TWI820739B - Heat dissipation structure - Google Patents
Heat dissipation structure Download PDFInfo
- Publication number
- TWI820739B TWI820739B TW111121336A TW111121336A TWI820739B TW I820739 B TWI820739 B TW I820739B TW 111121336 A TW111121336 A TW 111121336A TW 111121336 A TW111121336 A TW 111121336A TW I820739 B TWI820739 B TW I820739B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat dissipation
- fans
- dissipation structure
- opening area
- side wall
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 88
- 230000000903 blocking effect Effects 0.000 claims description 12
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000012546 transfer Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
本揭露是有關於一種散熱結構。This disclosure relates to a heat dissipation structure.
現今市售筆電的氣冷散熱結構多為雙風扇設計。其配置主要是在發熱元件周圍設置導熱管,並透過導熱管將熱量傳導至冷卻風扇周圍,在通過風扇的冷氣流將熱量帶出至筆電外部。然而,筆電中的發熱元件(例如,CPU、GPU晶片)常因為空間限制的緣故彼此配置非常靠近,因此筆電將產生單一位置的熱堆積,不利於散熱。此外,風扇的進氣口通常是由筆電的單一側面(通常是筆電底部)吸入冷空氣,汲取冷空氣的空間狹小也進一步造成筆電散熱效益較差。Most of the air-cooled heat dissipation structures of laptops on the market today are dual-fan designs. Its configuration is mainly to set up a heat pipe around the heating element, and conduct the heat to the cooling fan through the heat pipe, and the cold air flow passing through the fan will take the heat out to the outside of the laptop. However, the heating components (such as CPU and GPU chips) in laptops are often placed very close to each other due to space constraints. Therefore, the laptop will generate heat accumulation in a single location, which is not conducive to heat dissipation. In addition, the air inlet of the fan usually draws in cold air from a single side of the laptop (usually the bottom of the laptop). The space for drawing the cold air is small, which further results in poor cooling efficiency of the laptop.
因此,如何提出一種可解決上述問題的散熱結構,是目前業界亟欲投入研發資源解決的問題之一。Therefore, how to propose a heat dissipation structure that can solve the above problems is one of the problems that the industry is currently eager to invest in research and development resources to solve.
有鑑於此,本揭露之一目的在於提出一種可有效解決上述問題的散熱結構。In view of this, one purpose of the present disclosure is to provide a heat dissipation structure that can effectively solve the above problems.
本揭露是有關於一種散熱結構包含機殼、均熱板、第一風扇以及至少兩第二風扇。機殼具有相對的第一側壁以及第二側壁。第一側壁設置第一開口區域。第二側壁設置第二開口區域。第一開口區域以及第二開口區域相對。均熱板設置在機殼內部並覆蓋至少一熱源。均熱板包含對應第一開口區域設置並貫通均熱板的開口。第一風扇設置在開口中。至少兩第二風扇鄰近均熱板設置。至少兩第二風扇各別的氣流出口遠離第一風扇。機殼進一步包含多個側表面連接第一側壁以及第二側壁。側表面包含三側開口區域。三側開口區域各別朝向不同方向。The present disclosure relates to a heat dissipation structure including a chassis, a vapor chamber, a first fan and at least two second fans. The casing has first and second opposite side walls. The first side wall is provided with a first opening area. The second side wall provides a second opening area. The first opening area and the second opening area are opposite to each other. The vapor chamber is arranged inside the casing and covers at least one heat source. The vapor chamber includes an opening corresponding to the first opening area and penetrating the vapor chamber. The first fan is disposed in the opening. At least two second fans are disposed adjacent to the vapor chamber. The air flow outlets of at least two second fans are respectively located away from the first fan. The casing further includes a plurality of side surfaces connecting the first side wall and the second side wall. The side surface contains three side open areas. The opening areas on the three sides face different directions.
在目前一些實施方式中,均熱板包含導熱元件由該均熱板延伸並通過至少兩第二風扇的氣流出口。In some current embodiments, the vapor chamber includes thermally conductive elements extending from the vapor chamber and passing through the airflow outlets of at least two second fans.
在目前一些實施方式中,三側開口區域包含第一側開口區域鄰近第一風扇設置於均熱板的一側。In some current implementations, the three-side opening area includes a first side opening area disposed on one side of the vapor chamber adjacent to the first fan.
在目前一些實施方式中,機殼進一步包含可收合的至少一支架鄰近第一側開口區域設置於第二側壁上。至少一支架係隔開由第一側開口區域排出的氣流。In some current implementations, the casing further includes at least one collapsible bracket disposed on the second side wall adjacent to the first side opening area. At least one bracket isolates the airflow discharged from the first side opening area.
在目前一些實施方式中,當至少一支架展開時係增加機殼一側的高度。In some current implementations, when at least one bracket is deployed, the height of one side of the casing is increased.
在目前一些實施方式中,熱交換器設置在第一側開口區域與第一風扇之間。In some current implementations, the heat exchanger is disposed between the first side opening area and the first fan.
在目前一些實施方式中,三側開口區域進一步包含兩第二側開口區域對應至少兩第二風扇的氣流出口設置。均熱板包含導熱元件由均熱板延伸並設置在氣流出口以及兩第二側開口區域之間。In some current implementations, the three-side opening area further includes two second side opening areas corresponding to the air flow outlets of at least two second fans. The vapor chamber includes a thermal conductive element extending from the vapor chamber and disposed between the airflow outlet and the two second side opening areas.
在目前一些實施方式中,熱交換器設置在兩第二側開口區域與至少兩第二風扇之間。In some current implementations, the heat exchanger is disposed between the two second side opening areas and at least two second fans.
在目前一些實施方式中,第一側開口區域朝向第一方向,並且兩第二側開口區域朝向彼此相反的第二方向以及第三方向。In some current implementations, the first side opening area faces a first direction, and the two second side opening areas face a second direction and a third direction opposite to each other.
在目前一些實施方式中,熱源為多個並且開口隔開熱源。In some current implementations, there are multiple heat sources and the openings separate the heat sources.
在目前一些實施方式中,機殼包含分別位於第一側壁以及第二側壁且對應至少兩第二風扇設置的第三開口區域以及第四開口區域。In some current implementations, the casing includes third opening areas and fourth opening areas located on the first side wall and the second side wall respectively and corresponding to at least two second fans.
在目前一些實施方式中,機殼進一步包含阻擋塊。阻擋塊設置在第二側壁上,並分別位於相鄰的至少兩第二風扇的氣流出口以及第四開口區域之間。In some current implementations, the housing further includes blocking blocks. The blocking blocks are disposed on the second side wall and are respectively located between the air flow outlets and the fourth opening areas of at least two adjacent second fans.
在目前一些實施方式中,散熱結構進一步包含第一擋體設置以隔開至少兩第二風扇以及均熱板。In some current implementations, the heat dissipation structure further includes a first baffle to separate at least two second fans and a vapor chamber.
在目前一些實施方式中,第一擋體設置在機殼內部並連接第二側壁與第一側壁的其中一者。In some current implementations, the first blocking body is disposed inside the casing and connects one of the second side wall and the first side wall.
在目前一些實施方式中,第一擋體設置在至少兩第二風扇的邊緣,並且邊緣藉由第一擋體連接第一側壁與第二側壁的其中一者。In some current implementations, the first baffle is disposed on the edges of at least two second fans, and the edges are connected to one of the first side wall and the second side wall through the first baffle.
在目前一些實施方式中,至少兩第二風扇包含第二擋體部分地圍繞至少兩第二風扇的氣流入口。In some current implementations, the at least two second fans include a second baffle partially surrounding the airflow inlets of the at least two second fans.
綜上所述,於本揭露的散熱結構中,通過有系統地在不同方向設置第一風扇以及兩第二風扇的氣流出口,將可以將熱量快速由不同方向傳導並排出至機殼外部。另外,散熱結構中設置的大面積的均熱板、延伸的導熱元件以及多個熱交換器,將可以有效提升散熱面積。同時,散熱結構也配合將熱源分散地設置在均熱板上,因此將可以避免單一位置上的熱量堆積。另一方面,散熱結構在第一側壁以及第二側壁對應風扇的氣流入口設置多個開口區域,將可以使風扇由兩個方向吸入冷空氣,並因此提升了風扇的冷空氣吸入量。更進一步地,散熱結構在風扇的氣流出口與氣流入口之間設置有支架與阻擋塊,在他們的協同作用下,將可以防止排出的熱氣流再次被吸入機殼內部,使每個風扇的對流流場各自獨立互不干涉,並確保排熱路徑的順暢並避免無效率的熱傳遞發生。此外,散熱結構在機殼內部設置第一擋體並劃分出均熱區以及散熱區,並且在兩第二風扇的氣流入口周圍設置第二擋體使其與機殼內部隔開。如此一來,將可以有效的控制熱量的傳遞方向,避免在風扇散熱的過程中,熱氣流在機殼內部產生無效率的熱傳遞。In summary, in the heat dissipation structure of the present disclosure, by systematically arranging the air flow outlets of the first fan and the two second fans in different directions, heat can be quickly conducted in different directions and discharged to the outside of the casing. In addition, the large-area vapor chamber, extended thermal conductive elements and multiple heat exchangers installed in the heat dissipation structure will effectively increase the heat dissipation area. At the same time, the heat dissipation structure also arranges the heat sources dispersedly on the vapor chamber, so heat accumulation in a single location can be avoided. On the other hand, the heat dissipation structure is provided with multiple opening areas on the first side wall and the second side wall corresponding to the air flow inlet of the fan, which allows the fan to suck in cold air from two directions, thereby increasing the amount of cold air sucked in by the fan. Furthermore, the heat dissipation structure is provided with a bracket and a blocking block between the air flow outlet and the air flow inlet of the fan. Under their synergy, it will be possible to prevent the discharged hot air flow from being sucked into the cabinet again, thereby improving the convection of each fan. The flow fields are independent and do not interfere with each other, ensuring a smooth heat dissipation path and avoiding inefficient heat transfer. In addition, the heat dissipation structure is provided with a first baffle inside the casing to divide a uniform heat zone and a heat dissipation zone, and is provided with a second baffle around the air inlets of the two second fans to separate them from the inside of the casing. In this way, the direction of heat transfer can be effectively controlled to prevent the hot air flow from causing inefficient heat transfer inside the casing during the heat dissipation process of the fan.
以下揭露內容提供用於實施所提供標的之不同特徵的許多不同實施例或實例。以下描述部件及佈置之特定實例以簡化本揭露。當然,此些僅為實例,且並不意欲為限制性的。舉例而言,在如下描述中第一特徵在第二特徵之上或在第二特徵上形成可包括其中第一特徵與第二特徵形成為直接接觸之實施例,且亦可包括其中額外特徵可在第一特徵與第二特徵之間形成而使得第一特徵與第二特徵可不直接接觸的實施例。另外,本揭露可在各種實例中重複元件符號及/或字母。此重複係出於簡化及清楚目的,且其自身並不表示所論述之各種實施例及/或配置之間的關係。The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are examples only and are not intended to be limiting. For example, the following description where a first feature is formed on or on a second feature may include embodiments in which the first feature and the second feature are formed in direct contact, and may also include embodiments in which additional features may be Embodiments are formed between a first feature and a second feature such that the first feature and the second feature may not be in direct contact. Additionally, the present disclosure may repeat reference symbols and/or letters in various instances. This repetition is for simplicity and clarity and does not in itself represent a relationship between the various embodiments and/or configurations discussed.
另外,為了描述簡單,可在本文中使用諸如「在……下面」、「在……下方」、「下部」、「在……上方」、「上部」及其類似術語之空間相對術語,以描述如諸圖中所示的一個元件或特徵與另一(另外)元件或特徵的關係。除了諸圖中所描繪之定向以外,此些空間相對術語意欲涵蓋元件在使用中或操作中之不同定向。裝置可以其他方式定向(旋轉90度或以其他定向),且可同樣相應地解釋本文中所使用之空間相對描述詞。In addition, for simplicity of description, spatially relative terms such as "below", "below", "lower", "above", "upper" and similar terms may be used herein. Describe the relationship of one element or feature to another (additional) element or feature as illustrated in the figures. These spatially relative terms are intended to encompass different orientations of elements in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
本文中使用的「大約」、「約」、「近似」或者「實質上」一般表示落在給定值或範圍的百分之二十之中,或在百分之十之中,或在百分之五之中。本文中所給予的數字量值為近似值,表示使用的術語如「大約」、「約」、「近似」或者「實質上」在未明確說明時可以被推斷。As used herein, "about," "approximately," "approximately" or "substantially" generally means falling within twenty percent, within ten percent, or within one hundred percent of a given value or range. Out of five. Numerical quantities given herein are approximations, meaning that terms such as "about," "approximately," "approximately" or "substantially" may be inferred when not expressly stated otherwise.
第1圖為根據本揭露之一些實施例繪示的散熱結構100在俯視角的示意圖。第2圖為根據本揭露之一些實施例繪示的散熱結構100在背面視角的示意圖。第3A圖為根據本揭露之一些實施例繪示的位於機殼110內部的局部散熱結構100的剖面示意圖。請參照第1圖至第3A圖,本揭露是有關於一種散熱結構100包含機殼110、均熱板120、第一風扇130以及至少兩第二風扇140。機殼110具有相對的第一側壁112以及第二側壁114。第一側壁112設置第一開口區域112a。第二側壁114設置第二開口區域114a。第一開口區域112a以及第二開口區域114a相對。均熱板120設置在機殼110內部並覆蓋至少一熱源150。均熱板120包含對應第一開口區域112a設置並貫通均熱板120的開口122。第一風扇130設置在開口122中。至少兩第二風扇140鄰近均熱板120設置。至少兩第二風扇140各別的氣流出口142遠離第一風扇130。機殼110進一步包含多個側表面116連接第一側壁112以及第二側壁114。側表面116包含三側開口區域116a、116b、116c。三側開口區域116a、116b、116c各別朝向不同方向。FIG. 1 is a schematic diagram of a
請參照第1圖至第2圖,在一些實施例中,機殼110的第一側壁112、第二側壁114以及多個側表面116可以定義一個容置空間以容納部分的散熱結構100。然而,機殼110亦可以是其他裝置,例如,計算機、處理器,的一部分。另一方面,在容置空間中亦可以包含其他不屬於散熱結構100的電子元件或裝置,例如,鍵盤、觸控板、觸控筆等。舉例來說,在第1圖至第2圖所繪示的實施例中,機殼110與筆記型電腦結合,機殼110中除了容納散熱結構100之外,也包含處理器、電路板、輸入裝置以及輸入/輸出介面等裝置或元件。Referring to FIGS. 1 to 2 , in some embodiments, the
第4圖為根據本揭露之一些實施例繪示的散熱結構100的剖面側視圖。請參照第1圖至第4圖,第一側壁112以及第二側壁114彼此相對並分別設置有第一開口區域112a以及第二開口區域114a。在一些實施例中,第一開口區域112a以及第二開口區域114a內可以包含任意數目的開口。當第一開口區域112a以及第二開口區域114a彼此相對地設置時,這些開口並不一定要彼此相對。當第一開口區域112a以及第二開口區域114a彼此相對地設置時,氣流可以由第一開口區域112a流入並穿過機殼110再由第二開口區域114a流出,同樣地,氣流亦可以沿著相反的路徑移動。在一些實施例中,機殼110包含分別位於第一側壁112以及第二側壁114且對應至少兩第二風扇140設置的第三開口區域112b以及第四開口區域114b。在一些實施例中,第三開口區域112b以及第四開口區域114b可以鄰近設置在至少兩第二風扇140的氣流入口144,以協助至少兩第二風扇140由機殼110外部吸入冷空氣。舉例來說,在第一側壁112上對應兩第二風扇140的位置設置第三開口區域112b,並且在第二側壁114上對應兩第二風扇140的位置設置第四開口區域114b。在一些實施例中,第三開口區域112b以及第四開口區域114b內可以包含任意數目的開口,但本揭露並不以此為限。FIG. 4 is a cross-sectional side view of the
請參照第1圖至第4圖,在一些實施例中,多個側表面116連接第一側壁112以及第二側壁114的邊緣,並且每個側表面116面對不同方向。側表面116上設有側開口區域116a、116b、116c。側開口區域116a、116b、116c根據其設置位置可以分為與第一風扇130相鄰的第一側開口區域116a,以及與至少兩第二風扇140相鄰的兩第二側開口區域116b、116c。在一些實施例中,第一側開口區域116a以及兩第二側開口區域116b、116c可以作為排氣口,將氣體沿著多個不同的方向由機殼110內部排出。第一側開口區域116a以及兩第二側開口區域116b、116c的具體位置可以相對於均熱板120、第一風扇130以及至少兩第二風扇140設置,他們之間的相對位置關係將在下文細節說明。Referring to FIGS. 1 to 4 , in some embodiments, a plurality of side surfaces 116 connects the edges of the
請參照第1圖至第3A圖,均熱板120設置在容置空間中,並且覆蓋熱源150。在一些實施例中,熱源150可以是,例如,CPU、GPU或者其他發熱電子元件。均熱板120設有開口122並容置第一風扇130。具體來說,第一風扇130的位置(亦為開口122的位置)對應第一開口區域112a以及第二開口區域114a,並且第一開口區域112a以及第二開口區域114a將協助第一風扇130由機殼110外部吸入冷空氣。在一些實施例中,均熱板120的開口122位於均熱板120中心。如此一來,設置在開口122中的第一風扇130將位於均熱板120中心。第一風扇130可以通過氣流將熱源的熱量沿著遠離第一風扇130的方向輻射式地傳導至均熱板120的其他位置,並提升均熱板120的散熱效率。在另外一些實施例中,熱源150為多個並且開口122隔開熱源150。舉例來說,參照第3A圖,熱源150分別位於開口122的兩側。透過將熱源150分散在第一風扇130(即,開口122的位置)的兩側,將熱源150所產生的熱量打散,使熱量可以更平均的在均熱板120上分布,並提升均熱板120的散熱效率。Referring to Figures 1 to 3A, the
請參照第1圖至第3A圖,在一些實施例中,第一側開口區域116a鄰近第一風扇130設置於均熱板120的一側。更進一步來說,在第3A圖所繪示的實施例中,進一步設置熱交換器160在第一側開口區域116a與第一風扇130之間。如此一來,第一風扇130將可以在協助熱量在均熱板120上傳導的同時,透過氣流將熱量帶至熱交換器160並由第一側開口區域116a離開機殼110排放至外部。熱交換器160提供更大的表面積使熱量與氣流接觸,以更有效率的利用氣流將熱量排放至機殼110外部。Referring to FIGS. 1 to 3A , in some embodiments, the first
請參照第1圖至第3A圖,在一些實施例中,均熱板120包含導熱元件124由該均熱板120延伸並通過氣流出口142。導熱元件124的設置可以延伸均熱板120的導熱路徑置特定位置以輔助均熱板120散熱。舉例來說,參照第3A圖所繪示的實施例,兩個導熱元件124分別由均熱板120的相對兩邊緣延伸至至少兩第二風扇140的氣流出口142。更進一步來說,在一些實施例中,兩第二側開口區域116b、116c對應氣流出口142設置。導熱元件124由均熱板120延伸並設置在氣流出口142以及兩第二側開口區域116b、116c之間。如此一來,由導熱元件124傳導的熱量,可以精確地移動至氣流出口142並被至少兩第二風扇140的氣流帶出至機殼110外部。在一些實施例中,熱交換器160設置在兩第二側開口區域116b、116c與至少兩第二風扇140之間。具體來說,導熱元件124可以與熱交換器160連接以增加其散熱表面積,再透過將熱交換器160設置在氣流出口142前,以更有效率的利用氣流將熱量由兩第二側開口區域116b、116c帶出機殼110外部。Referring to FIGS. 1 to 3A , in some embodiments, the
應當注意的是,散熱結構100的設計可以減少並避免熱氣流在散熱結構100的風扇之間進行無效率的傳遞(例如,熱量持續在第一風扇130以及至少兩第二風扇140之間傳遞)。其原理在於,以不同方向設置散熱結構100的至少兩第二風扇140的氣流出口142(即,兩第二側開口區域116b、116c的方向)與第一風扇130的氣流出口方向(即,第一側開口區域116a的方向)。如此一來,可以避免由某一的風扇的氣流出口離開機殼110的熱氣流進入另一的風扇的氣流入口。舉例來說,在第1圖至第3A圖的實施例中,第一側開口區域116a朝向第一方向A1,並且兩第二側開口區域116b、116c朝向彼此相反的第二方向A2以及第三方向A3。It should be noted that the design of the
請參照第1圖至第3A圖,在一些實施例中,機殼110進一步包含阻擋塊170。阻擋塊170設置在第二側壁114上,並分別位於相鄰的氣流出口142(分別對應兩第二側開口區域116b、116c)以及第四開口區域114b之間。具體來說,第四開口區域114b對應至少第二風扇140的氣流入口144,若是在氣流出口142以及氣流入口144之間設置阻擋塊170,將可以更好的阻隔由氣流出口142排出的熱氣流回流至氣流入口144,以避免無效率的熱傳導。在一些實施例中,機殼110進一步包含可收合的支架180鄰近第一側開口區域116a設置於第二側壁114上。當支架180展開時係隔開由第一側開口區域116a排出的氣流。具體來說,支架180可以設置在第一側開口區域116a與第二開口區域114a之間。在支架180展開時將可以在第一側開口區域116a與第二開口區域114a之間形成一道凸壁,並阻隔由第一側開口區域116a排出的熱氣流回流至第二開口區域114a,以避免無效率的熱傳導。此外,支架180展開時亦可以將機殼110的一側墊高,並增加第二開口區域114a的冷空氣進氣空間以提升第一風扇130的進氣效率。Referring to FIGS. 1 to 3A , in some embodiments, the
第3B圖為根據本揭露之另一些實施例繪示的位於機殼110內部的局部散熱結構100的剖面示意圖。請參照第1圖、第2圖以及第3B圖,在一些實施例中,散熱結構100進一步包含第一擋體190設置以隔開至少兩第二風扇140以及均熱板120。具體來說,設置第一擋體190可以將機殼110的內部空間進行劃分,以提升散熱結構100的散熱效率。在至少兩第二風扇140以及均熱板120之間設置第一擋體190可以避免兩第二風扇140運作時吸入來自均熱板120的熱氣。第一擋體190將均熱板120以及第一風扇130隔成均熱區。在均熱區中熱量將被均勻分散,以避免多個熱源150之間的熱量疊加,並提升散熱效率。另一方面,第一擋體190同時將至少兩第二風扇140各別隔成散熱區。均熱區以及散熱區之間可以透過導熱元件124形成熱傳導途徑,將熱量由均熱區傳導至散熱區。如此一來,至少兩第二風扇140吸入的冷氣流將可以專注地幫助導熱元件124散熱,並且第一擋體190可以確保至少兩第二風扇140的冷氣流不會在均熱區與散熱區之間進行無效率的熱傳遞。FIG. 3B is a schematic cross-sectional view of the local
第3C圖為根據本揭露之另一些實施例繪示的位於機殼110內部的局部散熱結構100的剖面示意圖。請參照第1圖、第2圖以及第3C圖,在一些實施例中,第一擋體190設置在機殼110內部並連接第二側壁114與第一側壁112的其中一者。具體來說,第一擋體190可以設置在第二側壁114以及第一側壁112之間並且環繞均熱區,第一擋體190可以是由第二側壁114或第一側壁112延伸的凸台。第一擋體190隔出的均熱區中包含第一風扇130以及均熱板120。在一些實施例中,均熱區亦可以同時包含其他元件,諸如電路板或是其他電子裝置,或這些元件的一部分。另一方面,第一擋體190同時分別將至少兩第二風扇140隔成散熱區。在一些實施例中,兩個散熱區不互相連通,並且兩個散熱區各自通過導熱元件124與均熱區的均熱板120連接。如此一來,每個散熱區的散熱路徑將彼此獨立、互不干擾,因此提升了散熱結構100的散熱效率。在另外一些實施例中,第一擋體190設置在至少兩第二風扇140的邊緣,並且邊緣藉由第一擋體190連接第一側壁112與第二側壁114的其中一者。具體來說,將第一擋體190設置在至少兩第二風扇140的邊緣亦可以達到前述劃分均熱區以及散熱區的效果。FIG. 3C is a schematic cross-sectional view of the local
請參照第1圖至第3A圖,在一些實施例中,至少兩第二風扇140包含第二擋體146部分地圍繞至少兩第二風扇140的氣流入口144。在氣流入口144周圍設置第二擋體146將可以進一步確保至少兩第二風扇140的冷氣流是由機殼110外部進入。如此一來,將可以確保氣流入口144只接受來自外部的冷氣流,並且不會與機殼110內部的熱氣流之間產生無效率的熱傳遞。Referring to FIGS. 1 to 3A , in some embodiments, at least two
以上對於本揭露之具體實施方式之詳述,可以明顯地看出,於本揭露的散熱結構中,通過有系統地在不同方向設置第一風扇以及兩第二風扇的氣流出口,將可以將熱量快速由不同方向傳導並排出至機殼外部。另外,散熱結構中設置的大面積的均熱板、延伸的導熱元件以及多個熱交換器,將可以有效提升散熱面積。同時,散熱結構也配合將熱源分散地設置在均熱板上,因此將可以避免單一位置上的熱量堆積。另一方面,散熱結構在第一側壁以及第二側壁對應風扇的氣流入口設置多個開口區域,將可以使風扇由兩個方向吸入冷空氣,並因此提升了風扇的冷空氣吸入量。更進一步地,散熱結構在風扇的氣流出口與氣流入口之間設置有支架與阻擋塊,在他們的協同作用下,將可以防止排出的熱氣流再次被吸入機殼內部,使每個風扇的對流流場各自獨立互不干涉,並確保排熱路徑的順暢並避免無效率的熱傳遞發生。此外,散熱結構在機殼內部設置第一擋體並劃分出均熱區以及散熱區,並且在兩第二風扇的氣流入口周圍設置第二擋體使其與機殼內部隔開。如此一來,將可以有效的控制熱量的傳遞方向,避免在風扇散熱的過程中,熱氣流在機殼內部產生無效率的熱傳遞。From the above detailed description of the specific embodiments of the present disclosure, it can be clearly seen that in the heat dissipation structure of the present disclosure, by systematically arranging the air flow outlets of the first fan and the two second fans in different directions, the heat can be dissipated. It is quickly conducted from different directions and discharged to the outside of the casing. In addition, the large-area vapor chamber, extended thermal conductive elements and multiple heat exchangers installed in the heat dissipation structure will effectively increase the heat dissipation area. At the same time, the heat dissipation structure also arranges the heat sources dispersedly on the vapor chamber, so heat accumulation in a single location can be avoided. On the other hand, the heat dissipation structure is provided with multiple opening areas on the first side wall and the second side wall corresponding to the air flow inlet of the fan, which allows the fan to suck in cold air from two directions, thereby increasing the amount of cold air sucked in by the fan. Furthermore, the heat dissipation structure is provided with a bracket and a blocking block between the air flow outlet and the air flow inlet of the fan. Under their synergy, it will be possible to prevent the discharged hot air flow from being sucked into the cabinet again, thereby improving the convection of each fan. The flow fields are independent and do not interfere with each other, ensuring a smooth heat dissipation path and avoiding inefficient heat transfer. In addition, the heat dissipation structure is provided with a first baffle inside the casing to divide a uniform heat zone and a heat dissipation zone, and is provided with a second baffle around the air inlets of the two second fans to separate them from the inside of the casing. In this way, the direction of heat transfer can be effectively controlled to prevent the hot air flow from causing inefficient heat transfer inside the casing during the heat dissipation process of the fan.
前文概述了若干實施例之特徵,使得熟習此項技術者可較佳地理解本揭露之態樣。熟習此項技術者應瞭解,他們可容易地使用本揭露作為設計或修改用於實現相同目的及/或達成本文中所介紹之實施例之相同優勢的其他製程及結構的基礎。熟習此項技術者亦應認識到,此些等效構造不脫離本揭露之精神及範疇,且他們可在不脫離本揭露之精神及範疇的情況下於本文作出各種改變、代替及替換。The foregoing summarizes the features of several embodiments so that those skilled in the art can better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent structures do not depart from the spirit and scope of the disclosure, and they can make various changes, substitutions and substitutions herein without departing from the spirit and scope of the disclosure.
100:散熱結構100:Heat dissipation structure
110:機殼110:Chassis
112:第一側壁112:First side wall
112a:第一開口區域112a: First opening area
112b:第三開口區域112b: The third opening area
114:第二側壁114:Second side wall
114a:第二開口區域114a: Second opening area
114b:第四開口區域114b: The fourth opening area
116:側表面116:Side surface
116a,116b,116c:側開口區域116a, 116b, 116c: Side opening area
120:均熱板120:Vapor chamber
122:開口122:Open your mouth
124:導熱元件124: Thermal conductive element
130:第一風扇130:First fan
140:第二風扇140: Second fan
142:氣流出口142:Air flow outlet
144:氣流入口144:Air flow inlet
146:第二擋體146:Second blocking body
150:熱源150:Heat source
160:熱交換器160:Heat exchanger
170:阻擋塊170: blocking block
180:支架180:Bracket
190:第一擋體190:First block
A1,A2,A3:方向A1,A2,A3: direction
當結合隨附諸圖閱讀時,得以自以下詳細描述最佳地理解本揭露之態樣。應注意,根據行業上之標準實務,各種特徵未按比例繪製。事實上,為了論述清楚,可任意地增大或減小各種特徵之尺寸。 第1圖為根據本揭露之一些實施例繪示的散熱結構在俯視角的示意圖。 第2圖為根據本揭露之一些實施例繪示的散熱結構在背面視角的示意圖。 第3A圖為根據本揭露之一些實施例繪示的位於機殼內部的局部散熱結構的剖面示意圖。 第3B圖為根據本揭露之另一些實施例繪示的位於機殼內部的局部散熱結構的剖面示意圖。 第3C圖為根據本揭露之另一些實施例繪示的位於機殼內部的局部散熱結構的剖面示意圖。 第4圖為根據本揭露之一些實施例繪示的散熱結構的剖面側視圖。 Aspects of the present disclosure are best understood from the following detailed description when read in conjunction with the accompanying figures. It should be noted that in accordance with standard industry practice, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion. Figure 1 is a schematic diagram from a top view of a heat dissipation structure according to some embodiments of the present disclosure. FIG. 2 is a schematic diagram of a heat dissipation structure from a rear view according to some embodiments of the present disclosure. Figure 3A is a schematic cross-sectional view of a local heat dissipation structure located inside a casing according to some embodiments of the present disclosure. Figure 3B is a schematic cross-sectional view of a local heat dissipation structure located inside the casing according to other embodiments of the present disclosure. Figure 3C is a schematic cross-sectional view of a local heat dissipation structure located inside the casing according to other embodiments of the present disclosure. Figure 4 is a cross-sectional side view of a heat dissipation structure according to some embodiments of the present disclosure.
100:散熱結構 100:Heat dissipation structure
110:機殼 110:Chassis
112:第一側壁 112:First side wall
112a:第一開口區域 112a: First opening area
112b:第三開口區域 112b: The third opening area
116:側表面 116:Side surface
116c:側開口區域 116c: Side opening area
Claims (15)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111121336A TWI820739B (en) | 2022-06-08 | 2022-06-08 | Heat dissipation structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111121336A TWI820739B (en) | 2022-06-08 | 2022-06-08 | Heat dissipation structure |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI820739B true TWI820739B (en) | 2023-11-01 |
TW202350057A TW202350057A (en) | 2023-12-16 |
Family
ID=89722169
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111121336A TWI820739B (en) | 2022-06-08 | 2022-06-08 | Heat dissipation structure |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI820739B (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201925954A (en) * | 2017-11-23 | 2019-07-01 | 宏碁股份有限公司 | Laptop computer |
TWM620617U (en) * | 2021-07-30 | 2021-12-01 | 華碩電腦股份有限公司 | Electronic device |
TWI763256B (en) * | 2021-01-15 | 2022-05-01 | 宏碁股份有限公司 | Heat dissipation system of portable electronic device |
-
2022
- 2022-06-08 TW TW111121336A patent/TWI820739B/en active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201925954A (en) * | 2017-11-23 | 2019-07-01 | 宏碁股份有限公司 | Laptop computer |
TWI763256B (en) * | 2021-01-15 | 2022-05-01 | 宏碁股份有限公司 | Heat dissipation system of portable electronic device |
TWM620617U (en) * | 2021-07-30 | 2021-12-01 | 華碩電腦股份有限公司 | Electronic device |
Also Published As
Publication number | Publication date |
---|---|
TW202350057A (en) | 2023-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI468100B (en) | Mobile computing device | |
TWI475363B (en) | Electronic device having heat sink structure | |
CN117215379A (en) | Heat dissipation structure | |
TW201314425A (en) | Radiator device and electronic device using same | |
JP2021111779A (en) | Electronic device | |
US20090201639A1 (en) | Chassis of portable electronic apparatus | |
TWM620617U (en) | Electronic device | |
CN110597356A (en) | Notebook computer | |
TWM619677U (en) | Electronic device | |
TWI820739B (en) | Heat dissipation structure | |
CN117215380A (en) | Heat dissipation structure | |
TWI832283B (en) | Heat dissipation structure | |
TW201422135A (en) | Electronic device | |
TWI564699B (en) | Heat sink assembly and graphics card module | |
CN211349137U (en) | Notebook computer | |
TW201146152A (en) | Air duct | |
TWM463384U (en) | All-in-one computer | |
TWI715504B (en) | Computer device | |
TW201511660A (en) | Server | |
JP7371170B1 (en) | Electronics | |
JP2013140501A (en) | Information processing device | |
KR200456335Y1 (en) | cooling device of electronic equipment | |
CN216979669U (en) | Heat dissipation system for notebook computer | |
TW201021678A (en) | Heat sink structure of an electronic means | |
TW202350055A (en) | Air cooling system |