CN115133994B - 4-channel direct modulation electro-optical conversion assembly based on photoelectric hybrid integration - Google Patents
4-channel direct modulation electro-optical conversion assembly based on photoelectric hybrid integration Download PDFInfo
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- H—ELECTRICITY
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- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/25—Arrangements specific to fibre transmission
- H04B10/2575—Radio-over-fibre, e.g. radio frequency signal modulated onto an optical carrier
- H04B10/25752—Optical arrangements for wireless networks
- H04B10/25758—Optical arrangements for wireless networks between a central unit and a single remote unit by means of an optical fibre
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Abstract
The scheme belongs to the technical field of photoelectric communication, and particularly relates to a 4-channel direct modulation electro-optical conversion component based on photoelectric hybrid integration. The device comprises a microwave unit, a laser unit, a space light path unit, a temperature control unit and a control circuit unit, wherein the microwave unit is as follows: the low-noise amplifier comprises Bias Tee, an LNA low-noise amplifier and a digital attenuator; laser unit: the device comprises a laser chip and a backlight detector chip; spatial light path unit: comprises an optical fiber, a collimating lens and a focusing lens; a temperature control unit: the laser comprises a semiconductor refrigerator TEC and an NTC thermistor, and is used for controlling the stable temperature of a laser unit; control circuit unit: the temperature controller and the laser controller are included, and the laser unit, the space light path unit, the microwave unit and the control circuit unit 4 channel are mixed and integrated in the same shell. The air-tightness packaging is realized, the channel isolation is good, the size is small, the power consumption is low, and the integration level of the system is greatly improved.
Description
Technical Field
The scheme belongs to the technical field of photoelectric communication, and particularly relates to a 4-channel direct modulation electro-optical conversion component based on photoelectric hybrid integration.
Background
In the past decades, radio frequency communication technologies have been rapidly developed, however, due to the frequency band characteristics of radio frequency signals, in an application scenario of long-distance transmission, a direct transmission method based on a low-attenuation and anti-interference radio frequency cable has high cost; optical Radio over Fiber (RoF) technology, which is a method of modulating a high-speed Radio frequency analog signal onto an optical signal to achieve high-bandwidth, low-loss and long-distance transmission of the Radio frequency signal, has been widely used due to the increasing maturity of optical Fiber technology. In an optical carrier radio frequency communication system, an electro-optical conversion module is used as a light source to provide an optical carrier signal, and the radio frequency signal is modulated on the optical carrier signal, so that the optical carrier signal is an important component in the system; the common realization method of the electro-optical conversion module is divided into a direct modulation mode with a laser as a core or an external modulation mode with a combination of the laser and a modulator; the direct modulation laser has the advantages of small volume, simple process, low cost, easy integration and the like, and is widely focused;
however, with the continuous improvement and evolution of the integration level and the functional requirement of the radio frequency communication system, more requirements of high integration level, controllable power and the like are also provided for the electro-optical conversion module, and at present, the adopted microwave component, optical signal component and control component are separated and cannot meet the requirement of miniaturization of users in a mode of radio frequency cable and optical fiber interconnection.
In chinese patent CN109361463a, a multichannel ROF system and an implementation method are disclosed, eight radio frequency signals are respectively input to eight electro-optical conversion boxes of an optical transceiver, where the optical emission boxes include a low noise amplifier, a digital control attenuator, a detector, a laser, an MCU control and LD driving circuit, and the like; however, due to the different processing technologies of optoelectronic devices such as lasers, microwave modules and PCBs, the system is built up from discrete components such as an electro-optic component, a microwave component and a control circuit component, and electrical connection and signal transmission are achieved through optical fibers, radio frequency cables, wires and the like. The system has large packaging volume and large weight, and cannot meet the requirement of high-integration product design.
Disclosure of Invention
The 4-channel direct modulation electro-optical conversion component based on photoelectric hybrid integration is provided, and the integration level of the component is improved.
In order to achieve the above purpose, the present solution provides a 4-channel direct modulation electro-optical conversion component based on photoelectric hybrid integration, which comprises a microwave unit, a laser unit, a spatial light path unit, a temperature control unit and a control circuit unit;
microwave unit: the low-noise amplifier comprises Bias Tee, an LNA low-noise amplifier and a digital attenuator;
the microwave unit is connected with the laser unit through a microstrip line and is used for amplifying and filtering an input microwave signal and providing the microwave signal for the laser unit;
Bias-Tee is connected with the LNA low-noise amplifier to realize intermediate frequency amplification;
the numerical control attenuator is used for equalizing gains of different channels in a microwave communication system with gain setting and control function requirements,
laser unit: the device comprises a laser chip and a backlight detector chip;
the laser unit is connected with the space light path unit, and directly loads the microwave signal into the optical signal to realize electro-optic conversion, and directly modulates the optical signal and then outputs the modulated optical signal;
spatial light path unit: comprises an optical fiber, a collimating lens and a focusing lens;
converting the divergent light of the LD into collimated light through a collimating lens, focusing the collimated light to a point through a focusing lens, and coupling the focused light into one end of an optical fiber through the focusing lens;
a temperature control unit: the laser comprises a semiconductor refrigerator TEC and an NTC thermistor, and is used for controlling the stable temperature of a laser unit;
control circuit unit: the temperature controller is connected with the semiconductor refrigerator and the thermistor to realize temperature control; the laser controller is connected with the laser chip and the backlight detector to realize the control of the output power of the laser;
the microwave integrated circuit also comprises a packaging shell body, wherein the microwave unit, the laser unit, the space light path unit and the control circuit unit are integrally packaged and integrated, meanwhile, the requirement of channel isolation is met between multi-channel integration, and the shielding shell body comprises a microwave input interface, an optical signal output interface, a low-frequency feed interface and a control interface.
The principle of the scheme is as follows: the control circuit unit provides driving current to enable the laser chip to generate an optical carrier signal of electro-optical conversion, and the optical carrier signal is respectively transmitted to the focusing lens and the backlight detector chip; the backlight detector chip is used for monitoring the output optical power of the laser, feeding back the monitored optical power intensity and feeding back the monitored optical power intensity to the laser chip unit.
After the laser unit receives the signal, the signal is input into the LNA through the radio frequency microstrip to amplify the signal, the amplified signal sequentially flows through the attenuator and the Bisa Tee, and the amplified signal is input into the LD chip after passing through the Bisa Tee; and then the LD chip emits light through the LD chip by the electro-optic effect, and the received electric signals are transmitted out.
The effect of this scheme: and 4, realizing the mixed integration of the laser unit, the space light path unit, the microwave unit and the control circuit unit in the same shell. The air-tightness packaging is realized, the channel isolation is good, the size is small, the power consumption is low, and the integration level of the system is greatly improved.
Further, the cavity structure in the shell is designed into four channels, each channel is independent in space, the power-on lead terminal is designed into an H-shaped structure, and the power-on lead terminal is led out from the bottom through a glass sintering process; the upper layer is welded by cover plate laser. The structure of the shell realizes space independence, and good channel isolation is ensured; the air tightness of the product is ensured.
Further, the packaging shell adopts a metalized shielding shell. The shell structure is used for shielding radio frequency interference signals generated among the outside, the components and the multichannel component channels.
Further, the laser chip is not limited to FB, DFB, and VCSEL chips. The chip selection range is wide, the application threshold of the conversion component is low, and the application range is wide.
Further, the backlight detector chip is connected with the control circuit by adopting a PIN type detector chip. The PIN chip is not limited to a conventional packaging form in application, and can be applied to complex environments such as various curved surfaces, flexible devices and the like.
Further, the NTC thermistor and the LD chip are mounted on the same substrate. The temperature of the LD chip is ensured to be within a fixed range.
Further, the temperature control unit is mounted under the laser chip. The semiconductor refrigerator receives the control signal of the control circuit unit and provides the working current of the semiconductor refrigerator to realize temperature control; the thermistor monitors the temperature value and converts the temperature value into an electrical signal to be reported to the control circuit unit.
Further, a power converter is also included. The power converter converts the voltage or the current of the electronic equipment to obtain an output power supply suitable for supplying power to different circuit modules of the electronic equipment, and the power supply to the different circuit modules of the electronic equipment is realized.
Further, the temperature control unit is used for performing stable temperature control on the laser unit, and the temperature control unit is assembled below the laser chip. The semiconductor refrigerator receives the control signal of the control circuit unit and provides the working current of the semiconductor refrigerator to realize temperature control; the thermistor monitors the temperature value and converts the temperature value into an electrical signal to be reported to the control circuit unit.
Further, an ADN8834 chip is also included. The NTC thermistor and the LD chip are attached to the same substrate, the NTC thermistor is high along with the change of temperature, and the resistance value of the thermistor is changed (the temperature is increased and the resistance is reduced) along with the change of temperature; after the resistance is changed, a signal is transmitted to an ADN8834 chip, and the ADN8834 chip controls the TEC to work through an internal algorithm and surrounding links, so that the TEC is controlled to refrigerate when the temperature is higher; the TEC is controlled to heat when the temperature is low; the working temperature of the chip is ensured to be within a fixed range.
Further, an ADN2830 chip is also included. When the LD chip works, the current change can influence the light-emitting light power, when the driving current is larger than the chip threshold current, the chip starts to emit light (both sides of the chip emit light), and at the moment, the MPD chip at the rear end of the LD can receive the light and convert the light into current; and then transmitted to the ADN2830 chip, and the ADN2830 chip calculates the voltage value output to the LD chip through an internal algorithm and a surrounding link, thereby realizing the control of power.
Drawings
Fig. 1 is a cross-sectional view of a single channel structure according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of an embodiment of the present invention.
Fig. 3 is a cross-sectional view of a four-channel structure according to an embodiment of the present invention.
Fig. 4 is a schematic diagram of a microwave unit according to an embodiment of the invention.
Fig. 5 is a schematic structural diagram of the working principle of the microwave unit according to the embodiment of the invention.
Fig. 6 is a schematic diagram of a spatial light path structure according to an embodiment of the invention.
Fig. 7 is a schematic diagram of a temperature control principle structure of a control circuit according to an embodiment of the present invention.
Fig. 8 is a schematic diagram of a power control principle structure of a control circuit according to an embodiment of the present invention.
Fig. 9 is a structural cross-sectional view of a heat dissipating device according to embodiment 2 of the present invention.
Fig. 10 is a top view showing a structure in which the disc of the case of embodiment 2 of the present invention overlaps the heat dissipation holes.
Fig. 11 is a top view showing a structure in which the disk and the heat dissipation holes are separated in embodiment 2 of the present invention.
Fig. 12 is a left side view of the structure of the case of embodiment 2 of the present invention.
Fig. 13 is an enlarged view of embodiment 2 of the present invention at a in fig. 11.
Detailed Description
The following is a further detailed description of the embodiments:
the labels in the drawings of this specification include: the laser device comprises a microwave unit 1, a laser unit 2, a laser chip 2-1, a backlight detector chip 2-2, a space light path unit 3, a temperature control unit 4, a semiconductor refrigerator 4-1, a thermistor 4-2, a control circuit unit 5, a first cylinder 6, a micro fan 7, a piston 8, a mounting plate 9, a convex block 10, a forward rotation switch 11, a reverse rotation switch 12, a hollowed-out net 13, a heat radiator 14, a shell 15, a lower side wall 16, a second cylinder 17, a heat radiating hole 18, a sliding rail 19, a disc 20 and a piston rod 21.
Example 1 is substantially as shown in fig. 1-2:
4-channel direct modulation electro-optical conversion component based on photoelectric hybrid integration; each channel comprises a microwave unit 1, a laser unit 2, a space light path unit 3, a temperature control unit 4 and a control circuit unit 5;
as shown in fig. 3:
the microwave unit 1, the laser unit 2, the space light path unit 3 and the control circuit unit 5 are integrally packaged and integrated by the packaging shell 15, meanwhile, the multi-channel integration meets the channel isolation requirement, and the shielding shell 15 comprises a microwave input interface, an optical signal output interface, a low-frequency feed interface, a control interface and the like. The package housing 15 adopts a metallized shielding housing structure for shielding radio frequency interference signals generated among the outside, the components and the multi-channel component channels.
As shown in fig. 4-5:
the microwave unit 1 comprises Bias Tee, an LNA low noise amplifier and a digital attenuator;
the microwave unit 1 is connected with the laser unit 2 through a microstrip line and is used for amplifying and filtering an input microwave signal and providing the microwave signal for the laser unit 2;
as shown in fig. 6:
the digital control attenuator is used for equalizing gains of different channels in a microwave communication system with gain setting and control function requirements, and the Bias-Tee is connected with the LNA low-noise amplifier to realize intermediate frequency amplification;
the amplifier and the attenuator in the microwave unit 1 are changed from a module level to a chip level, and are integrated into the same cavity together with the light path part; all the separation devices are integrated into a whole, so that the purposes of reducing the volume and the power consumption are achieved.
The whole microwave unit 1 works according to the following principle: after the radio frequency signal is received, the radio frequency signal is input into an LNA through a radio frequency microstrip to amplify the signal, the amplified signal flows through an attenuator (to buffer the change of impedance and improve impedance matching) to reach a Bisa Tee (the Bisa Tee consists of ultra-wideband, near-ideal and high-frequency inductance and capacitance without resonance points), and the amplified signal is input into an LD chip after passing through the Bisa Tee; then the LD emits light through the LD by the electro-optic effect, and the received electric signal is transmitted out.
The laser unit 2 is connected with the space light path unit 3, and the laser unit 2 directly loads the microwave signal into the optical signal to realize electro-optic conversion, and directly modulates the optical signal and then outputs the optical signal;
as shown in fig. 6:
the temperature control unit 4 is used for performing stable temperature control on the laser chip 2-1 unit 2, and the control circuit unit 5 is respectively connected with the temperature control unit 4 and the laser unit 2 in a modulating way.
The laser chip 2-1 unit 2 comprises a laser chip 2-1 and a backlight detector chip 2-2, the control circuit unit 5 provides driving current to enable the laser chip 2-1 to generate an optical carrier signal of electro-optical conversion, and the optical carrier signal is respectively transmitted to the focusing lens and the backlight detector chip 2-2; the backlight detector 2-2 chip can be connected with the control circuit 5 by adopting a PIN type detector chip, the backlight detector chip 2-2 is used for monitoring the output optical power of the laser and feeding back the intensity of the monitored optical power so as to form the feedback control of the laser unit 2.
Spatial light path unit 3: comprises an optical fiber, a collimating lens and a focusing lens;
the collimating lens is used for focusing and converting divergent light emitted by the LD chip into collimated light; the focus of the collimating lens is positioned on the light emitting surface of the LD chip;
a focusing lens for coupling the beam of greater free space into the optical fiber;
converting the divergent light of the LD into collimated light through a collimating lens, focusing the collimated light to a point through a focusing lens, and coupling the focused light into one end of an optical fiber through the focusing lens;
as shown in fig. 7-8:
the temperature regulating unit 4 is assembled below the laser chip 2-1, the temperature regulating unit 4 comprises a semiconductor refrigerator 4-1 with temperature control and a thermistor 4-2 with temperature monitoring, the semiconductor refrigerator 4-1 receives a control signal of the control circuit unit 5, and the working current of the semiconductor refrigerator 4-1 is provided to realize temperature control; the thermistor 4-2 monitors the temperature value and converts the temperature value into an electrical signal to be reported to the control circuit unit 5.
An ADN8834 chip is also included. The NTC thermistor and the LD chip are attached to the same substrate, the NTC thermistor is high along with the change of temperature, and the resistance value of the thermistor is changed (the temperature is increased and the resistance is reduced) along with the change of temperature; after the resistance is changed, a signal is transmitted to an ADN8834 chip, and the ADN8834 chip controls the TEC to work through an internal algorithm and surrounding links, so that the TEC is controlled to refrigerate when the temperature is higher; the TEC is controlled to heat when the temperature is low; the working temperature of the chip is ensured to be within a fixed range.
An ADN2830 chip is also included. When the LD chip works, the current change can influence the light-emitting light power, when the driving current is larger than the chip threshold current, the chip starts to emit light (both sides of the chip emit light), and at the moment, the MPD chip at the rear end of the LD can receive the light and convert the light into current; and then transmitted to the ADN2830 chip, and the ADN2830 chip calculates the voltage value output to the LD chip through an internal algorithm and a surrounding link, thereby realizing the control of power.
And the control circuit unit 5 comprises a temperature controller and a laser controller, and the temperature controller is connected with the semiconductor refrigerator 4-1 and the thermistor 4-2 to realize temperature control. The laser controller is connected with the laser chip 2-1 and the backlight detector to realize the control of the output power of the laser.
The power supply device comprises a power supply converter, wherein the power supply converter converts voltage or current of the electronic equipment to obtain an output power supply suitable for supplying power to different circuit modules of the electronic equipment, and the power supply to the different circuit modules of the electronic equipment is realized.
Example 2, as shown in fig. 9-11:
the difference between this embodiment and embodiment 1 is that the heat dissipation device further comprises a heat dissipation device, the heat dissipation device comprises a first air cylinder 6 and a micro fan 7, the micro fan 7 comprises a motor and fan blades, the fan blades are fixedly arranged on an output shaft of the motor, the first air cylinder 6 is fixedly arranged on the outer portion of a shell 15, a piston 8 is slidably arranged on the side wall of the first air cylinder 6, the piston 8 and the first air cylinder 6 form a closed space, and liquid with a boiling point of 30-40 degrees is arranged in the closed space.
The port of the first air cylinder 6 is provided with a mounting plate 9, the mounting plate 9 is provided with a vent hole, the bottom of the motor is fixed on the mounting plate 9, a lug 10 is arranged on the piston 8 in the direction close to the micro fan 7, the mounting plate 9 is provided with a switch for controlling the motor to rotate, the switch is matched with the lug 10, and the mounting plate 9 is provided with a through hole for ventilation and balancing air pressure.
The material of the side wall of the first cylinder 6 is a metal material. The metal material has good heat conduction performance, can better sense the temperature change of the shell 15, and can timely transfer the temperature on the shell 15 into the liquid in the sealed space, so that the first air cylinder 6 can transfer heat to the liquid and can also reduce the temperature of the shell 15.
Four heat dissipation devices are respectively arranged on the upper side and the lower side of the shell 15, and the four heat dissipation devices respectively correspond to each channel. The heat dissipation effect is better.
The fan is provided with a protection shell, the protection shell is a hollowed-out net 13, and the fan blades are prevented from being damaged by external impact.
The switches on the heat sink comprise a forward switch 11 for controlling forward transmission of the motor and a reverse switch 12 for controlling reverse rotation of the motor, and the forward switches 11 of the four heat sinks are shorter than the distance between the reverse switch 12 and the lug 10.
The forward rotation switch 11 on the first heat dissipation device is further used for controlling the lower side wall 16 of the housing 15 to conduct electricity, and corresponding heat dissipation holes 18 are formed in the upper side wall and the lower side wall of the housing 15.
As shown in fig. 12-13:
a second air cylinder 17 and a sliding rail 19 are further arranged between the heat dissipation devices on two sides of the shell 15, a disc 20 is fixedly connected to a piston rod 21 of the second air cylinder 17, the disc 20 is arranged in the sliding rail 19 in a sliding manner, and the disc 20 is used for opening and closing the heat dissipation holes 18; the side wall in the second cylinder 17 is slidably provided with a piston 8, the piston 8 and the second cylinder 17 form a sealed space, and liquid with the boiling point of 30-40 degrees is arranged in the sealed space.
When the 4-channel external modulation electro-optical conversion assembly is working, when the temperature of the shell 15 reaches more than 30 degrees, liquid in the first cylinder 6 is evaporated, the piston 8 moves towards the direction of the fan, the pistons 8 of the four heat dissipation devices firstly contact the forward rotation switch 11, the fans corresponding to the four heat dissipation devices start to rotate forward, air is blown against the shell 15 to blow away heat on the surface of the shell 15, the lower side wall 16 of the shell 15 is electrified, dust on the upper side wall and parts of the shell 15 automatically falls on the lower side wall 16 of the shell 15 due to gravity, and the electrified side wall adsorbs the dust to prevent the dust from accumulating on the parts inside the shell 15.
Simultaneously, the liquid in the second air cylinder 17 evaporates, the piston is pushed towards the disc 20, the disc 20 and the heat dissipation holes 18 are enabled to be in an overlapped state to be in a separated state, at the moment, the heat dissipation holes 18 are completely leaked, the fan blows in through the heat dissipation holes 18, then the heat in the shell 15 is blown out, the purpose of rapid heat dissipation is achieved, and the situation that the heat dissipation device blows the heat corresponding to the shell 15 aside to cause the temperature of the shell 15 to dissipate slowly is avoided.
If the temperature continues to rise, the pressure in the first cylinder 6 continues to rise, the piston 8 continues to move towards the direction close to the heat dissipating device, so that the pistons 8 of the four heat dissipating devices contact the reversing switch 12, the fans corresponding to the four heat dissipating devices start to rotate reversely, negative pressure is formed between the fans and the shell 15, heat on the shell 15 corresponding to the four heat dissipating devices can be absorbed, heat in the shell 15 is absorbed through the heat dissipating holes 18, and the fan wire on the heat dissipating devices rotates reversely after rotating positively, so that the purpose of heat dissipation is achieved, and the service life of the shell 15 is prolonged.
Meanwhile, the four fans are reversed, negative pressure is formed between the fans and the shell 15, and then dust in the shell 15 can be sucked out through the heat dissipation holes 18, so that dust is prevented from adhering to parts, and the power of the 4-channel external modulation electro-optical conversion assembly is influenced.
When the temperature of the shell 15 is reduced, the temperature of the liquid in the first cylinder and the second cylinder 17 is reduced, and then the piston moves towards the bottom of the cylinder, so that the convex block 10 is separated from the forward switch 11 and the reverse switch 12, the disc 20 is overlapped with the heat dissipation hole 18, and the heat dissipation hole 18 is blocked, so that dust is prevented from entering the shell 15.
Meanwhile, the reversing switches 12 of the second heat dissipating device and the fourth heat dissipating device are in contact with the protruding blocks 10, so that fans on the second heat dissipating device and the fourth heat dissipating device are reversed, negative pressure is formed between the fans on the second heat dissipating device and the fourth heat dissipating device and the shell 15, heat on the corresponding shell 15 of the second heat dissipating device and the corresponding shell 15 of the fourth heat dissipating device can be absorbed away, the purpose of rapid heat dissipation is achieved, the heat dissipation device is prevented from blowing the heat of the corresponding shell 15 aside, and the shell 15 is enabled to dissipate heat rapidly.
The foregoing is merely exemplary embodiments of the present invention, and specific structures and features that are well known in the art are not described in detail herein. It should be noted that modifications and improvements can be made by those skilled in the art without departing from the structure of the present invention, and these should also be considered as the scope of the present invention, which does not affect the effect of the implementation of the present invention and the utility of the patent. The protection scope of the present application shall be subject to the content of the claims, and the description of the specific embodiments and the like in the specification can be used for explaining the content of the claims.
Claims (9)
1. A4-channel direct modulation electro-optical conversion assembly based on photoelectric hybrid integration is characterized in that: comprises a microwave unit (1), a laser unit (2), a space light path unit (3), a temperature control unit (4) and a control circuit unit (5);
microwave unit (1): the low-noise amplifier comprises Bias Tee, an LNA low-noise amplifier and a digital attenuator;
the microwave unit (1) is connected with the laser unit (2) through a microstrip line and is used for amplifying and filtering an input microwave signal and providing the microwave signal for the laser unit (2);
Bias-Tee is connected with the LNA low-noise amplifier to realize intermediate frequency amplification;
the numerical control attenuator is used for equalizing gains of different channels in a microwave communication system with gain setting and control function requirements,
laser unit (2): comprises a laser chip (2-1) and a backlight detector chip (2-2);
the laser unit (2) is connected with the space light path unit (3), the laser unit (2) directly loads the microwave signal into the optical signal to realize electro-optic conversion, and the optical signal is directly modulated and then output;
space optical path unit (3): comprises an optical fiber, a collimating lens and a focusing lens;
the method comprises the steps of converting divergent light of an LD into collimated light through a collimating lens, focusing the collimated light to a point through a focusing lens, and coupling the focused light into one end of an optical fiber through the focusing lens;
temperature control unit (4): comprises a semiconductor refrigerator (4-1) TEC and an NTC thermistor (4-2) which are used for controlling the stable temperature of the laser unit (2);
control circuit unit (5): the temperature controller is connected with the semiconductor refrigerator (4-1) and the thermistor (4-2) to realize temperature control; the laser controller is connected with the laser chip (2-1) and the backlight detector to realize the control of the output power of the laser;
the microwave device also comprises a shell (15), wherein the microwave unit (1), the laser unit (2), the space light path unit (3) and the control circuit unit (5) are integrally packaged and integrated, meanwhile, the multi-channel integration meets the requirement of channel isolation, and the shell (15) comprises an external interface, a microwave input interface, an optical signal output interface, a low-frequency feed interface and a control interface; the cavity structure in the shell (15) is designed into four channels, each channel is independent in space, the power-on lead terminal is designed into an H-shaped structure, and the power-on lead terminal is led out from the bottom through a glass sintering process; the upper layer is welded by cover plate laser;
the heat dissipation device comprises a first air cylinder (6) and a micro fan (7), the micro fan (7) comprises a motor and fan blades, the fan blades are fixedly arranged on an output shaft of the motor, the first air cylinder (6) is fixedly arranged on the outer portion of a shell (15), a piston (8) is arranged on the side wall of the first air cylinder (6) in a sliding mode, the piston (8) and the first air cylinder (6) form a closed space, and liquid with the boiling point of 30-40 DEG is arranged in the closed space;
a mounting plate (9) is arranged on a port of the first air cylinder (6), a vent hole is formed in the mounting plate (9), the bottom of the motor is fixed on the mounting plate (9), a lug (10) is arranged on the piston (8) in the direction close to the miniature fan (7), a switch for controlling the motor to rotate is arranged on the mounting plate (9), the switch is matched with the lug (10), and a through hole is formed in the mounting plate (9) and used for ventilation and balancing air pressure;
a second air cylinder (17) and a sliding rail (19) are further arranged between the heat dissipation devices on two sides of the shell (15), a disc (20) is fixedly connected to a piston rod (21) of the second air cylinder (17), the disc (20) is slidably arranged in the sliding rail (19), and the disc (20) is used for opening and closing the heat dissipation holes (18); the side wall in the second cylinder (17) is slidably provided with a piston (8), the piston (8) and the second cylinder (17) form a sealed space, and liquid with the boiling point of 30-40 degrees is arranged in the sealed space.
2. The 4-channel direct modulation electro-optic conversion assembly based on photoelectric hybrid integration according to claim 1, wherein: the housing (15) is a metallized shielding housing.
3. The 4-channel direct modulation electro-optic conversion assembly based on photoelectric hybrid integration according to claim 1, wherein: the laser chip (2-1) is not limited to FB, DFB and VCSEL chips.
4. The 4-channel direct modulation electro-optic conversion assembly based on photoelectric hybrid integration according to claim 1, wherein: the backlight detector chip (2-2) is connected with the control circuit by adopting a PIN type detector chip.
5. The 4-channel direct modulation electro-optic conversion assembly based on photoelectric hybrid integration according to claim 1, wherein: the NTC thermistor (4-2) and the LD chip are attached to the same substrate.
6. The 4-channel direct modulation electro-optic conversion assembly based on photoelectric hybrid integration according to claim 1, wherein: the temperature control unit (4) is mounted below the laser chip (2-1).
7. The 4-channel direct modulation electro-optic conversion assembly based on photoelectric hybrid integration according to claim 1, wherein: a power converter is also included.
8. The 4-channel direct modulation electro-optic conversion assembly based on photoelectric hybrid integration according to claim 1, wherein: the temperature control unit (4) is used for performing stable temperature control on the laser unit (2), and the temperature control unit (4) is assembled below the laser chip (2-1).
9. The 4-channel direct modulation electro-optic conversion assembly based on photoelectric hybrid integration according to claim 1, wherein: an ADN8834 chip is also included.
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| CN117906586A (en) * | 2024-03-19 | 2024-04-19 | 西安中科华芯测控有限公司 | Four-channel integrated PIN-FET detector assembly and manufacturing method thereof |
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