JP2000105635A - Cooling device for notebook-type personal computer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooling system having high cooling ability suitable for a thin type casing since the heat of a CPU is propagated through a heat conductive body or a heat pipe to a keyboard or lower casing, concerning a notebook- type personal computer(PC) conventionally characterized by a thin type casing, and the keyboard or casing is heated in a conventional method by the tendency of increasing heating accompanying higher performance of the CPU. SOLUTION: A heating element 4 and a cooling fan 5 are parallelly arranged at adjacent positions and thermally coupled by a plate (heat conductive plate 6) improved in heat conductivity. The heat conductive plate 6 is cooled by the cooling fan 5 and the heat conductive plate 6 removes the heat of the heating element 4 so that the heating element 4 is cooled. Both high heat radiation due to the cooling fan and thinning can be made compatible.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for a heating element suitable for a thin notebook personal computer.

[0002]

2. Description of the Related Art In recent years, there has been a remarkable advance in the performance and miniaturization of notebook personal computers. With the advance in performance, the speed of CPUs and the capacity of auxiliary storage devices have increased, and heat generation has increased. However, with the progress of miniaturization and thinning, the space around the heat-generating component has been narrowed, and heat radiation has become difficult.

[0003] In a conventional notebook personal computer, as shown in FIG.
The heat of the PU 40 is transferred to the keyboard 42 via the heat conductor 43.
From the CPU 40, as shown in FIG.
4 is radiated from the housing 41 via the heat conductor 43 or, as shown in FIG. 4C, the cooling fan 44 is attached to the upper surface of the CPU 40 and radiated by the cooling fan 44. .

[0004]

However, in the method of conducting heat to the keyboard and the lower housing to cool naturally, a large amount of heat generated by the recent high-performance CPU cannot be sufficiently dissipated. Further, a cooling fan mounted on the upper surface of the CPU has an excellent cooling effect, but has a problem that it is not suitable for a thin housing because the height of the CPU is high. An object of the present invention is to realize a notebook personal computer cooling device which is suitable for miniaturization, is thin and has excellent heat dissipation efficiency.

[0005]

In order to solve the above-mentioned problems, the present invention arranges a CPU as a heat-generating component and a cooling fan side by side at a position adjacent to each other, and uses a plate (heat conductive plate) having excellent heat conductivity. It is characterized in that the CPU is cooled by thermally coupling and cooling the heat conduction plate with a cooling fan.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 is characterized in that a heating element and a cooling fan are arranged adjacent to each other and are thermally coupled by a plate having excellent heat conduction. This has the effect of cooling the CPU in a low space that can be mounted in a thin housing.

According to a second aspect of the present invention, there is provided a cooling device for a notebook personal computer, wherein the cooling fan is disposed at a position in contact with a side surface of the housing and air is taken in or exhausted from the side surface. Has the effect of efficiently dissipating heat without intersecting the flow of

An embodiment of the present invention will be described below with reference to FIGS. (Embodiment 1) FIG. 1 is a perspective view when a cooling element for a notebook personal computer according to an embodiment of the present invention is used.

Reference numeral 1 denotes a notebook personal computer housing which stores main electric circuits. Reference numeral 2 denotes a keyboard for inputting character input and operation instructions. Numeral 3 indicates a calculation result on a display unit. Reference numeral 4 denotes a heating element, which corresponds to a CPU of a notebook personal computer. The CPU is thermally coupled to the cooling fan (5) through the heat conducting plate (6). Reference numeral 7 denotes a board on which a CPU and other electronic components are mounted.

FIG. 2 is a sectional view showing the structure around the heating element 4.
FIG. 2A is a perspective view of FIG. The CPU 20 is mounted on a substrate 25 on which an electric circuit is mounted, and the heat conductive plate 22
Through the cooling fan 21. These components are arranged in a low space between the upper housing 23 and the lower housing 24. The cooling fan 21 is located at a position in contact with the side surface of the housing, and a slit 26 is provided on the side surface.

The heat generated by the CPU 20 is transmitted to the heat conductive plate 22. The cooling fan 21 draws in air from the lower part in the figure and exhausts it to the outside of the housing through the slit 26 on the side surface, so that
Take away the heat of. As the heat conductive plate, a plate-shaped material such as an aluminum or copper plate or a cloth-like material such as a graphite sheet can be used. The heat conductive plate cooled by the cooling fan further releases heat from the upper surface of the CPU 20. The CPU 20 is cooled by robbing.

A slit 26 is provided on the side surface of the cooling fan 21, and the air heated by the heat of the heat conducting plate 22 is discharged to the outside of the housing. Do not warm.

By providing an intake opening below the cooling fan 21, unheated air flowing through the lower part of the housing can be taken in, so that the cooling effect can be enhanced. Conversely, if the opening for intake is omitted, the air around the lower part of the housing is sucked, so that the cooling effect of other components inside the housing can be enhanced.

(Embodiment 2) FIG. 3A is a sectional view showing a structure around a heating element 4 according to another embodiment of the present invention.
FIG. 3 (b) shows a perspective view. The CPU 30 is mounted on a substrate 35 on which an electric circuit is mounted, and is thermally coupled to the cooling fan 31 via a bent heat conductive plate 32.
These components are arranged in a low space between the upper case 33 and the lower case 34. The cooling fan 31 is located at a position in contact with the side surface of the housing, and a slit 36 is provided on the side surface.

The heat generated by the CPU 30 is transmitted to the heat conducting plate 32. The cooling fan 31 takes in heat from the upper portion in the figure and exhausts heat from the heat conducting plate 32 by exhausting the air to the outside of the housing through the slit 36 on the side surface. As the heat conduction plate, a plate-like material such as an aluminum or copper plate or a cloth-like material such as a graphite sheet can be used, and the heat conduction plate 32 cooled by the cooling fan 31 is further removed from the upper surface of the CPU 30. The CPU 30 is cooled by removing heat. A slit 36 is provided on the side surface of the cooling fan 31, and the heated air is taken out of the heat conduction plate 32 and the heated air is discharged outside the housing. There is no.

In this embodiment, since air can be taken in from the upper part,
This is effective for a structure in which a slit or a space for intake cannot be provided at a lower portion.

If it is possible to provide upper and lower openings for ventilation, an axial cooling fan can be used. In this case, there is no need to provide a fan at a position facing the side surface, and the fan can be located at an arbitrary position.

[0018]

As described above, in the cooling device for a notebook type personal computer according to the present invention, the heat generated by the heat generating element is transmitted to the cooling fan by the heat conducting plate and radiated, so that the space in the height direction is limited. It is possible to efficiently cool the heat-generating component in the intended use.

[Brief description of the drawings]

FIG. 1 is a perspective view of a housing in which a cooling device for a notebook personal computer is mounted according to an embodiment of the present invention.

2A is a cross-sectional view illustrating a structure around a heat-generating component according to an embodiment of the present invention. FIG. 2B is a perspective view illustrating a structure around a heat-generating component according to one embodiment of the present invention.

FIG. 3A is a cross-sectional view illustrating a structure around a heat-generating component according to another embodiment of the present invention. FIG. 3B is a perspective view illustrating a structure around a heat-generating component according to another embodiment of the present invention.

4A is a cross-sectional view showing a structure in which heat is radiated from a keyboard in a conventional example. FIG. 4B is a cross-sectional view showing a structure in which heat is radiated from a lower housing in the conventional example. Sectional view

[Explanation of symbols]

 Reference Signs List 1 housing 2 keyboard 3 display unit 4 heating element 5 cooling fan 6 heat conductive plate 7 substrate 20 CPU 21 cooling fan 22 heat conductive plate 23 upper housing 24 lower housing 25 substrate 26 slit 30 CPU 31 cooling fan 32 heat conductive plate 33 upper housing 34 lower housing 35 substrate 36 slit

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Tatsuhiko Ikeda 1006 Kazuma Kadoma, Kadoma-shi, Osaka Matsushita Electric Industrial Co., Ltd. F-term (reference) 5E322 AA11 AB11 BA01 BB03 FA04

Claims (2)

[Claims] 1. A heating element and a cooling fan are arranged adjacent to each other, and are thermally coupled by a plate having excellent heat conduction.
Cooling device for notebook personal computers. 2. A cooling device for a notebook personal computer, wherein a cooling fan is arranged at a position in contact with a side surface of the housing and air is taken in or exhausted from the side surface.