JP2003008274A - Electronic apparatus system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus system, capable of directly absorbing heat generated in electronic apparatus. SOLUTION: The electronic apparatus system, which discharges heat from the inside of an electronic apparatus to outside thereof comprises a heat pipe 30, composed of a first piece end parallel to the top of the electronic apparatus 20, and a second piece end extending in a direction perpendicular to the first piece end on the outside of the electronic apparatus; and a heat absorber, having a heat absorbing fin 51 on the first piece end of the heat pipe, and a heat- absorbing fan unit 60 mounted on the upper side or the lower side of the fin 51.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic equipment device having a cooling function for an electronic equipment such as an outdoor type optical transmission device.

[0002]

2. Description of the Related Art As a conventional cooling structure for electronic equipment, there is one disclosed in Japanese Patent Application Laid-Open No. 10-206046 (first document). This cooling structure uses a Z-shaped heat pipe, absorbs heat inside the electronic device with a heat absorbing part mounted on the lower part of the electronic device, and is vertically mounted on the upper part of the electronic device via the Z-shaped heat pipe. It is a structure that conducts to a heat dissipation part that radiates heat to the outside of the electronic device. The cooling structure of the electronic device is a structure in which the heat absorbing portion and the heat radiating portion are in the same straight line, and heat is transmitted vertically from the lower heat absorbing portion to the upper heat radiating portion.

As a conventional cooling structure for electronic equipment,
There is one disclosed in Japanese Patent Application Laid-Open No. 10-190270 (second document). This cooling structure uses an I-shaped heat pipe and mounts a partition plate for collecting heat collected in the upper part of the electronic device into a heat absorbing part mounted in the lower part of the electronic device. It is a structure in which the heat is conducted to the heat radiating portion mounted on the upper part of the electronic device via the I-shaped heat pipe mounted at an angle and radiates heat to the outside of the electronic device.

Further, as a conventional cooling structure for electronic equipment,
There is one disclosed in JP-A-7-86779 (the third document). In this cooling structure, an L-shaped heat pipe is used, one end of the heat pipe is parallel to the upper part of the electronic device, a heat absorbing fin is provided at the one end, and an outer cylindrical body surrounding the heat absorbing fin is provided. A fan is mounted on the side of the heat absorbing fin at the opening at one end of the cylinder, and the air warmed inside the sealed housing that surrounds the electronic device and the outer cylinder is absorbed by the fan inside the outer cylinder, It has a structure in which the heat absorbing fins meander and flow from right to left.

[0005]

However, in the above-mentioned prior art, the high-temperature heat generated in the heat-generating portion of the electronic device rises to the upper part of the electronic device by natural convection, but in both cases, the entire interior of the electronic device is warmed. Is. Therefore, the high temperature heat generated in the electronic device cannot be directly absorbed, and the heat cannot be efficiently dissipated.

An object of the present invention is to provide an electronic device apparatus capable of directly absorbing the heat generated by the electronic device.

[0007]

SUMMARY OF THE INVENTION The present invention is an electronic device apparatus for radiating heat inside an electronic device to the outside of the electronic device, the first one end portion being parallel to the upper part of the electronic device and the electronic device. A second device extending outside the device in a direction perpendicular to the first one end.
A heat pipe having one end portion; and a heat absorbing portion having a heat absorbing fin at the first one end portion of the heat pipe and having a heat absorbing fan unit mounted above or below the heat absorbing fin. .

The present invention is characterized in that the heat absorption fan unit is detachable.

According to the present invention, a heat radiating fin is provided at the second end of the heat pipe, and a heat radiating portion having a heat radiating fan unit is provided at a position where forced convection is possible with respect to the heat radiating fin. Characterize.

The present invention is characterized in that the heat radiation fan unit is removable.

The present invention is characterized in that the heat radiation fin is mounted on a lower portion of the heat radiation portion, and a cover is mounted on an upper portion of the heat radiation portion.

The present invention is an electronic device apparatus for radiating heat inside an electronic device to the outside of the electronic device, the first end being parallel to the upper part of the electronic device and a direction perpendicular to the first end. A plurality of heat pipes each including a second one end portion extending toward the front side and a rear surface side of the electronic device, the plurality of heat pipes being alternately turned with respect to the second one end portion. It is characterized in that a heat absorbing fin is provided at the first end portion, and a heat absorbing portion in which a heat absorbing fan unit is mounted is provided below the heat absorbing fin.

According to the present invention, a heat radiating fin is provided at the second end portion of the heat pipe, and a heat radiating portion having a heat radiating fan unit is provided at a position where forced convection is possible with respect to the heat radiating fin. Characterize.

[0014]

1 to 4 are views showing a first embodiment of an electronic apparatus according to the present invention. 1 is a side sectional view showing the outline, FIG. 2 is an enlarged sectional view of the electronic device cooling structure of FIG. 1, FIG. 3 is a schematic perspective view of FIG. 2, and FIG. 4 is an exploded perspective view of FIG. And will be described below.

The electronic device 10 includes a heat pipe 40 having a first end parallel to the upper part of the electronic device 20 and a second end extending outside the electronic device 20 in a direction perpendicular to the first end and a heat pipe 40. The heat absorbing fins 5 are attached to the first end of the pipe 40.
1 and a heat absorbing portion 50 having a removable heat absorbing fan unit 60 mounted on the upper or lower portion of the heat absorbing fin 51, and a heat radiating fin 71 at the second one end of the heat pipe 40. Radiating part 7 with a removable radiating fan unit 80 mounted in a position that allows forced convection
The electronic device cooling structure 30 having 0 is provided.

The electronic device 20 is inserted into the frame 25 from the left side of FIG. 1, and is surrounded by the frame 25 with the front surface on the left side. The electronic device cooling structure 30 is provided in the insertion hole of the frame 25 provided on the upper part of the electronic device 20 in the electronic device device 1.
It can be mounted by sliding it from the rear surface of 0 and fixing it on the rear surface of the frame 25, and the mounting and dismounting is also easy.

The heat absorbing section 50 is an endothermic fan unit 60 for collecting heat efficiently, a heat pipe 40, a plurality of heat absorbing fins 51 mounted on the heat pipe 40, and a heat absorbing unit for mounting the heat absorbing fan unit 60. Each of the fin cases 52 and the like can be specifically configured. In addition, the heat dissipation unit 70 includes a heat dissipation fan unit 80 for efficiently dissipating the heat conducted to the heat dissipation fins 71 to the outside of the electronic device 20, the heat pipe 40 extended from the heat absorption unit 50, and the heat pipe 40. Each of the mounted heat radiation fins 71 and the like can be specifically configured.

The heat absorbing portion 50 is composed of a plurality of L-shaped copper heat pipes 40, and a plurality of flat plate heat absorbing fins 51 made of aluminum and having a hole formed in the center thereof. The heat pipe 40 is fixed by being press-fitted from one end.

Heat absorbing part fin case 5 made of box-shaped sheet metal
The heat-absorbing fins 51 fixed to the heat pipe 40 are inserted into the heat pipe 40 so that they can be fixed and stored.
The heat absorbing fan unit 60 can be mounted on the upper portion of the heat absorbing fin case 52, and the lower portion of the heat absorbing fin case 52 has an opening 73 for absorbing heat from the electronic device 20.
There is.

The endothermic fan unit 60 is composed of an endothermic fan mounting plate 61, a plurality of endothermic fans 62, an endothermic fan cover 63, and two endothermic fan unit screws 64. The heat absorbing fan unit 60 is fixed to the upper portion of the heat absorbing fan unit 60 and is fixed to the heat absorbing fan mounting plate 61 so as to be sandwiched by the internal fan cover 63 so as to be sandwiched between the heat absorbing fan unit 60 and the inner fan cover 63 for protection.

The heat absorbing fan unit 60 is mounted on the heat absorbing section fin case 62, and the heat absorbing section fin case 6 is mounted.
2 is fixed by the heat absorbing fan unit fixing screws 64 at the two front surfaces by sliding and pushing the heat absorbing fan unit 60, and the end portion of the heat absorbing fan mounting plate 61 is sandwiched by the two heat absorbing fan unit fixing members 65, whereby the heat absorbing fan unit 60 is fixed. It can be fixed.

As described above, the heat-absorption fan unit 60 is mounted on the heat-absorption part fin case 62, and the heat-absorption fan 62 is operated in the direction in which the air flows from the lower part to the upper part to positively generate the heat generated from the electronic device 20. Therefore, the heat can be efficiently transferred to the heat absorbing fins 51.

Further, by mounting the heat absorbing fan 62 directly on the heat absorbing fan mounting plate 61, the heat absorbing portion 50 can be made thin, and the height space to be mounted inside the electronic device 10 is suppressed as much as possible. Can be

High temperature air 90 (a) inside the electronic equipment on the front side of the electronic equipment 10 sucked up by the heat absorbing fan 62
Is cooled by the heat absorbing fins 51, and the cooled air is cooled by the front gap 32 between the heat absorbing portion 50 on the front side and the electronic device 10.
To the lower part of the electronic device apparatus 10, and the high temperature air 90 (b) inside the electronic device on the back side of the electronic device apparatus 1 is cooled by the heat absorbing fins 51, and the back surface gap 33 between the heat absorbing section 50 and the electronic device apparatus 10 is formed. It flows through to the lower part of the electronic device apparatus 10 to cause air circulation.

Further, the heat absorbing fan unit 60 can be mounted on the lower part of the heat absorbing fin case 52, and the structure can be freely mounted in the internal space of the electronic device 10.

Next, the heat radiating portion 70 is formed of a plurality of aluminum radiating fins 71 made of aluminum and having a hole formed in the central portion of the heat absorbing portion 50 of the heat pipe 40 from the opposite side end portion.
Is fixed by press-fitting.

The heat radiating section inner case cover 72 has a heat radiating section inner case cover opening 73 larger than the heat absorbing fin 51 for inserting the heat absorbing fin 51 fixed to the heat pipe 40. After being inserted into the case cover opening 73, it is fixed to the heat absorbing fin case 52.

The heat radiating section inner case cover 72 is fixed to the heat absorbing section fin case 52 by two fixing members 78.

The heat absorbing fins 5 mounted on the heat pipe 40 are inserted into the heat radiating portion inner case cover openings 73 of the heat radiating portion inner case cover 72 fixed to the heat absorbing portion fin case 52.
By inserting 1, the heat dissipation part inner case cover 72
And an opening closing plate 74 formed in a size capable of closing the heat radiating section inner case cover opening 73 are in contact with each other,
Can be fixed.

Further, by sealing the contact surface between the heat radiating section inner case cover 72 and the opening closing plate 74, the heat absorbing section 50 and the heat radiating section 70 can completely block the flow of air and rainwater. Therefore, it is possible to ensure waterproofness that is effective even for electronic devices installed outdoors.

Since the heat radiating portion 70 has a structure projecting to the outside of the electronic device 10, when it is installed outdoors, the heat radiating portion inner case cover is provided for the purpose of protecting it from the influence of rain water and solar radiation from the outside. 72 to the heat dissipation part external case 7
By fixing 5, it is possible to suppress the influence from the outside.

By fixing the waterproof packing 79 to the heat radiating section inner case cover 72, the electronic device main body 10
The waterproof packing 79 and the waterproof packing 79 are in contact with each other to ensure the waterproof property, and the waterproof property can be easily secured.

The heat absorbed by the heat absorbing portion 50 is transmitted to the heat radiating portion fin 71 of the heat radiating portion 70 through the heat pipe 40 and is radiated to the outside of the electronic device 10 by the heat radiating fan unit 80.

The heat dissipation fan unit 80 is constructed by directly fixing the heat dissipation fan 81 to the upper part of the heat dissipation part outer case cover 82, and the heat dissipation fan unit 80 can be made thin.

By mounting the heat dissipation fan 81 on the upper part of the heat dissipation part outer case cover 82, the heat dissipation fin 7
Since the heat generated from No. 1 rises to the upper part of the heat dissipation unit 70 by natural convection, by operating the heat dissipation fan 81,
The effect of natural convection can be effectively used, and the heat dissipation performance can be made efficient.

That is, by operating the heat radiation fan 81, the outside air 92 (a) can be sucked from the case air inlet 76 (a) provided at the bottom of the heat radiation part outer case 75. In addition, the outside air 92 (b) is supplied to the outside air 92 (b) from the case intake ports 76 (b) provided below both side surfaces of the heat radiating section outer case 75.
Can be inhaled. Further, the outside air 92 (c) can be taken in through the cover intake port 83 in the lower part of the heat radiating section outer case cover 82. The above three intake ports 76 (a),
External air 92 (a), 92 (b), 9 from 76 (b), 83
By inhaling 2 (c), the heat transferred to the radiation fin 71 is efficiently cooled, and the heat radiation part air 91 is radiated to the outside of the electronic device 10 from the cover exhaust port 86.

Depending on the amount of heat generated by the electronic device 20, the endothermic fan 62 itself of the endothermic fan unit 60 may be made larger or smaller, or the quantity may be changed, or the endothermic fan unit 60 itself may not be mounted. It has a possible structure. Similarly, the heat dissipation fan 8 of the heat dissipation fan unit 80
It is possible for 1 to be compatible with the shape, quantity, or even when not mounted.

The electronic device cooling structure 30 can be mounted by sliding the electronic device cooling structure 30 into the insertion hole of the frame 25 provided on the upper part of the electronic device 20 from the rear surface of the electronic device device 10 and fixing it to the rear surface of the frame 25. Yes, it is easy to put on and take off.

Further, the heat absorbing fan unit 60 can be attached and detached from the front surface of the electronic device body 10 by loosening the heat absorbing fan unit fixing screws 64 at two places, and the heat absorbing fan 62 can be easily replaced. Is.
Similarly, the heat dissipation fan unit 80 is also a structure that can be attached and detached from the rear surface of the electronic device 10 by removing the heat dissipation part external case cover 82 from the heat dissipation part external case 75, and the structure of the heat dissipation fan 81 can be easily replaced. Is.

FIG. 5 is a rear perspective view of another embodiment of the electronic equipment cooling structure in the electronic equipment of FIG.
Is a central cross-sectional view of the heat radiating section outer case of FIG.
This will be described below.

Referring to FIG. 5, the heat dissipation fan unit 80 can be mounted on the left side surface or the right side surface of the heat dissipation portion outer case 75. Hereinafter, the case where the heat dissipation fan unit 80 is mounted on the left side surface will be described.

When the heat radiation fan 81 is operated, the outside air 92 (b) is sucked from the outside through the case air inlet 76, flows through the heat radiation fin 71 and the heat pipe 40 mounting portion, and radiates heat from the case air outlet 88 to the outside of the electronic device body 10. This is a structure for discharging the partial air 91.

Further, by mounting the heat radiation fan 81 in the opposite direction of rotation, it is possible to take in air from the case exhaust port 88 and exhaust it from the case intake port 76.

The air flow generated by the heat dissipation fan 81 is parallel to the heat dissipation fins 71 and can reduce the air resistance, so that the number and the number of rotations of the heat dissipation fans 81 can be reduced, resulting in low noise and high efficiency. It is a structure that can realize excellent heat dissipation performance.

FIG. 7 is a side sectional view showing the outline of the second embodiment of the electronic device apparatus of the present invention, and FIG. 8 is an enlarged perspective view of the electronic device cooling structure of FIG. 7, which will be described below.

The heat-absorption fans 62 (a) and 62 (b) mounted on the heat-absorption fan unit 60 have an intake direction in which heat is absorbed from the electronic device 20 from the lower part of the fan, and an exhaust direction is perpendicular to the intake air. It is a structure that emits wind.

That is, the heat absorbing fan 62 (a) on the front side of the electronic device 10 sucks the high temperature air 90 (a) inside the electronic device 20 from the electronic device 20, and cools the air cooled to the front of the electronic device 10. From the front gap 32 to the electronic device 10
It is a structure that flows to the bottom of. Further, the heat absorbing fan 62 (b) on the back side of the electronic device apparatus 10 sucks the high temperature air 90 (b) inside the electronic device from the electronic device 20, and the electronic device apparatus 1
The structure is such that the air cooled to the back side of 0 flows from the back side gap 33 to the lower part of the electronic device apparatus 10.

Further, the heat absorbing fans 62 (a) and 62 (b)
Since the intake direction and the exhaust direction are perpendicular to each other, the gap 69 above the endothermic fan is not required, and the electronic device cooling structure 30
The heat absorption part 50 can reduce the mounting space inside the electronic device, and the inside of the electronic device 10 has a structure that actively causes air circulation, and has a structure with excellent cooling performance.

FIG. 9 is an enlarged cross-sectional view of the electronic equipment cooling structure of the third embodiment of the electronic equipment of the present invention, and FIG. 10 is shown in FIG.
11 is an exploded perspective view of FIG. 10 and is described below.

Heat dissipation fan 81 of heat dissipation fan unit 80
Is mounted on the lower portion of the Z-shaped heat radiating portion outer case cover 82, so that the heat radiating fan 81 is mounted at a position where it is not easily affected by rain water and solar radiation from the outside.

Further, by operating the heat dissipation fan 81, the cover intake port 83 of the heat dissipation unit outer case cover 82 is operated.
Has a cover structure for sucking the outside air 92 (c) from below, and the intake port 83 has a structure that is not easily influenced by the outside.

The outside air 92 (c) sucked from the cover intake port 83 at the lower part of the heat dissipation part outer case cover 82 is discharged from the cover exhaust port 86 at the upper part of the heat dissipation part outer case cover 82. The air exhausted from the cover exhaust port 86 is sent to the heat radiating unit exhaust case 87, and the case exhaust port 88 on the rear surface and the case exhaust ports 88 (a), 88 on the left and right side surfaces.
It is a structure that is discharged from (b) to the outside. Therefore, the outside air 9 is discharged from the cover intake port 83 of the heat dissipation unit outer case cover 82.
The structure in which 2 (c) is sucked up from below and the heat dissipation part exhaust case 87 is mounted can make the heat dissipation part 70 less susceptible to external influences and have a structure with efficient exhaust performance. is there.

FIG. 12 is a side sectional view showing an outline of a fourth embodiment of an electronic equipment device of the present invention, and FIG. 13 is a sectional view.
FIG. 4 is a left side view of FIG.

As a matter of course, it is possible to use the L-shaped heat pipe 40 and mount the heat absorbing portion 50 and the heat radiating portion 70 of the electronic device cooling structure 30 inside the electronic device 10.

In the heat absorbing portion 50, one end of the heat pipe 40 is alternately mounted on the front side of the electronic device 10 and the rear side of the electronic device 10, and the heat absorbing fins 51 are attached to the electronic device 1.
It is fixed by press-fitting from the front side and the back side of 0.

The heat-absorption fan unit 60 is mounted below the heat sink 51 fixed to the heat pipe 40, and is removable from the front surface of the electronic device 20. Endothermic fan 62
90 high temperature air inside the electronic equipment sucked up by
In (a) and 90 (b), the heat absorbing fins 51 cool the cooled air, and the cooled air has a left side surface gap 34 and a right side surface gap 3.
5 and flows to the lower part of the electronic device 10 to cause circulation inside the electronic device 10.

Next, the heat radiation part 70 is fixed by mounting one end of the heat pipe 40 on the same straight line and press-fitting the heat radiation fin 71.

The heat radiation fan 81 can be mounted on the left side surface or the right side surface of the electronic device 10. In the following description, the case where the electronic device 10 is mounted on the left side surface will be described.

By operating the heat dissipation fan 81,
The structure is such that the outside air 92 (a) is taken in through the main body intake port 100, flows through the heat radiation fins 71 fixed to the heat pipe 40, and the electronic device internal high temperature air 90 (a) is exhausted through the main body exhaust port 101.

By mounting the partition plate 102 between the heat absorbing portion 50 and the heat radiating portion 70, the inside and outside of the electronic device 10 can be shielded and waterproof.

Further, the electronic equipment cooling structure 30 has a size which can be easily mounted and accommodated by changing the length of the heat pipe 40 and the shapes of the heat absorbing fins 51 and the heat radiating fins 71 according to the shape of the electronic equipment 10. Will be available.

The heat absorbing portion 50 has a structure to be mounted on the upper portion of the electronic device 20, and therefore has excellent heat absorbing performance. Further, since the heat radiating portion 70 has a structure in which air flows horizontally with respect to the heat radiating fins 71, it has a structure capable of reducing air resistance and thus has excellent heat radiating performance.

As described above, according to the embodiment of the present invention, by mounting the heat absorbing portion of the cooling structure on the upper portion of the heat generating portion inside the electronic device, both sides of the heat absorbing fan and natural convection are integrated. The effect is possible. Therefore, the heat generated inside the electronic device can be efficiently transmitted to the heat radiating portion, and by having the heat radiating portion having the highly efficient intake and exhaust performance, it is possible to realize the small and highly efficient heat radiating performance. It has become a thing.

[0064]

According to the present invention, it is possible to obtain an electronic device apparatus capable of directly absorbing the heat generated by the electronic device.

[Brief description of drawings]

FIG. 1 is a side sectional view showing an outline of a first embodiment of an electronic device apparatus of the present invention.

FIG. 2 is an enlarged cross-sectional view of the electronic device cooling structure of FIG.

3 is a schematic perspective view of FIG. 2. FIG.

FIG. 4 is an exploded perspective view of FIG.

5 is a rear perspective view of another embodiment of the electronic device cooling structure in the electronic device device of FIG. 1. FIG.

FIG. 6 is a central cross-sectional view of the heat dissipation unit outer case of FIG.

FIG. 7 is a side sectional view showing an outline of a second embodiment of an electronic device apparatus of the present invention.

8 is an enlarged schematic perspective view of the electronic device cooling structure of FIG. 7. FIG.

FIG. 9 is an enlarged cross-sectional view of an electronic device cooling structure of the third embodiment of the electronic device device of the present invention.

10 is a rear perspective view of FIG. 9. FIG.

11 is an exploded perspective view of FIG.

FIG. 12 is a side sectional view showing an outline of a fourth embodiment of an electronic device apparatus of the present invention.

13 is a left side view of FIG.

[Explanation of symbols]

10: electronic equipment device, 20: electronic equipment, 25: frame, 30: electronic equipment cooling structure, 32: front gap, 33:
Back clearance, 34: Left clearance, 35: Right clearance, 4
0: heat pipe, 50: heat absorbing part, 51: heat absorbing fin,
52: heat absorbing part fin case, 60: heat absorbing fan unit, 61: heat absorbing fan mounting plate, 62, 62 (a), 62
(B): Endothermic fan, 63: Endothermic fan cover, 64:
Heat absorbing fan unit fixing screw, 65: heat absorbing fan unit fixing member, 69: heat absorbing fan upper gap, 70: heat radiating portion, 71: heat radiating fin, 72: heat radiating portion inner case cover, 73: heat radiating portion inner case cover opening, 74 : Opening part closing plate, 75: Heat dissipation part external case, 76, 76
(A), 76 (b): case inlet, 78: fixing member,
79: Waterproof packing, 80: Radiating fan unit, 8
1: Heat dissipation fan, 82: Heat dissipation part external case cover, 8
3: Cover intake port, 86: Cover exhaust port, 87: Radiator exhaust case, 88, 88 (a), 88 (b): Case exhaust port, 90, 90 (a), 90 (b): Inside electronic device High temperature air, 91: air for heat radiating portion, 92 (a), 92 (b),
92 (c): outside air, 100: main body intake port, 101: main body exhaust port, 102: partition plate.

Claims (7)

[Claims] 1. An electronic device apparatus for radiating heat inside an electronic device to the outside of the electronic device, the first end being parallel to the upper part of the electronic device and the first end outside the electronic device. Portion and a second end portion extending in a direction perpendicular to the heat pipe, and a heat absorbing portion having a heat absorbing fin at the first end portion of the heat pipe and having an endothermic fan unit mounted above or below the heat absorbing fin. An electronic apparatus device comprising: 2. The electronic equipment device according to claim 1, wherein the heat absorbing fan unit is detachable. 3. The electronic device according to claim 1, wherein a heat radiation fan unit is mounted at a position having a heat radiation fin at the second one end of the heat pipe and enabling forced convection to the heat radiation fin. An electronic equipment device comprising the heat dissipation part. 4. The electronic equipment device according to claim 3, wherein the heat dissipation fan unit is removable. 5. The electronic equipment device according to claim 3, wherein the heat radiation fan is mounted on a lower portion of the heat radiation portion, and a cover is mounted on an upper portion of the heat radiation portion. 6. An electronic device apparatus for radiating heat inside an electronic device to the outside of the electronic device, the first one end parallel to an upper part of the electronic device and extending in a direction perpendicular to the first one end. A plurality of heat pipes each including a second one end portion, the first one end portion being alternately turned with respect to the second one end portion toward a front surface side and a rear surface side of the electronic device; and the plurality of heat pipes. An electronic apparatus device comprising a heat absorbing fin at a first end portion and a heat absorbing portion having a heat absorbing fan unit mounted below the heat absorbing fin. 7. The electronic device apparatus according to claim 6, wherein a radiating fin is provided at the second end of the heat pipe, and a radiating fan unit is mounted at a position where forced convection is possible with respect to the radiating fin. An electronic equipment device comprising the heat dissipation part.