CN104122634B - A kind of optically-coupled equipment being applied to opto-electronic device encapsulation - Google Patents
A kind of optically-coupled equipment being applied to opto-electronic device encapsulation Download PDFInfo
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- CN104122634B CN104122634B CN201410344680.9A CN201410344680A CN104122634B CN 104122634 B CN104122634 B CN 104122634B CN 201410344680 A CN201410344680 A CN 201410344680A CN 104122634 B CN104122634 B CN 104122634B
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Abstract
The present invention discloses a kind of optically-coupled equipment being applied to opto-electronic device encapsulation, comprising: shell; Refrigerator; Heat sink; Semiconductor light-emitting device chip; Focus on lens carrier; Focus on lens; Beam splitting prism; Detector chip; Optical fiber coupled output. A branch of optical signal is introduced in detector chip by installing beam splitting prism in optically-coupled part by the present invention, overcome the difficulty that cannot settle back light detector because microwave microstrip circuit is complicated or needs both-end optically-coupled, it is achieved that to the monitoring of semiconductor photoelectronic device optical signal.
Description
Technical field
The invention belongs to field of optoelectronic devices, more specifically it is a kind of optically-coupled equipment being applied to opto-electronic device encapsulation.
Background technology
The encapsulation of semiconductor photoelectronic device refers to the measures such as and sealing fixing by electrical connection, optically-coupled, temperature control, machinery, makes semiconductor photoelectronic device become the assembling process with certain function and stable performance assembly. Conduct in order to the optical signal in semiconductor photoelectronic device is introduced optical fiber, need to be encapsulated in the middle of certain specific packing forms by semiconductor photoelectronic device coupling, reach the optical signal by semiconductor photoelectronic device produces reliablely and stablely to be coupled in the middle of transmission medium and optical fiber, and the electrical signal such as direct current biasing, modulation signal is introduced the object of semiconductor photoelectronic device. In the encapsulating package of semiconductor photoelectronic device, by placing semi-conductor refrigerator and thermistor, in conjunction with external control circuit, it is ensured that semiconductor photoelectronic device is operated in steady temperature. By settling microwave microstrip circuit, it is possible to reduce the impact of encapsulation for semiconductor photoelectronic device high frequency response characteristic. Under normal circumstances, it is necessary to utilize photodetector the luminous energy transmitted in light path to be monitored, to maintain the steady-working state of system. Such as, at present for the encapsulation of semiconductor laser, it is generally settle back light detector at its chip back. Back light detector can receive the light that the chip of laser back side sends, and produces photoelectric current thus monitors the luminous situation of chip of laser. But, along with the high frequency performance of communication noise spectra of semiconductor lasers requires more and more higher, in encapsulating package, design complicated microwave microstrip circuit also become more and more complicated. For some specific situations, it is mounted with complicated microwave microstrip circuit at the chip of laser back side, does not now have unnecessary space to settle back light detector again. Again layout microwave microstrip circuit process is complicated, very big for the laser high-frequency performance impact after encapsulation. In addition, for the semiconductor photoelectronic device needing both-end to be coupled such as electroluminescent Absorption modulation device, semiconductor optical amplifier etc., settle the scheme of back light detector also infeasible.
Summary of the invention
(1) technical problem solved
In view of this, it is an object of the invention to provide a kind of optically-coupled equipment being applied to opto-electronic device encapsulation. This equipment can when not having redundant space to settle back light detector, it is achieved to the monitoring of semiconductor photoelectronic device optical signal.
(2) technical scheme
According to the optically-coupled equipment being applied to opto-electronic device encapsulation that the present invention proposes, this optically-coupled equipment comprises: shell, and this shell is can valve or stupalith;Refrigerator, this refrigerator is fixed on shell bottom surface; Heat sink, this is heat sink is ladder structure, has upper and lower two loading surfaces, and it is fixed on refrigerator; Semiconductor light-emitting device chip, this semiconductor light-emitting device chip is semiconductor laser or electroluminescent Absorption modulation device or semiconductor optical amplifier, and this semiconductor light-emitting device chip is fixed on heat sink upper loading surface; Focusing on lens carrier, this focusing lens carrier is fixed on heat sink lower loading surface, in the type of falling �� or L-type; Focusing on lens, these focusing lens are fixed on and focus on lens carrier; Beam splitting prism, this beam splitting prism is fixed on heat sink lower loading surface; Detector chip, this detector chip is fixed on heat sink lower loading surface; Optical fiber coupled output, this optical fiber coupled output is strictly directed at an exiting surface of beam splitting prism.
(3) useful effect
A kind of optically-coupled equipment being applied to opto-electronic device encapsulation of the present invention, the difficulty that cannot settle back light detector because microwave microstrip circuit is complicated or needs both-end optically-coupled can be overcome, in optically-coupled part by installing beam splitting prism by a branch of optical signal introducing detector chip, it is achieved that to the monitoring of semiconductor photoelectronic device optical signal.
Accompanying drawing explanation
For the technology contents of the present invention is described further, below in conjunction with drawings and Examples, the invention will be further described, wherein:
Fig. 1 is the overall diagram of a kind of optically-coupled equipment being applied to opto-electronic device encapsulation of the present invention.
Fig. 2 is the vertical view of a kind of optically-coupled equipment being applied to opto-electronic device encapsulation of the present invention.
Embodiment
For making the object, technical solutions and advantages of the present invention clearly understand, below in conjunction with specific embodiment, and with reference to accompanying drawing, the present invention is described in more detail.
Fig. 1 is the overall diagram of the optically-coupled equipment being applied to opto-electronic device encapsulation of the present invention. Fig. 2 is the vertical view of the optically-coupled equipment being applied to opto-electronic device encapsulation of the present invention. The implication of each Reference numeral occurred in Figure of description is as follows:
1-shell; 2-refrigerator;
3-is heat sink; 4-semiconductor light-emitting device chip;
5-focuses on lens carrier; 6-focuses on lens;
7-beam splitting prism; 8-detector chip;
9-optical fiber coupled output.
As depicted in figs. 1 and 2, the optically-coupled equipment being applied to opto-electronic device encapsulation of the present invention, comprising:
Shell 1, this shell 1 is can valve or stupalith.
Refrigerator 2, this refrigerator 2 freezes in shell 1 bottom surface, for ensureing that semiconductor photoelectronic device is operated in steady temperature.
Heat sink 3, this is heat sink 3 is ladder structure, has upper and lower two loading surfaces, goes up loading surface 301 and lower loading surface 302 as shown in Figure 1. Upper loading surface 301 exceeds certain height than lower loading surface 302, and height value should be the distance focusing on lens 6 central shaft to lower loading surface 302, to ensure that lens 6 can be in same height to semiconductor light-emitting device chip 4 with focusing on. This is heat sink 3 freezes on refrigerator 2, and what adopt is anaerobic high conductance copper or diamond or valve or aluminium nitride or beryllium oxide or silicon carbide etc. can have high heat conductance and low-expansion material. Heat sink 3 by adopting, the method for Linear cut or corrosion obtains, through polishing, after polishing, in two surface gold-plating up and down of heat sink 3 so that heat sink 3 have good electroconductibility and thermal conductivity.
Semiconductor light-emitting device chip 4, this semiconductor light-emitting device chip 4 soldering is attached on the upper loading surface 301 of heat sink 3.This semiconductor light-emitting device chip 4 can be semiconductor laser, electroluminescent Absorption modulation device, semiconductor optical amplifier etc. This semiconductor light-emitting device chip 4 to be tried one's best the vertical edge of on heat sink 3 loading surface 301, enters in semiconductor light-emitting device chip 4 with the reflection avoiding edge metal to cause and affects serviceability. The effect of the upper loading surface 301 that with soldering, semiconductor light-emitting device chip 4 is fixed on heat sink 3 is, semiconductor light-emitting device chip 4 is closely fixed with heat sink 3, and keeps heat sink 3 and the excellent electric contact of semiconductor light-emitting device chip 4 electrode and heat-conductive characteristic.
One or two focus on lens carrier 5, this focusing lens carrier 5 plays the effect of support and connection to focusing on lens 6, focus on lens carrier 5 to select and valve, nickel or stainless material can carry out Linear cut or die stamping processing, shape similar �� or L-type, the needs one of ��, its bottom surface and heat sink 3 lower loading surface 302 fixed by laser welding, the spacing of two vertical surfaces should equal focus on lens 6 external diameter; L-type support needs two, be distributed in focus on lens 6 both sides, spacing equal focus on lens 6 external diameter, its bottom surface and heat sink 3 lower loading surface 302 fixed by laser welding.
Focusing on lens 6, these focusing lens 6 are being focused on lens carrier 5 by laser welding, play the effect assembling the laser from semiconductor light-emitting device chip 4 outgoing. Center and the semiconductor light-emitting device chip 4 of these focusing lens 6 are in same level height. Focusing on lens 6 adopts aspheric surface to design, to improve coupling efficiency. The anti-reflection antireflective film of two-sided plating focusing on lens 6 is to reduce the impact of luminous reflectance.
Beam splitting prism 7, this beam splitting prism 7 is fixed on the lower loading surface 302 of heat sink 3 by metal welding or solidification glue, and is in same optical axis with focusing lens 6, semiconductor light-emitting device chip 4. The effect of this beam splitting prism 7 is that the laser after by focusing is divided into orthogonal two bundles in propagation direction, and major part light directly enters optical fiber coupled output 9 by this beam splitting prism 7, and another small portion light turns to through 90 degree and incides in detector chip 8.
Detector chip 8, this detector chip 8 soldering is attached on the lower loading surface 302 of heat sink 3. This detector chip 8 and should tiltedly should be put to reduce reflection near an exiting surface of beam splitting prism 7. Detector chip 8 should closely be fixed with heat sink 3, with the excellent electric contact that ensures between heat sink 3 and detector chip 8 electrode and heat-conductive characteristic.
Optical fiber coupled output 9, this optical fiber coupled output 9 is strictly directed at an exiting surface of beam splitting prism 7, for will directly be exported by the laser coupled of beam splitting prism 7.
It should be noted that, according to the requirement of packaging performance, in the present embodiment, shell 1 (comprising pin, light input end, electrical input etc., do not draw in the drawings) can have different designs, is not limited to shown in figure; Intense adjustment is answered in the position focusing on lens 6 and beam splitting prism 7, to ensure that coupling efficiency is maximum; Heat sink 3, semiconductor light-emitting device chip 4 should be weldingly connected with shell 1 pin by lead leg or gold silk with detector chip 8, does not draw these connections in the drawings.
So far, by reference to the accompanying drawings a kind of optically-coupled equipment being applied to opto-electronic device encapsulation of the present invention has been described in detail. Describing according to above, a kind of optically-coupled equipment being applied to opto-electronic device encapsulation of the present invention should have been had and clearly recognized by those skilled in the art.
In addition, above-mentioned various concrete structure, shape or the mode that the definition of each element and method is not limited in enforcement mode mention, it can be carried out replacing with simply knowing by the those of ordinary skill of this area.
In sum, a kind of optically-coupled equipment being applied to opto-electronic device encapsulation of the present invention, the difficulty that cannot settle back light detector because microwave microstrip circuit is complicated or needs both-end optically-coupled can be overcome, in optically-coupled part by installing beam splitting prism by a branch of optical signal introducing detector chip, it is achieved that to the monitoring of semiconductor photoelectronic device optical signal.
Claims (10)
1. one kind is applied to the optically-coupled equipment of opto-electronic device encapsulation, it is characterised in that, comprising:
Shell, this shell is can valve or stupalith;
Refrigerator, this refrigerator is fixed on shell bottom surface;
Heat sink, this is heat sink is ladder structure, has upper and lower two loading surfaces, and it is fixed on refrigerator;
Semiconductor light-emitting device chip, this semiconductor light-emitting device chip is semiconductor laser or electroluminescent Absorption modulation device or semiconductor optical amplifier, and this semiconductor light-emitting device chip is fixed on heat sink upper loading surface;
Focusing on lens carrier, this focusing lens carrier is fixed on heat sink lower loading surface, in the type of falling �� or L-type;
Focusing on lens, these focusing lens are fixed on and focus on lens carrier;
Beam splitting prism, this beam splitting prism is fixed on heat sink lower loading surface;
Detector chip, this detector chip is fixed on heat sink lower loading surface;
Optical fiber coupled output, this optical fiber coupled output is strictly directed at an exiting surface of beam splitting prism.
2. the optically-coupled equipment being applied to opto-electronic device encapsulation according to claim 1, it is characterised in that, described heat sink employing be anaerobic high conductance copper, diamond, can valve, aluminium nitride, beryllium oxide or carbofrax material.
3. a kind of optically-coupled equipment being applied to opto-electronic device encapsulation according to claim 1, it is characterised in that, described heat sink two surface rubbings up and down, polishing.
4. a kind of optically-coupled equipment being applied to opto-electronic device encapsulation according to claim 1, it is characterised in that, described heat sink two surface gold-plating up and down.
5. a kind of optically-coupled equipment being applied to opto-electronic device encapsulation according to claim 1, it is characterized in that, described semiconductor light-emitting device chip should be tried one's best near the vertical edge of heat sink upper loading surface, enters semiconductor light-emitting device chip with the reflection avoiding edge metal to cause.
6. a kind of optically-coupled equipment being applied to opto-electronic device encapsulation according to claim 1, it is characterized in that, described focusing lens carrier is selected can valve, nickel or stainless material carries out Linear cut or die stamping is processed into, shape similar �� or L-type, the focusing lens carrier two vertical surface spacing of the type of falling �� equals the external diameter focusing on lens, L-type support is distributed in the both sides focusing on lens, and spacing equals the external diameter focusing on lens.
7. the optically-coupled equipment being applied to opto-electronic device encapsulation according to claim 1, it is characterized in that, described focusing lens adopt aspheric surface design, and the anti-reflection antireflective film of two-sided plating, the center and the semiconductor light-emitting device chip that focus on lens are in same level height.
8. the optically-coupled equipment being applied to opto-electronic device encapsulation according to claim 1, it is characterised in that, described beam splitting prism is in same optical axis with focusing lens, semiconductor light-emitting device chip.
9. the optically-coupled equipment being applied to opto-electronic device encapsulation according to claim 1, it is characterised in that, described detector chip is near an exiting surface of beam splitting prism and tiltedly puts.
10. the optically-coupled equipment being applied to opto-electronic device encapsulation according to claim 1, it is characterized in that, described refrigerator freezes to be fixed on shell, described heat sink be freeze to be fixed on refrigerator, described semiconductor light-emitting device chip and detector chip be soldering be fixed on heat sink on, described focusing lens carrier be laser welding be fixed on heat sink on, described focusing lens are that laser welding is fixed on and focuses on lens carrier, described beam splitting prism be with solidify glue or metal welding be fixed on heat sink on.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410344680.9A CN104122634B (en) | 2014-07-18 | 2014-07-18 | A kind of optically-coupled equipment being applied to opto-electronic device encapsulation |
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| CN201410344680.9A CN104122634B (en) | 2014-07-18 | 2014-07-18 | A kind of optically-coupled equipment being applied to opto-electronic device encapsulation |
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| CN104122634A CN104122634A (en) | 2014-10-29 |
| CN104122634B true CN104122634B (en) | 2016-06-08 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US9806486B2 (en) * | 2015-03-19 | 2017-10-31 | Ii-Vi Incorporated | Optical amplifier module |
| CN106019496B (en) * | 2016-05-31 | 2018-05-08 | 武汉光迅科技股份有限公司 | A kind of illuminating source packaging structure and its positioning, coupling process |
| CN109756272A (en) * | 2019-01-07 | 2019-05-14 | 中国电子科技集团公司第二十九研究所 | A kind of transferring radio frequency electric light Transform Sets are at component |
| CN111999823A (en) * | 2020-08-06 | 2020-11-27 | 武汉电信器件有限公司 | Light receiving device and method for manufacturing the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6965714B2 (en) * | 2002-06-13 | 2005-11-15 | Northrop Grumman Corporation | Integrated aspheric optical coupler for RF planarized automatic photonics packaging |
| CN100369340C (en) * | 2005-09-22 | 2008-02-13 | 中国科学院半导体研究所 | Butterfly packaging device for semiconductor laser |
| DE102009036022B4 (en) * | 2009-08-04 | 2014-04-03 | Northrop Grumman Litef Gmbh | Optical transceiver and fiber optic gyro |
| CN102540364A (en) * | 2011-12-31 | 2012-07-04 | 北京航空航天大学 | Coaxial encapsulated light receiving-transmitting integrated module for optical fiber sensing |
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