TWI761926B - Server device - Google Patents

Abstract

A server device includes a chassis, an electronic component and a heat dissipation component. The chassis includes a box body and a partition. The partition is arranged in the box body and separates an accommodating space and a heat dissipation space. The box body has a plurality of first vents, and these first vents communicate with the heat dissipation space. The electronic component is located in the accommodating space. The heat dissipation component includes a radiator and a heat pipe. The radiator is located in the heat dissipation space. The heat pipe includes an evaporation section and a condensing section connected each other. The heat pipe passes through the partition, and the evaporation section is thermally coupled to the electronic component and the condensation section is coupled to the radiator.

Description

Servo

The present invention relates to a servo device, in particular to a servo device with a partition.

Servers are mainly used in high-traffic websites, independent email systems, large-scale database management, or general enterprises for specific purposes of data processing. Such electronic components are prone to generate heat and increase the working temperature of the server. Therefore, in general, the server will reduce the operating temperature of the server through air-cooled heat dissipation.

Air-cooled heat dissipation is generally divided into forced convection and natural convection. Forced convection is to install cooling fins and fans on the server. The cooling fins are thermally coupled to the internal heat source and placed at the vents of the server. Take out the heat accumulated on the cooling fins. Natural convection is where only cooling fins are installed on the server, but no fans are installed. That is to say, the cooling airflow is naturally formed through the temperature difference between the inside of the server and the external environment to carry out the heat accumulated in the heat dissipation fins.

The heat dissipation effect of natural convection is proportional to the opening rate of the opening of the server case. The greater the opening ratio of the openings, the greater the flow of cooling airflow. However, the larger the aperture ratio of the openings, the easier it is for foreign objects to enter and cause damage to the internal electronic components, and it is easy for the light emitted by the internal electronic components to irradiate the outside of the server, resulting in light pollution. Therefore, how to improve the heat dissipation efficiency of the server and prevent foreign objects from entering the server under the natural convection heat dissipation method is one of the problems that the R&D personnel should solve.

The present invention is to provide a servo device, so as to improve the heat dissipation efficiency of the server and prevent foreign objects from entering the server.

The servo device disclosed in an embodiment of the present invention includes a chassis, an electronic component and a heat dissipation component. The chassis includes a box body and a partition. The partition is arranged in the box and separates an accommodating space and a heat dissipation space that are not connected. The box body has a plurality of first ventilation openings, and the first ventilation openings communicate with the heat dissipation space. Electronic components are located in the accommodating space. The heat dissipation component includes a heat sink and a heat pipe. The radiator is located in the cooling space. The heat pipe includes an evaporating section and a condensing section which are connected together. The heat pipe passes through the baffle, and the evaporation section is thermally coupled to the electronic components and the condensation section is coupled to the heat sink.

Another embodiment of the present invention discloses a servo device comprising a chassis, an electronic component and a heat dissipation component. The chassis includes a box body and a partition. The partition is arranged in the box and separates a accommodating space and a heat dissipation space. Electronic components are located in the accommodating space. The heat dissipation component includes a heat sink and a heat pipe. The radiator is located in the cooling space. The heat pipe includes an evaporating section and a condensing section which are connected together. The heat pipe passes through the baffle, and the evaporation section is thermally coupled to the electronic components and the condensation section is coupled to the heat sink. Wherein the separator has a plurality of perforations. The accommodating space is communicated with the heat dissipation spaces through the through holes, the box body has a plurality of first ventilation openings, and the size of the through holes is smaller than the size of the first ventilation openings.

According to the servo device of the above-mentioned embodiment, the box is divided into the accommodating space and the heat-dissipating space through the partition plate, and no openings are provided on the wall surface surrounding the accommodating space, or small-sized perforations or second ventilation openings are provided, and the surrounding The wall surface of the heat dissipation space is provided with a first vent of a larger size. In this way, in addition to bringing the heat in the heat dissipation space to the outside of the box through the first vent, foreign objects will not enter the accommodating space through the first vent.

The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principle of the present invention, and provide further explanation of the scope of the patent application of the present invention.

See Figures 1 to 2. FIG. 1 is a schematic perspective view of a servo device according to a first embodiment of the present invention. FIG. 2 is a schematic rear view of FIG. 1 .

The servo device 10 of this embodiment is, for example, a chassis server, and its height is, for example, 1U to 4U. The servo device 10 includes a chassis 100 , an electronic component 200 and a heat dissipation component 300 .

The case 100 includes a case body 110 and a partition 120 . The box body 110 includes a bottom plate 111 , two side plates 112 , a front plate 113 , a back plate 114 and a top plate 115 . The two side plates 112 , the front plate 113 and the back plate 114 are respectively connected to different sides of the bottom plate 111 . Different sides of the top plate 115 are respectively connected to one side of the two side plates 112 , the front plate 113 and the back plate 114 away from the bottom plate 111 . The material of the separator 120 is a fireproof material. The partition plate 120 is interposed between the front plate 113 and the back plate 114 , and different sides of the partition plate 120 are respectively connected to the bottom plate 111 , the top plate 115 and the two side plates 112 . That is to say, the partition plate 120 is disposed in the box body 110 and separates an accommodating space S1 and a heat dissipation space S2 which are not connected.

In this embodiment, the back plate 114 has a plurality of first vents 1141 . These first vents 1141 communicate with the heat dissipation space S2, but are not communicated with the accommodating space S1. In this way, besides the heat in the heat dissipation space S2 can be carried to the outside of the box 110 through the first vent 1141 , foreign objects will not enter the accommodating space S1 through the first vent 1141 .

The electronic component 200 is located in the accommodating space S1 and includes a circuit board 210 and a heat source 220 . The circuit board 210 is installed on the bottom plate 111 of the box body 110 . The heat source 220 is installed on a side of the circuit board 210 close to the bottom plate 111 .

In this embodiment, the heat source 220 is installed on a side of the circuit board 210 close to the bottom plate 111 , but it is not limited thereto. In other embodiments, the heat source can also be installed on a side of the circuit board away from the bottom plate.

The heat dissipation assembly 300 includes a heat sink 310 and a heat pipe 320 . The heat sink 310 is, for example, a heat dissipation fin, and is located in the heat dissipation space S2. The heat pipe 320 includes an evaporation section 321 and a condensation section 322 which are connected to each other. The heat pipe 320 passes through the partition 120, and the evaporation section 321 is thermally coupled to the heat source 220 of the electronic component 200 and the condensation section 322 is coupled to the radiator 310 to transfer the heat generated by the heat source 220 to the radiator 310 in the heat dissipation space S2.

In this embodiment, the gap between the partition plate 120 and the heat pipe 320 is sealed by waterproof glue, so that the accommodating space S1 and the heat dissipation space S2 are not connected, but not limited thereto. In other embodiments, if there is no requirement for complete waterproofing, the gap between the partition plate and the heat pipe may not be sealed through waterproof glue, so that the accommodating space and the heat dissipation space can still communicate with each other.

In this embodiment, the box body 110 is divided into an accommodating space S1 and a heat dissipation space S2 through the partition plate 120 . The bottom plate 111 , the two side plates 112 , the front plate 113 and the partition plate 120 surrounding the accommodating space S1 are not provided with openings to prevent foreign matter from entering the accommodating space S1 where the electronic components 200 are mainly placed. In addition, since the electronic component 200 is not disposed in the heat dissipation space S2, in design, the size of the first vent 1141 of the back plate 114 on one side of the heat dissipation space S2 can be increased, or the size of the first vent 1141 can be increased. The aperture ratio is increased, such as 40% to 50% of the total area of the backplane 114 , and even more, it can reach 80% of the total area of the backplane 114 . In this way, in the case of natural convection, the heat dissipation efficiency of the servo device 10 can be improved through the first vent 1141 with a larger aperture ratio.

See Figure 3. 3 is a schematic perspective view of a servo device according to a second embodiment of the present invention.

The servo device 10a in this embodiment is, for example, a chassis server, and its height is, for example, 1U to 4U. The servo device 10a includes a chassis 100a , an electronic component 200 and a heat dissipation component 300 .

The case 100a includes a case body 110a and a partition 120 . The box body 110 a includes a bottom plate 111 , two side plates 112 , a front plate 113 a , a back plate 114 and a top plate 115 . The two side plates 112 , the front plate 113 a and the back plate 114 are respectively connected to different sides of the bottom plate 111 . Different sides of the top plate 115 are respectively connected to one side of the two side plates 112 , the front plate 113 a and the back plate 114 away from the bottom plate 111 . The material of the separator 120 is a fireproof material. The partition plate 120 is interposed between the front plate 113 a and the back plate 114 , and different sides of the partition plate 120 are respectively connected to the bottom plate 111 , the top plate 115 and the two side plates 112 . That is to say, the partition plate 120 is disposed in the box body 110a, and separates an accommodating space S1 and a heat dissipation space S2 that are not connected to each other.

In this embodiment, the back plate 114 has a plurality of first vents 1141 . These first vents 1141 communicate with the heat dissipation space S2 and communicate with the accommodating space S1. The front panel 113a has a plurality of second vents 1131a, and the sizes of the second vents 1131a are smaller than those of the first vents 1141 . In this way, in addition to transferring a large amount of heat in the heat dissipation space S2 to the outside of the box 110a through the first vent 1141, foreign objects will not enter the accommodating space S1 through the second vent 1131a.

The electronic component 200 is located in the accommodating space S1 and includes a circuit board 210 and a heat source 220 . The circuit board 210 is mounted on the bottom plate 111 of the box body 110a. The heat source 220 is installed on a side of the circuit board 210 close to the bottom plate 111 .

In this embodiment, the heat source 220 is installed on a side of the circuit board 210 close to the bottom plate 111 , but it is not limited thereto. In other embodiments, the heat source can also be installed on a side of the circuit board away from the bottom plate.

The heat dissipation assembly 300 includes a heat sink 310 and a heat pipe 320 . The heat sink 310 is, for example, a heat dissipation fin, and is located in the heat dissipation space S2. The heat pipe 320 includes an evaporation section 321 and a condensation section 322 which are connected to each other. The heat pipe 320 passes through the partition 120, and the evaporation section 321 is thermally coupled to the heat source 220 of the electronic component 200 and the condensation section 322 is coupled to the radiator 310 to transfer the heat generated by the heat source 220 to the radiator 310 in the heat dissipation space S2.

In this embodiment, the box body 110a is divided into the accommodating space S1 and the heat dissipation space S2 through the partition plate 120, and the size of the second vent 1131a of the front panel 113a is smaller than the size of the first vent 1141 of the back panel 114, or It is because the aperture ratio of the first ventilation openings 1141 in the back plate 114 is greater than the aperture ratio of the second ventilation openings 1131a in the front plate 113a. In this way, in addition to preventing foreign matter from entering the accommodating space S1 where the electronic components 200 are mainly placed through the second vent 1131a with a smaller size, the first vent 1141 with a larger opening ratio can also improve the performance of the servo device 10a. cooling efficiency.

See Figure 4. FIG. 4 is a schematic perspective view of a servo device according to a third embodiment of the present invention.

The servo device 10b in this embodiment is, for example, a chassis server, and its height is, for example, 1U to 4U. In this embodiment, the servo device 10b is, for example, placed vertically. The servo device 10b includes a chassis 100b , an electronic component 200 and a heat dissipation component 300 .

The case 100b includes a case body 110b and a partition 120b. The box body 110 b includes a bottom plate 111 , two side plates 112 , a front plate 113 b , a back plate 114 and a top plate 115 . The two side plates 112 , the front plate 113 b and the back plate 114 are respectively connected to different sides of the bottom plate 111 . Different sides of the top plate 115 are respectively connected to one side of the two side plates 112 , the front plate 113 b and the back plate 114 away from the bottom plate 111 . The material of the separator 120b is fireproof material, and has a plurality of through holes 121b. The partition plate 120b is interposed between the front plate 113b and the back plate 114, and different sides of the partition plate 120b are connected to the bottom plate 111, the top plate 115 and the two side plates 112, respectively. That is to say, the partition plate 120b is disposed in the box body 110b, and separates a accommodating space S1 and a heat dissipation space S2 which are communicated with each other.

In this embodiment, the back plate 114 has a plurality of first vents 1141 . These first vents 1141 communicate with the heat dissipation space S2 and communicate with the accommodating space S1. The front panel 113b has a plurality of second vents 1131b, and the size of the second vents 1131b is smaller than the size of the first vents 1141, and the size of the through holes 121b is smaller than the size of the first vents 1141. In this way, in addition to transferring a large amount of heat in the heat dissipation space S2 to the outside of the box 110b through the first vent 1141, foreign matter will not enter the accommodating space S1 through the through hole 121b and the second vent 1131b.

The electronic component 200 is located in the accommodating space S1 and includes a circuit board 210 and a heat source 220 . The circuit board 210 is mounted on the bottom plate 111 of the box body 110b. The heat source 220 is installed on a side of the circuit board 210 close to the bottom plate 111 .

In this embodiment, the heat source 220 is installed on a side of the circuit board 210 close to the bottom plate 111 , but it is not limited thereto. In other embodiments, the heat source can also be installed on a side of the circuit board away from the bottom plate.

The heat dissipation assembly 300 includes a heat sink 310 and a heat pipe 320 . The heat sink 310 is, for example, a heat dissipation fin, and is located in the heat dissipation space S2. The heat pipe 320 includes an evaporation section 321 and a condensation section 322 which are connected to each other. The heat pipe 320 passes through the partition 120b, and the evaporation section 321 is thermally coupled to the heat source 220 of the electronic component 200 and the condensation section 322 is coupled to the heat sink 310 to transfer the heat generated by the heat source 220 to the heat sink 310 in the heat dissipation space S2.

In this embodiment, the box body 110b is divided into the accommodating space S1 and the heat dissipation space S2 through the partition plate 120b, and the through hole 121b of the partition plate 120b and the second ventilation opening of the front plate 113b communicate with the receiving space S1 and the heat dissipation space S2 The size of the 1131b is smaller than the size of the first vent 1141 of the back plate 114 . In this way, in addition to preventing foreign objects from entering the accommodating space S1 where the electronic components 200 are mainly placed through the through holes 121b and the second vents 1131b with a smaller size, the servo can be improved through the first vent 1141 with a larger opening ratio. Heat dissipation efficiency of device 10b.

In addition, since the front panel 113b has the second vent 1131b, the partition 120b has the perforation 121b, and the back panel 114 has the first vent 1141 in this embodiment, when the servo device 10b is placed vertically, it can additionally form a chimney effect to improve the The heat dissipation efficiency of the servo device 10b.

According to the servo device of the above-mentioned embodiment, the box is divided into the accommodating space and the heat-dissipating space through the partition plate, and no openings are provided on the wall surface surrounding the accommodating space, or small-sized perforations or second ventilation openings are provided, and the surrounding The wall surface of the heat dissipation space is provided with a first vent of a larger size. In this way, in addition to bringing the heat in the heat dissipation space to the outside of the box through the first vent, foreign objects will not enter the accommodating space through the first vent.

Although the present invention is disclosed above by the aforementioned embodiments, it is not intended to limit the present invention. Anyone who is familiar with similar techniques can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, this The scope of patent protection of the invention shall be determined by the scope of the patent application attached to this specification.

10, 10a, 10b...Servo devices 100, 100a, 100b... Chassis 110, 110a, 110b...Box 111…Bottom plate 112…Side Plate 113, 113a, 113b...Front plate 1131a, 1131b...Second vents 114…Backplane 1141…First vent 115…Top Plate 120, 120b...Separator 121b…Perforated 200…Electronic components 210…circuit board 220…heat source 300…cooling components 310…radiator 320…Heat pipe 321…Evaporation section 322…Condensing section S1…Accommodating space S2… Cooling space

FIG. 1 is a schematic perspective view of a servo device according to a first embodiment of the present invention. FIG. 2 is a schematic rear view of FIG. 1 . 3 is a schematic perspective view of a servo device according to a second embodiment of the present invention. FIG. 4 is a schematic perspective view of a servo device according to a third embodiment of the present invention.

10…Servo 100…Chassis 110…Cabinet 111…Bottom plate 112…Side Plate 113…Front plate 114…Backplane 1141…First vent 115…Top Plate 120…Clapboard 200…Electronic components 210…circuit board 220…heat source 300…cooling components 310…radiator 320…Heat pipe 321…Evaporation section 322…Condensing section S1…Accommodating space S2… Cooling space

Claims (3)

A servo device, comprising: a case, including a case and a partition, the partition is arranged in the case and separates an accommodating space and a heat dissipation space; an electronic component is located in the accommodating space; and A heat dissipation component includes a heat sink and a heat pipe, the heat sink is located in the heat dissipation space, the heat pipe includes an evaporation section and a condensation section connected to each other, the heat pipe passes through the partition, and the evaporation section is thermally coupled to the electronic The assembly and the condensation section are coupled to the radiator; wherein the partition plate has a plurality of through holes, the accommodating space is communicated with the heat dissipation spaces through the through holes, the box body has a plurality of first vents, and the through holes The size is smaller than the size of the first vents. The servo device as claimed in claim 1, wherein the box body comprises a bottom plate, two side plates, a front plate, a back plate and a top plate, and the two side plates, the front plate and the back plate are respectively connected to the phases of the bottom plate. Different sides, the different sides of the top plate are respectively connected to one side of the two side plates, the front plate and the back plate away from the bottom plate, the partition plate is between the front plate and the back plate, and the partition plate is The different sides are respectively connected to the bottom plate, the top plate and the two side plates, the first ventilation openings are located on the back plate, and the opening ratio of the first ventilation openings in the back plate is greater than that of the perforations in the partition plate the opening rate. The servo device as claimed in claim 2, wherein the front plate has a plurality of second ventilation openings, and the second ventilation openings communicate with the accommodating space, but are not connected with the accommodating space. The heat dissipation spaces are communicated with each other, and the size of the first ventilation openings is larger than the size of the second ventilation openings.

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