201021678 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種電子裝置之散熱結構，特別是一種無裝 設風扇之散熱結構。 【先前技術】 隨著電子科技的快速提昇，使得各種電子裝置產品之設計皆 ❹朝向I!、薄、短、小之目標邁進，但由於此類產品之體積大幅的 減> 因此衍生出各種電子元件所產生之高熱排放的問題，若以 電腦、電子裝置或電視而言，大多於機殼内部裝設散熱風扇等方 式以解決熱源(如晶片、中央處理器、積體電路等電子元件)過熱的 問題’然而對於諸如超薄型電腦、可攜式電腦或簡易型電腦來說， 因其内部可使用空間有限，因此，這一類的電子裝置中便省略了 風扇的設置(fanless)，而單純以一般之散熱模組來進行散熱，如散 熱片、散熱鰭片或熱管等，同時會在電子裝置的殼體下方對應於 ®熱源區域周圍設置-些開孔，以利用空氣對流之方式來改善其内 部所累積的高熱狀態。 就整體而言，利用空氣對流之方式來達成散熱效果時，由於 現行之做法係將散熱模組設置於機殼内部，因此散熱成效大多侷 限於將熱源平均分散於機殼内部，再透過位於殼體上之開孔排出 於外界空氣中，而存在於機殼内部之元件會影響此散熱氣流流向 機殼開孔之路徑，使其受内部元件之阻擋而使大部分熱源仍存在 於機殼内部，進而造成散熱效能無法有效提昇；此外，藉由在殼 體上開孔以進行散熱之方法，受限於機殼整體結構強度的限制， 201021678 並無法敝财的開孔’否_存在妓體料受損的風險。 目前選用無風練顏組進行散熱之電子裝置，大部份在改 善散熱效果之方法上通常針對如散熱额之導紐質的改變如選 用銅材、銘材等，或增加散熱籍片之面積，以及於機殼上增加開 孔數目來改2散熱之問題。然而，多數顧無風扇散熱模組之電 子裝置，如簡易㈣腦、超_電腦等之殼體畴空間有限，上 述改良熱源賴的方式使散熱之成效受_子裝置本衫間的限 制’亦即電子裝置運作效能與散熱問題之間難以取得平衡。 故如何提财好的散_絲提昇電子裝置的運作效能，已 隨著這些電子錢躺輕巧、簡便之設計下，而抛難業視為 極為重要之課題。 【發明内容】 蓉於以上的問題’本發明提供—種電子裝置之散熱結構，藉 乂改良電子裝置因熱源無法迅速有效地排出機殼外部，而導致散 _ 熱效能不佳的問題。 本表明為-種電子裝置之散熱結構，其係由—殼體和一散熱 模組所組成。殼體具有一容置空間與一對流室，此容置空間設置 於破體内部，以供-電子元件配置其中，此對流室係位於此殼體 之側邊，並有與外抑氣連通L及—人口 ；散熱模組具有 一冷卻部、一熱傳部與一受熱部，此受熱部用於與位於容置空間 内之電子7L件接觸’以將此電子元件所散發之熱源經熱傳部導引 至冷卻部’而冷卻部係設置於殼體之對流室中。 由於此對流室倾外界空氣具連通之設計，先賴源透過設 201021678 於容置空間内之受熱部，傳導至位於對流室中之冷卻部，利用* 乳自然對流之躲，即冷空氣下降、熱空氣上如私 : 溫之特性，將此被料至冷卻部之熱源進行熱交換作用概而輯 流室具有-賊與容置空間做隔離，因此所發散於外射氣之熱 源將不會再進入此容置空間内，使熱源持續於外界環境進行散熱 -作用而達到降低殼内溫度之目的，進而使賴效能提高，以讓位、 於容置空間内之電子元件因溫度得到適度的調節而促進其運作效 © 能。 以上之關於本發明内容之說明及以下之實施方式之說明係用 以示範與解釋本發明之原理’並且提供本發明之專利申請範圍更 進一步之解釋。 【實施方式】 ▲本發明所揭露之散熱結構係針對—電子裝置之—熱源進行熱 交換’以降低熱源之工作溫度，其中電子裝置係為筆記型電腦、、 ❿簡易型電腦或超薄型電腦等電腦系統，而熱源係指電子裝置中之 運算晶片、中央處理器或北橋等。 如第1圖」和「第2圖」所示為本發明第一實施例之分解 及組合示意圖。散熱結構10包含一殼體1〇〇和一散熱模組2〇〇 ; 此殼體100具有一上蓋130與一底殼140,以形成-容置空間Πο， 此谷置空間110可供一承載有一電子零件或一發熱源(如晶片、中 央處理器、北橋等）U1之機板m設置其中，同時於底殼⑽之 側邊具有一對流室120’同時此對流室12〇具有與外界空氣相連 通之一入口 121和一出口 ,並以一隔板141與容置空間11〇 201021678 相隔離，此隔板另具一缺口 142，以供散熱模組200之熱管220 穿設於容置空間110與對流室120之間；而散熱模組200係具有 一散熱鰭片（即冷卻部)210、一熱管(即熱傳部)22〇以及一金屬平板 (即受熱部)230’此金屬平板230係設置於殼體勘之容置空間11〇 内並貼合於電子零件111上，其材質可為銅等易傳導熱源之金屬， 而散熱鰭片210係經由熱管220與金屬平板230相連接，同時設 置於殼體100之對流室120中。 ® 當位於容置空間110内之電子零件111因運作而導致熱源發 生時，此熱源即藉由金屬平板230傳導至散熱鰭片210上。由於 此散熱鰭片210位於殼體1〇〇之對流室12〇中，而此對流室12〇 係以一隔板141與容置空間110做隔離(如「第2圖」所示），因此 傳導至散熱鰭片210上之熱源被隔絕於容置空間11〇之外，並不 會造成熱源於殼體1〇〇内部累積’由於對流室丨2〇係與外界空氣 相連通，可直接使熱源與外界空氣進行熱交換作用而達到散熱目 ❿ 的。 請參照「第3圖」至「第6圖」所示為本發明第二實施例之 示意圖。本發明之第二實施例與第一實施例在結構上大致相同， 以下僅就兩者間之差異加以說明。本發明第二實施例所揭露之電 子裝置之殼體結構，其中對流室12〇具有一散熱蓋3〇〇，此散熱蓋 300設有複數個卡鉤31〇，用以和設置於底殼14〇上之扣孔143結 合，使散熱蓋300固定於底殼14〇上，同時散熱蓋3〇〇之—平面 具有複數個與外界空氣連通之入口 121 (如「第5圖」所示），且散 熱蓋300與殼體100之上蓋13〇間具有一間距，此間距即形成與 201021678 外界空氣連通之一出口 122(如「第5圖」和「第6圖」所示）。而 位於此對流室120上方之上蓋13〇係設有一由上蓋13〇邊緣朝向 隔板141傾斜之斜邊結構132,此斜邊結構132有助於將經由金屬 平板230傳導至對流室120中散熱鰭片210之熱源引導至出口 122 •處，進而使熱源於外界空氣中發散。 如「第7A圖」所示即為自然對流導引冷、熱氣流之流動方式， 冷空氣於散熱蓋300之入口 121處流入於對流室12〇中並與傳導 〇 至散熱鰭片210之熱源所散發出之熱空氣產生自然對流，熱空氣 受設置於上蓋130之斜邊結構132導引至對流室12〇之出口 122 而發散於外界之空氣中，因此可有效的平衡對流室12〇之溫度， 使熱源所產生之熱氣流不會累積於殼體100内，進而達到使電子 裝置整體降溫的目的。 此外，如「第7B圖」所示’亦可於隔板mi上設置一隔熱片 144，此隔熱片144可設置於隔板141相對於對流室12〇之一側， ❹或設置於隔板14!相對容置空間⑽之—侧(圖未示），使熱源所散 發出的熱空氣經由隔板Ml料而進人容置空間m的機率降 低，以增加隔板141阻隔熱空氣的效能。 請參閱「第8圖」和「第9圖」所示為本發明第三實施例之 分解及組合示意圖。本發明之第三實施例與第二實施例在結構上 大致相同’以下僅就兩者間之差異加以說明。於本發明所揭露之 第三實施射’對流室⑽與外界空氣連接之出口 122係於對流 室120上方之上蓋13〇區域設置複數個開口，使空氣之自然對流 以垂直流動之方式進行，冷空氣由散熱蓋3〇〇下方之入口 Η〗進 201021678 入(圖未示）’熱空氣由設置於上蓋13〇之出口 U2流出，使藉由容 置空間110内之金屬平板230傳導至對流室12〇中散熱鰭片21〇 之熱源發散於外界空氣中,，以達到散熱之目的。 如「第10圖」至「第12圖」所示為本發明第四實施例之示 意圖。為將第三實施例上蓋13〇區域除具有複數個出口 122外， 再s又置與此出口 122呈相互交錯位置之複數個破口丨31，此具有# 位設置之出口 122與破口 131即為對流室120與外界空氣連通之 ❹位置’可導引熱氣流朝此出口之方向加快流動，並進一步加強對 々，L至120之散熱效果，並且可防止異物藉由出口 及破口 掉入對流室120而影響對流室12〇的散熱效能。 如「第13圖」所示為本發明第五實施例之示意圖。其係將第 四實施例中之散熱鰭片210相對上蓋13〇之一端延伸至破口 ΐ3ι 與出口 122之間，以使熱源所散發之熱氣流能更迅速的流出於對 流室120巾，因此讓經由容置空間⑽内之金屬平板23〇傳導至 ❿對流室120巾散熱鰭片210之熱源發散於外界空氣的速度加快， 而達到使電子裝置整體有效降溫的目的。同時，此一散熱201021678 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation structure of an electronic device, and more particularly to a heat dissipation structure without a fan. [Prior Art] With the rapid advancement of electronic technology, the design of various electronic device products is moving toward the goal of I!, thin, short, and small, but due to the large volume reduction of such products, In the case of computers, electronic devices, or televisions, the heat-dissipating fan is often installed in the casing to solve the heat source (such as electronic components such as chips, CPUs, integrated circuits, etc.). The problem of overheating' However, for ultra-thin computers, portable computers or simple computers, because of the limited space available inside, the fan settings are omitted in this type of electronic device. The heat dissipation is usually performed by a general heat dissipation module, such as a heat sink, a heat sink fin, or a heat pipe. At the same time, some openings are provided under the housing of the electronic device corresponding to the heat source area to utilize air convection. Improve the high heat accumulated in the interior. As a whole, when the air convection method is used to achieve the heat dissipation effect, since the current method is to arrange the heat dissipation module inside the casing, the heat dissipation effect is mostly limited to disperse the heat source evenly inside the casing, and then pass through the casing. The opening of the body is discharged into the outside air, and the components existing inside the casing affect the path of the heat-dissipating airflow to the opening of the casing, so that it is blocked by the internal components, so that most of the heat source still exists inside the casing. In addition, the heat dissipation performance cannot be effectively improved; in addition, the method of dissipating holes in the casing for heat dissipation is limited by the strength of the overall structural strength of the casing, and 201021678 is not able to open the hole for the wealth. Risk of damage to the material. At present, the electronic device that uses the windless training group to dissipate heat is used, and most of the methods for improving the heat dissipation effect are generally directed to changes such as the amount of heat transfer, such as selecting copper materials, Ming materials, etc., or increasing the area of heat dissipation films. And increase the number of openings in the case to change the problem of heat dissipation. However, most of the electronic devices that have no fan cooling module, such as the simple (four) brain, super-computer, etc., have limited space in the shell domain, and the improved heat source relies on the way that the heat dissipation effect is limited by the _ sub-device between the shirts. That is, it is difficult to balance the operational efficiency of the electronic device with the heat dissipation problem. Therefore, how to improve the operation efficiency of the electronic device has become a very important issue as the electronic money is laid down in a light and simple design. SUMMARY OF THE INVENTION The present invention provides a heat dissipation structure for an electronic device in which the improved electronic device cannot be quickly and efficiently discharged outside the casing due to the heat source, resulting in a problem of poor heat dissipation performance. This is a heat dissipation structure of an electronic device consisting of a housing and a heat dissipation module. The housing has an accommodating space and a pair of flow chambers, and the accommodating space is disposed inside the broken body for the electronic component to be disposed therein, the convection chamber is located at a side of the housing, and has an external air-suppressing communication. And a population; the heat dissipation module has a cooling portion, a heat transfer portion and a heat receiving portion, wherein the heat receiving portion is in contact with the electronic 7L member located in the accommodating space to heat transfer the heat source emitted by the electronic component The portion is guided to the cooling portion' and the cooling portion is disposed in the convection chamber of the housing. Because the convection chamber is designed to communicate with the outside air, the first source is transmitted to the cooling portion located in the convection chamber through the heat receiving portion of the 201021678 in the accommodating space, and the natural convection is hidden by the milk, that is, the cold air is lowered. The hot air is as private as the temperature: the heat source is used to heat exchange the heat source to the cooling part. The stream chamber has a thief and the accommodating space to be isolated, so the heat source radiated from the external ejector will not Then enter the accommodating space, so that the heat source continues to radiate in the external environment to achieve the purpose of reducing the temperature inside the shell, thereby improving the efficiency of the reliance, so that the electronic components in the accommodating space are moderately temperature-dependent. Adjust to promote its operational effectiveness. The above description of the present invention and the following description of the embodiments of the present invention are intended to illustrate and explain the principles of the invention. [Embodiment] ▲ The heat dissipation structure disclosed in the present invention is for heat exchange of a heat source of an electronic device to reduce the operating temperature of the heat source, wherein the electronic device is a notebook computer, a simple computer or an ultra-thin computer. A computer system, and a heat source refers to an arithmetic chip, a central processing unit, or a north bridge in an electronic device. Fig. 1 and Fig. 2 are schematic views showing the decomposition and combination of the first embodiment of the present invention. The heat dissipation structure 10 includes a casing 1 and a heat dissipation module 2; the casing 100 has an upper cover 130 and a bottom casing 140 to form a receiving space Πο, the valley space 110 is for a bearing An electronic component or a heat source (such as a wafer, a central processing unit, a north bridge, etc.) U1 is disposed therein, and has a pair of flow chambers 120' on the side of the bottom case (10) while the convection chamber 12 has air with the outside air. An inlet 121 and an outlet are connected to each other, and are separated from the accommodating space 11 〇 201021678 by a partition 141. The partition has a notch 142 for the heat pipe 220 of the heat dissipation module 200 to pass through the accommodating space. The heat dissipation module 200 has a heat dissipation fin (ie, a cooling portion) 210, a heat pipe (ie, a heat transfer portion) 22, and a metal plate (ie, a heat receiving portion) 230'. The 230 series is disposed in the housing space 11 并 and is attached to the electronic component 111. The material of the 230 is a metal that is easy to conduct heat, such as copper, and the heat dissipation fin 210 is connected to the metal plate 230 via the heat pipe 220. At the same time, it is disposed in the convection chamber 120 of the housing 100. When the electronic component 111 located in the accommodating space 110 causes a heat source to occur due to operation, the heat source is conducted to the heat dissipation fins 210 by the metal plate 230. Since the heat dissipation fins 210 are located in the convection chamber 12 of the housing 1 , the convection chamber 12 is separated from the accommodating space 110 by a partition 141 (as shown in FIG. 2 ). The heat source transmitted to the heat dissipating fins 210 is isolated from the accommodating space 11 ,, and does not cause heat to accumulate inside the casing 1 ' 'Because the convection chamber 〇 2 is connected to the outside air, the The heat source exchanges heat with the outside air to achieve heat dissipation. Please refer to "Fig. 3" to "Fig. 6" for a schematic view of a second embodiment of the present invention. The second embodiment of the present invention is substantially the same in structure as the first embodiment, and only the differences between the two will be described below. The housing structure of the electronic device disclosed in the second embodiment of the present invention, wherein the convection chamber 12A has a heat dissipation cover 3〇〇, and the heat dissipation cover 300 is provided with a plurality of hooks 31〇 for being disposed on the bottom case 14 The fastening holes 143 are combined to fix the heat dissipation cover 300 to the bottom case 14〇, and the heat dissipation cover 3 has a plurality of inlets 121 connected to the outside air (as shown in FIG. 5). The heat dissipating cover 300 and the upper cover 13 of the casing 100 have a spacing, which forms an outlet 122 which communicates with the outside air of 201021678 (as shown in "Fig. 5" and "Fig. 6"). The upper cover 13 above the convection chamber 120 is provided with a bevel structure 132 inclined from the edge of the upper cover 13 toward the partition 141. The bevel structure 132 helps to conduct heat to the convection chamber 120 via the metal plate 230. The heat source of the fins 210 is directed to the outlets 122, thereby allowing the heat source to diverge in the outside air. As shown in "Fig. 7A", the natural convection guides the flow of cold and hot air, and the cold air flows into the convection chamber 12 at the inlet 121 of the heat dissipation cover 300 and conducts heat to the heat sink fin 210. The emitted hot air generates natural convection, and the hot air is guided to the outlet 122 of the convection chamber 12 by the bevel structure 132 disposed on the upper cover 130 to be dispersed in the outside air, thereby effectively balancing the convection chamber 12 The temperature causes the hot gas generated by the heat source to not accumulate in the casing 100, thereby achieving the purpose of cooling the entire electronic device. In addition, as shown in FIG. 7B, a heat insulating sheet 144 may be disposed on the partition plate mi. The heat insulating sheet 144 may be disposed on one side of the partition plate 141 with respect to the convection chamber 12, or may be disposed on the side of the partition plate 141. The partition 14 is opposite to the side (not shown) of the accommodating space (10), so that the hot air emitted by the heat source is reduced in the probability of entering the accommodating space m via the partition M1, so as to increase the insulating air of the partition 141. Performance. Please refer to "Fig. 8" and "Fig. 9" for the decomposition and combination of the third embodiment of the present invention. The third embodiment of the present invention is substantially identical in structure to the second embodiment. Hereinafter, only the difference between the two will be described. In the third embodiment of the present invention, the outlet 122 connecting the convection chamber (10) to the outside air is disposed in a plurality of openings above the convection chamber 120, so that the natural convection of the air is performed in a vertical flow manner. The air is discharged from the lower surface of the heat-dissipating cover 3 into the 201021678 (not shown). The hot air flows out through the outlet U2 provided in the upper cover 13〇, and is conducted to the convection chamber by the metal plate 230 in the accommodating space 110. The heat source of the heat sink fins 21 in the 12 发 is dispersed in the outside air to achieve the purpose of heat dissipation. The illustrations of the fourth embodiment of the present invention are shown in "Fig. 10" to "12th". In order to divide the upper cover 13 〇 area of the third embodiment with a plurality of outlets 122, a plurality of ruptures 31 are formed between the outlets 122 and the outlets 122, and the outlets 122 and the openings 131 having the # position are disposed. That is, the crucible position of the convection chamber 120 communicating with the outside air can guide the flow of hot air to the direction of the outlet, and further enhance the heat dissipation effect of the enthalpy, L to 120, and prevent foreign matter from being dropped by the exit and the break. Into the convection chamber 120 affects the heat dissipation performance of the convection chamber 12A. A "fifth diagram" is a schematic view showing a fifth embodiment of the present invention. The heat dissipation fin 210 of the fourth embodiment is extended to the end of the upper cover 13 至 between the opening ΐ3ι and the outlet 122, so that the hot air generated by the heat source can flow out more quickly in the convection chamber 120. The heat source passing through the metal plate 23 in the accommodating space (10) to the convection chamber 120 and the heat sink fin 210 is dissipated to the outside air, thereby achieving the purpose of effectively cooling the electronic device as a whole. At the same time, this heat dissipation
之延伸結構亦具有防止異物、_出口 122及破口 m掉入對流室 120的作用"L 本發明電子裝置之散熱結構係於殼體側邊設置一對流室，並 以一隔板與殼體内具熱源之容置空間隔離，透過一散熱模组將殼 體内之熱源傳導至一對流室，由於此對流室具有與外界空氣連通 之出口及人口 ’因此使熱源能直接發散於外界空氣中，而不會使 熱源於贿内_，進而翻使電子裝置整斷溫的目的。 201021678The extension structure also has the function of preventing foreign matter, the outlet 122 and the breach m from falling into the convection chamber 120. The heat dissipation structure of the electronic device of the present invention is provided with a pair of flow chambers on the side of the casing, and a partition and a shell The heat source of the body is spatially isolated, and the heat source in the housing is transmitted to the pair of flow chambers through a heat dissipation module. Since the convection chamber has an outlet and a population that communicates with the outside air, the heat source can be directly dispersed to the outside air. In the middle, without the heat coming from the bribe, and then turn the electronic device to the temperature. 201021678
雖然本發明之實施例揭露如上所述，然並非 明’任何熟習相關技藝者，在不脫離本發明之精 圍^ X 範圍所述之形狀、“^ m::咖峨編翻料 【圖式簡單說明】 第1圖為本發明第一實施例之分解示意圖；Although the embodiments of the present invention are as described above, it is not obvious to those skilled in the art that the shape described in the scope of the present invention does not deviate from the scope of the present invention, "^ m:: curry splicing [pattern] BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is an exploded perspective view of a first embodiment of the present invention;
第2圖為本發明第一實施例之組合示意圖； 第3圖為本發明第二實施例之分解示意圖； 弟4圖為本發明第二實施例之組合示意圖； 第5圖為本發明第二實施例之側視示意圖； 第6圖為本發明第二實施例之剖面示意圖； 第7A圖為本發明第二實施例對流室之剖面示意圖； 第7B圖為本發明第二實施例之隔板具有一隔熱片之示意圖； 第8圖為本發明第三實施例之分解示意圖； 第9圖為本發明第三實施例之組合示意圖； 第10圖為本發明第四實施例之分解示意圖； 第11圖為本發明第四實施例之部分剖面示意圖； 第U圖為本發明第四實施例之對流室示意圖；以及 第13圖為本發明第五實施例之對流室示意圖。 【主要元件符號說明】 散熱結構 殼體 11 100 2010216782 is a schematic exploded view of a first embodiment of the present invention; FIG. 3 is an exploded perspective view of a second embodiment of the present invention; FIG. 4 is a schematic view of a second embodiment of the present invention; 6 is a schematic cross-sectional view of a second embodiment of the present invention; FIG. 7A is a cross-sectional view of a convection chamber according to a second embodiment of the present invention; and FIG. 7B is a cross-sectional view of a second embodiment of the present invention FIG. 8 is a schematic exploded view of a third embodiment of the present invention; FIG. 10 is a schematic exploded view of a third embodiment of the present invention; Figure 11 is a partial cross-sectional view showing a fourth embodiment of the present invention; Figure U is a schematic view of a convection chamber according to a fourth embodiment of the present invention; and Figure 13 is a schematic view showing a convection chamber according to a fifth embodiment of the present invention. [Main component symbol description] Heat dissipation structure Housing 11 100 201021678
110 容置空間 111 電子零件或發熱源 112 機板 120 對流室 121 入口 122 出曰 130 上蓋 131 破口 132 斜邊結構 140 底殼 141 隔板 142 缺口 143 扣孔 144 隔熱片 200 散熱模組 210 散熱鰭片 220 熱管 230 金屬平板 300 散熱蓋 310 卡鉤 12110 accommodating space 111 electronic parts or heat source 112 board 120 convection chamber 121 inlet 122 exit 130 upper cover 131 break 132 bevel structure 140 bottom case 141 partition 142 notch 143 button hole 144 heat insulation sheet 200 heat dissipation module 210 Heat sink fin 220 heat pipe 230 metal plate 300 heat sink cover 310 hook 12