CN103018856A - High-speed butterfly-packaged light emitter component with drive IC (integrated circuit) - Google Patents
High-speed butterfly-packaged light emitter component with drive IC (integrated circuit) Download PDFInfo
- Publication number
- CN103018856A CN103018856A CN2012105691789A CN201210569178A CN103018856A CN 103018856 A CN103018856 A CN 103018856A CN 2012105691789 A CN2012105691789 A CN 2012105691789A CN 201210569178 A CN201210569178 A CN 201210569178A CN 103018856 A CN103018856 A CN 103018856A
- Authority
- CN
- China
- Prior art keywords
- drive
- light
- heat sink
- high speed
- boss structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention provides a high-speed butterfly-packaged light emitter component with a drive IC (integrated circuit). The high-speed butterfly-packaged light emitter component with the drive IC comprises a butterfly metal ceramic cartridge, a boss structure and a semiconductor cooler are arranged above a bottom plate of the cartridge, the drive IC and a matching element thereof are arranged above the boss structure, a heat sink is arranged above the semiconductor cooler, a transition block, a collimating lens and an optical isolator are arranged above a second heat sink, a thermistor, an emitter chip and a backlight detector are arranged above the transition block, and a focusing lens is arranged at the center of the tail of the metal cartridge. The boss structure is directly formed on the cartridge of the miniaturized high-speed light emitter component or welded on the same in the later period and further is used as a carrier of the drive IC and matched with a network, the drive IC is integrated into the emitter component so as to effectively decrease the size of a light emission module, anti-jamming capability of the drive IC is enhanced, signal transmission distance is shortened, and loss of high-frequency signals is reduced.
Description
Technical field
Involved in the present invention is a kind of light-emitter assembly with the encapsulation of drive IC high speed butterfly, and this light-emitter assembly is mainly used in 25Gb/s and the above optical fiber telecommunications system of 25Gb/s.
Background technology
Light-emitter assembly is the core devices of modern optical fiber communication, and the above high-speed light transmitter of 25Gb/s and 25Gb/s adopts butterfly to encapsulate to improve the high frequency performance of device usually.Do not comprise drive IC and corresponding matched element in traditional butterfly encapsulation TOSA light emission component, its structure as depicted in figs. 1 and 2, mainly comprise butterfly metallic ceramics shell 1, be installed in semiconductor cooler 6 on the butterfly shell 1, be welded on the elements such as ballistic device chip 11, thermistor 9, back light detector 10 and optical isolator 13 on the transition block 8, transition block 8 is by scolder or gluing being connected on heat sink 7, heat sink 7 usefulness scolders or gluing being connected on the semiconductor cooler 6.Coupled lens 18 or collimation lens 12 is combined to form two-lens structure with condenser lens 16, and Main Function is in the compressed transmissions device chip 11 hot spot out, allows hot spot be coupled to as much as possible in the ceramic contact pin 15.On heat sink 7, condenser lens 16 is welded on the contact pin 15 by laser bonding for coupled lens 18 or collimation lens 12.In the modern optical communications field to can plug, the light-emitter assembly of low-power consumption proposed more and more higher application requirements, the volume of traditional butterfly encapsulation optical transmitting set all can not satisfy the demand that modern optical is communicated by letter with power consumption, and light-emitter assembly is just towards miniaturization, integrated, low-power consumption direction fast development.In order to reduce the power consumption of device, continue to obtain a kind ofly to have better radio-frequency performance and drive IC can be integrated in the light emission component in the butterfly device.
Summary of the invention
For problems of the prior art, technical matters to be solved by this invention provides a kind of light-emitter assembly with the encapsulation of drive IC high speed butterfly.
The invention provides a kind of light-emitter assembly with the encapsulation of drive IC high speed butterfly, comprise shell, described shell comprises high-frequency ceramic circuit and Can, the base plate top of described Can has boss structure and semiconductor cooler, described boss structure top is provided with the matched element of drive IC and drive IC, the matched element of this drive IC links to each other with drive IC, described semiconductor cooler top is provided with heat sink, described heat sink top is provided with transition block, collimation lens and optical isolator, described transition block top is provided with thermistor, emitter chip and back light detector, the pipe tail center of described Can is provided with condenser lens, the pipe tail place of described Can also is connected with welding work pieces, and this welding work pieces is connected with the ceramic optical fibre contact pin.
It is heat sink that described boss structure top is welded with aluminium nitride, and the matched element of described drive IC and drive IC is by the heat sink described boss structure top that is positioned at of this aluminium nitride.
Described Can is for can cut down Can.
Connect by spun gold or gold ribbon between the matched element of described drive IC and the drive IC, described high-frequency ceramic circuit links to each other with drive IC by spun gold or gold ribbon.
Described heat sink material is tungsten copper or nickel material.
The central optical axis of described collimation lens passes the light-emitting area center of emitter chip, and the focusing surface of collimation lens is positioned at the light-emitting area of emitter chip.
The end face of described ceramic optical fibre contact pin is positioned at the focus place of condenser lens.
Described boss structure is one-body molded or be welded on the Can base plate.
The advantage that the present invention has is:
1, the invention provides a kind of light-emitter assembly with the encapsulation of drive IC high speed butterfly, straight forming has boss structure or later stage welding boss structure on the shell of the high-speed light emitter assemblies of miniaturization, and then be used as supporting body and the matched element of drive IC, drive IC is integrated into emitter assemblies inside, effectively reduce the volume of light emission module, strengthen the drive IC antijamming capability, reduce the distance of signal transmission, reduce the loss of high-frequency signal;
2, the invention provides a kind of light-emitter assembly with the encapsulation of drive IC high speed butterfly, directly adopt the TOSA encapsulation of miniaturization, satisfy modern optical communication to the small size of emitter assemblies and the requirement of plug property;
3, the invention provides a kind of light-emitter assembly with the encapsulation of drive IC high speed butterfly, adopt the heat sink transition of aluminium nitride between drive IC and the boss structure, or drive IC directly links to each other with boss structure, aluminium nitride is heat sink and the matched coefficients of thermal expansion of the thermal expansivity of drive IC and boss structure, can make device have higher reliability, and when selecting drive IC directly to link to each other with boss structure, can obtain better heat dispersion.
4, the invention provides a kind of light-emitter assembly with drive IC high speed butterfly encapsulation, be connected by spun gold or gold ribbon between drive IC and the emitter chip, can obtain preferably high frequency performance.
Description of drawings
Fig. 1: the inner structure of the simple lens structure of high speed butterfly emitter assemblies TOSA.
Fig. 2: the two-lens structure inner structure of high speed butterfly emitter assemblies TOSA.
Fig. 3: band drive IC high speed butterfly encapsulation light-emitter assembly (TOSA) structural drawing that the present invention proposes.
Fig. 4: band drive IC high speed butterfly encapsulation light-emitter assembly (TOSA) structural drawing that the present invention proposes.
Fig. 5: the structural representation that is welded with the shell of boss structure among the present invention.
Fig. 6: the one-body molded structural representation that the shell of boss structure is arranged among the present invention.
Embodiment
The invention will be further described below in conjunction with the drawings and specific embodiments, can be implemented so that those skilled in the art can better understand the present invention also, but illustrated embodiment is not as a limitation of the invention.
In order to satisfy modern optical communication to the requirement on the volume of laser instrument emitting module, power consumption, the performance, the invention provides a kind of light-emitter assembly with the encapsulation of drive IC high speed butterfly.This light-emitter assembly adopts in tube shell bottom and generates boss structure, places drive IC and matched element at boss structure, and the method that drive IC follows the laser instrument transmitting chip to be connected by spun gold or gold ribbon has realized the encapsulating structure design of built-in drive IC; The design has realized low-power consumption, high-performance, has reduced light emission module volume texts.
The invention provides a kind of light-emitter assembly with the encapsulation of drive IC high speed butterfly, as shown in Figure 3 and Figure 4, this light-emitter assembly comprises:
Drive IC 3, this drive IC 3 can be welded direct on the boss structure 2, as shown in Figure 3, or is welded to first on the aluminium nitride heat sink 4, aluminium nitride heat sink 4 is welded on the boss structure 2, as shown in Figure 4 again.The high-frequency ceramic circuit 1-1 of shell 1 directly links to each other with drive IC 3 by spun gold or gold ribbon.
Aluminium nitride is heat sink 4, and this aluminium nitride is heat sink to be welded direct to boss structure 2 tops.
The matched element 5 of drive IC, the matched element 5 of this drive IC can be welded direct to heat sink 4 tops of aluminium nitride, as shown in Figure 4, or are welded direct to boss structure 2 tops, as shown in Figure 3.Matched element 5 usefulness spun golds or the gold ribbon of drive IC link to each other with drive IC 3.
Thermistor 9, back light detector 10 and emitter chip 11 all are arranged at transition block 8 tops; As far as possible near emitter chip 11, back light detector 10 was positioned at emitter chip 11 rears namely towards the direction of boss structure 2 when thermistor 9 was installed.
In the embodiment of the light-emitter assembly (TOSA) that this high speed butterfly encapsulates, shell 1 adopts and can cut down Can 1-2 and high-frequency ceramic circuit 1-1 and weld together by high-temperature solder, and condenser lens 16 is welded together by the tail pipe of scolder and Can 1-2.Can cut down material and have good thermal conductivity and low thermal expansivity, can guarantee the performance when the TOSA device is worked in wide temperature range; The base plate of tungsten copper structure is adopted in the bottom of Can 1-2, can be one-body molded on the base plate or adopt scolder 19 to be welded with boss structure 2, and the material of boss structure 2 is Tungsten-copper Composites.Drive IC 3 and drive IC matched element 5 are welded on the aluminium nitride heat sink 4, and aluminium nitride is heat sink 4 to have low-expansion coefficient, high heat conductance and high specific inductive capacity.Or drive IC 3 directly is welded direct on the boss structure 2.High-frequency ceramic circuit 1-1 importation directly links to each other with drive IC 3 with spun gold or gold ribbon simultaneously, and matched element 5 usefulness spun golds or the gold ribbon of drive IC link to each other with drive IC 3, can guarantee the high frequency performance that device is good.Adopt two-lens structure among the present invention, guarantee high coupling efficiency and stability of layout, then semiconductor cooler 6 is welded on Can 1-2 the inside, to guarantee during welding that the lower surface of semiconductor cooler 6 and the base plate of Can 1-2 do not have void as far as possible, to guarantee good heat conduction and the long-term reliability of device.Heat sink 7 and on parts finish in Can 1-2 external welding, specifically at first thermistor 9, emitter chip 11 and back light detector 10 are welded on the transition block 8, then transition block 8 is welded on heat sink 7, again collimation lens 12 and optical isolator 13 are fixed on heat sink 7, guarantee as far as possible in the time of fixedly that the central optical axis of collimation lens passes the light-emitting area center of emitter chip 11, the focusing surface of collimation lens 12 is positioned at the light-emitting area of emitter chip.Under high-power microscope, be welded in the Can 1 that is welded with semiconductor cooler 6 and condenser lens 16 heat sink 7 accurately, will guarantee in the welding process that the central optical axis of collimation lens overlaps with the central optical axis of condenser lens.By laser bonding welding work pieces 14 and ceramic optical fibre contact pin 15 are welded on the coupling of arriving optical fiber contact pins with the realization light path on the shell at last, welding work pieces 14 is used for adjusting the position of ceramic optical fibre contact pin 15 to realize maximum coupling efficiency.
The present invention adopt on the shell directly the welding boss or on base plate the direct shell structure of production boss, drive IC and matched element are integrated into emitter assemblies inside, not only greatly improved assembly high frequency characteristics, dwindled the volume of whole light emission module, also effectively reduce the power consumption of whole light emission module.Adopt welding or the mode such as gluing that the technique that drive IC and matched element thereof are fixed on the boss structure is very simple, cost is low, has very strong operability.This effectively integrated, in the situation that do not increase cost, greatly improved the high speed performance of ballistic device.For the encapsulation of high speed transmitter assembly provides direction.Be applicable to 25Gb/s and above high-speed light transmitter.
The above embodiment is the preferred embodiment that proves absolutely that the present invention lifts, and protection scope of the present invention is not limited to this.Being equal to that those skilled in the art do on basis of the present invention substitutes or conversion, all within protection scope of the present invention.Protection scope of the present invention is as the criterion with claims.
Claims (8)
1. light-emitter assembly with drive IC high speed butterfly encapsulation, comprise shell, described shell comprises high-frequency ceramic circuit and Can, it is characterized in that: the base plate top of described Can is provided with boss structure and semiconductor cooler, described boss structure top is provided with the matched element of drive IC and this drive IC, the matched element of this drive IC links to each other with drive IC, described semiconductor cooler top is provided with heat sink, described heat sink top is provided with transition block, collimation lens and optical isolator, described transition block top is provided with thermistor, emitter chip and back light detector, the pipe tail center of described Can is provided with condenser lens, the pipe tail place of described Can also is connected with welding work pieces, and this welding work pieces is connected with the ceramic optical fibre contact pin.
2. the light-emitter assembly with drive IC high speed butterfly encapsulation according to claim 1, it is characterized in that: it is heat sink that described boss structure top is welded with aluminium nitride, and the matched element of described drive IC and this drive IC is by the heat sink described boss structure top that is arranged at of this aluminium nitride.
3. the light-emitter assembly with drive IC high speed butterfly encapsulation according to claim 1, it is characterized in that: described Can is for can cut down Can.
4. the light-emitter assembly with drive IC high speed butterfly encapsulation according to claim 1, it is characterized in that: connect by spun gold or gold ribbon between the matched element of described drive IC and the drive IC, described high-frequency ceramic circuit links to each other with drive IC by spun gold or gold ribbon.
5. the light-emitter assembly with drive IC high speed butterfly encapsulation according to claim 1, it is characterized in that: described heat sink material is tungsten copper or nickel material.
6. the light-emitter assembly with drive IC high speed butterfly encapsulation according to claim 1, it is characterized in that: the central optical axis of described collimation lens passes the light-emitting area center of emitter chip, and the focusing surface of collimation lens is positioned at the light-emitting area of emitter chip.
7. the light-emitter assembly with drive IC high speed butterfly encapsulation according to claim 1, it is characterized in that: the end face of described ceramic optical fibre contact pin is positioned at the focus place of condenser lens.
8. the light-emitter assembly with drive IC high speed butterfly encapsulation according to claim 1 is characterized in that: described boss structure is one-body molded or be welded on the Can base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105691789A CN103018856A (en) | 2012-12-25 | 2012-12-25 | High-speed butterfly-packaged light emitter component with drive IC (integrated circuit) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105691789A CN103018856A (en) | 2012-12-25 | 2012-12-25 | High-speed butterfly-packaged light emitter component with drive IC (integrated circuit) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103018856A true CN103018856A (en) | 2013-04-03 |
Family
ID=47967658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012105691789A Pending CN103018856A (en) | 2012-12-25 | 2012-12-25 | High-speed butterfly-packaged light emitter component with drive IC (integrated circuit) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103018856A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104570236A (en) * | 2014-11-27 | 2015-04-29 | 武汉电信器件有限公司 | High-speed butterfly-shaped packaging optical emitter component |
| CN107741618A (en) * | 2017-10-31 | 2018-02-27 | 武汉电信器件有限公司 | A kind of high speed DML emitting modules |
| CN109586797A (en) * | 2018-11-16 | 2019-04-05 | 武汉电信器件有限公司 | A kind of laser emitting module and corresponding optical module |
| CN111416269A (en) * | 2020-03-30 | 2020-07-14 | 武汉光谷信息光电子创新中心有限公司 | Light emitting device |
| CN112379490A (en) * | 2020-11-16 | 2021-02-19 | 河北华美光电子有限公司 | Optical module |
| CN112946836A (en) * | 2021-02-04 | 2021-06-11 | 光彩芯辰(浙江)科技有限公司 | Light emitting assembly and assembling method thereof |
| CN113219600A (en) * | 2021-04-20 | 2021-08-06 | 武汉光迅科技股份有限公司 | Optical transmitter sub-module |
| CN114488431A (en) * | 2021-12-16 | 2022-05-13 | 中国电子科技集团公司第二十九研究所 | Miniaturized high-reliability external modulation light source packaging structure and packaging method |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1260615A (en) * | 2000-01-20 | 2000-07-19 | 南京玻璃纤维研究设计院 | Semiconductor laser capable of quickly coupling with optical fibre |
| US20030174976A1 (en) * | 2002-03-12 | 2003-09-18 | Kazuyuki Fukuda | Optical coupling apparatus |
| JP2003304024A (en) * | 2002-04-12 | 2003-10-24 | Nippon Telegr & Teleph Corp <Ntt> | Optical module with built-in drive circuit |
| CN1530681A (en) * | 2003-03-14 | 2004-09-22 | 中国科学院半导体研究所 | Parallel light transmitting module of vertical cavity transmitting laser array and producing method thereof |
| CN101017956A (en) * | 2006-02-08 | 2007-08-15 | 中国科学院微电子研究所 | Encapsulation structure and method of the high-speed semiconductor light emission component |
| CN101713850A (en) * | 2008-10-02 | 2010-05-26 | 韩国电子通信研究院 | Bidirectional optical transceiving and receiving apparatus |
| CN102129101A (en) * | 2010-11-23 | 2011-07-20 | 武汉电信器件有限公司 | High-speed butterfly-shaped encapsulating tube shell with coupling lens, light emitter assembly and manufacture process |
| CN102520491A (en) * | 2011-11-24 | 2012-06-27 | 深圳市易飞扬通信技术有限公司 | Optical emitter assembly and manufacture method thereof |
-
2012
- 2012-12-25 CN CN2012105691789A patent/CN103018856A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1260615A (en) * | 2000-01-20 | 2000-07-19 | 南京玻璃纤维研究设计院 | Semiconductor laser capable of quickly coupling with optical fibre |
| US20030174976A1 (en) * | 2002-03-12 | 2003-09-18 | Kazuyuki Fukuda | Optical coupling apparatus |
| JP2003304024A (en) * | 2002-04-12 | 2003-10-24 | Nippon Telegr & Teleph Corp <Ntt> | Optical module with built-in drive circuit |
| CN1530681A (en) * | 2003-03-14 | 2004-09-22 | 中国科学院半导体研究所 | Parallel light transmitting module of vertical cavity transmitting laser array and producing method thereof |
| CN101017956A (en) * | 2006-02-08 | 2007-08-15 | 中国科学院微电子研究所 | Encapsulation structure and method of the high-speed semiconductor light emission component |
| CN101713850A (en) * | 2008-10-02 | 2010-05-26 | 韩国电子通信研究院 | Bidirectional optical transceiving and receiving apparatus |
| CN102129101A (en) * | 2010-11-23 | 2011-07-20 | 武汉电信器件有限公司 | High-speed butterfly-shaped encapsulating tube shell with coupling lens, light emitter assembly and manufacture process |
| CN102520491A (en) * | 2011-11-24 | 2012-06-27 | 深圳市易飞扬通信技术有限公司 | Optical emitter assembly and manufacture method thereof |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104570236A (en) * | 2014-11-27 | 2015-04-29 | 武汉电信器件有限公司 | High-speed butterfly-shaped packaging optical emitter component |
| CN107741618A (en) * | 2017-10-31 | 2018-02-27 | 武汉电信器件有限公司 | A kind of high speed DML emitting modules |
| CN107741618B (en) * | 2017-10-31 | 2019-02-12 | 武汉电信器件有限公司 | A kind of high speed DML emitting module |
| WO2019085232A1 (en) * | 2017-10-31 | 2019-05-09 | 武汉电信器件有限公司 | High-speed dml emitter assembly |
| CN109586797A (en) * | 2018-11-16 | 2019-04-05 | 武汉电信器件有限公司 | A kind of laser emitting module and corresponding optical module |
| CN109586797B (en) * | 2018-11-16 | 2020-05-12 | 武汉电信器件有限公司 | Laser emitting assembly and corresponding optical module |
| CN111416269A (en) * | 2020-03-30 | 2020-07-14 | 武汉光谷信息光电子创新中心有限公司 | Light emitting device |
| CN111416269B (en) * | 2020-03-30 | 2021-09-10 | 武汉光谷信息光电子创新中心有限公司 | Light emitting device |
| CN112379490A (en) * | 2020-11-16 | 2021-02-19 | 河北华美光电子有限公司 | Optical module |
| CN112946836A (en) * | 2021-02-04 | 2021-06-11 | 光彩芯辰(浙江)科技有限公司 | Light emitting assembly and assembling method thereof |
| CN113219600A (en) * | 2021-04-20 | 2021-08-06 | 武汉光迅科技股份有限公司 | Optical transmitter sub-module |
| CN113219600B (en) * | 2021-04-20 | 2022-07-15 | 武汉光迅科技股份有限公司 | Transmitter optical subassembly |
| CN114488431A (en) * | 2021-12-16 | 2022-05-13 | 中国电子科技集团公司第二十九研究所 | Miniaturized high-reliability external modulation light source packaging structure and packaging method |
| CN114488431B (en) * | 2021-12-16 | 2023-08-18 | 中国电子科技集团公司第二十九研究所 | Miniaturized high-reliability external modulation light source packaging structure and packaging method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102129101B (en) | High-speed butterfly-shaped encapsulating tube shell with coupling lens, light emitter assembly and manufacture process | |
| CN103018856A (en) | High-speed butterfly-packaged light emitter component with drive IC (integrated circuit) | |
| CN106526763B (en) | A kind of coaxial packaging optic communication device | |
| CN101521194B (en) | High-speed photoelectric subassembly | |
| US8705906B2 (en) | Photoelectric conversion module | |
| CN201936040U (en) | Cooling coaxial package light emission tube core | |
| CN104570236B (en) | High-speed butterfly-shaped packaging optical emitter component | |
| CN100578764C (en) | Optical semiconductor device, optical connector and electronic equipment | |
| CN201004104Y (en) | Small cooling light radiation component | |
| CN102650718A (en) | Refrigeration-type coaxial packaging light-emitting tube core | |
| US20150116809A1 (en) | Optical module | |
| CN109407226B (en) | High-speed EML coaxial transmitting assembly and manufacturing method thereof | |
| CN102313937A (en) | Refrigeration coaxial light-emitting pipe core | |
| CN107340574A (en) | Multichannel parallel light receiving assembly | |
| CN110888206A (en) | Packaging structure and packaging method of silicon optical chip and laser | |
| JP2001196607A (en) | Micro-bench and method for manufacturing the same and optical semiconductor module using the same | |
| CN201707474U (en) | Coaxial light emission tube core with cooling function | |
| CN104122634B (en) | A kind of optically-coupled equipment being applied to opto-electronic device encapsulation | |
| CN207051545U (en) | A kind of multi-channel parallel light-receiving component | |
| CN203707560U (en) | Packaging structure of photoelectronic integrated chip | |
| CN213240598U (en) | Small-volume light emitting assembly and multichannel parallel optical device | |
| CN214474114U (en) | Optical module | |
| CN109494199A (en) | A kind of flange and semiconductor power device | |
| CN115360581A (en) | Coaxially packaged laser device | |
| CN208156254U (en) | Tunable receiving end shell and receiving end component based on NGPON2 technology |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130403 |