CN110597356A - Notebook computer - Google Patents
Notebook computer Download PDFInfo
- Publication number
- CN110597356A CN110597356A CN201910863217.8A CN201910863217A CN110597356A CN 110597356 A CN110597356 A CN 110597356A CN 201910863217 A CN201910863217 A CN 201910863217A CN 110597356 A CN110597356 A CN 110597356A
- Authority
- CN
- China
- Prior art keywords
- air outlet
- fan
- air
- notebook computer
- semi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 64
- 230000000694 effects Effects 0.000 abstract description 28
- 238000001816 cooling Methods 0.000 abstract description 9
- 238000010586 diagram Methods 0.000 description 15
- 238000002955 isolation Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 229920002457 flexible plastic Polymers 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
Abstract
The application provides a notebook computer, which is used for improving the heat dissipation effect of the notebook computer. The application provides a keyboard shell's pivot district is equipped with first opening area and second opening area. The first fan is provided with a first air outlet and a second air outlet. The wind blown out from the first wind outlet flows out from the first opening area. The second air outlet faces the chip area of the mainboard. The semi-enclosed structure is formed by at least a base shell, a keyboard shell, a first fan and an air guide piece. The air blown out from the second air outlet of the first fan enters the semi-enclosed structure, flows through the chip area and flows out from the second opening area. On the one hand, the chip area of the notebook computer is cooled through the first air outlet, on the other hand, the air which is blown into the chip area of the semi-surrounding structure by the second air outlet is increased, the chip in the chip area is directly cooled, and therefore the cooling effect of the chip area is improved.
Description
Technical Field
The application relates to the field of computers, in particular to a notebook computer.
Background
With the rapid development of computers, the heat dissipation of notebook computers becomes an extremely important design point. At present, in a notebook computer, a fan, a heat pipe and a heat dissipation fin are used for dissipating heat of a main board in the notebook computer. Specifically, one end of the heat pipe is in thermal contact with the electronic element through the copper block, and the other end of the heat pipe is in thermal contact with the heat dissipation fins. The heat pipe may transfer heat generated from the electronic component to the heat dissipating fins. The heat dissipation fins are arranged in an opening area at the joint of the keyboard shell and the screen shell of the notebook computer, and air blown by the fan flows out of the notebook computer from the opening area after flowing through the heat dissipation fins so as to realize heat dissipation of electronic elements in the notebook computer.
With the development of electronic industry technology, the transistor density of various chips (particularly, cpus) is increasing, the data processing speed is increasing, and the consumed power and the generated heat are also increasing. Existing heat dissipation schemes have not been able to meet the demands. Therefore, a heat dissipation scheme for a notebook computer is needed to improve the heat dissipation effect of the notebook computer.
Disclosure of Invention
The application provides a notebook computer, which is used for improving the heat dissipation effect of the notebook computer.
In a first aspect, the present application provides a notebook computer, which includes a keyboard housing, a base housing, a first fan, and an air guide. The keyboard shell is provided with a rotating shaft area and is connected with a notebook screen through a rotating shaft of the rotating shaft area; the spindle region is provided with a first opening region and a second opening region. The base shell is connected with the keyboard shell to form a cavity; a main board, a first fan and an air guide piece are arranged in the cavity. The first fan is provided with a first air outlet and a second air outlet, air blown out from the first air outlet flows out from the first opening area, and the second air outlet faces the chip area of the mainboard. The base shell, the keyboard shell, the first fan and the air guide component form a semi-enclosed structure; the chip area is positioned inside the semi-surrounding structure, and the opening of the semi-surrounding structure faces the second opening area; and the air blown out of the second air outlet of the first fan enters the semi-surrounding structure, flows through the chip area and flows out of the second opening area. Because still directly blow to the chip district through the second air outlet on the radiating basis of realizing notebook computer through the first air outlet of first fan to the radiating effect in chip district has been improved.
In one possible implementation, the air guide is in contact with the housing of the first fan; the distance between the contact area of the first fan and the air guide piece and the second air outlet is smaller than a preset distance. The half-surrounding structure is equivalent to the arrangement of air duct isolation in the notebook computer, and because the distance between the contact area of the air guide piece on the first fan and the second air outlet is short, the air blown out from the second air outlet can be prevented from being sucked back into the first fan again to form backflow.
In a possible implementation manner, the side of the first fan where the first air outlet is arranged is adjacent to the side of the second air outlet. Therefore, on the basis of ensuring that the second air outlet faces the chip area, the first air outlet of the first fan is more compatible with the structure of the existing notebook computer, and the layout of input and output ports on the side edge of the notebook computer is not influenced.
In one possible implementation, the second outlet is located inside the semi-enclosed structure. Therefore, the air blown out from the second air outlet can completely enter the semi-surrounding structure, and the heat dissipation efficiency of the chip area is further improved. On the other hand, the wind blown out from the second air outlet is also prevented from running around the notebook computer in the area except the inside of the half-enclosed structure to cause interference with other devices.
In one possible implementation, the air output of the first air outlet is greater than the air output of the second air outlet. Because the second air outlet directly blows towards the chip area, therefore less wind can bring great radiating effect, and this kind of arrangement can maintain the higher heat-sinking capability of first air outlet under the prerequisite that promotes the radiating effect in chip area.
In one possible implementation, the base housing forms a bottom surface of the semi-enclosed structure, the keyboard housing forms a top surface of the semi-enclosed structure, and the first fan has a side surface provided with the second air outlet and the air guide forms a side surface of the semi-enclosed structure. The semi-surrounding structure is formed by the air guide component under the auxiliary action of the existing structure of the notebook computer, so that the added parts in the scheme are fewer, and the structure of the notebook computer is more compatible.
In a possible implementation, the air conditioner further comprises a second fan, wherein the second fan is provided with a third air outlet; the rotating shaft area is also provided with a third opening area; and the air blown out from the third air outlet flows out from the third opening area. The heat dissipation effect of the notebook computer is further increased through the third air outlet of the second fan.
In one possible implementation, the second fan further includes a fourth air outlet. The fourth air outlet faces the chip area of the main board. The base shell, the keyboard shell, the first fan, the second fan and the air guide component form a semi-enclosed structure; and the air blown out of the fourth air outlet of the second fan enters the semi-surrounding structure, flows through the chip area and flows out of the second opening area. The fourth air outlet and the second air outlet blow air to the chip area in the semi-surrounding structure, and the heat dissipation effect of the chip area of the notebook computer is increased.
In one possible implementation, the air guide is in contact with the housing of the second fan. And the distance between the contact area of the second fan and the air guide piece and the fourth air outlet is smaller than a preset distance. The half-surrounding structure is equivalent to the arrangement of air duct isolation in the notebook computer, and because the distance between the contact area of the second fan and the air guide piece and the fourth air outlet is short, the air blown out from the fourth air outlet can be prevented from being sucked back into the second fan again to form backflow.
In a possible implementation manner, the side of the second fan where the third air outlet is disposed is adjacent to the side of the second fan where the fourth air outlet is disposed. Therefore, on the basis of ensuring that the fourth air outlet faces the chip area, the third air outlet of the second fan is more compatible with the structure of the existing notebook computer, and the layout of input and output ports on the side edge of the notebook computer is not influenced.
In one possible implementation, the fourth outlet is located inside the semi-enclosed structure. Therefore, the air blown out from the fourth air outlet can completely enter the semi-surrounding structure, and the heat dissipation efficiency of the chip area is further improved. On the other hand, the wind blown out from the fourth air outlet is also prevented from running around the notebook computer except for the inside of the half-enclosed structure to cause interference with other devices.
In one possible implementation, the air output of the third air outlet is greater than the air output of the fourth air outlet. Because the fourth air outlet directly blows towards the chip area, smaller wind can bring larger heat dissipation effect, and the arrangement can maintain higher heat dissipation capacity of the third air outlet on the premise of improving the heat dissipation effect of the chip area.
In one possible implementation, the base housing forms a bottom surface of the semi-enclosed structure, the keyboard housing forms a top surface of the semi-enclosed structure, the first fan has a side surface provided with the second air outlet, the second fan has a side surface provided with the fourth air outlet, and the air guide forms a side surface of the semi-enclosed structure. The semi-surrounding structure is formed by the air guide component under the auxiliary action of the existing structure of the notebook computer, so that the added parts in the scheme are fewer, and the structure of the notebook computer is more compatible.
In one possible implementation, the second air outlet is located between the first air outlet and the second air outlet. In the notebook computer, the chip area is usually located in the middle of the base of the notebook computer, and the second air outlet is arranged in the middle and can be closer to the chip area, so that the heat dissipation effect of the chip area can be further improved.
In a second aspect, the present application provides a notebook computer, which includes a keyboard housing, a base housing, a first fan, a second fan, first heat dissipation fins, second heat dissipation fins, and an air guide. The keyboard shell is provided with a rotating shaft area and is connected with a notebook screen through a rotating shaft of the rotating shaft area; the rotating shaft area is provided with a first opening area, a second opening area and a third opening area, and the second air outlet is located between the first air outlet and the second air outlet. The base shell is connected with the keyboard shell to form a cavity; the cavity is internally provided with a mainboard, a first fan, first radiating fins, a second fan, second radiating fins and an air guide piece. The first fan is provided with a first air outlet and a second air outlet, the side surface of the first fan, which is provided with the first air outlet, is adjacent to the side surface of the second fan, the first air outlet faces the first heat dissipation fins, and air blown out of the first air outlet flows out of the first opening area after flowing through the first heat dissipation fins; the second air outlet faces the chip area of the main board. The second fan is provided with a third air outlet and a fourth air outlet, the side surface of the second fan, which is provided with the third air outlet, is adjacent to the side surface, which is provided with the fourth air outlet, the third air outlet faces the second heat dissipation fins, and air blown out from the third air outlet flows through the second heat dissipation fins and then flows out from the third opening area; the fourth air outlet faces the chip area of the main board. One end of the air guide piece is in contact with the shell of the first fan, and the other end of the air guide piece is in contact with the shell of the second fan. The base shell, the keyboard shell, the first fan, the second fan and the air guide component form a semi-enclosed structure; the base casing constitutes the bottom surface of semi-surrounding structure, the keyboard casing constitutes the top surface of semi-surrounding structure, be provided with on the first fan the side of second air outlet, be provided with on the second fan the side of fourth air outlet with the air guide constitutes the side of semi-surrounding structure. The air blown out of the second air outlet of the first fan enters the semi-surrounding structure, flows through the chip area and flows out of the second opening area; and the air blown out of the fourth air outlet of the second fan enters the semi-surrounding structure, flows through the chip area and flows out of the second opening area. Therefore, on one hand, the airflow discharged by the first air outlet is used for cooling the first heat dissipation fins, and the airflow discharged by the third air outlet is used for cooling the second heat dissipation fins, so that the heat dissipation of the electronic elements in the notebook computer is realized. On the other hand, the chip area is cooled by the wind at the second air outlet of the first fan, and the chip area is also cooled by the wind at the fourth air outlet of the second fan, so that the heat dissipation effect of the chip area is improved.
Drawings
Fig. 1 is a schematic structural diagram of a notebook computer according to an embodiment of the present application;
fig. 2a is a schematic structural diagram of a notebook base according to an embodiment of the present disclosure;
FIG. 2b is an enlarged view of a portion of area A of the notebook base shown in FIG. 2 a;
FIG. 2c is an enlarged view of the first fan shown in FIG. 2 a;
FIG. 3 is an exploded view of the notebook base shown in FIG. 2 a;
FIG. 4a is a plan view of the notebook base shown in FIG. 2 a;
FIG. 4b is a schematic view of the air outlet effects of the first air outlet and the second air outlet of the first fan in the plane of the notebook base shown in FIG. 4 a;
FIG. 5a is a schematic structural diagram of another notebook computer base provided in accordance with an embodiment of the present application;
FIG. 5B is an enlarged view of a portion of area B of the notebook base shown in FIG. 5 a;
FIG. 5c is an enlarged view of the first fan and the second fan shown in FIG. 5 a;
FIG. 6 is an exploded view of the notebook base shown in FIG. 5 a;
FIG. 7 is a plan view of the notebook base shown in FIG. 5 a;
FIG. 8a is a schematic structural diagram of another notebook computer base provided in the embodiments of the present application;
FIG. 8b is an enlarged partial view of area C of the notebook base shown in FIG. 8 a;
FIG. 8c is an enlarged view of the first fan and the second fan shown in FIG. 8 a;
FIG. 9 is an exploded view of the notebook base shown in FIG. 8 a;
FIG. 10 is a plan view of the notebook base shown in FIG. 8 a;
FIG. 11 is a plan view of another notebook computer base provided in accordance with an embodiment of the present application;
FIG. 12 is a graph illustrating the temperature of various areas of a prior art notebook base;
fig. 13 is a schematic diagram of the temperature of each area of the notebook base when the embodiment shown in fig. 2a is applied according to the embodiment of the present application.
The reference numbers in the drawings of the embodiments of the present application are as follows:
10-notebook screen;
20-notebook base;
201-keyboard case;
202-base housing;
2011-pivot region;
2012-first open area;
2013-second open area;
2014-third open area;
203-main board;
2031-chip area;
2032-Central Processing Unit (CPU);
2033-Graphics Processing Unit (GPU);
2034-other devices;
30-first fan;
301-first outlet;
302-second outlet port;
303 — first cooling fins;
304-vapor chamber;
40-second fan;
401-third outlet;
402-fourth outlet;
403-second cooling fins;
50-wind guide;
501-first distance;
502-second distance.
Detailed Description
Fig. 1 schematically illustrates a structural diagram of a notebook computer provided in an embodiment of the present application. As shown in fig. 1, the notebook computer includes a notebook screen 10 and a notebook base 20. A rotating shaft area 2011 is arranged on one side of the notebook base 20 close to the notebook screen 10, and the notebook screen 10 and the notebook base 20 are connected through a rotating shaft arranged in the rotating shaft area 2011.
In the embodiment of the present application, one or two fans for dissipating heat are disposed on the notebook base 20, and when one fan is disposed on the notebook base 20, two air outlets are disposed on the fan, and the fan can be disposed on one side of the motherboard. When two fans are arranged on the notebook computer base 20, one fan is provided with two air outlets, and the other fan can be provided with one air outlet or two air outlets; and the two fans can be arranged on two sides of the main board.
In the embodiment of the present application, fig. 2a, fig. 2b, fig. 2c, fig. 3, fig. 4a, and fig. 4b exemplarily describe that the notebook computer includes the first fan 30, and the first fan 30 is provided with the first air outlet 301 and the second air outlet 302;
in the embodiment of the present application, fig. 5a, fig. 5b, fig. 5c, fig. 6, and fig. 7 exemplify that the notebook computer includes the first fan 30 and the second fan 40, the first fan 30 is provided with the first air outlet 301 and the second air outlet 302, and the second fan 40 is provided with the third air outlet 401;
fig. 8a, 8b, 8c, 9, and 10 in this embodiment of the application exemplify a case where the notebook computer includes a first fan 30 and a second fan 40, the first fan 30 is provided with a first air outlet 301 and a second air outlet 302, and the second fan 40 is provided with a third air outlet 401 and a fourth air outlet 402.
Reference will now be made to the embodiment of the notebook computer shown in fig. 2a, 2b, 2c, 3, 4a and 4b including the first fan 30.
Fig. 2a schematically illustrates a structural diagram of the notebook base 20 in fig. 1, fig. 2b is a partially enlarged view of a region a of the notebook base shown in fig. 2a, fig. 2c is a structural diagram of a first fan in fig. 2a, and fig. 3 is an exploded view of the notebook base shown in fig. 2a, as shown in fig. 2a, fig. 2b, fig. 2c and fig. 3, the notebook base 20 includes a keyboard housing 201, a base housing 202, a hinge region 2011, a main board 203, a chip region 2031, a CPU2032, a GPU2033, a first fan 30, first heat dissipation fins 303 and a temperature equalization plate 304; the rotation shaft area 2011 is provided with a first opening area 2012 and a second opening area 2013, and the first fan 30 is provided with a first air outlet 301 and a second air outlet 302.
As shown in fig. 2a, 2b and 3, the keyboard housing 201 and the base housing 202 are engaged to form a cavity. A main board 203 is provided between the keyboard housing 201 and the base housing 202. Various electronic components, such as a CPU2032, a GPU2033, and the like, may be provided on the motherboard 203. The motherboard 203 has a chip area 2031, and the chip area 2031 may include one or more chips disposed on the motherboard 203, for example, the chip area 2031 includes a CPU2032 and a GPU 2033. In an alternative embodiment, the chip area 2031 may further include other electronic elements besides chips disposed on the main board 203.
The chips on the main board 203 may be disposed on the temperature-uniforming plate 304, and other electronic components than the chips may be disposed on the temperature-uniforming plate 304. The temperature equalizing plate 304 is connected to the first heat dissipating fins 303. The electronic components disposed on the temperature equalizing plate 304 generate heat in an operating state, and the temperature equalizing plate 304 can transfer the heat generated by the electronic components disposed thereon to the first heat dissipating fins 303. In another alternative embodiment, the temperature equalization plate 304 may be replaced by a heat pipe, one end of the heat pipe may be thermally connected to the electronic component, and the other end of the heat pipe may be connected to the first heat dissipation fins 303, and the heat pipe may be used to transfer heat of the connected electronic component to the first heat dissipation fins 303.
As shown in fig. 2a, 2b and 3, the first fan 30 includes a first side surface and a second side surface, the first side surface and the second side surface are adjacent, the first air outlet 301 is located at the first side surface, and the second air outlet 302 is located at the second side surface. It can also be described as: the first air outlet 301 and the second air outlet 302 are respectively located at two adjacent side surfaces of the first fan 30.
The hinge area 2011, which is provided with the first opening area 2012 and the second opening area 2013, may be disposed on the keyboard housing 201 and located on a side of the keyboard housing 201 close to the notebook screen 10. The first outlet 301 of the first fan 30 faces the first opening area 2012 of the rotating shaft area 2011. The first heat dissipation fins 303 may be disposed between the first outlet 301 and the first opening region 2012.
As shown in fig. 2a, the air guide 50 is disposed on the base housing, and the second air outlet 302 of the first fan 30 faces the chip area 2031 of the main board 203. The base housing 202, the keyboard housing 201, the first fan 30, and the air guide 50 form a half-enclosed structure. Specifically, the base housing 202 is a top surface of a semi-enclosed structure, the keyboard housing 201 is a bottom surface of the semi-enclosed structure, a side surface of the first fan provided with the second air outlet 302 and the air guide 50 constitute a side surface with an enclosing effect in the semi-enclosed structure, an opening in the semi-enclosed structure faces a second opening area, the opening in the semi-enclosed structure may also be referred to as a side surface that is not enclosed in the enclosed structure, and may also be described as a position where the side surface that is not enclosed in the enclosed structure is the second opening area 2013 of the rotating shaft area 2011. The semi-enclosed structure includes within it the electronic components of the chip area 2031. The second outlet 302 is directed towards the interior of the semi-enclosed structure.
Fig. 4a is a plan view of the notebook base shown in fig. 2a, and fig. 4a is a schematic diagram illustrating the direction of the wind blown out from the first outlet 301 and the direction of the wind blown out from the second outlet 302 by the first fan 30 in the notebook computer shown in fig. 2 a. As shown in fig. 4a, on one hand, heat generated by the CPU2032 and the GPU2033 is transferred to the first heat dissipation fins 303 through the temperature equalization plate 304, and the airflow discharged from the first air outlet 301 by the first fan 30 flows through the first heat dissipation fins 303 and then is discharged through the first opening region 2012. In this process, the airflow discharged from the first air outlet 301 is used to cool the first heat dissipation fins 303, thereby achieving heat dissipation for cooling the electronic components inside the notebook computer. On the other hand, the air blown out from the second outlet 302 of the first fan 30 enters the semi-enclosed structure, flows through the chip area 2031, and flows out from the second opening area 2013. As can be seen, the chip area 2031 is cooled by the wind from the first air outlet 301 of the first fan 30, and the chip area 2031 is also cooled by the wind from the second air outlet 302 of the first fan 301, so that the heat dissipation effect on the chip area 2031 is improved. Secondly, because the base housing 202, the keyboard housing 201, the first fan 30 and the air guide 50 form a semi-enclosed structure, that is, an air duct partition is arranged in the keyboard of the notebook computer, thus, the air blown out from the second air outlet 302 can flow out from the second opening area 2013 after flowing through the chip area 2031 as much as possible, and the heat dissipation effect is improved. Third, at the end of the air guide 50 contacting the outer shell of the first fan 30, the first distance 501 between the contact area and the second air outlet 302 is within a preset distance range, and the preset distance can be set to a smaller value, for example, the contact area can be set at the edge of the second air outlet 302, or can be set at a position several millimeters away from the edge of the second air outlet 302, because the position of the air guide 50 contacting the first fan 30 is closer to the second air outlet 302, and the air duct isolation is set in the notebook computer, the air blown out from the second air outlet 302 can be prevented from being sucked back into the first fan 30 again to form backflow. In the fourth aspect, the second air outlet 302 faces the chip area 2031, and the chip area 2031 is disposed in the middle of the notebook computer, in this case, the arrangement of the second air outlet 302 will not affect the input/output ports disposed on the two sides of the notebook computer, and the notebook computer can be better compatible with the existing notebook computer.
The shape of the air guide 50 in the embodiment of the present application can be adjusted according to the position and layout of a specific device on the main board 203 of the notebook computer. As shown in fig. 2a, the wind guide 50 may be an L-shaped structural member, and optionally, the wind guide 50 may also be in other shapes, such as an inclined surface. The wind guide 50 may be a flexible structure. The specific material can be various, such as foam, flexible plastic member, flexible metal member, etc.
In an alternative embodiment, the size of the first air outlet 301 may be larger than that of the second air outlet 302, so that the air exhausted from the first fan 30 is mainly exhausted through the first air outlet 301, and the second air outlet 302 can assist in exhausting air to meet the heat dissipation requirement of the notebook computer. Fig. 4b is a schematic view of the air outlet effects of the first air outlet and the second air outlet of the first fan in the plane of the notebook computer base shown in fig. 4a, as shown in fig. 4b, compared with the first air outlet 301, the size of the second air outlet 302 is smaller than that of the first air outlet 301, and the air output of the second air outlet 302 is also smaller than that of the first air outlet 301.
The following description is directed to an embodiment in which the notebook computer shown in fig. 5a, 5b, 6, and 7 includes a first fan 30 and a second fan 40, and the first fan 30 includes a first air outlet 301 and a second air outlet 302, and the second fan 40 includes a third air outlet 401.
Fig. 5a schematically illustrates a structure of the notebook base 20 in fig. 1, fig. 5B is a partially enlarged view of a region B of the notebook base shown in fig. 5a, fig. 5c is an enlarged view of the first fan and the second fan in fig. 5a, and fig. 6 is an exploded view of the notebook base shown in fig. 5a, as shown in fig. 5a, fig. 5B, fig. 5c and fig. 6, the notebook base 20 includes a keyboard housing 201, a base housing 202, a hinge area 2011, a main board 203, a 203area 2031, a CPU2032, a GPU2033, a first fan 30, a second fan 40, a first heat dissipation fin 303, a second heat dissipation fin 403 and a temperature equalization plate 304; the rotation shaft area 2011 is provided with a first opening area 2012, a second opening area 2013 and a third opening area 2014, the first fan 30 is provided with a first air outlet 301 and a second air outlet 302, and the second fan 40 is provided with a third air outlet 401.
As shown in fig. 5a, 5b, 5c and 6, the keyboard housing 201 and the base housing 202 are engaged to form a cavity. A main board 203 is provided between the keyboard housing 201 and the base housing 202. For the description of the main board 203, the chip area 2031 and the first fan 30, reference is made to the description of fig. 2a, and the description thereof is omitted here.
As shown in fig. 5a, 5b, 5c, and 6, the temperature equalization plate 304 connects the first radiator fins 303 and the second radiator fins 403. The temperature equalization plate 304 may transfer heat generated from an electronic component disposed thereon to the first and second heat fins 303 and 403. In another alternative embodiment, the temperature equalization plate 304 may be replaced by a heat pipe, the heat pipe may sequentially connect the first heat dissipating fins 303, the electronic component and the second heat dissipating fins 403, and the heat pipe may be used to transfer heat of the connected electronic component to the first heat dissipating fins 303 and the second heat dissipating fins 403.
As shown in fig. 5a, 5b, 5c and 6, the first fan 30 and the second fan 40 are disposed at both sides of the chip area 2031, and the second opened area 2013 is located between the first opened area 2012 and the third opened area 2014. The second fan 40 includes a third side surface, and the third air outlet 401 is located on the third side surface. The third side is a side of the third opening 2014 facing the rotation axis 2011 of the second fan 40. The second radiator fins 403 may be disposed between the third air outlet 401 and the third opening region 2014.
As shown in fig. 5a, 5b, 5c and 6, the wind guide 50 may be disposed between the first fan 30 and the second fan 40, and the wind guide 50 may be in contact with the housings of the first fan 30 and the second fan 40. As shown in fig. 5a, the air guide 50 is disposed on the base housing, and the second air outlet 302 of the first fan 30 faces the chip area 2031 of the main board 203. The base housing 202, the keyboard housing 201, the first fan 30, the second fan 40, and the air guide 50 form a half-enclosed structure. Specifically, the base housing 202 is a top surface of a semi-enclosed structure, the keyboard housing 201 is a bottom surface of the semi-enclosed structure, a side surface of the first fan, on which the second air outlet 302 is disposed, the air guide 50, and a fourth side surface of the second fan constitute a side surface with an enclosing effect in the semi-enclosed structure, and one side surface not enclosed in the semi-enclosed structure is a position of the second opening area 2013 of the rotating shaft area 2011. The fourth side of the second fan is the side of the second fan adjacent to the third side, and the fourth side faces the chip area 2031, and the inside of the semi-enclosed structure includes the electronic components in the chip area 2031. The second outlet 302 is directed towards the interior of the semi-enclosed structure.
Fig. 7 is a plan view of the notebook computer base shown in fig. 5a, and fig. 7 is a schematic diagram illustrating the direction of the wind blown out from the first outlet 301, the direction of the wind blown out from the second outlet 302, and the direction of the wind blown out from the third outlet 401 of the second fan 40 by the first fan 30 in the notebook computer shown in fig. 5 a. As shown in fig. 7, on one hand, heat generated by the CPU2032 and the GPU2033 is transferred to the first heat dissipating fins 303 and the second heat dissipating fins 403 through the temperature equalizing plate 304, and the first fan 30 exhausts air flowing out through the first air outlet 301 through the first heat dissipating fins 303 and then through the first opening region 2012. The air flow discharged from the second fan 40 through the third air outlet 401 flows through the second heat dissipating fins 403 and then is discharged through the third opening 2014. In this process, the airflow discharged from the first air outlet 301 is used to cool the first heat dissipating fins 303, and the airflow discharged from the third air outlet 401 is used to cool the second heat dissipating fins 403, so as to achieve heat dissipation for cooling the electronic components inside the notebook computer. On the other hand, the air blown out from the second outlet 302 of the first fan 30 enters the semi-enclosed structure, flows through the chip area 2031, and flows out from the second opening area 2013. As can be seen, the chip area 2031 is cooled by the wind at the first air outlet 301 of the first fan 30, and the chip area 2031 is also cooled by the wind at the second air outlet 302 of the first fan 30, so that the heat dissipation effect on the chip area 2031 is improved. Secondly, because the base housing 202, the keyboard housing 201, the first fan 30, the second fan 40 and the air guide 50 form a semi-enclosed structure, that is, an air duct is arranged in the keyboard of the notebook computer, so that the air blown out from the second air outlet 302 can flow out from the second opening area 2013 after flowing through the chip area 2031 as much as possible, thereby improving the heat dissipation effect. Third, at the end of the air guide 50 contacting the outer shell of the first fan 30, the first distance 501 between the contact area and the second air outlet 302 is within a preset distance range, and the preset distance can be set to a smaller value, for example, the contact area can be set at the edge of the second air outlet 302, or can be set at a position several millimeters away from the edge of the second air outlet 302, because the position of the air guide 50 contacting the first fan 30 is closer to the second air outlet 302, and the air duct isolation is set in the notebook computer, the air blown out from the second air outlet 302 can be prevented from being sucked back into the first fan 30 again to form backflow. In the fourth aspect, the second air outlet 302 faces the chip area 2031, and the chip area 2031 is disposed in the middle of the notebook computer, in this case, the arrangement of the second air outlet 302 will not affect the input/output ports disposed on the two sides of the notebook computer, and the notebook computer can be better compatible with the existing notebook computer.
The shape of the air guide 50 in the embodiment of the present application can be adjusted according to the position and layout of a specific device on the main board 203 of the notebook computer. As shown in fig. 7, the wind guide 50 may be a straight structure, and alternatively, the wind guide 50 may have another shape, such as an inclined surface. The wind guide 50 may be a flexible structure. The specific material can be various, such as foam, flexible plastic member, flexible metal member, etc.
The following description is directed to an embodiment in which the notebook computer shown in fig. 8a, 8b, 8c, 9, and 10 includes a first fan 30 and a second fan 40, and the first fan 30 includes a first air outlet 301 and a second air outlet 302, and the second fan 40 includes a third air outlet 401 and a fourth air outlet 402.
Fig. 8a schematically illustrates a structural diagram of the notebook base 20 in fig. 1, fig. 8b is a partially enlarged view of a region C of the notebook base shown in fig. 8a, fig. 8C is a structural diagram of the first fan and the second fan in fig. 8a, and fig. 9 is an exploded view of the notebook base shown in fig. 8a, as shown in fig. 8a, fig. 8b, fig. 8C, and fig. 9, where the notebook base 20 includes a keyboard housing 201, a base housing 202, a hinge region 2011, a main board 203, a chip region 2031, a CPU2032, a GPU2033, a first fan 30, a second fan 40, a first heat dissipation fin 303, a second heat dissipation fin 403, and a temperature equalization plate 304; the rotation shaft region 2011 is provided with a first opening region 2012, a second opening region 2013 and a third opening region 2014, the first fan 30 is provided with a first air outlet 301 and a second air outlet 302, and the second fan 40 is provided with a third air outlet 401 and a fourth air outlet 402.
As shown in fig. 8a, 8b, 8c and 9, the keyboard housing 201 and the base housing 202 are engaged to form a cavity. A main board 203 is provided between the keyboard housing 201 and the base housing 202. For the description of the main board 203, the chip area 2031 and the first fan 30, reference is made to the description of fig. 2a, and the description thereof is omitted here. The temperature equalization plate 304 connects the first radiator fins 303 and the second radiator fins 403. For the descriptions of the vapor chamber 304, the first and second cooling fins 303 and 403, the first open area 2012, the second open area 2013 and the third open area 2014, reference may be made to the above description of fig. 5a, and no further description is provided herein.
As shown in fig. 8a, 8b, 8c and 9, the second fan 40 includes a third side and a fourth side, the third outlet 401 is located on the third side, and the fourth outlet 402 is located on the fourth side. The third side is a side of the second fan 40 facing the third opening 2014 of the hinge 2011, the fourth side is adjacent to the third side, and the fourth outlet 402 faces the chip region 2031. It can also be described as: the third air outlet 401 and the fourth air outlet 402 are respectively located at two adjacent side surfaces of the second fan 40.
As shown in fig. 8a, 8b, 8c and 9, the wind guide 50 may be disposed between the first fan 30 and the second fan 40, and the wind guide 50 may be in contact with the housings of the first fan 30 and the second fan 40. As shown in fig. 8a, the air guide 50 is disposed on the base housing, the second air outlet 302 of the first fan 30 faces the chip area 2031 of the motherboard 203, and the second air outlet 302 of the second fan 40 faces the chip area 2031 of the motherboard 203. The base housing 202, the keyboard housing 201, the first fan 30, the second fan 40, and the air guide 50 form a half-enclosed structure. Specifically, the base housing 202 is a top surface of a semi-enclosed structure, the keyboard housing 201 is a bottom surface of the semi-enclosed structure, a side surface of the first fan, which is provided with the second air outlet 302, the air guide 50, and a side surface of the second fan, which is provided with the fourth air outlet 402, form a side surface with an enclosed effect in the semi-enclosed structure, and one side surface which is not enclosed in the semi-enclosed structure is a position of the second opening area 2013 of the rotating shaft area 2011. The semi-enclosed structure includes within it the electronic components of the chip area 2031. The second outlet vent 302 and the fourth outlet vent 402 face the interior of the semi-enclosed structure.
Fig. 10 is a plan view of the notebook computer base shown in fig. 8a, and fig. 10 is a schematic diagram illustrating the direction of the wind blown out from the first outlet 301, the direction of the wind blown out from the second outlet 302, the direction of the wind blown out from the third outlet 401 of the second fan 40, and the direction of the wind blown out from the fourth outlet 402 of the second fan 40 by the first fan 30 in the notebook computer shown in fig. 8 a. As shown in fig. 10, on one hand, heat generated by the CPU2032 and the GPU2033 is transferred to the first heat dissipating fins 303 and the second heat dissipating fins 403 through the temperature equalizing plate 304, and the first fan 30 exhausts air flowing out through the first air outlet 301 through the first heat dissipating fins 303 and then through the first opening region 2012. The air flow discharged from the second fan 40 through the third air outlet 401 flows through the second heat dissipating fins 403 and then is discharged through the third opening 2014. In this process, the airflow discharged from the first air outlet 301 is used to cool the first heat dissipating fins 303, and the airflow discharged from the third air outlet 401 is used to cool the second heat dissipating fins 403, so as to achieve heat dissipation for cooling the electronic components inside the notebook computer. On the other hand, the air blown out from the second outlet 302 of the first fan 30 enters the semi-enclosed structure, flows through the chip area 2031, and flows out from the second opening area 2013. As can be seen, the chip area 2031 is cooled by the wind at the first air outlet 301 of the first fan 30, and the chip area 2031 is also cooled by the wind at the second air outlet 302 of the first fan 30, so that the heat dissipation effect on the chip area 2031 is improved. And the air blown out from the fourth outlet 402 of the second fan 40 enters the semi-enclosed structure, flows through the chip area 2031, and flows out from the second opening area 2013. It can be seen that the chip area 2031 is cooled by the wind from the third outlet 401 of the second fan 40, and the chip area 2031 is also cooled by the wind from the fourth outlet 402 of the second fan 40, so that the heat dissipation effect on the chip area 2031 is improved. Secondly, because the base housing 202, the keyboard housing 201, the first fan 30, the second fan 40 and the air guide 50 form a semi-enclosed structure, that is, an air duct is arranged in the keyboard of the notebook computer, so that the air blown out from the second air outlet 302 can flow out from the second opening area 2013 after flowing through the chip area 2031 as much as possible, and the air blown out from the fourth air outlet 402 can flow out from the second opening area 2013 after flowing through the chip area 2031 as much as possible, thereby improving the heat dissipation effect. Again, at the end of the air guide 50 contacting the outer casing of the first fan 30, the first distance 501 between the contact area and the second air outlet 302 is within a preset distance range, and the preset distance may be set to a smaller value, for example, the contact area may be disposed at the edge of the second air outlet 302, or may be disposed at a position several millimeters from the edge of the second air outlet 302. At one end of the air guide 50 contacting with the outer casing of the second fan 40, the second distance 502 between the contact area and the fourth air outlet 402 is within a preset distance range, and the preset distance may be set to a smaller value, for example, the contact area may be disposed at the edge of the fourth air outlet 402, or may be disposed at a position several millimeters away from the edge of the fourth air outlet 402, because the position where the air guide 50 contacts with the first fan 30 is closer to the second air outlet 302, and the position where the air guide 50 contacts with the second fan 40 is closer to the fourth air outlet 402, an air duct isolation is disposed in the notebook computer, so that the air blown out from the second air outlet 302 can be prevented from being sucked back into the first fan 30 again to form a backflow, and the air blown out from the fourth air outlet 402 can be prevented from being sucked back into the second fan 40 again to form a backflow. In the fourth aspect, the second air outlet 302 faces the chip area 2031, the chip area 2031 is disposed at an intermediate position of the notebook computer, the fourth air outlet 402 faces the chip area 2031, and the chip area 2031 is disposed at an intermediate position of the notebook computer, in this case, the arrangement of the second air outlet 302 and the fourth air outlet 402 will not affect the input/output ports disposed at two sides of the notebook computer, and the notebook computer can be better compatible with the existing notebook computer.
In an alternative embodiment, the size of the third outlet 401 may be larger than that of the fourth outlet 402, so that the air exhausted from the second fan 40 is mainly exhausted through the third outlet 401, and the fourth outlet 402 can assist in exhausting air to meet the heat dissipation requirement of the notebook computer.
The shape of the air guide 50 in the embodiment of the present application can be adjusted according to the position and layout of a specific device on the main board 203 of the notebook computer. As shown in fig. 10, the wind guide 50 may be a linear structure, and alternatively, the wind guide 50 may have another shape.
Fig. 11 is a plan view of another notebook base provided in this embodiment of the present application, as shown in fig. 11, fig. 11 is a schematic view illustrating another wind guide 50 that may be present in fig. 10, and as shown in fig. 11, another component 2034 may also be included in the half-enclosed structure shown in fig. 11. The air guide is a flexible member, and the shape of the air guide can be set according to the actual distribution of the devices included in the semi-enclosed structure, for example, the air guide is bent into the structure shown in fig. 11.
For the heat dissipation requirement of the notebook computer, there are several situations, one of which is to set two fans at two sides of the chip area of the notebook computer, but the two fans are both provided with only one air outlet, and the air outlets of the two fans are both facing the heat dissipation fins. The heat dissipation effect of this embodiment is inferior to that of the above-described solutions shown in fig. 2a to 11.
In another case, two fans are disposed on two sides of a chip area of the notebook computer, but both fans are provided with only one air outlet, and the air outlets of both fans face the heat dissipation fins. The newly added fan in such a solution may cause an increase in weight of the notebook computer and an increase in noise, and the wind blown by the fan may jump in the base housing and the keyboard housing of the notebook computer and also form a backflow.
In another case, two fans are disposed on two sides of a chip area of the notebook computer, but the two fans are both provided with two air outlets, the main air outlets of the two fans are both facing the heat dissipation fins, and the secondary air outlets of the two fans are both facing a direction opposite to the chip area, that is, the secondary air outlets of the two fans are facing the side of the notebook computer. Generally, however, the two sides of the notebook computer will be laid out with some input and output interfaces. If the air outlet is arranged on the side edge of the notebook computer, the air outlet is not suitable for arranging the input and output interface any more, the arrangement influence on the internal parts of the whole notebook computer is larger, and the air blown out by the secondary air outlets of the two fans in the arrangement directly flows out of the outside from the side edge of the notebook computer and does not flow through the chip area, so that the heat dissipation effect of the scheme on the chip area is smaller.
Fig. 12 is a schematic diagram of temperatures of various regions of a notebook base in the prior art, and fig. 13 is a schematic diagram of temperatures of various regions of a notebook base when the embodiment shown in fig. 2a is applied, which shows that, when the heat dissipation scheme in the prior art is applied, as shown in fig. 12, temperatures of several positions on a keyboard housing of a notebook computer are respectively: 43.5 degrees Celsius (degC), 51.2degC, 52.3degC, and 44.9 degC. When the embodiment provided in fig. 2a of the present application is applied, the temperatures of several corresponding positions on the keyboard housing of the notebook computer are respectively: 40.5degC, 44degC, 46.3degC and 42.5 degC. And as can be seen from fig. 12 and 13, the keyboard housing shown in fig. 12 has a darker gray scale and a darker gray scale, and a higher temperature, and the keyboard housing shown in fig. 13 has a lighter gray scale and a lighter gray scale, and a lower temperature. Based on fig. 12 and 13, it can be seen that the solution provided by the embodiment of the present application has a good heat dissipation effect on the notebook computer.
Claims (15)
1. A notebook computer, comprising:
the keyboard shell is provided with a rotating shaft area and is connected with the notebook computer screen through a rotating shaft of the rotating shaft area; the rotating shaft area is provided with a first opening area and a second opening area;
the base shell is connected with the keyboard shell to form a cavity; a main board, a first fan and an air guide piece are arranged in the cavity;
the first fan is provided with a first air outlet and a second air outlet, air blown out from the first air outlet flows out from the first opening area, and the second air outlet faces the chip area of the mainboard;
the base shell, the keyboard shell, the first fan and the air guide component form a semi-enclosed structure; the chip area is positioned inside the semi-surrounding structure, and the opening of the semi-surrounding structure faces the second opening area; and the air blown out of the second air outlet of the first fan enters the semi-surrounding structure, flows through the chip area and flows out of the second opening area.
2. The notebook computer of claim 1, wherein the air guide is in contact with a housing of the first fan;
the distance between the contact area of the first fan and the air guide piece and the second air outlet is smaller than a preset distance.
3. The notebook computer of claim 1 or 2, wherein a side of the first fan at which the first air outlet is disposed is adjacent to a side at which the second air outlet is disposed.
4. A notebook computer as claimed in any of claims 1 to 3, wherein the second outlet is located inside the semi-enclosed structure.
5. The notebook computer of any of claims 1 to 4, wherein an air output of the first air outlet is greater than an air output of the second air outlet.
6. The notebook computer of any one of claims 1 to 5, wherein the base housing forms a bottom surface of the semi-enclosed structure, the keyboard housing forms a top surface of the semi-enclosed structure, a side surface of the first fan on which the second air outlet is provided and the air guide form a side surface of the semi-enclosed structure.
7. The notebook computer of any of claims 1 to 5, further comprising a second fan, the second fan being provided with a third air outlet;
the rotating shaft area is also provided with a third opening area;
and the air blown out from the third air outlet flows out from the third opening area.
8. The notebook computer of claim 7, wherein the second fan further comprises a fourth air outlet;
the fourth air outlet faces to the chip area of the mainboard;
the base shell, the keyboard shell, the first fan, the second fan and the air guide component form a semi-enclosed structure; and the air blown out of the fourth air outlet of the second fan enters the semi-surrounding structure, flows through the chip area and flows out of the second opening area.
9. The notebook computer of claim 8, wherein the air guide is in contact with a housing of the second fan;
and the distance between the contact area of the second fan and the air guide piece and the fourth air outlet is smaller than a preset distance.
10. The notebook computer of claim 8 or 9, wherein a side of the second fan at which the third air outlet is disposed is adjacent to a side at which the fourth air outlet is disposed.
11. The notebook computer of any of claims 8 to 10, wherein the fourth air outlet is located inside the semi-enclosed structure.
12. The notebook computer of any of claims 8 to 11, wherein an air output of the third air outlet is greater than an air output of the fourth air outlet.
13. The notebook computer of any one of claims 8 to 12, wherein the base housing forms a bottom surface of the semi-enclosed structure, the keyboard housing forms a top surface of the semi-enclosed structure, a side surface of the first fan on which the second air outlet is provided, a side surface of the second fan on which the fourth air outlet is provided, and the air guide forms a side surface of the semi-enclosed structure.
14. The notebook computer of any of claims 7 to 13, wherein the second air outlet is located between the first air outlet and the second air outlet.
15. A notebook computer, comprising:
the keyboard shell is provided with a rotating shaft area and is connected with the notebook computer screen through a rotating shaft of the rotating shaft area; the rotating shaft area is provided with a first opening area, a second opening area and a third opening area, and the second air outlet is positioned between the first air outlet and the second air outlet;
the base shell is connected with the keyboard shell to form a cavity; the cavity is internally provided with a mainboard, a first fan, first radiating fins, a second fan, second radiating fins and an air guide piece;
the first fan is provided with a first air outlet and a second air outlet, the side surface of the first fan, which is provided with the first air outlet, is adjacent to the side surface of the second fan, the first air outlet faces the first heat dissipation fins, and air blown out of the first air outlet flows out of the first opening area after flowing through the first heat dissipation fins; the second air outlet faces to the chip area of the mainboard;
the second fan is provided with a third air outlet and a fourth air outlet, the side surface of the second fan, which is provided with the third air outlet, is adjacent to the side surface, which is provided with the fourth air outlet, the third air outlet faces the second heat dissipation fins, and air blown out from the third air outlet flows through the second heat dissipation fins and then flows out from the third opening area; the fourth air outlet faces to the chip area of the mainboard;
one end of the air guide piece is in contact with the shell of the first fan, and the other end of the air guide piece is in contact with the shell of the second fan;
the base shell, the keyboard shell, the first fan, the second fan and the air guide component form a semi-enclosed structure; the base shell forms the bottom surface of the semi-surrounding structure, the keyboard shell forms the top surface of the semi-surrounding structure, the side surface of the first fan provided with the second air outlet, the side surface of the second fan provided with the fourth air outlet and the side surface of the semi-surrounding structure formed by the air guide piece are arranged on the first fan;
the air blown out of the second air outlet of the first fan enters the semi-surrounding structure, flows through the chip area and flows out of the second opening area; and the air blown out of the fourth air outlet of the second fan enters the semi-surrounding structure, flows through the chip area and flows out of the second opening area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910863217.8A CN110597356A (en) | 2019-09-12 | 2019-09-12 | Notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910863217.8A CN110597356A (en) | 2019-09-12 | 2019-09-12 | Notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110597356A true CN110597356A (en) | 2019-12-20 |
Family
ID=68859172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910863217.8A Pending CN110597356A (en) | 2019-09-12 | 2019-09-12 | Notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110597356A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111447812A (en) * | 2020-05-15 | 2020-07-24 | 维沃移动通信有限公司 | Heat sink device |
| CN113107885A (en) * | 2021-04-08 | 2021-07-13 | 合肥联宝信息技术有限公司 | Heat dissipation structure and heat dissipation method for bottom surface of notebook computer |
| CN113885678A (en) * | 2021-10-26 | 2022-01-04 | 深圳微步信息股份有限公司 | Heat radiation assembly and notebook computer with same |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1410860A (en) * | 2001-09-25 | 2003-04-16 | 纬创资通股份有限公司 | Heat dissipating module of notebook computer |
| CN2606455Y (en) * | 2003-02-09 | 2004-03-10 | 纬创资通股份有限公司 | Radiating module |
| CN101201677A (en) * | 2006-12-13 | 2008-06-18 | 英业达股份有限公司 | Wind-guiding structure for radiating fan |
| CN101832280A (en) * | 2009-03-13 | 2010-09-15 | 富准精密工业(深圳)有限公司 | Heat-dissipating device, centrifugal fan thereof and electronic device using same |
| CN201903833U (en) * | 2010-12-21 | 2011-07-20 | 纬创资通股份有限公司 | Electronic device |
| CN102523721A (en) * | 2011-11-24 | 2012-06-27 | 华为技术有限公司 | Flow guide device and electronic equipment comprising same |
| CN102573409A (en) * | 2010-11-08 | 2012-07-11 | 仁宝电脑工业股份有限公司 | Electronic apparatus |
| US20130286590A1 (en) * | 2010-12-28 | 2013-10-31 | Fujitsu Limited | Cooling unit, electronic apparatus, and guide member |
| CN204229298U (en) * | 2014-11-06 | 2015-03-25 | 联想(北京)有限公司 | Terminal device |
| CN105652991A (en) * | 2015-12-29 | 2016-06-08 | 湖南长城银河科技有限公司 | Laptop cooling device and laptop |
| CN208607605U (en) * | 2018-08-01 | 2019-03-15 | 中新工程技术研究院有限公司 | A kind of cooling fan structure of laptop |
| CN211349137U (en) * | 2019-09-12 | 2020-08-25 | 华为技术有限公司 | Notebook computer |
-
2019
- 2019-09-12 CN CN201910863217.8A patent/CN110597356A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1410860A (en) * | 2001-09-25 | 2003-04-16 | 纬创资通股份有限公司 | Heat dissipating module of notebook computer |
| CN2606455Y (en) * | 2003-02-09 | 2004-03-10 | 纬创资通股份有限公司 | Radiating module |
| CN101201677A (en) * | 2006-12-13 | 2008-06-18 | 英业达股份有限公司 | Wind-guiding structure for radiating fan |
| CN101832280A (en) * | 2009-03-13 | 2010-09-15 | 富准精密工业(深圳)有限公司 | Heat-dissipating device, centrifugal fan thereof and electronic device using same |
| CN102573409A (en) * | 2010-11-08 | 2012-07-11 | 仁宝电脑工业股份有限公司 | Electronic apparatus |
| CN201903833U (en) * | 2010-12-21 | 2011-07-20 | 纬创资通股份有限公司 | Electronic device |
| US20130286590A1 (en) * | 2010-12-28 | 2013-10-31 | Fujitsu Limited | Cooling unit, electronic apparatus, and guide member |
| CN102523721A (en) * | 2011-11-24 | 2012-06-27 | 华为技术有限公司 | Flow guide device and electronic equipment comprising same |
| CN204229298U (en) * | 2014-11-06 | 2015-03-25 | 联想(北京)有限公司 | Terminal device |
| CN105652991A (en) * | 2015-12-29 | 2016-06-08 | 湖南长城银河科技有限公司 | Laptop cooling device and laptop |
| CN208607605U (en) * | 2018-08-01 | 2019-03-15 | 中新工程技术研究院有限公司 | A kind of cooling fan structure of laptop |
| CN211349137U (en) * | 2019-09-12 | 2020-08-25 | 华为技术有限公司 | Notebook computer |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111447812A (en) * | 2020-05-15 | 2020-07-24 | 维沃移动通信有限公司 | Heat sink device |
| CN113107885A (en) * | 2021-04-08 | 2021-07-13 | 合肥联宝信息技术有限公司 | Heat dissipation structure and heat dissipation method for bottom surface of notebook computer |
| CN113107885B (en) * | 2021-04-08 | 2022-04-12 | 合肥联宝信息技术有限公司 | Heat dissipation structure and heat dissipation method for bottom surface of notebook computer |
| CN113885678A (en) * | 2021-10-26 | 2022-01-04 | 深圳微步信息股份有限公司 | Heat radiation assembly and notebook computer with same |
| CN113885678B (en) * | 2021-10-26 | 2023-09-19 | 深圳微步信息股份有限公司 | Radiating assembly and notebook computer with same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6804115B2 (en) | Heat dissipation apparatus | |
| CN101174172B (en) | Housing temperature suppressing structure in electronic device and portable computer | |
| US6621698B2 (en) | Computer assembly providing cooling for more than one electronic component | |
| TWI399165B (en) | System for efficiently cooling a processor | |
| US20080093056A1 (en) | Thermal module | |
| US9277672B2 (en) | Television, radiating member, and electronic apparatus | |
| CN110597356A (en) | Notebook computer | |
| US20030151900A1 (en) | Multi-opening heat-dissipation device for high-power electronic components | |
| TWI761944B (en) | Electronic device | |
| JP2009169752A (en) | Electronic equipment | |
| CN101174168A (en) | Cooling structure of electronic device | |
| US20090201639A1 (en) | Chassis of portable electronic apparatus | |
| KR20040038162A (en) | Main body of computer | |
| CN211349137U (en) | Notebook computer | |
| JP4496978B2 (en) | Electronics | |
| JP2000105635A (en) | Cooling device for notebook-type personal computer | |
| WO2022181001A1 (en) | Electronic device | |
| JP2001257494A (en) | Electronic apparatus | |
| CN111031767B (en) | Electronic equipment and heat dissipation module | |
| JPH11194859A (en) | Information processor | |
| WO2022249878A1 (en) | Heat dissipating structure, and electronic device | |
| CN216979669U (en) | Heat dissipation system for notebook computer | |
| TWI820739B (en) | Heat dissipation structure | |
| TWI832283B (en) | Heat dissipation structure | |
| JP3000846B2 (en) | Cooling device for electronic components |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |