CN114637080B - Optical module - Google Patents

Abstract

The optical module comprises a first emission component and a second emission component, wherein the first emission component comprises a first heat sink, a first lens and a first laser component, the second emission component comprises a second heat sink, a second lens and a second laser component, the first lens and the first laser component are arranged on the first heat sink, and the second lens and the second laser component are arranged on the second heat sink; the first emission component and the second emission component respectively comprise independent first heat sink and second heat sink, the independent heat dissipation system can ensure stable heat dissipation capacity, and the normal-temperature operation of the second laser component is not influenced on the premise of ensuring the constant temperature operation of the first laser component; the first transmitting assembly and the second transmitting assembly are arranged in parallel, the structure of the built-in double transmitting assembly can realize the transmission of double-light-path signals, the space utilization rate of BOSA is improved, and CPON high integration is realized conveniently.

Description

Optical module

Technical Field

The application relates to the technical field of optical communication, in particular to an optical module.

Background

A Passive Optical Network (PON) is a system for providing network access in the last mile. Among other things, PON transceivers may employ a bi-directional optical sub-module (BOSA) to optically couple outgoing light emitted from a transmitter with a single optical fiber and to couple incoming light from the single optical fiber to a receiver. The BOSA is made by encapsulating a separate light transmitting sub-module (TOSA) package and a light receiving sub-module (ROSA) together in a metal housing. Conventional BOSAs often combine TOSA and ROSA into a single Transistor Outline (TO) package in an attempt TO reduce form factor and cost.

At present, in order TO fully utilize the advantages and technical characteristics of TO packaging, the cost is further reduced, the competitive advantage and development potential of BOSA are improved, CPON high integration is realized, and the BOSA gradually has a double-light-path structure form. To implement the BOSA dual optical path architecture, two TOSAs and two ROSAs are typically employed. However, in specific use, the two TOSAs and the two ROSAs increase the size of the optical module, which is disadvantageous for miniaturization and high integration of the optical module.

Disclosure of Invention

The application provides an optical module to solve the technical problem that current two TOSAs and two ROSAs can increase the size of the optical module.

The application provides an optical module, include:

a circuit board;

the light emitting device is electrically connected with the circuit board and is used for converting the electric signal into an optical signal;

wherein the light emitting device includes:

a tube seat, the surface of which is provided with a plurality of pins;

the first emission component is arranged on the surface of the tube seat and comprises a first heat sink, a first lens and a first laser component, wherein the first heat sink is provided with a first side surface and a second side surface, the first lens is arranged on the first side surface, and the first laser component is arranged on the second side surface;

The second emission assembly is arranged on the surface of the tube seat and comprises a second heat sink, a second lens and a second laser assembly, wherein the second heat sink is provided with a third side surface and a fourth side surface, the second lens is arranged on the third side surface, and the second laser assembly is arranged on the fourth side surface;

and the switching column is arranged on the surface of the tube seat and used for electrically connecting the first laser component and the second laser component with the upper tube pin of the tube seat respectively.

As can be seen from the above technical solution, the optical module provided by the present application includes a first emission component and a second emission component, where the first emission component includes a first heat sink, a first lens and a first laser component, and the second emission component includes a second heat sink, a second lens and a second laser component, where the first lens and the first laser component are disposed on the first heat sink, and the second lens and the second laser component are disposed on the second heat sink; the signal beam emitted by the first laser component is converged into the external optical fiber through the first lens, and the signal beam emitted by the second laser component is converged into the external optical fiber through the second lens.

The first emission component and the second emission component respectively comprise independent first heat sink and second heat sink, the independent heat dissipation system can ensure stable heat dissipation capacity, and the normal-temperature operation of the second laser component is not influenced on the premise of ensuring the constant temperature operation of the first laser component; the first transmitting assembly and the second transmitting assembly are arranged in parallel, the structure of the built-in double transmitting assembly can realize the transmission of double-light-path signals, namely, the two transmitting assemblies are integrated in one TOSA, the occupied space of the installation transmitter can be saved, the space utilization rate of the BOSA is improved, and the CPON is convenient to realize high integration.

Meanwhile, the lens is accurately positioned according to the emission light path of the laser through the first lens and the second lens which are arranged above the laser, so that the optical high-precision alignment of the lens relative to the laser is realized, the influence of the sealing and welding precision of the tube cap is avoided, the light path deviation caused by the welding deviation of the lens in the traditional tube cap and the laser in the tube seat is avoided, and the light path coupling efficiency is improved.

Drawings

In order to more clearly illustrate the technical solutions of the present application, the drawings that are needed in the embodiments will be briefly described below, and it will be obvious to those skilled in the art that other drawings can be obtained from these drawings without inventive effort.

FIG. 1 is a schematic diagram of the connection relationship of an optical communication terminal;

fig. 2 is a schematic diagram of an optical network unit structure;

fig. 3 is a schematic structural diagram of an optical module provided in an embodiment of the present application;

fig. 4 is an exploded schematic structural diagram of an optical module provided in an embodiment of the present application;

fig. 5 is a schematic view of an appearance structure of a light emitting device 500 according to an embodiment of the present application;

fig. 6 is a schematic diagram of an internal structure of a laser device according to an embodiment of the present disclosure;

Fig. 7 is an exploded schematic view of the internal structure of the laser device provided in the embodiment of the present application;

fig. 8 is a schematic diagram of a relative positional relationship structure of a dual emission device and a TEC under a viewing angle according to an embodiment of the present application;

fig. 9 is a schematic structural diagram of a relative positional relationship between a dual-emission component and a TEC under another view angle according to an embodiment of the present application;

fig. 10 is a schematic structural diagram of a first light emitting component according to an embodiment of the present disclosure;

fig. 11 is a schematic structural diagram of a first heat sink in a first light emitting component according to an embodiment of the present disclosure;

fig. 12 is a schematic structural diagram of a second light emitting component according to an embodiment of the present disclosure;

fig. 13 is a schematic structural diagram of a second heat sink in a second light emitting assembly according to an embodiment of the present disclosure;

fig. 14 is a schematic structural diagram of a TEC in a light emitting device provided in an embodiment of the present application;

fig. 15 is a schematic structural diagram of a switching post of a light emitting device according to an embodiment of the present application;

fig. 16 is one of the schematic routing diagrams of each structure of the light emitting device according to the embodiment of the present application;

FIG. 17 is a second schematic diagram of a bonding wire for each structure of a light emitting device according to an embodiment of the present disclosure;

fig. 18 is a schematic structural diagram of a light emitting device socket according to an embodiment of the present application.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

One of the key links of optical fiber communication is the mutual conversion of optical signals and electric signals. The optical fiber communication uses the optical signal carrying information to transmit in the information transmission equipment such as optical fiber/optical waveguide, and the information transmission with low cost and low loss can be realized by utilizing the passive transmission characteristic of the light in the optical fiber/optical waveguide; in order to establish an information connection between an information transmission device such as an optical fiber and an information processing device such as a computer, it is necessary to perform interconversion between an electric signal and an optical signal.

The optical module realizes the function of the mutual conversion of the optical signal and the electric signal in the technical field of optical fiber communication, and the mutual conversion of the optical signal and the electric signal is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the golden finger has become the mainstream connection mode of the optical module industry, and on the basis of the main connection mode, the definition of pins on the golden finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;

one end of the optical fiber 101 is connected with a remote server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the remote server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

The optical port of the optical module 200 is externally connected to the optical fiber 101, and bidirectional optical signal connection is established with the optical fiber 101; the electrical port of the optical module 200 is externally connected into the optical network terminal 100, and bidirectional electrical signal connection is established with the optical network terminal 100; the method comprises the steps that the mutual conversion of optical signals and electric signals is realized in an optical module, so that information connection is established between an optical fiber and an optical network terminal; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.

The optical network terminal is provided with an optical module interface 102, which is used for accessing the optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104 which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 and the network cable 103 are connected through the optical network terminal 100, specifically, the optical network terminal transmits signals from the optical module to the network cable, and transmits signals from the network cable to the optical module, and the optical network terminal is used as an upper computer of the optical module to monitor the operation of the optical module.

So far, the remote server establishes a bidirectional signal transmission channel with the local information processing equipment through the optical fiber, the optical module, the optical network terminal and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, which provides data signals for the optical module and receives data signals from the optical module, and the common optical module upper computer also includes an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 includes a circuit board 105, and a cage 106 is provided on a surface of the circuit board 105; an electrical connector is arranged in the cage 106 and is used for accessing an optical module electrical port such as a golden finger; the cage 106 is provided with a radiator 107, and the radiator 107 has a convex portion such as a fin that increases a heat radiation area.

The optical module 200 is inserted into an optical network terminal, specifically, an electrical port of the optical module is inserted into an electrical connector inside the cage 106, and the optical port of the optical module is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged inside the cage; the light module is inserted into the cage, the light module is fixed by the cage, and the heat generated by the light module is conducted to the cage 106 and then diffused through the heat sink 107 on the cage.

Fig. 3 is a schematic structural diagram of an optical module provided in an embodiment of the present application, and fig. 4 is an exploded structural diagram of the optical module. The optical module in the optical communication terminal of the foregoing embodiment will be described with reference to fig. 3 and 4; as shown in fig. 3 and 4, the optical module 200 provided in the embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking member 203, a circuit board 300, and an optical transceiver assembly 400.

The upper case 201 is covered on the lower case 202 to form a packing cavity having two openings; the outer contour of the wrapping cavity generally presents a square shape. Specifically, the lower housing 202 includes a main board and two side boards located at two sides of the main board and arranged perpendicular to the main board; the upper shell comprises a cover plate, and the cover plate covers the two side plates of the upper shell to form a wrapping cavity; the upper case may further include two sidewalls disposed at both sides of the cover plate and perpendicular to the cover plate, and the two sidewalls are combined with the two side plates to realize the covering of the upper case 201 on the lower case 202.

The two openings can be two ends openings (204, 205) in the same direction or two openings in different directions; one opening is an electric port 204, and a golden finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205, which is used for external optical fiber access to connect with the optical transceiver assembly 400 inside the optical module; the circuit board 300, the optical transceiver assembly 400, and other optoelectronic devices are located in the encapsulation cavity.

The upper shell and the lower shell are combined to be assembled, so that devices such as the circuit board 300, the optical transceiver assembly 400 and the like can be conveniently installed in the shells, and the upper shell and the lower shell form an encapsulation protection shell of the outermost layer of the module; the upper shell and the lower shell are made of metal materials, electromagnetic shielding and heat dissipation are realized, the shell of the optical module is not made into an integral part, and therefore, when devices such as a circuit board and the like are assembled, the positioning part, the heat dissipation and the electromagnetic shielding part cannot be installed, and the production automation is not facilitated.

The unlocking component 203 is located on the outer wall of the lower housing 202, and is used for realizing or releasing the fixed connection between the optical module and the host computer.

The unlocking part 203 is provided with a clamping part matched with the upper computer cage; pulling the end of the unlocking member can relatively move the unlocking member on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; the unlocking part is pulled, and the clamping part of the unlocking part moves along with the unlocking part, so that the connection relation between the clamping part and the upper computer is changed, the clamping relation between the optical module and the upper computer is relieved, and the optical module can be pulled out of the cage of the upper computer.

The circuit board 300 is provided with circuit wiring, electronic components (such as capacitor, resistor, triode, MOS tube) and chips (such as MCU, laser driving chip, limiting amplifying chip, clock data recovery CDR, power management chip, data processing chip DSP), etc.

The circuit board 300 connects the electrical devices in the optical module together according to a circuit design through circuit wiring, so as to realize electrical functions such as power supply, electrical signal transmission, grounding and the like.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear chips; when the optical transceiver component is positioned on the circuit board, the hard circuit board can provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, specifically, a metal pin/golden finger is formed on the end surface of one side of the hard circuit board and is used for being connected with the electric connector; these are all inconvenient to implement with flexible circuit boards.

A flexible circuit board is also used in part of the optical modules and is used as a supplement of the hard circuit board; the flexible circuit board is generally used in cooperation with the hard circuit board, for example, the hard circuit board and the optical transceiver assembly can be connected by using the flexible circuit board.

The optical transceiver 400 includes two parts, namely a light emitting device and a light receiving device, for respectively implementing emission of an optical signal and reception of the optical signal. The emission sub-module generally comprises a light emitter, a lens and a light detector, wherein the lens and the light detector are respectively positioned at different sides of the light emitter, the front side and the back side of the light emitter respectively emit light beams, and the lens is used for converging the light beams emitted by the front side of the light emitter, so that the light beams emitted by the light emitter are converged light so as to be conveniently coupled to an external optical fiber; the light detector is used for receiving the light beam emitted by the back surface of the light emitter so as to detect the light power of the light emitter. Specifically, light emitted by the light emitter is converged by the lens and then enters the optical fiber, and meanwhile, the light detector detects the light emitting power of the light emitter so as to ensure the constancy of the light emitting power of the light emitter. The optical transceiver module 400 is described in detail below.

The optical transceiver 400 includes two parts, namely a light emitting device 500 and a light receiving device, for respectively implementing emission of an optical signal and reception of the optical signal. The light emitting device 500 generally includes a light emitter, a lens and a light detector, wherein the lens and the light detector are respectively located at different sides of the light emitter, the front side and the back side of the light emitter respectively emit light beams, and the lens is used for converging the light beams emitted by the front side of the light emitter, so that the light beams emitted by the light emitter are converged light so as to be conveniently coupled to an external optical fiber; the light detector is used for receiving the light beam emitted by the back surface of the light emitter so as to detect the light power of the light emitter. Specifically, light emitted by the light emitter is converged by the lens and then enters the optical fiber, and meanwhile, the light detector detects the light emitting power of the light emitter so as to ensure the constancy of the light emitting power of the light emitter.

A Passive Optical Network (PON) is a system for providing network access in the last mile. Among other things, PON transceivers may employ a bi-directional optical sub-module (BOSA) to optically couple outgoing light emitted from a transmitter with a single optical fiber and to couple incoming light from the single optical fiber to a receiver. The BOSA is made by encapsulating a separate light transmitting sub-module (TOSA) package and a light receiving sub-module (ROSA) together in a metal housing. Conventional BOSAs often combine TOSA and ROSA into a single Transistor Outline (TO) package in an attempt TO reduce form factor and cost.

At present, in order TO fully utilize the advantages and technical characteristics of TO packaging, the cost is further reduced, the competitive advantage and development potential of BOSA are improved, CPON high integration is realized, and the BOSA gradually has a double-light-path structure form. To implement the BOSA dual optical path architecture, two more TOSAs and two ROSAs are typically employed. However, in a specific use, each TOSA and ROSA needs one flexible circuit board, so that at least 4 flexible circuit boards are needed for installation and use of the TOSA in order to meet two optical path structures of the TOSA, so that the difficulty in assembly of the TOSA is increased, and meanwhile, the space of the optical module is increased, which is not beneficial to miniaturization and high integration of the optical module.

Fig. 5 is a schematic view of an appearance structure of a light emitting device 500 according to an embodiment of the present application; as shown in fig. 6, the light emitting device 500 includes a stem 501 and a cap 502, the cap 502 is covered on the stem 501, and a light-transmitting window is provided on the cap 502 for transmitting light beams. The flat window glass is arranged at the light window, and the tube seat 501 and the tube cap 502 are subjected to capacitance welding to realize airtight packaging, so that the reliability requirement of the laser is met. A sealed cavity is formed between the tube seat 501 and the tube cap 502, and an optoelectronic device such as a laser is packaged in the sealed cavity.

Fig. 6 is a schematic diagram of an internal structure of a laser device provided in an embodiment of the present application, and fig. 7 is an exploded schematic diagram of an internal structure of a laser device provided in an embodiment of the present application, where, as shown in fig. 6 and 7, a surface of a stem 501 carries a first heat sink 510, a first lens 520, a first laser component, a TEC540, a second heat sink 550, a second lens 560, a second laser component, an adapter post 580, and a ceramic substrate 590. Specifically, the first heat sink 510, the first lens 520, the first laser assembly, the TEC540, the second heat sink 550, the second lens 560, the second laser assembly, the transfer post 580, and the ceramic substrate 590 are disposed within a sealed cavity formed between the stem 501 and the cap 502 and carried by the stem 501; the first heat sink 510 and the second heat sink 550 may each be a tungsten copper heat dissipation block structure; the first heat sink 510 has a bearing surface that carries the first lens 520 and the first laser assembly, respectively, and the second heat sink 550 has a bearing surface that carries the second lens 560 and the second laser assembly, respectively. The first laser assembly and the second laser assembly each include a laser chip and a chip carrier, the laser chip is soldered on the chip carrier by gold-tin solder, and the chip carrier is adhered to the sides of the first heat sink 510 and the second heat sink 550 by using silver colloid. Specifically, the first laser assembly includes a first laser chip 530 and a first carrier 516, the second laser assembly includes a second laser chip 570 and a second carrier 556, the first laser chip 530 may be an EML laser, the EML laser is an integrated device of a laser DFB and an electroabsorption modulator EA, the laser DFB converts an electrical signal into an optical signal, the electroabsorption modulator EA encodes and modulates the optical signal and outputs the optical signal, so that the output optical signal carries information; the second laser chip 570 may be a DFB laser considering cost issues. It is also within the scope of embodiments of the present application that both the first laser chip 530 and the second laser chip 570 are EML lasers. The positive and negative electrodes of the first and second laser chips 530 and 570 need to be electrically connected to the corresponding pins through gold wires to achieve separate electrical connection of the positive and negative electrodes to the outside. As can be seen from the foregoing, the light emitting device in the present application has two sets of heat sinks, lenses and lasers, for convenience of description, the two sets of heat sinks, lenses and lasers may be described as built-in dual emission components, where the first emission component includes a first heat sink 510, a first lens 520, and a first laser chip 530, the second emission component includes a second heat sink 550, a second lens 560, and a second laser chip 570, the first emission component and the second emission component are disposed in parallel, and the first emission component and the second emission component are both disposed on the surface of the tube socket, where the first emission component is indirectly disposed on the surface of the tube socket through the TEC, and the second emission component is directly disposed on the surface of the tube socket. Meanwhile, the structure with the built-in double-emission components can realize the emission of double-light-path signals, namely, two emission components are integrated in one TOSA, so that the number of flexible circuit boards used for installing the emitters is reduced, and the problem that the assembly difficulty is increased due to the fact that the number of flexible circuit boards is more in the BOSA module multi-light-path structural form is solved in the prior art. Meanwhile, the space occupied by the installation emitter is saved, the space utilization rate of the BOSA is improved, and CPON high integration is realized conveniently.

The first emission component and the second emission component respectively comprise independent first heat sink and second heat sink, the independent heat dissipation system can ensure stable heat dissipation capacity, and the second laser can not be influenced to work at normal temperature under the premise of ensuring the constant temperature of the first laser.

The central axis of the first lens 520 coincides with the central axis of the first laser chip 530, and the first lens 520 is configured to converge the signal beam emitted by the first laser chip 530, for example, directly converge the signal beam emitted by the first laser chip 530, and the converged beam is coupled into the external optical fiber through the optical window of the cap 502; the central axis of the second lens 560 coincides with the central axis of the second laser chip 570, and the second lens 560 is used to converge the signal beam emitted by the second laser chip 570, for example, directly converge the signal beam emitted by the second laser chip 570, and the converged beam is coupled into the external optical fiber through the optical window of the cap 502. In a conventional coaxial TO package, a lens is typically integrated into the TO cap, and the emitted light from the laser is converted TO converging light by the lens on the TO cap, coupling the laser into an optical fiber or other optical device. However, in the coaxial TO packaging mode, when the TO pipe cap is welded on the TO pipe seat, the accuracy of the sealing and welding machine can only be 30-50 um generally, and the lens in the TO pipe cap and the laser in the TO pipe seat deviate after being welded, so that the coaxiality of the lens and the laser cannot be ensured, and the coupling efficiency of an optical path can be influenced.

This application sets up in the top of laser instrument through built-in first lens 520 and second lens 560, can carry out the accurate positioning TO the lens according TO the transmission light path of laser instrument, realizes the optics high accuracy alignment of lens relative laser instrument, and can not receive the influence of TO tube cap seal welding precision, avoids the light path skew that the lens in traditional TO tube cap caused with the laser instrument welding skew in the TO tube socket, has improved light path coupling efficiency.

In order TO ensure that the laser is hermetically packaged, a planar glass is arranged at an optical window of the TO tube cap 502, and the planar glass and the optical window of the TO tube cap 502 are fixed through glass solder, so that the airtight packaging of the TO tube cap 502 and the TO tube cap 501 is realized. The planar glass does not have a converging effect on the signal beam, that is, the light beams emitted from the first lens 520 and the second lens 560 directly penetrate the planar glass and do not have a converging effect on the light beams.

And in this example, the first lens 520 and the second lens 560 are placed on the TO tube seat 501, so that the distance between the first lens 520 and the second lens 560 and the corresponding lasers is reduced, and optical parameters such as focal lengths of the first lens 520 and the second lens 560 can be reduced. Since the laser spot size increases linearly with the focal length of the lens, the laser spot passing through the first lens 520 and the second lens 560 is reduced as the focal length of the first lens 520 and the second lens 560 is reduced, and the energy is more concentrated, thereby improving the laser coupling efficiency.

Specifically, when the first lens 520 and the second lens 560 are fixed on the corresponding heat sinks, the positions of the first lens 520 and the second lens 560 need to be determined, and the positions of the first lens 520 and the second lens 560 may be determined by optical parameters of the lenses, such as focal length and positions of the first laser chip 530 and the second laser chip 570, respectively, for example, the distance between the lenses and the light emitting surfaces of the corresponding lasers may be the focal length of the lenses, and the positions of the corresponding lenses may be determined according to the focal length of the lenses and the positions of the corresponding lasers, so that the lenses are fixed above the corresponding lasers.

When the first lens 520 and the second lens 560 are fixed, the lenses can be fixed on the corresponding heat sinks in a passive mode, namely by using a high-precision chip mounter, and the relative positions of the lenses and the corresponding lasers can be aligned in an active coupling mode, so that the optical high-precision alignment of the lenses relative to the corresponding lasers is realized.

Glue is used for fixing between the first lens 520 and the first heat sink 510 and between the second lens 560 and the second heat sink 550, and the central axes of the first lens 520 and the second lens 560 are respectively coincident with the central axes of the first laser chip 530 and the second laser chip 570, so that all signal beams emitted by the first laser chip 530 and the second laser chip 570 enter the first lens 520 and the second lens 560. In this example, the glue includes, but is not limited to, silver glue, UV glue, epoxy glue, UV epoxy glue, and the like.

The first lens 520 and the second lens 560 may be point-to-point converging lenses, and the first laser chip 530 and the second laser chip 570 emit a signal beam in a direction consistent with the light transmission direction of the cap 502, for example, the signal beam with a main optical axis perpendicular to the tube holder 501, and the signal beam is converted into converging light by the point-to-point converging lens, and the converging light is coupled into an external optical fiber through a flat window, so as to achieve the purpose of coupling laser light into the optical fiber.

The first lens 520 and the second lens 560 may be collimating lenses, and the first laser chip 530 and the second laser chip 570 emit signal beams with the same light transmission direction as the cap 502, for example, the signal beams with the main optical axis perpendicular to the tube holder 501 are converted into collimated beams by the collimating lenses, and the collimated beams are emitted through the flat window. A corresponding converging lens may be provided between the cap 502 and the external optical fiber, through which the collimated beam is converted into a converging beam and coupled into the external optical fiber, for the purpose of coupling the laser light into the optical fiber.

In this example, the materials of the first lens 520 and the second lens 560 are mainly glass, silicon, plastic PEI (Polyetherimide), or the like.

Fig. 8 and fig. 9 are schematic partial structures of the light emitting device provided in the embodiments of the present application, specifically, fig. 8 is a schematic structural diagram of a relative positional relationship between the dual-emission component provided in the embodiments of the present application and the TEC under a viewing angle, and fig. 9 is a schematic structural diagram of a relative positional relationship between the dual-emission component provided in the embodiments of the present application and the TEC under another viewing angle, as can be clearly shown in fig. 8 and fig. 9, where the first heat sink 510 is disposed on a heat exchange surface of the TEC540, the second heat sink 550 is disposed on a side surface of the TEC540, the first heat sink 510 is in direct contact with a heat exchange surface of the TEC540, a certain distance is provided between the second heat sink 550 and the side surface of the TEC540, and heat of the first heat sink 510 and the second heat sink 550 is dissipated through the TEC 540.

Fig. 10 is a schematic structural diagram of a first light emitting component provided in an embodiment of the present application, and fig. 11 is a schematic structural diagram of a first heat sink in the first light emitting component provided in an embodiment of the present application. As can be seen from fig. 11, the first heat sink 510 in the present application includes a first step surface 511, a second step surface 512, a third step surface 513, a first side surface 514 located between the first step surface 511 and the second step surface 512, and a second side surface 515 located between the second step surface 512 and the third step surface 513, the first step surface 511, the second step surface 512, and the third step surface 513 are arranged in a step shape, and the height of the first step surface 511 is greater than the height of the second step surface 512 and the third step surface 513, and the height of the second step surface 512 is greater than the height of the third step surface 513. The first step surface 511, the second step surface 512 and the third step surface 513 are parallel to the upper surface of the TEC 540. As shown in fig. 10, the first side 514 is used for carrying the first lens 520, the first lens 520 is adhered to the first side 514 by glue, the second side 515 is used for carrying the first laser chip 530, specifically, the first carrier 516 has a certain thickness, it is adhered to the second side 515 by glue, and the first laser chip 530 is adhered to the carrying surface of the first carrier 516 by glue. The glue may be UV glue, epoxy glue, etc., which has a certain fluidity, and after the first lens 520 is adhered by the glue, the flowing glue overflows, and the first carrier 516 with a certain thickness can carry a certain amount of overflowed glue, so as to avoid polluting the optical path.

Fig. 12 is a schematic structural diagram of a second light emitting assembly according to an embodiment of the present application, and fig. 13 is a schematic structural diagram of a second heat sink in the second light emitting assembly according to an embodiment of the present application. As can be seen from fig. 13, the second heat sink 550 in the present application includes a fourth step surface 551, a fifth step surface 552, a sixth step surface 553, a third side surface 554 located between the fourth step surface 551 and the fifth step surface 552, and a fourth side surface 555 located between the fifth step surface 552 and the sixth step surface 553, where the fourth step surface 551, the fifth step surface 552, and the sixth step surface 553 are arranged in a step shape, and the height of the fourth step surface 551 is greater than the height of the fifth step surface 552, and the height of the fifth step surface 552 is greater than the height of the sixth step surface 553. As shown in fig. 12, the third side 554 is configured to carry the second lens 560, the second lens 560 is adhered to the third side 554 by glue, the fourth side 555 is configured to carry the second laser chip 570, and specifically, a second carrier plate 556 is disposed between the second laser chip 570 and the fourth side 555, and is adhered to the fourth side 555 by glue, and the second laser chip 570 is adhered to the carrying surface of the second carrier plate 556 by glue. The glue may be UV glue, epoxy glue, etc. Further, the second heat sink in the present application includes, in addition to the structures including the fourth step surface 551, the fifth step surface 552, the sixth step surface 553, the third side surface 554 and the fourth side surface 555, a groove between the third side surface 554 and the fifth step surface 552, where the groove connects the third side surface 554 and the fifth step surface 552, and the groove is configured to carry glue overflowed for adhering the second lens 560, so as to avoid polluting the optical path.

It should be noted that, in the embodiment of the present application, the first heat sink 510 does not have a groove for carrying overflowing glue, and the second heat sink 550 has a groove for carrying overflowing glue, which is considered that the thickness of the first carrier plate in the first heat sink 510 is greater than the thickness of the second carrier plate in the second heat sink 550, and the first carrier plate in the first heat sink 510 may carry a certain amount of overflowing glue, and the second heat sink 550 carries a certain amount of overflowing glue through the groove. Of course, in order to better carry the glue to avoid the light path pollution, the first heat sink 510 may be provided with a groove, so it is within the scope of the embodiments of the present application that whether the first heat sink 510 is provided with a groove carrying the overflow glue and whether the second heat sink 550 is provided with a groove carrying the overflow glue. In some embodiments, both the first heat sink 510 and the second heat sink 550 may be recessed, in some embodiments, both the first heat sink 510 and the second heat sink 550 may not be recessed, in some embodiments, the first heat sink 510 may be recessed, and the second heat sink 550 may not be recessed.

Fig. 14 is a schematic structural diagram of a TEC in a light emitting device provided in an embodiment of the present application. On the one hand, the light emitting device is easy to generate heat when emitting light signals, and the heat generated in the process of emitting the light signals can be absorbed and led out through the TEC (Thermoelectric Cooler ). On the other hand, in some embodiments, when the first laser chip 530 is an EML laser and the second laser chip 570 is a DFB laser, since the center wavelength, the output power, and the like of the EML laser are affected by the operating temperature, the temperature of the EML laser needs to be controlled to be higher than that of the DFB laser in order to keep the center wavelength and the output power of the EML laser stable, so that the temperature of the EML laser is higher than that of the DFB laser, the lower surface of the first laser chip 530 is directly disposed on the upper surface of the TEC, and the upper surface of the TEC is a heat exchange surface; and simultaneously, a thermistor 517 is arranged on the accessory of the first laser chip 530, when the temperature of the first laser chip 530 changes, the thermistor 517 can feed back the temperature change to the TEC driver, and the TEC driver is used for controlling the TEC540 to perform refrigeration or heating, so that the temperature of the first laser chip 530 is kept constant, and the microcosmic accurate temperature control of the first laser chip 530 is realized. The specific process is as follows: acquiring a current resistance value of the thermistor 517, acquiring a thermistor temperature corresponding to the current resistance value according to a prestored temperature-resistance value mapping relation of the thermistor, comparing the thermistor temperature with a preset target temperature, and sending a signal to a TEC driver when the thermistor temperature is higher than the target temperature to enable the TEC540 to refrigerate, so that the temperature of the first laser chip 530 is reduced; when the temperature of the thermistor is lower than the target temperature, a signal is sent to the TEC driver to heat the TEC540, so that the temperature of the first laser chip 530 is increased, and the stability of the low temperature of the first laser chip 530 is ensured.

It should be noted that, when the second laser chip 570 is a DFB laser in the present application, since the DFB laser has low requirement on temperature control, no corresponding thermistor is disposed near the second laser chip 570 in the implementation of the present application, and the disposition of the corresponding thermistor near the second laser chip 570 is also within the protection scope of the embodiments of the present application.

In the embodiment of the present application, when the obtained sampling temperature of the thermistor 517 is higher than the target temperature, a temperature adjustment signal represented by a positive level is generated to make the TEC540 absorb heat; when the resulting sample temperature of thermistor 517 is below the target temperature, a negative level-identified temperature adjustment signal is generated that causes TEC540 to emit heat; when the resulting sample temperature of thermistor 517 is equal to the target temperature, a temperature adjustment signal identified at zero level is generated that maintains the TEC in the current state. The TEC driver converts the temperature regulation signals into voltage signals for controlling the current flow direction. When the temperature regulation signal is represented by a positive level, TEC540 outputs a forward bias voltage signal with current flow direction being forward; when the temperature regulation signal is represented at a negative level, TEC540 outputs a reverse bias voltage signal with current flow in the negative direction. When the temperature adjustment signal is zero level, TEC540 outputs a regulated voltage signal that maintains the current flow.

When the received voltage signal is a forward bias voltage signal, the current flow direction of the TEC540 is forward, and the first laser chip 530 and the thermistor 517 are refrigerated, so that the temperatures of the first laser chip 530 and the thermistor 517 are reduced; when the received voltage signal is reverse bias voltage, the current flow direction of the TEC540 is reverse, heating is performed on the first laser chip 530 and the thermistor 517, and the temperatures of the first laser chip 530 and the thermistor 517 are increased; when the received voltage signal is a steady voltage signal, TEC540 maintains the current flow.

In this embodiment of the present application, as shown in fig. 14, the TEC in this application includes an upper substrate and an electrode column, where the surface of the upper substrate has a heat conduction area and an heat insulation area, the surface of the heat insulation area is provided with a TEC anode 541 and a TEC cathode 542, and the TEC anode 541 and the TEC cathode 542 are electrically connected with the upper end of the electrode column, where the TEC electrode originally set in a manner of adding a wire bonding stand column is adjusted to be set on the surface of the upper substrate of the TEC, on one hand, no wire bonding stand column is required to be added, and on the other hand, the size of the TEC is not required to be additionally increased; on the other hand, the TEC electrode is arranged on the surface of the upper substrate, so that gold wire bonding is easier to carry out, and the TEC electrode is especially aimed at an optical module with a deep cavity structure.

Because TEC gold wire bonding requires higher, traditional mode is for increasing the stand that bonds, sets up the anodal and the negative pole of TEC on extra substrate, but this kind of mode must select and can increase the size of TEC, will originally set up the anodal and the negative pole of TEC on extra substrate and set up in the upper surface of TEC540 in this application, can reduce TEC volume, increase TEC integrality to gold wire bonding carries out more easily, especially to the optical module of dark chamber structure.

Meanwhile, the TEC anode and the TEC cathode are arranged in the heat insulation area, so that heat conduction from the substrate on the TEC to the tube seat or heat conduction from the substrate to the circuit board electrode can be avoided. Therefore, the optical module provided by the embodiment of the application can reduce the TEC size so as to increase the TEC integration, and is easier to bond in gold wire.

Fig. 15 is a schematic structural diagram of a switching post of a light emitting device according to an embodiment of the present application. In this application, the transfer posts 580 and the ceramic substrate 590 are provided for electrical connection. The structure of the transfer post may refer to fig. 15, and the structure of the ceramic substrate 590 may refer to fig. 7. The transfer column 580 is made of metal, and the whole structure of the transfer column 580 is a conductor; the ceramic substrate 590 is made of ceramic material. As shown in fig. 15, the transfer post 580 includes a first metal layer 581, a second metal layer 582, and a third metal layer 583. The first metal layer 581 is used to electrically connect the first laser chip 530 to a corresponding pin on the socket 501, the second metal layer 582 is used to electrically connect the second laser chip 570 to a corresponding pin on the socket 501, and the third metal layer 583 is used to electrically connect the thermistor 517 to a corresponding pin on the socket 501.

The first metal layer 581 includes a first metal region 5811, a second metal region 5812 and a third metal region 5813, both ends of the first metal region 581 are connected to the second metal region 5812 and the third metal region 5813, the second metal region 5812, the first metal region 5811 and the third metal region 5813 are sequentially connected to form the first metal layer 581, and the second metal region 5812, the first metal region 5811 and the third metal region 5813 are directly communicated with each other; the first metal region 5811, the second metal region 5812 and the third metal region 5813 are located on different planes of the via 580, that is, the first metal region 5811, the second metal region 5812 and the third metal region 5813 are located in different dimensions of the via 580, which increases flexibility and selectivity of device routing.

The second metal layer 582 includes a fourth metal region 5821, a fifth metal region 5822 and a sixth metal region 5823, two ends of the fourth metal region 5821 are connected to the fifth metal region 5822 and the sixth metal region 5823, the fifth metal region 5822, the fourth metal region 5821 and the sixth metal region 5823 are sequentially connected to form a second metal layer 582, and the third metal region 5822, the fourth metal region 5821 and the sixth metal region 5823 are directly communicated with each other; the fourth metal region 5821, the fifth metal region 5822 and the sixth metal region 5823 are located on different planes of the via 580, that is, the fourth metal region 5821, the fifth metal region 5822 and the sixth metal region 5823 are located in different dimensions of the via 580, which increases flexibility and selectivity of routing devices.

The third metal layer 583 may be formed by laying a metal layer on top of the via post 580.

The switching post 580 in this application embodiment can realize the switching of routing of first laser instrument, second laser instrument and thermistor simultaneously, with first metal layer 581 and the folding setting of second metal layer 582, set up third metal layer 583 at the top surface, obtain three-dimensional structure's switching post, can save space like this, need not to occupy great space, has higher integration, and can increase flexibility and the selectivity of each device routing simultaneously.

The first, second, third, fourth, fifth, and seventh metal regions 5811, 5812, 5813, the fourth, fifth, and sixth metal regions 5821, 5822, 5823, and the third metal layer 583 may be a first, second, third, fourth, fifth, sixth, and seventh blanket layer, respectively, the surfaces of which are etched with functional circuitry; and the first, second and third metal regions 5811, 5812 and 5813, the fourth, fifth and sixth metal regions 5821, 5822 and 5823, and the third and fourth metal layers 583 and 580 each have an insulating layer therebetween, and the regions of the first, second and third metal regions 5811, 5812 and 5813, in which the fourth, fifth and sixth metal regions 5821, 5822 and 5823 are in contact with the transition post 580 may have first, second, third, fourth, fifth, sixth and seventh insulating layers, respectively, and the first, second, third, fourth, fifth, sixth and seventh insulating layers may be ceramic regions applied to the corresponding metal regions for insulation.

The transfer column 580 in this application specifically can be three-dimensional transfer column, because the height and the degree of depth of first heat sink and second heat sink at the tube socket surface are all different, the transfer column 580 can realize the routing connection of the optoelectronic device of unnecessary direction and dimension, and the setting of transfer column 580 can realize that routing length is shorter and do not cross each other between the routing.

Referring to fig. 7 specifically, as shown in fig. 7, the surface of the tube holder 501 is provided with a first laser pin 5011, a second laser pin 5012, a thermistor pin 5013, a TEC positive electrode pin 5014, and a TEC negative electrode pin 5015, the positive electrode of the first laser chip 530 is connected to the first laser pin 5011 through a transfer wire of the first metal layer 581, the positive electrode of the second laser chip 570 is connected to the second laser pin 5012 through a transfer wire of the second metal layer 582, the thermistor 517 is connected to the thermistor pin 5013 through a transfer wire of the third metal layer 583, and the TEC positive electrode 541 and the TEC negative electrode 542 are directly connected to the TEC positive electrode pin 5014 and the TEC negative electrode pin 5015. In fig. 7, the surface of the tube seat 501 is also shown to be provided with a support post 5016, and the support post 5016 and the tube seat 501 are integrally formed, so that on one hand, the support post 5016 can support the ceramic substrate 590, and the stability of the ceramic substrate 590 is improved; on the other hand, the support post 5016 is integrally formed with the stem 501, so that the support post 5016 can also realize the grounding connection of the optoelectronic device.

Fig. 16 is one of the schematic routing diagrams of each structure of the light emitting device according to the embodiment of the present application; FIG. 17 is a second schematic diagram of a bonding wire for each structure of a light emitting device according to an embodiment of the present disclosure; FIG. 16 is a front view of the structures from the perspective of FIG. 6, and FIG. 17 is a top view of the structures from the perspective of FIG. 6; the implementation of the wire bonding connection between the devices is described in detail below in conjunction with fig. 16 and 17. In order to reduce the wire bonding difficulty and shorten the wire bonding length, in the embodiment of the present application, the surface of the first carrier 516 is provided with a first bonding pad 5161, the surface of the second carrier 556 is provided with a second bonding pad 5561, and wire bonding connections are made between the first metal region 5811, the second metal region 5812 and the third metal region 5813, the fourth metal region 5821, the fifth metal region 5822 and the sixth metal region 5823, and the third metal layer 583, and the first bonding pad 5161, and the second bonding pad 5561. The wire bonding method will be specifically described below with reference to the first, second, and third metal regions 5811, 5812, 5813, the fourth, fifth, and sixth metal regions 5821, 5822, 5823, and the third metal layer 583, and the first and second pads 5161, 5561.

It should be noted that, the routing method in the present application is based on the existing routing process, and a specific routing method is selected comprehensively under the requirements that the routing difficulty is not too high, the routing length is short and the routing is not crossed.

In some embodiments, the positive electrode of the first laser chip 530 is first connected to the first pad 5161 by wire bonding, is connected to the first metal region 5811 of the interposer pillar 580 by wire bonding through the first pad 5161, and is connected to the first laser pin 5011 by wire bonding through the second metal region 5812; the positive electrode of the second laser chip 570 is connected to the second bonding pad 5561 by wire bonding, the second bonding pad 5561 is connected to the fourth metal region 5821 of the transfer post 580 by wire bonding, and the fifth metal region 5822 is connected to the second laser pin 5012 by wire bonding; the thermistor 517 is connected to the third metal layer 583 by wire bonding, and the third metal layer 583 is connected to the thermistor pin 5013 by wire bonding; TEC anode 541 and TEC cathode 542 may be directly wire-bonded to TEC anode pin 5014 and TEC cathode pin 5015.

In some embodiments, based on the fact that the second laser assembly is located closer to the plane of the first metal region of the interposer pillar than the first laser assembly, i.e., the depths of the first laser assembly and the second laser assembly are different at the surface of the stem, the second laser assembly is located further forward than the first laser assembly, in order to shorten the routing distance, the positive electrode of the first laser chip 530 is first connected to the first bonding pad 5161 by routing, the third metal region 5813 connected to the interposer pillar 580 by the first bonding pad 5161 by routing, and the second metal region 5812 is connected to the first laser pin 5011 by routing; the positive electrode of the second laser chip 570 is connected to the second bonding pad 5561 by wire bonding, the second bonding pad 5561 is connected to the fourth metal region 5821 of the transfer post 580 by wire bonding, and the fifth metal region 5822 is connected to the second laser pin 5012 by wire bonding; the thermistor 517 is connected to the third metal layer 583 by wire bonding, and the third metal layer 583 is connected to the thermistor pin 5013 by wire bonding; TEC anode 541 and TEC cathode 542 may be directly wire-bonded to TEC anode pin 5014 and TEC cathode pin 5015.

In this application thermistor 517 and first laser chip 530 share first carrier plate 516, thermistor 517 is through routing to transfer post 580 earlier to guarantee that transfer post 580 is connected to thermistor pin 5013 through welding or the mode of routing, avoid thermistor 517 temperature direct connection radiating surface, cause the temperature of thermistor 517 because the heat dissipation reason causes self temperature to be slightly less than actual temperature's condition, can guarantee the accuracy of thermistor monitoring temperature.

The foregoing enables electrical connection of each device to a corresponding pin, as described below with respect to ground connection of each device.

The surface of the first carrier plate 516 has a first ground pad 5162 and a second ground pad 5163, the surface of the second carrier plate 556 has a third ground pad 5562, the surface of the ceramic substrate 590 has a fourth ground pad 591 and a fifth ground pad 592, the fourth ground pad 591 and the fifth ground pad 592 are respectively used for grounding connection of the optoelectronic devices on the first carrier plate 516 and the second carrier plate 556, specifically, the first laser chip 530 is wire-bonded to the first ground pad 5162, the first ground pad is wire-bonded to the fourth ground pad 591, the surface of the fourth ground pad 591 has a first perforation, the fourth ground pad 591 is wire-bonded to the support post 5016 through the first perforation, the support post 5016 is integrally molded with the stem 501, and thus the first laser chip 530 is wire-bonded to the support post 5016, the grounding connection of the first laser chip 530 can be achieved; the thermistor 517 is wire-bonded to the second ground pad 5163, the second ground pad 5163 is wire-bonded to the fifth ground pad 592, the surface of the fifth ground pad 592 has a second through hole, the fifth ground pad 592 is connected to the support post 5016 through the second through hole by wire bonding, and the support post 5016 is integrally formed with the stem 501, so that the connection of the thermistor 517 to the support post 5016 by wire bonding can realize the ground connection of the thermistor 517; the second laser chip 570 is wire-bonded to the third ground pad 5562, the third ground pad 5562 is wire-bonded to the fifth ground pad 592, the surface of the fifth ground pad 592 has a second through hole, the fifth ground pad 592 is connected to the support post 5016 through the second through hole by wire bonding, and the support post 5016 is integrally formed with the stem 501 as mentioned above, so that the second laser chip 570 is wire-bonded to the support post 5016, and the ground connection of the second laser chip 570 can be achieved.

Fig. 18 is a schematic structural diagram of a light emitting device socket according to an embodiment of the present application. As shown in fig. 18, the stem 501 has protruding positioning posts 5017 at the sides thereof, the positioning posts 5017 being perpendicular to the surface of the stem 501. In an actual package, the socket 501 and each pin arranged on the socket 501 need to be horizontally placed on a fixture, the positioning column 5017 can provide a reference surface for horizontal installation of the socket 501 and each pin arranged on the socket 501, and when the positioning column 5017 is horizontal, the positions of the socket 501 and each pin arranged on the socket 501 on the fixture are correct, so that the levelness of the socket 501 and each pin arranged on the socket 501 can be ensured; on the basis of guaranteeing the levelness of the tube seat 501, the perpendicularity of the first heat sink and the second heat sink can be guaranteed; and the coupling levelness of the first lens 520 and the second lens 560 can be ensured when the positioning column 5017 is horizontal, namely, the positioning column 5017 is parallel to the first lens 520 and the second lens 560, and the parallelism between the positioning column 5017 and the first lens 520 and the second lens 560 can be acquired through an instrument.

The positioning column 5017 can be used as a reference surface for adjusting the levelness of the tube seat and the tube seat surface pins, the levelness of the tube seat and the tube seat surface pins can be ensured by utilizing the positioning column 5017, meanwhile, the levelness of lens coupling can also be ensured, the levelness of lens coupling can be further ensured while the levelness of the tube seat and the tube seat surface pins are ensured, and the positioning column 5017 provides reference surfaces for positioning the tube seat, the first lens and the second lens so as to realize that the side surface of the tube seat, the plane where the light emergent direction of the first lens is positioned and the plane where the light emergent direction of the second lens is positioned are mutually parallel. The socket in the present application thus has a horizontal positioning function.

Specifically, the positioning post 5017 includes a groove provided at a side of the stem, and a protruding member extending along the groove.

The positioning posts 5017 are protruding structures of the header 501, which can increase the size of the header 501, thereby increasing the heat dissipation capacity of the header.

It is to be understood that the present application is not limited to the precise arrangements and instrumentalities shown in the drawings, which have been described above, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the application is limited only by the appended claims.

Claims (10)

1. An optical module, comprising:

a circuit board;

the light emitting device is electrically connected with the circuit board and is used for converting the electric signal into an optical signal;

wherein the light emitting device includes:

a tube seat, the surface of which is provided with a plurality of pins;

the first emission component is arranged on the surface of the tube seat and comprises a first heat sink, a first lens and a first laser component, wherein the first heat sink is provided with a first side surface and a second side surface, the first lens is arranged on the first side surface, and the first laser component is arranged on the second side surface;

the second emission assembly is arranged on the surface of the tube seat and comprises a second heat sink, a second lens and a second laser assembly, wherein the second heat sink is provided with a third side surface and a fourth side surface, the second lens is arranged on the third side surface, and the second laser assembly is arranged on the fourth side surface;

The switching post, set up in the tube socket surface, the surface is equipped with first metal level and second metal level, each region of first metal level is located respectively the different planes of switching post, each region of second metal level is located respectively the different planes of switching post, first metal level is used for with first laser subassembly with pin electricity on the tube socket is connected, second metal level is used for with second laser subassembly with pin electricity on the tube socket is connected.

2. The optical module of claim 1, wherein the first heat sink comprises a first step surface, a second step surface, and a third step surface, the first side surface connecting the first step surface and the second step surface, the second side surface connecting the second step surface and the third step surface, the first lens being affixed to the first side surface, the first laser assembly being affixed to the second side surface;

the second heat sink comprises a fourth step surface, a fifth step surface and a sixth step surface, the third side surface is connected with the fourth step surface and the fifth step surface, the fourth side surface is connected with the fifth step surface and the sixth step surface, the second lens is attached to the third side surface, and the second laser component is attached to the fourth side surface;

And a groove is arranged between the third side surface and the fifth step surface and is used for receiving glue overflowed when the second lens is adhered.

3. The optical module of claim 1, wherein the first laser assembly comprises a first laser chip and a first carrier plate, the second laser assembly comprises a second laser chip and a second carrier plate, a central axis of the first lens coincides with a central axis of the first laser chip, and a central axis of the second lens coincides with a central axis of the second laser chip.

4. A light module as recited in claim 3, wherein the first lens is spaced from the light emitting surface of the first laser chip by a focal length of the first lens and the second lens is spaced from the light emitting surface of the second laser chip by a focal length of the second lens.

5. The light module of claim 1 wherein the light emitting device further comprises:

the pipe cap is covered on the pipe seat and is provided with a light-transmitting window for transmitting light beams;

and the light window is provided with planar glass, and light beams emitted by the first lens and the second lens directly penetrate through the planar glass.

6. The optical module of claim 3, wherein the first lens is a collimating lens for converting the signal beam emitted by the first laser chip into a collimated beam; the second lens is a collimating lens and is used for converting the signal beam emitted by the second laser chip into a collimated beam.

7. A light module as recited in claim 3, wherein a thermistor is provided on the first carrier plate immediately adjacent the first laser chip for monitoring an operating temperature of the first laser chip.

8. The optical module of claim 1 wherein the stem surface is provided with support posts for effecting a ground connection of the first and second laser assemblies.

9. The optical module of claim 7, wherein the header surface has a first laser pin, a second laser pin, a thermistor pin, and a TEC pin;

the positive electrode of the first laser chip is connected to the first laser pin through the switching post wire bonding, the positive electrode of the second laser chip is connected to the second laser pin through the switching post wire bonding, the thermistor pin is connected to the thermistor pin through the switching post wire bonding, and the TEC wire bonding is connected to the TEC pin.

10. The optical module of claim 9, wherein the first carrier surface has a first bonding pad, the second carrier surface has a second bonding pad, and the stem surface is further provided with a ceramic substrate;

a first wire bonding is arranged between the anode of the first laser chip and the first bonding pad, a second wire bonding is arranged between the first bonding pad and the transfer column, and a third wire bonding is arranged between the transfer column and the first laser pin;

a fourth wire bonding is arranged between the anode of the second laser chip and the second bonding pad, a fifth wire bonding is arranged between the second bonding pad and the transfer column, and a sixth wire bonding is arranged between the transfer column and the second laser pin;

the surface of the first carrier plate is provided with a first grounding pad and a second grounding pad, the second carrier plate is provided with a third grounding pad, and the surface of the ceramic substrate is provided with a fourth grounding pad and a fifth grounding pad;

a seventh wire bonding is arranged between the cathode of the first laser chip and the first grounding pad, and an eighth wire bonding is arranged between the first grounding pad and the fourth grounding pad;

a ninth wire bonding is arranged between the thermistor and the second grounding pad, and a tenth wire bonding is arranged between the second grounding pad and the fifth grounding pad;

A tenth wire bonding is arranged between the cathode of the second laser chip and the third grounding pad, and a twelfth wire bonding is arranged between the third grounding pad and the fifth grounding pad.

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