CN101017956A - Encapsulation structure and method of the high-speed semiconductor light emission component - Google Patents
Encapsulation structure and method of the high-speed semiconductor light emission component Download PDFInfo
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- CN101017956A CN101017956A CNA2006100030695A CN200610003069A CN101017956A CN 101017956 A CN101017956 A CN 101017956A CN A2006100030695 A CNA2006100030695 A CN A2006100030695A CN 200610003069 A CN200610003069 A CN 200610003069A CN 101017956 A CN101017956 A CN 101017956A
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- heat sink
- light emission
- emission component
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- encapsulating structure
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 54
- 238000005538 encapsulation Methods 0.000 title claims description 18
- 238000000034 method Methods 0.000 title claims description 6
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 230000003287 optical effect Effects 0.000 claims abstract description 27
- 230000005540 biological transmission Effects 0.000 claims abstract description 23
- 238000010168 coupling process Methods 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 230000008878 coupling Effects 0.000 claims abstract description 14
- 238000005859 coupling reaction Methods 0.000 claims abstract description 14
- 229910000833 kovar Inorganic materials 0.000 claims abstract description 14
- 239000000835 fiber Substances 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 11
- 239000010931 gold Substances 0.000 claims description 11
- 229910052737 gold Inorganic materials 0.000 claims description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 239000013307 optical fiber Substances 0.000 claims description 8
- 238000001465 metallisation Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 6
- 238000012856 packing Methods 0.000 claims description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims description 4
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims description 3
- 229910017083 AlN Inorganic materials 0.000 claims description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 3
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 230000009977 dual effect Effects 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 230000010287 polarization Effects 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 238000005245 sintering Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims 1
- 238000004891 communication Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
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- 230000003595 spectral effect Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- 230000000452 restraining effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
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- Optical Couplings Of Light Guides (AREA)
Abstract
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CNB2006100030695A CN100428591C (en) | 2006-02-08 | 2006-02-08 | Encapsulation structure and method of the high-speed semiconductor light emission component |
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CNB2006100030695A CN100428591C (en) | 2006-02-08 | 2006-02-08 | Encapsulation structure and method of the high-speed semiconductor light emission component |
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CN101017956A true CN101017956A (en) | 2007-08-15 |
CN100428591C CN100428591C (en) | 2008-10-22 |
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CNB2006100030695A Expired - Fee Related CN100428591C (en) | 2006-02-08 | 2006-02-08 | Encapsulation structure and method of the high-speed semiconductor light emission component |
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Cited By (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101483164B (en) * | 2008-01-11 | 2010-10-13 | 佛山普立华科技有限公司 | Semi-conductor encapsulation structure |
CN102129101A (en) * | 2010-11-23 | 2011-07-20 | 武汉电信器件有限公司 | High-speed butterfly-shaped encapsulating tube shell with coupling lens, light emitter assembly and manufacture process |
CN102142431A (en) * | 2009-11-20 | 2011-08-03 | 西铁城控股株式会社 | Integrated device and manufacturing method of integrated device |
CN102522620A (en) * | 2011-12-27 | 2012-06-27 | 中国航空工业第六○七研究所 | Debugging method for pre-welding strip line splitter by laser |
CN102593716A (en) * | 2011-01-13 | 2012-07-18 | 上海旌纬微电子科技有限公司 | Operating method of optical fiber semiconductor laser integrated module |
CN103018856A (en) * | 2012-12-25 | 2013-04-03 | 武汉电信器件有限公司 | High-speed butterfly-packaged light emitter component with drive IC (integrated circuit) |
CN101625730B (en) * | 2008-07-07 | 2013-06-19 | 国际商业机器公司 | Radio frequency integrated circuit packages |
CN103715599A (en) * | 2013-12-17 | 2014-04-09 | 长春理工大学 | Multi-single tube beam-combination semiconductor laser packaging shell |
CN104486001A (en) * | 2014-12-02 | 2015-04-01 | 苏州市欧博锐自动化科技有限公司 | Optical transmitter based on second-order high-pass filter circuit |
CN106770434A (en) * | 2016-11-11 | 2017-05-31 | 沈阳紫微机电设备有限公司 | Radiometer method hemispherical emissivity tester |
CN106959490A (en) * | 2017-05-17 | 2017-07-18 | 莱特巴斯光学仪器(镇江)有限公司 | A kind of device that space optical coupling is entered to optical fiber |
CN107147004A (en) * | 2017-07-06 | 2017-09-08 | 北京航空航天大学 | A kind of external cavity semiconductor laser structure |
CN107315229A (en) * | 2017-07-17 | 2017-11-03 | 中国电子科技集团公司第四十四研究所 | Integrated encapsulation structure and the technique for making integrated encapsulation structure |
CN107643570A (en) * | 2017-10-31 | 2018-01-30 | 深圳市易飞扬通信技术有限公司 | Optics of parallel encapsulation and preparation method thereof |
CN109343180A (en) * | 2018-09-11 | 2019-02-15 | 深圳市易飞扬通信技术有限公司 | Laser and silicon optical chip coupled structure and its encapsulating structure and packaging method |
CN109390648A (en) * | 2018-09-10 | 2019-02-26 | 中国电子科技集团公司第二十九研究所 | A kind of encapsulating structure and method of Multi-channel microwave-light transition components |
CN109586797A (en) * | 2018-11-16 | 2019-04-05 | 武汉电信器件有限公司 | A kind of laser emitting module and corresponding optical module |
CN110034076A (en) * | 2018-01-12 | 2019-07-19 | 中兴光电子技术有限公司 | Opto-electronic device and its encapsulating structure |
CN110612645A (en) * | 2017-05-17 | 2019-12-24 | 三菱电机株式会社 | Semiconductor package |
CN110635350A (en) * | 2019-08-02 | 2019-12-31 | 国科光芯(海宁)科技股份有限公司 | Voltage-withstanding preparation method of pluggable semiconductor laser |
CN111123430A (en) * | 2018-10-30 | 2020-05-08 | 国科光芯(海宁)科技股份有限公司 | Packaging method of phase-control optical waveguide chip |
CN111509542A (en) * | 2020-05-27 | 2020-08-07 | 大连优迅科技有限公司 | 18Ghz laser |
CN112114446A (en) * | 2020-09-30 | 2020-12-22 | 武汉光迅科技股份有限公司 | Silicon optical modulator, optical transmitting device and optical signal modulation method |
CN112213832A (en) * | 2019-07-09 | 2021-01-12 | 美商祥茂光电科技股份有限公司 | Thermoelectric cooler having top and bottom plates with asymmetric thermal conductivity and optical subassembly implementing same |
WO2021057125A1 (en) * | 2019-09-26 | 2021-04-01 | 青岛海信宽带多媒体技术有限公司 | Optical module |
CN113156592A (en) * | 2020-12-31 | 2021-07-23 | 武汉联特科技股份有限公司 | Light emitting COC assembly and light emitting device |
CN113285347A (en) * | 2021-05-18 | 2021-08-20 | 陕西澳威激光科技有限公司 | Wavelength-selective laser integrated with polarization controller and processing method thereof |
CN116722334A (en) * | 2023-07-12 | 2023-09-08 | 上海华湘计算机通讯工程有限公司 | Heat dissipation method of radio frequency attenuation module |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19823691A1 (en) * | 1998-05-27 | 1999-12-02 | Siemens Ag | Housing arrangement for laser module |
CN1207598C (en) * | 2002-08-26 | 2005-06-22 | 中国科学院半导体研究所 | Semiconductor laser butterfly packaging device |
US20050100290A1 (en) * | 2003-11-06 | 2005-05-12 | Rong Huang | Low Profile Optoelectronic Package |
-
2006
- 2006-02-08 CN CNB2006100030695A patent/CN100428591C/en not_active Expired - Fee Related
Cited By (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101483164B (en) * | 2008-01-11 | 2010-10-13 | 佛山普立华科技有限公司 | Semi-conductor encapsulation structure |
CN101625730B (en) * | 2008-07-07 | 2013-06-19 | 国际商业机器公司 | Radio frequency integrated circuit packages |
US9049806B2 (en) | 2009-11-20 | 2015-06-02 | Citizen Holdings Co., Ltd. | Integrated device and manufacturing method |
CN102142431A (en) * | 2009-11-20 | 2011-08-03 | 西铁城控股株式会社 | Integrated device and manufacturing method of integrated device |
CN102142431B (en) * | 2009-11-20 | 2015-11-25 | 西铁城控股株式会社 | The manufacture method of integrated device and integrated device |
CN102129101A (en) * | 2010-11-23 | 2011-07-20 | 武汉电信器件有限公司 | High-speed butterfly-shaped encapsulating tube shell with coupling lens, light emitter assembly and manufacture process |
CN102129101B (en) * | 2010-11-23 | 2012-10-17 | 武汉电信器件有限公司 | High-speed butterfly-shaped encapsulating tube shell with coupling lens, light emitter assembly and manufacture process |
CN102593716A (en) * | 2011-01-13 | 2012-07-18 | 上海旌纬微电子科技有限公司 | Operating method of optical fiber semiconductor laser integrated module |
CN102522620A (en) * | 2011-12-27 | 2012-06-27 | 中国航空工业第六○七研究所 | Debugging method for pre-welding strip line splitter by laser |
CN103018856A (en) * | 2012-12-25 | 2013-04-03 | 武汉电信器件有限公司 | High-speed butterfly-packaged light emitter component with drive IC (integrated circuit) |
CN103715599A (en) * | 2013-12-17 | 2014-04-09 | 长春理工大学 | Multi-single tube beam-combination semiconductor laser packaging shell |
CN104486001A (en) * | 2014-12-02 | 2015-04-01 | 苏州市欧博锐自动化科技有限公司 | Optical transmitter based on second-order high-pass filter circuit |
CN106770434A (en) * | 2016-11-11 | 2017-05-31 | 沈阳紫微机电设备有限公司 | Radiometer method hemispherical emissivity tester |
CN106959490A (en) * | 2017-05-17 | 2017-07-18 | 莱特巴斯光学仪器(镇江)有限公司 | A kind of device that space optical coupling is entered to optical fiber |
CN110612645A (en) * | 2017-05-17 | 2019-12-24 | 三菱电机株式会社 | Semiconductor package |
CN107147004A (en) * | 2017-07-06 | 2017-09-08 | 北京航空航天大学 | A kind of external cavity semiconductor laser structure |
CN107315229A (en) * | 2017-07-17 | 2017-11-03 | 中国电子科技集团公司第四十四研究所 | Integrated encapsulation structure and the technique for making integrated encapsulation structure |
CN107643570A (en) * | 2017-10-31 | 2018-01-30 | 深圳市易飞扬通信技术有限公司 | Optics of parallel encapsulation and preparation method thereof |
CN110034076A (en) * | 2018-01-12 | 2019-07-19 | 中兴光电子技术有限公司 | Opto-electronic device and its encapsulating structure |
CN109390648A (en) * | 2018-09-10 | 2019-02-26 | 中国电子科技集团公司第二十九研究所 | A kind of encapsulating structure and method of Multi-channel microwave-light transition components |
CN109390648B (en) * | 2018-09-10 | 2020-09-29 | 中国电子科技集团公司第二十九研究所 | Packaging structure and method of multichannel microwave-optical conversion assembly |
CN109343180A (en) * | 2018-09-11 | 2019-02-15 | 深圳市易飞扬通信技术有限公司 | Laser and silicon optical chip coupled structure and its encapsulating structure and packaging method |
CN111123430A (en) * | 2018-10-30 | 2020-05-08 | 国科光芯(海宁)科技股份有限公司 | Packaging method of phase-control optical waveguide chip |
CN109586797B (en) * | 2018-11-16 | 2020-05-12 | 武汉电信器件有限公司 | Laser emitting assembly and corresponding optical module |
CN109586797A (en) * | 2018-11-16 | 2019-04-05 | 武汉电信器件有限公司 | A kind of laser emitting module and corresponding optical module |
CN112213832A (en) * | 2019-07-09 | 2021-01-12 | 美商祥茂光电科技股份有限公司 | Thermoelectric cooler having top and bottom plates with asymmetric thermal conductivity and optical subassembly implementing same |
CN110635350A (en) * | 2019-08-02 | 2019-12-31 | 国科光芯(海宁)科技股份有限公司 | Voltage-withstanding preparation method of pluggable semiconductor laser |
CN110635350B (en) * | 2019-08-02 | 2020-12-01 | 国科光芯(海宁)科技股份有限公司 | Voltage-withstanding preparation method of pluggable semiconductor laser |
WO2021057125A1 (en) * | 2019-09-26 | 2021-04-01 | 青岛海信宽带多媒体技术有限公司 | Optical module |
CN111509542A (en) * | 2020-05-27 | 2020-08-07 | 大连优迅科技有限公司 | 18Ghz laser |
CN112114446A (en) * | 2020-09-30 | 2020-12-22 | 武汉光迅科技股份有限公司 | Silicon optical modulator, optical transmitting device and optical signal modulation method |
CN112114446B (en) * | 2020-09-30 | 2023-09-05 | 武汉光迅科技股份有限公司 | Silicon optical modulator, optical transmitting device and optical signal modulation method |
CN113156592A (en) * | 2020-12-31 | 2021-07-23 | 武汉联特科技股份有限公司 | Light emitting COC assembly and light emitting device |
CN113285347A (en) * | 2021-05-18 | 2021-08-20 | 陕西澳威激光科技有限公司 | Wavelength-selective laser integrated with polarization controller and processing method thereof |
CN116722334A (en) * | 2023-07-12 | 2023-09-08 | 上海华湘计算机通讯工程有限公司 | Heat dissipation method of radio frequency attenuation module |
CN116722334B (en) * | 2023-07-12 | 2024-02-23 | 上海华湘计算机通讯工程有限公司 | Heat dissipation method of radio frequency attenuation module |
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CN100428591C (en) | 2008-10-22 |
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