CN115134002A - 4-channel external modulation electro-optical conversion assembly based on photoelectric hybrid integration - Google Patents

4-channel external modulation electro-optical conversion assembly based on photoelectric hybrid integration Download PDF

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Publication number
CN115134002A
CN115134002A CN202210772689.4A CN202210772689A CN115134002A CN 115134002 A CN115134002 A CN 115134002A CN 202210772689 A CN202210772689 A CN 202210772689A CN 115134002 A CN115134002 A CN 115134002A
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unit
heat dissipation
laser
shell
microwave
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CN115134002B (en
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黄雨新
毛滔
徐金平
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Chongqing Qinsong Technology Co ltd
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Chongqing Qinsong Technology Co ltd
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B10/00Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/50Transmitters
    • H04B10/501Structural aspects
    • H04B10/503Laser transmitters
    • H04B10/505Laser transmitters using external modulation
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B10/00Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/50Transmitters
    • H04B10/501Structural aspects
    • H04B10/503Laser transmitters

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Semiconductor Lasers (AREA)

Abstract

This scheme belongs to photoelectric communication technical field, concretely relates to 4 passageway external modulation electro-optical conversion subassemblies based on photoelectricity hybrid integration. The microwave laser comprises a laser unit, a microwave unit, a space light path unit and a control circuit unit; a microwave unit: the low noise amplifier comprises a Bias Tee, an LNA (low noise amplifier) and a numerical control attenuator; a laser unit: the device comprises a laser chip and a backlight detector chip; the space light path unit comprises an optical fiber, a collimating lens component, a focusing lens and an LD chip; a control circuit unit; the microwave unit, the laser unit, the space optical path unit and the control circuit unit are integrally packaged in the integrated shell, a cavity structure in the shell is designed into 4 channels, and each channel is an independent space. The scheme realizes the hybrid integration of the 4-channel spatial light path unit, the laser unit, the microwave unit and the control circuit unit in the same shell. The air-tight packaging can be realized, the channel isolation is good, the power consumption is low, the integration level of the system is improved, and the volume is reduced.

Description

4-channel external modulation electro-optical conversion assembly based on photoelectric hybrid integration
Technical Field
This scheme belongs to photoelectric communication technical field, concretely relates to 4 passageway external modulation electro-optical conversion subassemblies based on photoelectricity hybrid integration.
Background
At present, the demand of rapid development of emerging internet applications such as big data, cloud computing, cloud storage, internet of things and the like on data broadband transmission is increasing, so that the flow index of a data center is increased, the demand on a high-speed optical module is greatly improved, and the development of high-speed photoelectric devices and chips is promoted. The core optoelectronic devices of an optical module are the light emitting assembly (TOSA) and the light receiving assembly (ROSA). The operating principle of a light emitting module (TOSA) is: laser signals emitted by a plurality of semiconductor lasers are coupled to a single optical fiber output port through a wavelength division multiplexing chip (MUX), such as an Arrayed Waveguide Grating (AWG), a free space optical filter, and the like, and finally output optical signals through a collimating lens or a focusing lens. As data transmission rates increase from 400G to 800G, maintaining the physical size, power consumption, and cost of the optoelectronic devices in a TOSA package at the same time is a key technical challenge.
In the related art, the mainstream technology of the 100G, 200G and 400G optical modules is generally based on discrete TOSA modules, that is, the semiconductor laser chip and the wavelength division multiplexing chip are independent and combined in the TOSA system. As for the TOSA module, the core device is a semiconductor Laser for generating a Laser signal, and a direct-Modulated Laser (DML) and an electro-absorption Modulated Laser (EML) are commonly used.
The Direct Modulation Laser (DML) directly modulates the driving current of the laser at a high speed to generate a corresponding optical signal. DML has the advantages of low cost, small size, simple circuit, low power consumption, etc., but because direct modulation causes frequency chirp, it generates large dispersion penalty, and limits long-distance transmission and high-speed transmission of optical signals. The electro-absorption modulated laser (EML) is monolithically integrated by a distributed feedback laser (DFB) and an electro-absorption modulator (EAM), a constant current is adopted to drive the laser to emit direct current light, and the direct current light is matched with the wavelength of the EA modulator so as to ensure that the output light of the laser can pass through the modulator basically without damage in a zero modulation bias voltage state. Because the EML adopts direct current modulation, the chirp effect caused by carrier fluctuation does not exist, so the dispersion ratio is lower, the long-distance and high-speed transmission is more facilitated, but the EML has higher power consumption and higher cost.
The united states patent application US2018031946a1 discloses a microwave photonic link implementation method based on an electro-optical modulator, wherein devices such as a laser, the electro-optical modulator, an optical detector and the like which are connected through an optical fiber are provided, but the laser used on the laser link is generally a single channel, the volume is large, and the two sides of an interface pin are integrated and use the large volume.
Disclosure of Invention
The scheme provides a 4-channel external modulation electro-optical conversion component with high integration level based on photoelectric hybrid integration.
In order to achieve the purpose, the scheme provides a 4-channel external modulation electro-optical conversion component based on photoelectric hybrid integration, which comprises a laser unit, a microwave unit, a space optical path unit and a control circuit unit;
a microwave unit: the low noise amplifier comprises a Bias Tee, an LNA (low noise amplifier) and a numerical control attenuator;
the microwave unit is connected with the laser unit through a microstrip line and is used for amplifying and filtering an input microwave signal and providing the microwave signal for the laser unit;
a laser unit: the device comprises a laser chip and a backlight detector chip;
the laser unit is connected with the space light path unit, directly loads the microwave signal into the optical signal to realize electro-optic conversion, and directly modulates and outputs the optical signal;
the space light path unit comprises an optical fiber, a collimating lens component, a focusing lens and an LD chip;
laser emitted by the LD chip is collimated by the collimating lens and then enters the focusing lens, and is focused and converged into the optical fiber by the self-focusing lens to complete optical coupling;
a control circuit unit; the temperature control device comprises a power converter and a temperature control unit;
the power converter is used for converting the voltage or the current of the electronic equipment to obtain an output power supply suitable for supplying power to different circuit modules, so that the power supply to the different circuit modules of the electronic equipment is realized;
the temperature control unit comprises a semiconductor cooler TEC and an NTC thermistor and is used for carrying out stable temperature control on the laser unit;
the microwave laser device further comprises a shell, wherein the microwave unit, the laser unit, the space light path unit and the control circuit unit are integrally packaged in the integrated shell, a cavity structure in the shell is designed into 4 channels, and each channel is an independent space.
The principle of the scheme is as follows: the control circuit unit provides a driving current to enable the laser chip to generate an optical carrier signal of electro-optic conversion, and the optical carrier signal is respectively transmitted to the focusing lens and the backlight detector chip; the backlight detector chip is used for monitoring the output light power of the laser, feeding back and monitoring the light power intensity, and feeding back the light power to the laser chip unit, after the light power is received by the laser unit, the light power is input to the LNA through the radio frequency microstrip to amplify the signal, the amplified signal sequentially flows through the attenuator and the Bisa Tee, and after the amplified signal passes through the Bisa Tee, the amplified signal is input to the LD chip; then the LD chip emits the received electric signal through the LD chip by the electro-optic effect, and the electric signal is transmitted and carried out.
The beneficial effect of this scheme: and the mixed integration of the 4-channel spatial light path unit, the laser unit, the microwave unit and the control circuit unit is realized in the same shell. The air-tight packaging can be realized, the channel isolation is good, the power consumption is low, the integration level of the system is improved, and the volume is reduced.
Furthermore, the external interface of the shell comprises a microwave input interface, an optical signal output interface, a low-frequency feed and a control interface. And is convenient to be connected with an external circuit.
Further, the power-on lead terminal of the shell is designed into an H-shaped structure and is led out from the bottom through a glass sintering process; and the upper layer is welded by cover plate laser. The shell structurally realizes spatial independence and ensures good channel isolation; the air tightness of the product is ensured.
Further, the packaging shell adopts a metalized shielding shell. The shell structure is used for shielding radio frequency interference signals generated among the outside, the component and the multi-channel component channel.
Further, the power supply converter is also included. The voltage or the current accessed to the electronic equipment is converted to obtain an output power supply suitable for supplying power to different circuit modules, so that the power supply to the different circuit modules of the electronic equipment is realized.
Further, the laser chip is not limited to FB, DFB, and VCSEL chips. The chip selection range is wide, the application threshold of the conversion assembly is low, and the application range is wide.
Further, still include heat abstractor, heat abstractor includes cylinder and miniature fan, miniature fan includes motor and flabellum, the flabellum is fixed to be established on the output shaft of motor, the cylinder is fixed to be established on the casing is outside, the slip is equipped with the piston on the lateral wall of cylinder, the piston constitutes confined space with the cylinder, be equipped with the liquid that the boiling point is 30 to 40 in the confined space.
Be equipped with the mounting panel on the port of cylinder, be equipped with the ventilation hole on the mounting panel, the bottom fixed mounting panel of motor is on the mounting panel, be equipped with the lug on being close to miniature fan direction on the piston, be equipped with on the mounting panel and be used for controlling motor pivoted switch, switch and lug phase-match, be equipped with the through-hole on the mounting panel.
When the modulation electro-optical conversion subassembly is being worked when 4 passageways are outer, the temperature of subassembly is 30 to 40 when, the liquid evaporation in the cylinder, make the pressure increase in the enclosure space, promote the piston and move toward the fan direction, lug on the piston touches the switch, make the motor rotate, and then the fan rotates takes away the heat on the casing, after the temperature of casing drops, the liquid liquefaction of vaporization in the cylinder, and then the pressure of enclosure space reduces, the piston moves toward the cylinder direction, and then lug and switch separation, fan stall, control fan rotation and stop through the temperature of casing, it is very intelligent, the work load of artifical heat dissipation has been reduced.
Furthermore, four heat dissipation devices are arranged on the shell and correspond to each channel respectively. Four fans are opened simultaneously, and the radiating effect is better.
The switches on the heat dissipation devices comprise a forward switch for controlling forward transmission of the motor and a reverse switch for controlling reverse rotation of the motor, the four heat dissipation devices sequentially comprise a first heat dissipation device, a second heat dissipation device, a third heat dissipation device and a fourth heat dissipation device, the forward switches of the first heat dissipation device and the third heat dissipation device are shorter than the reverse switches in distance from the bumps, and the forward switches of the second heat dissipation device and the fourth heat dissipation device are longer than the reverse switches in distance from the bumps. When the temperature of the shell reaches more than 30 degrees, the liquid in the cylinder evaporates, and then the piston moves towards the direction of the fan, so that the pistons of the first heat dissipation device and the third heat dissipation device contact the forward rotation switch first, and then the fans corresponding to the first heat dissipation device and the third heat dissipation device start to rotate forward, and blow air towards the shell to blow away heat on the surface of the shell, meanwhile, the reverse rotation switches of the second heat dissipation device and the fourth heat dissipation device contact the lug, so that the fans on the second heat dissipation device and the fourth heat dissipation device rotate reversely, negative pressure is formed between the fans on the second heat dissipation device and the shell, and then the heat on the shell corresponding to the second heat dissipation device and the fourth heat dissipation device can be sucked away, the purpose of rapid heat dissipation is achieved, and the problem that the heat dissipation of the shell is slow due to the fact that the heat of the shell blows away the heat corresponding to the shell is avoided. If the temperature continues to rise, the pressure in the cylinder continues to increase, the piston continues to move towards the direction close to the heat dissipation device, then the pistons of the first heat dissipation device and the third heat dissipation device contact the reversing switch, and then the fans corresponding to the first heat dissipation device and the third heat dissipation device start to rotate reversely, so that heat on the shell corresponding to the first heat dissipation device and the third heat dissipation device can be sucked away, the fans corresponding to the second heat dissipation device and the fourth heat dissipation device start to rotate forwards, air is blown to the shell to blow away heat on the surface of the shell, the forward-mounted fan and the reversing fan on the heat dissipation device are arranged in a crossed mode, the purpose of heat dissipation is achieved, and the service life of the shell is prolonged.
Furthermore, a protective shell is arranged on the fan, and the protective shell is a hollow net. Avoid the flabellum to be struck and damaged by the external world.
Further, the material of cylinder lateral wall is the metal material. The metal material heat-conducting property is good, can be better experience the temperature variation of casing to can in time transmit the temperature on the casing to the liquid in confined space, and then liquid also can reduce the temperature of casing.
Furthermore, the upper wall and the lower wall of the shell are provided with heat dissipation devices. The heat dissipation effect is better.
Drawings
Fig. 1 is a schematic structural diagram of embodiment 1 of the present invention.
Fig. 2 is a cross-sectional view of a single-pass structure according to embodiment 1 of the present invention.
Fig. 3 is a cross-sectional view of a four-channel structure of embodiment 1 of the present invention.
Fig. 4 is a schematic structural diagram of a microwave unit in embodiment 1 of the present invention.
Fig. 5 is a schematic structural diagram of an operating principle of a microwave unit according to embodiment 1 of the present invention.
Fig. 6 is a schematic structural diagram of a spatial light path in embodiment 1 of the present invention.
Fig. 7 is a schematic structural diagram of a temperature control principle of a control circuit according to embodiment 1 of the present invention.
Fig. 8 is a sectional view of the heat dissipating device according to embodiment 2 of the present invention.
Fig. 9 is a top view of a housing according to embodiment 2 of the present invention, in which a disk and heat dissipation holes overlap.
Fig. 10 is a top view of the structure in which the disk and the heat dissipation holes are separated according to embodiment 2 of the present invention.
Fig. 11 is a structural left side view of the housing of embodiment 2 of the invention.
Fig. 12 is an enlarged view of a portion a in fig. 11 according to embodiment 2 of the present invention.
Detailed Description
The following is further detailed by way of specific embodiments:
the reference numbers in the drawings of the specification include: the device comprises a microwave unit 1, a laser unit 2, a laser chip 2-1, a backlight detector chip 2-2, a space light path unit 3, a temperature control unit 4, a semiconductor refrigerator 4-1, a thermistor 4-2, a control circuit unit 5, a first cylinder 6, a micro fan 7, a piston 8, an installation plate 9, a bump 10, a forward rotation switch 11, a reverse rotation switch 12, a hollow net 13, a heat dissipation device 14, a shell 15, a lower side wall 16, a second cylinder 17, heat dissipation holes 18, a slide rail 19, a disc 20 and a piston rod 21.
Example 1 is substantially as shown in figures 1-2 of the accompanying drawings:
a4-channel external modulation electro-optical conversion component based on photoelectric hybrid integration is disclosed, wherein each channel comprises a microwave unit 1, a laser unit 2, a spatial light path unit 3 and a control circuit unit 5;
as shown in figures 4-5:
microwave unit 1: the low noise amplifier comprises a Bias Tee, an LNA (low noise amplifier) and a numerical control attenuator;
the microwave unit 1 is connected with the laser unit 2 through a microstrip line and is used for amplifying and filtering an input microwave signal and providing the microwave signal for the laser unit 2;
the digital control attenuator is used in a microwave communication system with the requirements of gain setting and control functions and is responsible for equalizing the gains of different channels, and the Bias-Tee is connected with the LNA low noise amplifier to realize intermediate frequency amplification;
an amplifier and an attenuator in the microwave unit 1 are changed from a module level to a chip level, and are integrated into the same cavity together with a light path part; the separation devices are integrated into a whole, and the purposes of reducing the size and reducing the power consumption are achieved.
The working principle of the whole microwave unit 1 is as follows: after receiving a radio frequency signal, the radio frequency signal is input into an LNA through a radio frequency microstrip to realize amplification, the amplified signal flows through an attenuator (to buffer the change of impedance and improve impedance matching) to arrive at a Bisa Tee (the Bisa Tee is composed of an ultra wide band, a high-frequency inductor and a capacitor which are close to idealization and have no resonance point), and the amplified signal is input into an LD chip after passing through the Bisa Tee; then the LD emits the received electric signal through the LD by the electro-optic effect, and the electric signal is carried out.
Laser unit 2: the device comprises a laser chip 2-1 and a backlight detector chip 2-2;
the laser unit 2 is connected with the spatial light path unit 3, the laser unit 2 directly loads the microwave signal into the optical signal to realize electro-optic conversion, and directly modulates and outputs the optical signal;
the temperature control unit 4 is used for performing stable temperature control on the laser chip 2-1 unit 2, and the control circuit unit 5 is respectively connected with the temperature control unit 4 and the laser unit 2 in a modulation mode.
The laser chip 2-1 unit 2 comprises a laser chip 2-1 and a backlight detector chip 2-2, the control circuit unit 5 provides a driving current to enable the laser chip 2-1 to generate an electro-optical converted optical carrier signal, and the optical carrier signal is respectively transmitted to the focusing lens and the backlight detector chip 2-2; the backlight detector 2-2 chip can be connected with the control circuit 5 by adopting a PIN type detector chip, and the backlight detector 2-2 chip is used for monitoring the output light power of the laser and feeding back the monitored light power intensity to further form the feedback control of the laser unit 2.
As shown in fig. 6:
the spatial light path unit 3 comprises an optical fiber, a collimating lens component, a focusing lens and an LD chip;
the collimating lens component is used for focusing and converting divergent light emitted by the LD chip into collimated light; the focus of the collimating lens is positioned on the light emitting surface of the LD chip;
a focusing lens for coupling the larger free-space beam into the optical fiber;
laser emitted by the LD chip is collimated by the collimating lens and then enters the focusing lens, and is focused and converged into the optical fiber by the self-focusing lens to complete optical coupling;
a control circuit unit 5; comprises a power converter and a temperature control unit 4;
the power converter is used for converting the voltage or the current of the electronic equipment to obtain an output power supply suitable for supplying power to different circuit modules, so that the power supply to the different circuit modules of the electronic equipment is realized;
as shown in fig. 7:
the temperature control unit 4 comprises a semiconductor refrigerator 4-1TEC and an NTC thermistor 4-2 and is used for performing stable temperature control on the laser unit 2; the temperature regulation and control unit 4 is assembled below the laser chip 2-1, the temperature regulation and control unit 4 comprises a semiconductor refrigerator 4-1 for temperature control and a thermistor 4-2 for temperature monitoring, and the semiconductor refrigerator 4-1 receives a control signal of the control circuit unit 5 and provides working current of the semiconductor refrigerator 4-1 to realize temperature control; the thermistor 4-2 monitors the temperature value, converts the temperature value into an electrical signal and reports the electrical signal to the control circuit unit 5.
The power supply converter is used for converting voltage or current which enters the electronic equipment to obtain an output power supply which is suitable for supplying power to different circuit modules, and power supply to the different circuit modules of the electronic equipment is realized.
As shown in fig. 3:
the microwave laser unit comprises a microwave unit 1, a laser unit 2, a space light path unit 3 and a control circuit unit 5, and is characterized by further comprising a shell, wherein the microwave unit, the laser unit 2, the space light path unit 3 and the control circuit unit 5 are integrally packaged in the integrated shell, a cavity structure in the shell is designed into 4 channels, and each channel is an independent space.
The external interface of the shell comprises a microwave input interface, an optical signal output interface, a low-frequency feed and a control interface. The connection with an external circuit is convenient.
The power-on lead terminal of the shell is designed into an H-shaped structure and is led out from the bottom through a glass sintering process; and the upper layer is welded by cover plate laser. The shell structurally realizes spatial independence and ensures good channel isolation; the air tightness of the product is ensured.
The packaging shell adopts a metalized shielding shell. The shell structure is used for shielding radio frequency interference signals generated among the outside, the component and the multi-channel component channel.
Example 2, as shown in FIGS. 8-10:
the embodiment is different from embodiment 1 in that the heat dissipation device further comprises a heat dissipation device, the heat dissipation device comprises a first air cylinder 6 and a micro fan 7, the micro fan 7 comprises a motor and fan blades, the fan blades are fixedly arranged on an output shaft of the motor, the first air cylinder 6 is fixedly arranged on the outer portion of the shell 15, a piston 8 is arranged on the side wall of the first air cylinder 6 in a sliding mode, the piston 8 and the first air cylinder 6 form a closed space, and liquid with a boiling point of 30-40 degrees is arranged in the closed space.
Be equipped with mounting panel 9 on the port of first cylinder 6, be equipped with the ventilation hole on the mounting panel 9, the bottom of motor is fixed on mounting panel 9, is equipped with lug 10 on the piston 8 near 7 directions of miniature fan, is equipped with on the mounting panel 9 to be used for controlling motor pivoted switch, and switch and lug 10 phase-match are equipped with the through-hole on the mounting panel 9, and the through-hole is used for breathing freely and balanced atmospheric pressure.
The side wall of the first cylinder 6 is made of metal. The metal material heat conductivility is good, can be better feel the temperature variation of casing 15 to in can be in time with the temperature transmission to the liquid in confined space on the casing 15, and then first cylinder 6 also can reduce the temperature of casing 15 with heat transfer for liquid.
Four heat dissipation devices are disposed on the upper and lower sides of the housing 15, and correspond to each channel. The heat dissipation effect is better.
The fan is provided with a protective shell which is a hollow net 13, so that the fan blades are prevented from being damaged by external impact.
The switches on the heat dissipation devices comprise forward switches 11 for controlling the forward transmission of the motor and reverse switches 12 for controlling the reverse rotation of the motor, and the distances between the forward switches 11 of the four heat dissipation devices and the bumps 10 are shorter than the distances between the reverse switches 12 of the four heat dissipation devices.
The forward switch 11 of the first heat sink is also used to control the conduction of the lower sidewall 16 of the housing 15, the upper and lower sidewalls of the housing 15 are provided with corresponding heat dissipation holes 18,
as shown in figures 11-12:
a second cylinder 17 and a slide rail 19 are further arranged between the heat dissipation devices on the two sides of the shell 15, a piston rod 21 of the second cylinder 17 is fixedly connected with a disc 20, the disc 20 is slidably arranged in the slide rail 19, and the disc 20 is used for opening and closing the heat dissipation holes 18; and a piston 8 is arranged on the side wall in the second cylinder 17 in a sliding manner, the piston 8 and the second cylinder 17 form a sealed space, and liquid with a boiling point of 30-40 degrees is arranged in the sealed space.
When the 4-channel external modulation electro-optical conversion assembly works, when the temperature of the shell 15 reaches more than 30 degrees, liquid in the first air cylinder 6 is evaporated, the piston 8 moves towards the fan direction, the pistons 8 of the four heat dissipation devices contact the forward rotation switch 11 first, the fans corresponding to the four heat dissipation devices start to rotate forward, air is blown to the shell 15 to blow away heat on the surface of the shell 15, the lower side wall 16 of the shell 15 is electrified, dust on the upper side wall of the shell 15 and dust on parts can automatically fall on the lower side wall 16 of the shell 15 due to gravity, and the electrified side wall adsorbs the dust, so that the dust is prevented from being accumulated on the parts inside the shell 15.
Meanwhile, the liquid in the second cylinder 17 evaporates to push the piston towards the direction of the disc 20, so that the disc 20 and the heat dissipation holes 18 are in a separated state from an overlapped state, at the moment, the heat dissipation holes 18 are completely leaked, the fan blows in through the heat dissipation holes 18, and then blows out the heat in the shell 15, the purpose of rapid heat dissipation is achieved, and the problem that the heat dissipation device blows the heat corresponding to the shell 15 to the side to cause slow heat dissipation of the shell 15 due to the fact that the temperature of the shell 15 is slow is avoided.
If the temperature continues to rise, the pressure in the first cylinder 6 continues to increase, the piston 8 continues to move towards the direction close to the heat dissipation devices, then the pistons 8 of the four heat dissipation devices contact the reversing switch 12, then the fans corresponding to the four heat dissipation devices start to rotate in the reverse direction, negative pressure is formed between the fans and the shell 15, heat on the shell 15 corresponding to the four heat dissipation devices can be sucked away, meanwhile, the heat in the shell 15 is also sucked away through the heat dissipation holes 18, the fan on the heat dissipation devices rotates in the reverse direction after rotating in the forward direction, the purpose of heat dissipation is achieved, and the service life of the shell 15 is prolonged.
Meanwhile, the four fans rotate reversely, negative pressure is formed between the fans and the shell 15, and then dust in the shell 15 can be sucked out through the heat dissipation holes 18, so that the dust is prevented from being adhered to parts and affecting the power of the 4-channel external modulation electro-optic conversion assembly.
After the temperature of the casing 15 is reduced, the temperature of the liquid in the first cylinder and the second cylinder 17 is reduced, and then the piston moves towards the bottom of the cylinder, so that the bump 10 is separated from the forward switch 11 and the reverse switch 12 in sequence, the disc 20 is overlapped with the heat dissipation hole 18, and then the heat dissipation hole 18 is blocked, and dust is prevented from entering the casing 15.
Meanwhile, the reversing switches 12 of the second heat dissipation device and the fourth heat dissipation device are in contact with the bumps 10, so that the fans on the second heat dissipation device and the fourth heat dissipation device are reversed, negative pressure is formed between the fans on the second heat dissipation device and the fourth heat dissipation device and the shell 15, heat on the shell 15 corresponding to the second heat dissipation device and the fourth heat dissipation device can be absorbed, the purpose of rapid heat dissipation is achieved, the heat of the shell 15 corresponding to the heat dissipation device is prevented from being blown aside by the heat dissipation device, and the shell 15 is enabled to be warm and fast dissipated.
The foregoing is merely an example of the present invention and common general knowledge of known specific structures and features of the embodiments is not described herein in any greater detail. It should be noted that, for those skilled in the art, without departing from the structure of the present invention, several changes and modifications can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent. The scope of the claims of the present application shall be determined by the contents of the claims, and the description of the embodiments and the like in the specification shall be used to explain the contents of the claims.

Claims (10)

1. A4-channel external modulation electro-optical conversion component based on photoelectric hybrid integration comprises a laser unit (2), and is characterized in that: the microwave optical fiber device also comprises a microwave unit (1), a space optical path unit (3) and a control circuit unit (5);
microwave unit (1): the low noise amplifier comprises a Bias Tee, an LNA (low noise amplifier) and a numerical control attenuator;
the microwave unit (1) is connected with the laser unit (2) through a microstrip line and is used for amplifying and filtering an input microwave signal and providing the microwave signal for the laser unit (2);
laser unit (2): the laser device comprises a laser chip (2-1) and a backlight detector chip (2-2);
the laser unit (2) is connected with the spatial light path unit (3), the laser unit (2) directly loads microwave signals into optical signals to realize electro-optic conversion, and the optical signals are directly modulated and then output;
the space light path unit (3) comprises an optical fiber, a collimating lens component, a focusing lens and an LD chip;
laser emitted by the LD chip is collimated by the collimating lens and then enters the focusing lens, and is focused and converged into the optical fiber by the self-focusing lens to complete optical coupling;
a control circuit unit (5); comprises a power converter and a temperature control unit (4);
the power converter is used for converting the voltage or the current of the electronic equipment to obtain an output power supply suitable for supplying power to different circuit modules, so that the power supply to the different circuit modules of the electronic equipment is realized;
the temperature control unit (4) comprises a semiconductor refrigerator (4-1), a TEC (thermoelectric cooler) and an NTC (negative temperature coefficient) thermistor (4-2) and is used for carrying out stable temperature control on the laser unit (2);
the microwave laser device is characterized by further comprising a shell, wherein the microwave unit (1), the laser unit (2), the space light path unit (3) and the control circuit unit (5) are integrally packaged in the integrated shell, a cavity structure in the shell is designed into 4 channels, and each channel is an independent space.
2. The out-of-4-channel modulation electro-optical conversion assembly based on the optoelectronic hybrid integration according to claim 1, wherein: the shell external interface comprises a microwave input interface, an optical signal output interface, a low-frequency feed and control interface.
3. The out-of-4-channel modulation electro-optical conversion assembly based on the optoelectronic hybrid integration according to claim 1, wherein: the power-on lead terminal of the shell is designed into an H-shaped structure and is led out from the bottom through a glass sintering process; and the upper layer is welded by cover plate laser.
4. The out-of-4-channel modulation electro-optical conversion assembly based on the optoelectronic hybrid integration according to claim 1, wherein: the packaging shell adopts a metalized shielding shell.
5. The out-of-4-channel modulation electro-optical conversion assembly based on the optoelectronic hybrid integration, according to claim 4, wherein: also included is a power converter.
6. The out-of-4-channel modulation electro-optical conversion assembly based on the optoelectronic hybrid integration according to claim 5, wherein: the laser chip (2-1) is not limited to FB, DFB, and VCSEL chips.
7. The out-of-4-channel modulation electro-optical conversion assembly based on the optoelectronic hybrid integration according to claim 6, wherein: the heat dissipation device comprises an air cylinder (6) and a micro fan (7), the micro fan (7) comprises a motor and fan blades, the fan blades are fixedly arranged on an output shaft of the motor, the air cylinder (6) is fixedly arranged on the outer portion of the shell, a piston (8) is arranged on the side wall of the air cylinder (6) in a sliding mode, the piston (8) and the air cylinder (6) form a sealed space, and liquid with a boiling point of 30-40 degrees is arranged in the sealed space;
be equipped with mounting panel (9) on the port of cylinder (6), be equipped with the ventilation hole on mounting panel (9), the bottom fixed mounting panel (9) of motor is on mounting panel (9), be close to and be equipped with lug (10) on the miniature fan direction on the piston, be equipped with on mounting panel (9) and be used for controlling motor pivoted switch, switch and lug (10) phase-match, be equipped with the through-hole on mounting panel (9).
8. The out-of-4-channel modulation electro-optical conversion assembly based on the optoelectronic hybrid integration according to claim 7, wherein: the shell is provided with four heat dissipation devices, and the four heat dissipation devices correspond to the channels respectively.
9. The out-of-4-channel modulation electro-optical conversion assembly based on the optoelectronic hybrid integration according to claim 8, wherein: the switches on the heat dissipation devices comprise a forward switch (11) for controlling forward transmission of the motor and a reverse switch (12) for controlling reverse rotation of the motor, the four heat dissipation devices sequentially comprise a first heat dissipation device, a second heat dissipation device, a third heat dissipation device and a fourth heat dissipation device, the forward switches (11) of the first heat dissipation device and the third heat dissipation device are shorter than the distance from the reverse switch (12) to the bump (10), and the forward switches (11) of the second heat dissipation device and the fourth heat dissipation device are longer than the distance from the reverse switch (12) to the bump (10).
10. The out-of-4-channel modulation electro-optical conversion assembly based on the optoelectronic hybrid integration according to claim 9, wherein: the fan is provided with a protective shell, and the protective shell is a hollow net (13).
CN202210772689.4A 2022-06-30 2022-06-30 4-channel external modulation electro-optical conversion assembly based on photoelectric hybrid integration Active CN115134002B (en)

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003008274A (en) * 2001-06-18 2003-01-10 Hitachi Ltd Electronic apparatus system
WO2017000130A1 (en) * 2015-06-29 2017-01-05 河北华美光电子有限公司 Packaging structure for four-channel integrated tunable array laser chip
CN109756272A (en) * 2019-01-07 2019-05-14 中国电子科技集团公司第二十九研究所 A kind of transferring radio frequency electric light Transform Sets are at component
CN109874281A (en) * 2019-03-29 2019-06-11 武汉联特科技有限公司 Communication apparatus and its optical module with radiator structure
CN210469330U (en) * 2019-10-18 2020-05-05 成都成电光信科技股份有限公司 Four-way integrated ROF radio frequency light emitting device
CN111580228A (en) * 2020-04-24 2020-08-25 武汉光迅科技股份有限公司 Multichannel light emitting device for radio frequency optical transmission and manufacturing method
CN112162370A (en) * 2020-09-25 2021-01-01 武汉锐科光纤激光技术股份有限公司 Laser transmission optical cable
CN112234429A (en) * 2020-12-10 2021-01-15 武汉乾希科技有限公司 Multichannel laser transmitter and optical communication device
CN114401614A (en) * 2021-12-24 2022-04-26 中国电子科技集团公司第三十四研究所 Comprehensive multi-service optical transmitter and receiver

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003008274A (en) * 2001-06-18 2003-01-10 Hitachi Ltd Electronic apparatus system
WO2017000130A1 (en) * 2015-06-29 2017-01-05 河北华美光电子有限公司 Packaging structure for four-channel integrated tunable array laser chip
CN109756272A (en) * 2019-01-07 2019-05-14 中国电子科技集团公司第二十九研究所 A kind of transferring radio frequency electric light Transform Sets are at component
CN109874281A (en) * 2019-03-29 2019-06-11 武汉联特科技有限公司 Communication apparatus and its optical module with radiator structure
CN210469330U (en) * 2019-10-18 2020-05-05 成都成电光信科技股份有限公司 Four-way integrated ROF radio frequency light emitting device
CN111580228A (en) * 2020-04-24 2020-08-25 武汉光迅科技股份有限公司 Multichannel light emitting device for radio frequency optical transmission and manufacturing method
CN112162370A (en) * 2020-09-25 2021-01-01 武汉锐科光纤激光技术股份有限公司 Laser transmission optical cable
CN112234429A (en) * 2020-12-10 2021-01-15 武汉乾希科技有限公司 Multichannel laser transmitter and optical communication device
CN114401614A (en) * 2021-12-24 2022-04-26 中国电子科技集团公司第三十四研究所 Comprehensive multi-service optical transmitter and receiver

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
XIAOMENG LV等: "Photoelectric Characteristics of An 18 GHz Electronic-opto Modulator", 《2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)》 *
蔡雪芳;吕晓萌;廖翱;伍艺龙;景飞;王超;张童童;许玮华;赵炳旭;龙敏慧;: "基于封装集成的四通道微波光子电/光转换组件", 光通信技术 *

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