 and the heat sink 20 with respect to the flow of air are provided as constituent elements.
Thereby, heat generated inside the electronic device 1 can be efficiently radiated to the outside, and the inside of the electronic device 1 can be cooled. Furthermore, since the GPU 41 and the heat sink 20 are adjacent to each other without overlapping vertically, the electronic device 1 can be made thinner.

Hereinafter, each component of the electronic device 1 will be described.
In the present embodiment, the longitudinal (lateral) direction of the rectangular front plate 12 of the housing 10 will be described as the X-axis direction, the thickness (height) direction as the Y-axis direction, and the depth direction as the Z-axis direction.

[Housing 10]
The housing 10 has a bottom plate 11, a front plate 12, a back plate 13, a right plate 14, a left plate 15, and a top plate 16. A plurality of screw holes are formed in these plates 11 to 16.

  The bottom plate 11 is made of a material having thermal conductivity, and functions as a heat conductive member that transmits heat from the GPU 41 to the heat sink 20. Therefore, the bottom plate 11 is formed of a metal plate member having good heat conductivity.

  The front plate 12 is provided with a plurality of openings into which connection terminals such as USB terminals are inserted.

The back plate 13 has a plurality of intake holes 13a for allowing air to flow into the housing 10 from outside.
The intake hole 13a is formed in a long hole shape along the Y-axis direction, but may be formed in a long hole shape along the X-axis direction.

The right side plate 14 is made of a material having thermal conductivity, and has a plurality of exhaust holes 14a for discharging air flowing out of the heat sink 20, which will be described later, and fins 14b extending outward.
The exhaust hole 14a is formed in a long hole shape along the Z-axis direction, but may be formed in a long hole shape along the Y-axis direction.
The fin 14b is formed so as to sandwich the exhaust hole 14a. In the present embodiment, it is formed along the Z-axis direction so as to sandwich the exhaust hole 14a formed along the Z-axis direction.

The left side plate 15 is made of a material having thermal conductivity, and has a plurality of exhaust holes 15a for discharging air flowing out of the heat sink 20, which will be described later, and fins 15b extending outward.
The exhaust hole 15a is formed in a long hole shape along the Z-axis direction, but may be formed in a long hole shape along the Y-axis direction.
The fin 15b is formed so as to sandwich the exhaust hole 15a. In the present embodiment, it is formed along the Z-axis direction so as to sandwich the exhaust hole 15a formed along the Z-axis direction.

[Heat sink 20]
Since the heat sink 20 has a substantially concave shape in a front view, its bottom surface is installed on the bottom plate 11 and functions as a heat radiating member that conducts heat generated in the GPU 41 and radiates the heat. Therefore, the heat sink 20 is formed of a metal material having good heat conductivity.
The heat sink 20 has a concave groove 22 on the bottom surface in contact with the bottom plate 11, and a plurality of heat dissipating fins 21 on the left and right sides of the groove 22 for radiating heat transmitted to the heat sink 20. doing.
The radiation fins 21 are formed in a plate shape, and are formed such that an upper edge thereof extends along the X-axis direction.
The heat radiation fins 21 are exposed on the inner surface of the concave groove portion 22 in order to enhance the heat radiation effect. Further, in order to enhance the heat radiation effect of the radiation fins 21, the cooling fan 30 is provided so as to be accommodated in the groove 22.

[First substrate 40]
At least the GPU 41 and the communication modem 42 are mounted on the first board 40.
The communication modem 42 is mounted on a surface opposite to the surface on which the GPU 41 is mounted.
The first substrate 40 is housed inside the housing 10 so that the GPU 41 directly contacts the bottom plate 11.
The first substrate 40 is disposed closer to the Z-axis direction than the heat sink 20.

[Second substrate 50]
On the second substrate 50, for example, a USB terminal 51, a LAN terminal 52, an HDMI terminal 53 (HDMI is a registered trademark) and the like are mounted. These terminals are inserted into openings of the front plate 12.
The second substrate 50 is disposed closer to the Z-axis direction than the first substrate 40.

[Partition plate 60]
The partition plate 60 is for preventing the air that hits the heat sink 20 and flows out of the radiation fins 21 from flowing to the GPU 41 side.
The partition plate 60 has an upright wall portion 61 for partitioning between the GPU 41 and the heat sink 20, and a top plate portion 62 extending from an upper end of the upright wall portion 61 substantially perpendicular to the upright wall portion 61.
As an example, the partition plate 60 is formed of a heat-resistant plastic plate or the like.

When the electronic device 1 configured as described above is started, face authentication or the like is performed by a signal processing circuit based on image data from a connected digital camera, and the authenticated metadata is transmitted to the server. While the electronic device 1 is running, heat is generated from heat-generating components such as the GPU 41 included in the signal processing circuit. Since the GPU 41 is installed on the bottom plate 11, the heat generated from the initial component such as the GPU 41 is transferred to the heat sink 20 which is also installed on the bottom plate 11 via the bottom plate 11. Then, heat is radiated from the plurality of radiating fins 21 of the heat sink 20.
Then, when the electronic device 1 is started, the cooling fan 30 housed inside the electronic device 1 is operated, and the air sucked from the intake hole 13 a of the back plate 13 flows between the plurality of radiation fins 21. I do. The inflowing air flows out between the radiating fins 21 in a state where the temperature is increased by heat radiation from the radiating fins 21. The air that has flowed out is not discharged to the GPU 41 side by the partition plate 60, but is discharged from the exhaust holes 14a of the right side plate 14 and the exhaust holes 15a of the left side plate 15.

  In the electronic device of the present invention, as shown in FIG. 8, the upper plate 16A of the housing 10A is formed so as to function as a heat conductive plate, and the GPU 41A and the heat sink 20A are in close contact with the upper plate 16A. May be attached. Even in this case, the heat generated from the GPU 41A can be efficiently discharged to the outside of the housing 10A as described above. FIG. 8 emphasizes the structure and form for understanding the cooling mechanism of the electronic device of the present invention.

Next, the effects achieved by the electronic device 1 and the electronic device 1A will be described by comparing the electronic device 1A with the comparative examples shown in FIGS. 9 and 10, like FIG. 8, the structure and form are emphasized for understanding the cooling mechanism of the electronic device of the present invention.
The electronic device 1A includes a heat sink 20A and a cooling fan 30A inside the housing 10A, and can reduce the thickness of the electronic device 1A while reducing the thickness of the housing 10A.
That is, when the heat sink 20B is arranged so as to overlap with a heating element such as the GPU 41B as in the electronic device 1B shown in FIG. 9, it is difficult to reduce the thickness of the electronic device 1B. Also, as shown in FIG. 9, even when a heat sink 20B is arranged outside the housing 10B and air A is caused to flow into the heat sink 20B by the cooling fan 30B, the thickness of the housing 10B can be reduced. Although heat H generated from the GPU 41B can be efficiently dissipated, it is difficult to reduce the overall thickness of the electronic device 1B. In addition, there is a possibility that the heat sink 20B disposed outside the housing 10B may come into contact with another electronic device or the like.
On the other hand, in the electronic device 1A, the heat sink 20A can be disposed inside the housing 10A to prevent the heat sink 20A from coming into contact with other electronic devices. Can also be made thinner.

In addition, the electronic device 1A has the heat sink 20A and the GPU 41A placed close to and in close contact with the upper plate 16A, and the upper plate 16A is formed so as to function as a heat conductive plate. Thereby, in the process in which the heat generated in the GPU 41A is transferred to the heat sink 20A via the upper surface plate 16A, it is possible to suppress an increase in the temperature inside the housing 10A due to heat radiation from the upper surface plate 16A. Heat can be efficiently transferred to 20A.
That is, as in the electronic device 1C shown in FIG. 10, a heat pipe 70 formed in a meandering shape, not as a heat conducting plate, is provided as a heat transfer member from the heat generating member to the heat sink. When the heat sink 20C is provided at a distance from the heat sink 20C, the heat is radiated from the heat pipe 70 during the heat transfer from the GPU 41C to the heat sink 20C, and the temperature inside the housing 10C is increased.
Further, in the electronic device 1C, since the heat pipe 70 is housed inside the housing 10C, all of the heat radiation from the heat pipe 70 is performed inside the housing 10C, and the temperature inside the housing 10C rises.
On the other hand, since the upper surface plate 16A of the electronic device 1A is a heat conductive plate, heat can also be radiated from the surface exposed to the outside, and a rise in the temperature inside the housing 10A can be suppressed. Further, since the heat sink 20A and the GPU 41A are close to each other, it is possible to suppress the heat from being transmitted from the upper surface plate 16A to the inside of the housing 10A in the process of transferring the heat from the GPU 41A to the heat sink 20A. Thus, even if the heat sink 20A is brought close to the GPU 41A, the partition plate 60A can prevent the air A flowing out of the heat sink 20A from flowing toward the GPU 41A.
Furthermore, since the electronic device 1A can bring the heat conductive plate into surface contact with the GPU 41B and the heat sink 20A, heat can be efficiently transferred from the GPU 41A to the heat sink 20A.
Furthermore, since the upper surface plate 16A constituting the housing 10A functions as a heat transfer member, the number of components is reduced as compared with a case where a heat transfer member is provided separately from the housing 10C like the electronic device 1C. be able to.

As described above, the preferred embodiment of the present invention has been described. In addition to this, the configuration described in the above embodiment may be selected or changed to another configuration as appropriate without departing from the gist of the present invention. be able to.
For example, in the present embodiment, the cooling fan 30 is provided in the center of the heat sink 20 so as to be accommodated in the concave groove portion 22, but the present invention is not limited to this. The heat sink 20 is formed in a shape that can maximize the surface area of the radiation fins 21 according to the positional relationship with other electronic components housed in the electronic device, and the cooling fan 30 is housed in the concave groove 22 of the heat sink 20. May be provided.
Further, the concave groove 22 may not be formed in the heat sink 20, and the cooling fan 30 may be disposed inside the housing 10 so that air can flow into the radiation fins 21 from outside. Even in this case, the thickness of the housing 10 can be reduced as compared with the case where the GPU 41 and the heat sink 20 are arranged so as to overlap in the Y-axis direction. Further, the surface area of the radiation fins 21 can be increased.

  Further, in the electronic device 1 of the present embodiment, the partition plate 60 has the upright wall portion 61 and the top plate portion 62, but the present invention is not limited to this. The partition plate 60 need not have the top plate 62. In that case, an exhaust hole can also be provided in the upper surface plate 16.

  Furthermore, the electronic device 1 of the present embodiment includes the partition plate 60, but the present invention is not limited to this. The partition plate 60 need not be provided. Even in that case, the GPU 41 and the signal processing circuit including the GPU 41 can be cooled.

  Furthermore, the electronic device 1 of the present embodiment has a connection terminal such as a USB terminal on the front panel 12, but the present invention is not limited to this. The connection terminal can be provided at an arbitrary location according to an assumed installation location of the electronic device.

DESCRIPTION OF SYMBOLS 1 Electronic device 10 Case 11 Bottom plate 12 Front plate 13 Back plate 13a Intake hole 14 Right plate 14a Exhaust hole 14b Fin 15 Left side plate 15a Exhaust hole 15b Fin 16 Top plate 20 Heat sink 21 Radiation fin 22 Depression groove 30 Cooling fan 40 One board 41 GPU
42 Communication modem 50 Second substrate 51 USB terminal 52 LAN terminal 53 HDMI terminal 60 Partition plate 61 Standing wall portion 62 Top plate portion 70 Heat pipe

Claims (9)

A signal processing circuit arranged on the heat conducting plate,
A heat sink disposed on the heat conductive plate adjacent to the signal processing circuit;
A cooling fan provided for the heat sink and cooling the heat sink with air from the outside,
A housing that houses the signal processing circuit, the cooling fan, and the heat sink, and has the heat conductive plate as a bottom plate;
An electronic device comprising: The housing has a suction hole on the back surface for sucking the air into the inside,
The electronic device according to claim 1, wherein the cooling fan draws the air from the air intake hole to cool the heat sink. The said housing | casing is provided with the both side wall of the heat conduction member which has the radiation fin connected with the said heat conduction plate, and the exhaust hole which exhausts the said air which cooled the said heat sink. Electronic device as described. The electronic device according to any one of claims 1 to 3, wherein the heat sink has a substantially concave shape in a front view and a concave groove portion in which the cooling fan can be arranged. 5. The electronic device according to claim 4, wherein a heat sink including a cooling fan disposed in the housing has a rear side facing the intake hole and left and right side surfaces facing the exhaust hole. The electronic device according to claim 1, further comprising a partition plate that prevents the air that has cooled the heat sink from flowing toward the signal processing circuit. The electronic device according to claim 6, wherein the partition plate includes an upright wall portion that partitions between the signal processing circuit and the heat sink, and a top plate portion that extends horizontally from an upper end of the upright wall portion. . The electronic device according to claim 1, wherein a substrate including a communication modem is provided on the signal processing circuit. The electronic device according to claim 1, wherein the housing has a USB terminal on a front surface.

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