JP2009158803A - Liquid-cooled housing cooling device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid-cooled housing cooling device which does not decrease cooling effect and is free of environmental pollution. <P>SOLUTION: The housing cooling device which uses a cooling medium comprises a housing main body 4 in which a heat generating main body such as electronic equipment and an electronic component is built and a heat exchange 8 having a liquid flow passage 7 wherein the cooling medium flows is provided in its external wall, a chiller 9 which is a cooling unit separated from the housing main body 4 and installed in a different place from the housing main body 4, and a liquid flow passage means of forming the liquid flow passage 7 connecting the housing main body 4 and chiller 9 to each other, the housing main body 4 and chiller 9 being connected to each other by the liquid flow passage means. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention is a cooling device that cools the inside of a housing in which electronic parts and electronic devices are incorporated, and in particular, dislikes heat radiation to an installation room and noise from a cooling fan, for example, used for an operation console in the medical device field etc. The present invention relates to a liquid cooling type cooling device.

Conventionally, this type of cooling device is indicated by an arrow 3 from the outside in the housing 1 by the technique described in the following reference, that is, as shown in FIG. 8, by the fan 2 attached to the housing 1. As described above, it was a so-called air-cooled type that takes in air and discharges the cooled air to the outside to cool the inside of the casing 1 (see Patent Document 1).
JP-A-6-97338

  In recent years, in the field of all electronic devices, with the rapid improvement in performance of electronic devices, the number of components that make up electronic devices has increased remarkably, and the number of heat generating components that generate relatively large amounts of heat, such as semiconductors, has also increased. The amount of heat generated every time is large. Therefore, in the conventional air-cooling type cooling device, as a countermeasure for the heat generation amount, in order to increase the cooling effect, the cooling fan is enlarged or the air volume is increased by using a large number of cooling fans. As a result, noise and vibration from the cooling fan increase, and in addition, the temperature of the room where the enclosure is installed rises due to the exhaust heat air, polluting the environment of the installation site and adversely affecting the health of operators in the room. It was a cause to give.

  In addition, air-cooled cooling is affected by the temperature of the air taken in, that is, the room temperature, leading to a decrease in cooling effect, and there is also a problem that electronic equipment breaks down due to the dust that is sucked in. It was.

  On the other hand, there is a demand for downsizing of the cooling device, but this downsizing narrows the path of the cooling air, and as a result, naturally the cooling efficiency decreases. The decrease in cooling efficiency has been a big problem.

  For these reasons, the conventional air cooling system has limitations in terms of environmental pollution and cooling efficiency, and in particular in the medical field where environmental pollution is a problem, a liquid cooling type cooling device is used instead of the air cooling system. It was requested.

  Accordingly, an object of the present invention is to obtain a liquid-cooled enclosure cooling device without deteriorating the cooling effect and without environmental pollution.

  The liquid-cooled enclosure cooling device of the present invention is a cooling device using a refrigerant, in which a heat exchanger having a liquid flow path in which a heating element such as an electronic device and an electronic component flows and the refrigerant flows inside the outer wall. The housing main body provided and a separate cooling unit separated from the housing main body, and a chiller installed at a location different from the housing main body, and the housing main body and the chiller are connected to each other. A liquid flow path means for forming a liquid flow path, and the liquid flow path means connects the housing body and a cooling means for cooling the refrigerant.

  In the liquid-cooled case cooling apparatus of the present invention, the installation locations of the case main body and the cooling means are each a separate house partitioned in the same room.

  Furthermore, in the liquid cooling type casing cooling apparatus of the present invention, the installation place of the casing main body and the cooling means is characterized in that the casing main body is indoors and the cooling means is outdoor.

  Furthermore, in the liquid cooling type casing cooling apparatus of the present invention, the inside of the casing outer wall has a three-layer structure including the heat exchanger, the heat insulating layer, and the casing outer wall.

  Furthermore, in the liquid cooling type housing cooling apparatus of the present invention, a space is provided between the heat exchanger and the heat insulating layer.

  Furthermore, in the liquid cooling type housing cooling apparatus of the present invention, a heat sink is provided inside the heat exchanger.

  Furthermore, in the liquid cooling type housing cooling apparatus of the present invention, the heat exchanger and the heating element are directly connected by a heat conducting means such as a heat pipe or a heat lane.

  According to the present invention, since the liquid cooling system using the heat exchanger using the refrigerant is adopted, only the heat of the refrigerant is released to the outside, and there is no dust emission like the air-cooled type. Therefore, since it is not necessary to provide a filter at the air intake, the maintenance of the filter is also eliminated, so that a reliable and economical cooling device can be obtained.

  Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS.

  FIG. 1 is a perspective view showing the overall appearance of a liquid-cooled housing cooling apparatus according to the present invention, in which a sealed housing body 4 contains electronic devices and electronic components (not shown), and an upper surface 5 on the outer wall thereof. A heat exchanger 8 having a liquid flow path 7 formed of a heat exchanger, for example, a pipe through which a cooling refrigerant flows, is formed inside each of the right side surface 6 (for the drawing) and the right side of the outer wall 6 (for the drawing). Is provided.

  In the above-described embodiment, the case where the liquid flow path 7 is provided on the two surfaces of the outer wall upper surface 5 and the outer wall right side surface 6 has been described, but actually, it is provided on the other five surfaces excluding the bottom surface. There may be.

  Further, a chiller 9 as a cooling unit is installed at a location different from the housing main body 4, and this chiller 9 is connected to the housing main body 4 at one end 7 </ b> A and 7 </ b> B of the liquid flow path 7 described above. Here, the chiller 9 refers to a cooling means for cooling the refrigerant with a heat exchanger and releasing the heat from the refrigerant to the atmosphere.

  Then, inside the casing body 4, the inside of the casing body 4 is cooled in order along the flow direction of the refrigerant flowing in the liquid flow path 7.

  The refrigerant circulated and warmed in the casing body 4 is returned to the chiller 9, where only the heat of the returned refrigerant is radiated to the outside of the chiller 9, and the refrigerant is supplied by electronic means (not shown). It is cooled and sent to the housing body 4 again.

  FIG. 2 is a top view of an embodiment in which the liquid-cooled enclosure cooling device according to the present invention is installed in the same indoor. The operation room 10 is on the right side (with respect to the drawing) of the same indoor, and the left side (with respect to the drawing) The machine room 11 is provided in a state separate from the operation room 10.

  Among these, in the operation room 10, a housing body 14 is installed on the left side (relative to the drawing) of an operation console 13 on which an operator 12 performs an operation work, and a chiller 15 is installed in one machine room 11. The chiller 15 is connected to the housing body 14 through the liquid flow path means 16.

  In this way, by installing the chiller 15 in a separate room different from the installation room of the chassis main body 14, the operator 12 and the operation room 13 with the chassis main body 14 have no environmental pollution or cooling effect in the same room. Heat dissipation after cooling is possible without adverse effects.

  FIG. 3 is a top view showing another embodiment according to the present invention, that is, an embodiment in which the installation state of the liquid-cooled enclosure cooling device is divided into indoor and outdoor, and the above-described embodiment of FIG. The only difference is that the chiller 15 is installed outdoors.

  In this case, after cooling, the heat radiation from the chiller 15 is completely released to the outdoors, so that adverse effects due to heat radiation can be completely eliminated indoors where the operator 12 and the main body 14 are located.

  2, the same components as those in FIG. 2 are denoted by the same reference numerals, detailed description thereof will be omitted, and only the portions different from those in FIG. 2 will be mainly described above.

  4A and 4B are explanatory views showing an outer wall surface structure in the housing body according to the present invention, in which FIG. 4A is a sectional view of a structure in which a heat exchanger and a heat insulating layer are in contact, and FIG. 4B is a heat exchange. Sectional view in which a space is provided between the heat exchanger and the heat insulating layer, FIG. 6C is a sectional view in which a heat sink is provided inside the heat exchanger, and in the inside 4 of the housing body (FIG. 1), A heat exchanger 18 having a hole 17 through which refrigerant flows is provided on the innermost side, and a heat insulating layer 20 is provided between the heat exchanger 18 and the outer wall surface 19. .

  The embodiment shown in FIG. 6C is further configured to provide a heat sink 21 inside the heat exchanger 18 so as to collect heat generated from the electronic devices and electronic components and increase the cooling effect. Has been.

  By configuring in this way, the inside of the housing body 4 (FIG. 1) is hardly affected by the outside air temperature. In particular, in the case of the embodiment of FIG. Since the space 20d is provided between them, the influence of the outside air temperature can be further reduced.

  Further, in FIG. 3C, since the heat sink 21 is provided in the heat exchanger 18, the effect can be exhibited in cooling the heat generated from the electronic components, particularly the heat generated from the semiconductor or the like. .

  FIG. 5 is an explanatory diagram of an embodiment in which the heat generated from the heat generator in the housing main body of the present invention is directly led to the outer wall. Like the present embodiment, the heat generation in the housing main body 22 is particularly large. The heat generation of the body 23, for example, heat generation from a semiconductor or the like, the heat generation body 23 and a heat exchanger (not shown) provided on the outer wall surface 24 are connected to a heat conduction device 25 such as a heat pipe or heat lane, or It is also possible to increase the cooling effect by connecting with a metal plate or the like and directing heat generation through the heat conducting device 25 directly to a heat exchanger (not shown) provided inside the outer wall surface 24.

  6 to 7 are explanatory views showing the specific embodiment of FIG. 5 described above, FIG. 6 is a front view of the inside of the housing viewed from the front, and FIG. 7 is a heating element and an exterior outer wall surface. It is explanatory drawing which showed specifically the connection state.

  In FIG. 7, the same components as those in FIG. 6 are denoted by the same reference numerals, and in the following, detailed description of these components is omitted, and only components that are different from FIG. 6 are mainly described.

  In FIG. 6, a shelf 29 having an insertion groove 28A for inserting the substrate 27 is provided inside the housing 26, and a rack 30 having an insertion groove 28B for inserting the substrate 27 is also provided on the shelf 29. Each is provided. The substrate 27 is inserted and inserted in parallel with the insertion groove 28A and the insertion groove 28B, and this insertion is freely removable.

  Inside the housing having such a configuration, as shown in FIG. 7, the upper surface of the heating element 31, such as a semiconductor or other electronic component, provided on the substrate 27 is covered with a heat absorption block 32. The heat absorbing block 32 is fixed to the heating element 31 by a block fixing spring 33. The heat absorbing block 32 is connected to the exterior outer wall surface 36 of the casing 26 by a heat pipe 35 via a joint portion 34, and heat generated from the heating element 31 is transmitted to the outside of the casing 26 through the exterior outer wall surface 36. To be released.

  In such a configuration, when the board 27 is inserted into and removed from the housing 26, the joint portion 34 is removed or the heat absorbing block 32 is removed from the block fixing spring 33.

  According to the casing cooling apparatus of the present invention described above, since the liquid cooling method using the heat exchanger using the refrigerant is adopted, only the heat of the refrigerant is released to the outside, such as an air-cooled type. There is no dust emission. Therefore, since it is not necessary to provide a filter at the air intake, the maintenance of the filter is also eliminated, so that a reliable and economical cooling device can be obtained.

  Further, according to the housing cooling device of the present invention, the casing main body and the chiller are separated into separate bodies, and the chiller and the casing main body are installed in different places, respectively, so that they are discharged from the chiller after cooling. The adverse effects of the generated heat do not affect electronic devices and electronic components, and the environmental pollution given to operators and other workers is eliminated, improving not only the reliability of electronic devices and electronic components, but also the environmental pollution effect. Is also remarkable.

  Further, according to the housing cooling device of the present invention, the wall surface structure inside the housing body has a three-layer structure in which a heat insulating layer is provided between the heat exchanger and the outer wall, and further, the heat exchanger and the heat insulating layer Since an interval is provided between the two, the influence of the outside air temperature on the housing body is extremely small, and the cooling effect can be greatly improved.

  Furthermore, according to the housing cooling device of the present invention, particularly for an electronic component having a large amount of heat generation, the heat generation is directly performed by connecting the electronic component and the heat exchanger with a heat conduction device. Since it can be made to lead to a heat exchanger, a cooling effect can be improved further.

It is the perspective view which showed the whole external appearance of the liquid cooling type | system | group cooling device by this invention. 1 is a top view of an embodiment in which a liquid-cooled enclosure cooling device according to the present invention is installed indoors. It is the top view which showed embodiment in which the installation state of the liquid cooling type | system | group cooling device by this invention is divided into indoor and the outdoors. BRIEF DESCRIPTION OF THE DRAWINGS It is explanatory drawing which showed the wall surface structure in the housing main body by this invention, The same figure (A) is a structure sectional drawing with which the heat exchanger and the heat insulation layer are contacting, The same figure (B) is a heat exchanger, a heat insulation layer, and FIG. 3C is a structural cross-sectional view in which a heat sink is provided inside the heat exchanger. It is explanatory drawing of embodiment which derives | leads-out the heat_generation | fever from the heat generating body in the housing main body of this invention directly to an outer wall. It is the front view which looked at the inside of the frame main part of the present invention from the front. It is explanatory drawing which showed concretely the connection state of the heat generating body and exterior outer wall surface in the housing main body of this invention. It is explanatory drawing which showed schematic structure of the conventional air cooling type cooling device.

Explanation of symbols

1 Housing 2 Fan 3 Arrow (Air flow)
4, 14, 22 Housing body 5 Outer wall upper surface 6 Outer wall right side surface 7 Liquid flow path 7A, 7B One end of liquid flow path 8, 18 Heat exchanger 9, 15 Chiller 10 Operation room 11 Machine room 12 Operator 13 Operation desk 16 Liquid flow Route means 17 Holes through which refrigerant flows 19, 24 Outer wall surface 20 Heat insulation layer 20d Interval 21 Heat sink 23, 31 Heating element 25 Thermal conduction device

Claims (7)

  In a cooling device using a refrigerant, a housing body in which a heating element such as an electronic device and an electronic component is incorporated, and a heat exchanger having a liquid flow path through which the coolant flows is provided inside the outer wall, and the housing body Is a separate cooling unit, and is installed in a place different from the casing main body, the cooling means for cooling the refrigerant, and the liquid flow path connecting the casing main body and the cooling means A liquid cooling type housing cooling apparatus comprising: a liquid flow path means for forming the housing; and the housing main body and the cooling means are connected by the liquid flow path means.   2. The liquid-cooled enclosure cooling apparatus according to claim 1, wherein the installation locations of the enclosure main body and the cooling means are each separated premises in the same room.   2. The liquid-cooled enclosure cooling apparatus according to claim 1, wherein the enclosure main body and the cooling means are installed such that the enclosure main body is indoors and the cooling means is outdoors.   The liquid cooling type casing cooling apparatus according to claim 1, wherein the inside of the casing outer wall has a three-layer structure including the heat exchanger, a heat insulating layer, and a casing outer wall.   The liquid cooling type housing cooling apparatus according to claim 4, wherein an interval is provided between the heat exchanger and the heat insulating layer.   The liquid cooling type housing cooling apparatus according to claim 4, wherein a heat sink is provided inside the heat exchanger.   The liquid-cooled enclosure cooling apparatus according to claim 1, wherein the heat exchanger and the heating element are directly connected by a heat conducting means such as a heat pipe or a heat lane.

Images