CN111948762A - Optical module - Google Patents
Optical module Download PDFInfo
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- CN111948762A CN111948762A CN201910403334.6A CN201910403334A CN111948762A CN 111948762 A CN111948762 A CN 111948762A CN 201910403334 A CN201910403334 A CN 201910403334A CN 111948762 A CN111948762 A CN 111948762A
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- optical fiber
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4206—Optical features
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The embodiment of the invention provides an optical module, and relates to the field of optical fiber communication. In the optical module provided by the embodiment of the invention, the silicon optical chip is arranged on the surface of the circuit board, the optical fiber port is positioned at one end of the laser box, the laser chip is arranged at the other end of the laser box relative to the optical fiber port, light emitted by the laser chip is emitted into the optical fiber clamped in the optical fiber port and transmitted to the silicon optical chip through the optical fiber, and the silicon optical chip is connected with the optical fiber socket through the optical fiber ribbon.
Description
Technical Field
The invention relates to the field of optical fiber communication, in particular to an optical module.
Background
The realization of the photoelectric conversion function by the silicon optical chip has become a mainstream scheme adopted by the high-speed optical module at present. In the silicon optical module, a silicon optical chip is arranged on the surface of a circuit board and is electrically connected with the circuit board through routing; the silicon optical chip is connected with the optical interface of the optical module through the optical fiber ribbon, so that optical signals can enter and exit the silicon optical chip. Since the silicon material used for the silicon optical chip is not an ideal laser chip light-emitting material and cannot integrate the light-emitting unit in the silicon optical chip manufacturing process, the silicon optical chip needs to be provided with light by an external light source.
Disclosure of Invention
The embodiment of the invention provides an optical module, which provides an external light source for a silicon optical chip in the optical module and realizes optical connection.
In order to achieve the above purpose, the embodiment of the present invention adopts the following technical solutions:
the embodiment of the invention provides an optical module, which comprises a circuit board, a silicon optical chip, a laser box and an optical fiber socket, wherein the circuit board is provided with a plurality of optical fibers; the silicon optical chip is arranged on the surface of the circuit board; the laser box comprises a laser chip and an optical fiber port, the optical fiber port is positioned at one end of the laser box, and the laser chip is arranged at the other end of the laser box relative to the optical fiber port; the optical fiber is clamped in the optical fiber port, the optical fiber is optically connected with the silicon optical chip, and light emitted by the laser chip is emitted into the optical fiber; the silicon optical chip is optically connected with the optical fiber socket through an optical fiber ribbon.
In the optical module provided by the embodiment of the invention, the silicon optical chip is arranged on the surface of the circuit board, the optical fiber port is positioned at one end of the laser box, the laser chip is arranged at the other end of the laser box relative to the optical fiber port, light emitted by the laser chip is emitted into the optical fiber clamped in the optical fiber port and transmitted to the silicon optical chip through the optical fiber, and the silicon optical chip is connected with the optical fiber socket through the optical fiber ribbon.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;
FIG. 2 is a schematic diagram of an optical network unit;
fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present invention;
FIG. 4 is an exploded view of an optical module according to an embodiment of the present invention;
fig. 5 is a schematic view of a partial structure of an optical module according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a laser box in an optical module according to an embodiment of the present invention;
fig. 7 is an exploded schematic view of a laser box in an optical module according to an embodiment of the present invention;
fig. 8 is a schematic view of another angle-resolved structure of a laser box in an optical module according to an embodiment of the present invention;
fig. 9 is an exploded schematic view of another laser box in the optical module according to the embodiment of the present invention;
fig. 10 is an exploded view of a fiber port in a laser box according to an embodiment of the present invention;
fig. 11 is a schematic diagram illustrating a structural relationship between a silicon optical chip and a circuit board in an optical module according to an embodiment of the present invention;
fig. 12 is a schematic diagram of an optical coupling structure of a silicon optical chip in an optical module according to an embodiment of the present invention;
fig. 13 is a schematic structural diagram of a fiber port according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
One of the core elements of fiber optic communications is the conversion of optical to electrical signals. The optical fiber communication uses the optical signal carrying information to transmit in the optical fiber/optical waveguide, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of the light in the optical fiber. The information processing equipment such as computer adopts electric signals, which needs to realize the interconversion between the electric signals and the optical signals in the signal transmission process
The optical module realizes the photoelectric conversion function in the technical field of optical fiber communication, and the interconversion of optical signals and electric signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on a circuit board, main electrical connections comprise power supply, I2C signals, data signal transmission, grounding and the like, the electrical connection mode realized by the golden finger becomes a standard mode of the optical module industry, and on the basis, the circuit board is a necessary technical characteristic in most optical modules. On this basis, the package of the optical chip, the electrical connection between the package structure and the circuit board are two main research and development directions of the optical module.
Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes an optical network unit 100, an optical module 200, an optical fiber 101, and a network cable 103;
one end of the optical fiber is connected with the far-end server, one end of the network cable is connected with the local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber and the network cable; and the connection between the optical fiber and the network cable is completed by an optical network unit with an optical module.
An optical port of the optical module 200 is connected with the optical fiber 101 and establishes bidirectional optical signal connection with the optical fiber; the electrical port of the optical module 200 is accessed into the optical network unit 100, and establishes bidirectional electrical signal connection with the optical network unit; the optical module realizes the mutual conversion of optical signals and electric signals, thereby realizing the connection between the optical fiber and the optical network unit; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network unit 100, and the electrical signal from the optical network unit 100 is converted into an optical signal by the optical module and input to the optical fiber. The optical module 200 is a tool for realizing the mutual conversion of the photoelectric signals, and has no function of processing data, and information is not changed in the photoelectric conversion process.
The optical network unit is provided with an optical module interface 102, which is used for accessing an optical module and establishing bidirectional electric signal connection with the optical module; the optical network unit is provided with a network cable interface 104 for accessing a network cable and establishing bidirectional electric signal connection with the network cable; the optical module is connected with the network cable through the optical network unit, specifically, the optical network unit transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network unit is used as an upper computer of the optical module to monitor the work of the optical module.
At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network unit and the network cable.
Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network unit is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.
Fig. 2 is a schematic diagram of an optical network unit structure. As shown in fig. 2, the optical network unit 100 includes a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a convex structure such as a fin for increasing a heat radiation area.
The optical module 200 is inserted into an optical network unit, specifically, an electrical port of the optical module is inserted into an electrical connector in the cage 106, and an optical port of the optical module is connected with the optical fiber 101.
The cage 106 is positioned on the circuit board, enclosing the electrical connectors on the circuit board in the cage; the optical module is inserted into the cage, the cage fixes the optical module, and heat generated by the optical module is conducted to the cage through the optical module housing and finally diffused through the heat sink 107 on the cage.
An optical module plays a key role in photoelectric conversion in the optical communication connection, and at present, a packaging mode of a silicon-based photoelectric chip is gradually mature in the optical module industry, and a silicon-based integrated circuit technology and an optical waveguide technology are combined together to manufacture a chip integrating a photoelectric conversion function and an electro-optical conversion function by a chip growth manufacturing process. However, since the silicon material used for the silicon optical chip is not an ideal laser chip light emitting material, and the light emitting unit cannot be integrated in the silicon optical chip manufacturing process, the silicon optical chip needs to be provided with light by an external light source.
Fig. 3 is a schematic diagram of an optical module according to an embodiment of the present invention, fig. 4 is an exploded schematic diagram of an optical module according to an embodiment of the present invention, and fig. 5 is a schematic diagram of a partial structure of an optical module according to an embodiment of the present invention. As shown in fig. 3, 4 and 5, the optical module according to the embodiment of the present invention includes a circuit board 300, a silicon optical chip 400, a laser box 500 and a fiber optic receptacle 600.
The silicon optical chip 400 is arranged on the circuit board 300 and electrically connected with the circuit board 300, and specifically can be wire bonding connection; the periphery of the silicon optical chip is connected to the circuit board 300 by a plurality of conductive wires, so the silicon optical chip 400 is generally disposed on the surface of the circuit board 300.
The silicon optical chip 400 receives light from the laser box 500, and further modulates the light, specifically, loads a signal on the light; the silicon optical chip 400 receives light from the fiber optic receptacle 600, and converts the optical signal into an electrical signal.
The silicon optical chip 400 and the optical fiber receptacle 600 are optically connected by the optical fiber ribbon 401, and the optical fiber receptacle 600 is optically connected to an optical fiber outside the optical module. The light modulated by the silicon optical chip 400 is transmitted to the optical fiber socket 600 through the optical fiber ribbon 401, and is transmitted to the external optical fiber through the optical fiber socket 600; light transmitted from the external optical fiber is transmitted to the optical fiber ribbon 401 through the optical fiber socket 600, and is transmitted to the silicon optical chip 400 through the optical fiber ribbon 401; therefore, the silicon optical chip 400 outputs light carrying data to the optical module external optical fiber or receives light carrying data from the optical module external optical fiber.
The laser box 500 and the circuit board 300 are electrically connected, and specifically, may be connected through a flexible board. The main electrical devices in the laser box 500 are laser chips; the laser chip emits light with relatively stable power, the light is not modulated and carries no information, and a high-speed signal circuit is not involved; the circuit structure of the laser box 500 is relatively simple, and the electrical connection with the circuit board 300 can be realized through a flexible board, through which the laser chip is electrically driven from the outside of the laser box 500. The laser box 500 may be disposed on the surface of the circuit board 300, or may be disposed outside the circuit board 300.
A temperature adjusting electric device such as a semiconductor refrigerator may be provided in the laser box 500 to realize temperature control for the laser chip, and the temperature adjusting electric device obtains power supply driving from the outside of the laser box 500 through a flexible board.
The laser box 500 provides light to the silicon photonics chip 400 with relatively stable optical power. The laser box 500 is connected with the silicon optical chip 400 through an optical fiber/optical fiber ribbon.
Fig. 6 is a schematic structural diagram of a laser box in an optical module according to an embodiment of the present invention, fig. 7 is a schematic structural diagram of an exploded laser box in an optical module according to an embodiment of the present invention, and fig. 8 is a schematic structural diagram of another angle exploded laser box in an optical module according to an embodiment of the present invention. As shown in fig. 6 and 7, specifically, the laser box 500 includes a cover plate 501, a bottom plate 502, a fiber port 503, a conductive substrate 504, a laser chip 505, and a focusing lens 506, and the laser box 500 may further include an optical isolator 507;
a cover plate 501 covers a bottom plate 502, and the bottom plate 502 and the cover plate 501 form a wrapping cavity with openings at two ends;
the laser chip 505, the optical isolator 507 and the focusing lens 506 are positioned in the packaging cavity, specifically, the laser chip 505 is positioned on the surface of the conductive substrate 504, and the conductive substrate 504 is connected with the circuit board 300 through a flexible board; the focusing lens 506 and the optical isolator 507 are respectively positioned on the surface of the bottom plate;
the laser chip 505 emits light, and the emitted light is converged by the focusing lens 506 and then enters the optical fiber 402 in the optical fiber port 503; a collimating lens 509 may be disposed between the laser chip 505 and the focusing lens 506, and the diffused light emitted from the laser chip 505 is converged into collimated light, so as to reduce power loss in the long-distance transmission process of light; an optical isolator 507 can be arranged between the focusing lens 506 and the optical fiber port 503, wherein the optical isolator 507 allows light to pass in a single direction and is prevented from passing in the opposite direction, so that light in the opposite direction is prevented from returning to the laser chip to cause light interference; an optical isolator 507 may also be disposed between the collimating lens 509 and the focusing lens 506.
As shown in fig. 7 and 8, in the embodiment, two laser chips, two conductive substrates, two focusing lenses and an optical isolator 507 are disposed in the laser box 500; an outgoing light path is formed by a conductive substrate 504, a laser chip and a focusing lens 506, and two outgoing light paths are formed in the laser box; in an outgoing light path, the driving power supply from the circuit board 300 is connected into the conductive substrate 504 through the flexible board, the conductive substrate 504 supplies power to the laser chip, the laser chip 505 emits light, and the outgoing light of the laser chip is converged by the focusing lens 506; the two light-emitting optical paths share one optical isolator 507;
of course, two optical isolators can be arranged, and one optical isolator is respectively used by the two outgoing light paths; the two laser chips can also share one conductive substrate;
the conductive substrate 504 is positioned at an opening at one end of the packaging cavity, one end of the conductive substrate 504 extends into the packaging cavity, and the other end of the conductive substrate 504 extends out of the packaging cavity; a sealing piece (508, 510) is arranged between the conductive base plate 504 and the cover plate 501 and/or the bottom plate 502, and the conductive base plate 504 and the sealing piece together seal one end opening of the packaging cavity; common sealing elements are objects which can be sealed by ceramics, kovar alloy, solidified glue or die-cast metal and the like.
The optical fiber port 503 is positioned at the opening at the other end of the packaging cavity, and the opening at the other end of the packaging cavity is sealed by the optical fiber port 503; the optical fiber port 503 has an optical fiber 402 disposed therein, and the optical fiber 402 receives light from the focusing lens 506.
Fig. 9 is an exploded schematic view of another laser box in the optical module according to the embodiment of the present invention. As shown in fig. 9, the laser box provided by the embodiment of the present invention includes a cover plate 501, a bottom plate 502, a conductive substrate 504, a laser chip 505 located on the conductive substrate, a focusing lens 506, an optical isolator 507, a collimating lens 509, and a spacer 516; the focusing lens 506 is disposed on an upper surface of a spacer 516 disposed between the focusing lens 506 and the base plate 502 to adjust a height of the focusing lens in the optical path.
The conductive substrate 504 is used for supplying power to the laser chip, and has a plurality of feasible designs, one of which is shown in fig. 9, the conductive substrate is partially located in the cavity and partially located outside the cavity, the laser chip is arranged at the part located in the cavity, and the part located outside the cavity is electrically connected with the circuit board; in another feasible mode, the conductive substrate is completely positioned in the cavity, the laser chip is positioned on the conductive substrate, and the laser box is provided with other electric connection structures to be electrically connected with the conductive substrate; the matching relationship between the conductive substrate and the laser chip can be various, one is that one conductive substrate is provided with one laser chip, and the other is that one conductive substrate is provided with two laser chips. A common conductive substrate is a metallized ceramic, and a circuit pattern is formed on the surface of the ceramic to realize different electrical connection requirements.
The laser chip, the focusing lens and the optical isolator are generally positioned in the cavity; the lens is arranged in two modes, one mode is that a lens, specifically a focusing lens, is arranged in the light-emitting direction of the laser chip and is used for converging light emitted by the laser chip so as to facilitate subsequent coupling; in another mode, as shown in fig. 9, two lenses, specifically a collimating lens and a focusing lens, are disposed in the light emitting direction of the laser chip, light emitted from the laser chip is converted into collimated light through the collimating lens, the collimated light can maintain small optical power attenuation in the long-distance light transmission process, and the focusing lens receives the collimated light to converge and couple the light into the silicon optical chip. The optical isolator is used for preventing light emitted by the laser chip from returning to the laser chip after being emitted, so that the optical isolator is arranged in the light emitting direction of the laser chip.
Two laser chips (a first laser chip and a second laser chip) are adopted to emit light with the same wavelength, so that two beams of light are formed, and the light emitting power of the silicon optical chip is finally improved by the two beams of light with the same wavelength;
when the laser chip works, a large amount of Heat (Heat) is generated to raise the temperature of the working environment, but the high temperature of the working environment causes the power of the laser chip to be reduced and the wavelength to be shifted, so that a better Heat dissipation channel needs to be provided for the laser chip.
The laser box is assembled by taking the bottom plate as the bottom, arranging devices on the bottom plate, then closing the cover plate, assembling the optical module by taking the lower shell as the bottom, arranging the devices on the lower shell, and then covering the upper shell. The assembly sequence enables the cover plate of the laser box to face the upper shell of the optical module, the bottom plate of the laser box to face the lower shell of the optical module, the upper shell of the optical module has a better heat dissipation channel than the lower shell of the optical module, and the bottom plate of the laser box can dissipate heat through the upper shell of the optical module.
In order to use the upper shell of the optical module to dissipate heat, the embodiment of the invention provides a laser box structure, wherein the lower surface of a cover plate is in heat conduction contact with at least two laser chips, and the upper surface of the cover plate is in heat conduction contact with the upper shell of the optical module; specific thermally conductive contact structures may be: arranging a conductive substrate on the lower surface of a cover plate, arranging a laser chip on the lower surface of the conductive substrate, namely arranging the conductive substrate on the lower surface of a laser box cover plate on the side facing to an upper shell of an optical module, and arranging the laser chip on the side facing to a lower shell of the optical module; the upper surface of the cover plate is contacted with the upper shell of the optical module through heat conducting pieces such as heat conducting glue and the like; the heat generated by the laser chip is conducted to the laser box cover plate through the conductive substrate, and is conducted to the upper shell of the optical module through the cover plate of the laser box. The structure of the specific embodiment of the heat conduction contact is that a heat conduction piece is arranged between the electric conduction substrate and the laser box cover plate; the arrangement of the heat conducting piece between the laser box cover plate and the optical module upper shell belongs to the specific embodiment structure of the heat conducting contact.
Fig. 9 shows a specific laser box structure, in which the laser chip is disposed on the lower surface of the conductive substrate, the upper surface of the conductive substrate faces the inner surface of the cover plate, the laser chip is suspended above the bottom plate, no better heat conduction channel is formed between the laser chip and the bottom plate, and the heat of the laser chip is mainly dissipated through the cover plate.
The conductive substrate is arranged on the inner surface of the cover plate, the laser chip is arranged on the conductive substrate, and the laser chip is fixed on the cover plate of the laser box in a preset mode by combining the assembly sequence of the laser box. When the cover plate is not closed, the light path of the laser box is not completely installed, and the laser chip cannot be subjected to charged active light path coupling; after the cover plate is closed, the outside cannot move the position of the device inside the laser chip, and active coupling cannot be realized. The laser box is assembled according to the preset position, a large position error exists, the position error causes a large position difference between the preset light path and the actual light path, the optical coupling efficiency is greatly influenced, especially when the laser box provides more than two light beams, the position between the light beams can not be modulated, two light beams are aligned with two light inlets of a silicon optical chip at the same time very difficultly, and more than three light beams are aligned more difficultly.
The embodiment of the invention in fig. 9 provides a laser box, and the active coupling of the laser box is realized. Specifically, as shown in fig. 9, a through hole 514 is provided on the cover plate of the laser box, a focusing lens 506 is provided below the through hole 514, and the focusing lens 506 is provided on the bottom plate 501; to adjust the height of the focusing lens, a spacer 516 may be provided between the focusing lens and the base plate 501. After the cover plate of the laser box is closed, the position of the laser chip is fixed, the laser chip is powered on to emit light, the light is emitted through the lens, an external adjusting device can extend into the laser box through the through hole 514, and the focusing lens is positioned below the through hole, so that the external adjusting device can conveniently emit the light into the laser box from the through hole and adjust the position of the focusing lens, and the position or the angle of the lens is changed to change the emitting position of the light beam; after the laser box and the silicon optical chip are fixed relatively, the laser chip can be adjusted to the optical hole of the silicon optical chip by light under the light-emitting state through the adjustment of the lens, and active coupling is achieved. To achieve sealing of the laser box, the laser box further comprises a block 515, and the through hole 514 is blocked by the block 515.
Specifically, in combination with the specific size of the lens, the collimating lenses 505a, 505b may be disposed on the inner surface (lower surface) of the cover plate to achieve matching with the light path of the laser chip.
An exploded structure of the fiber port 503 is shown in fig. 8 and 9, the fiber port 503 includes an upper substrate 512, a lower substrate 511 and optical fibers/fiber ribbons 402; the optical fiber/optical fiber ribbon 402 is located between the upper substrate 512 and the lower substrate 511, the optical fiber/optical fiber ribbon 402 is clamped by the structures arranged on the surfaces of the upper substrate and the lower substrate, and the structures arranged on the surfaces of the upper substrate and the lower substrate can also realize the sealing effect on the optical fiber/optical fiber ribbon.
Fig. 10 is an exploded view of a fiber port in a laser box according to an embodiment of the present invention. As shown in fig. 10, the surface of the lower substrate 511 of the optical fiber port is provided with a groove 519, the optical fiber/optical fiber ribbon is disposed in the groove, and the upper substrate 512 covers the lower substrate and the optical fiber/optical fiber ribbon, respectively. The commonly used groove structure is a V-shaped groove or a U-shaped groove.
Specifically, the laser box outputs two beams of light to the outside, and two optical fibers are held in the optical fiber port 503. Of course, the laser box may output a beam of light to the outside, and a single optical fiber may be clamped in the optical fiber port 503.
The optical fiber/optical fiber ribbon comprises an inner layer and a protective layer, wherein the inner layer realizes the optical transmission function of the optical fiber, the protective layer is arranged outside the inner layer, and the protective layer is added to protect the inner layer due to the fact that the inner layer is fine and easy to break. The inner layer is exposed after the protective layer is removed from the optical fiber, and the inner layer 403 of the optical fiber 402 is located in the groove 519. The inner layer 403 has a diameter smaller than the diameter of the entire optical fiber. The protective layer is removed from the end part length of the optical fiber, the inner layer of the optical fiber is arranged in the groove of the lower substrate, and the optical fiber with partial length connected with the inner layer part is also positioned on the lower substrate so as to be fixed by the upper substrate and the lower substrate;
because the diameter of the inner layer of the optical fiber is different from the overall diameter of the optical fiber, in order to compensate for the height difference caused by the diameter, the step structure is arranged on the lower substrate 511, the inner layer of the optical fiber is arranged on the upper step 518, the optical fiber is arranged on the lower step 517, and the groove 519 is formed on the surface of the upper step 518. The step structure enables the surface of the lower substrate to have different heights, the upper substrate 512 covers the upper step 518, and the special-shaped plate 513 covers the lower step 517; the upper step 518 and the lower step 517 are connected via a step transition inclined plane 520, correspondingly, a plane 522 and an inclined plane 521 are provided on the bottom surface of the special-shaped plate 513, the lower step 517 is covered at the plane 522, and the transition inclined plane 520 of the upper step and the lower step is covered at the inclined plane 521.
In another structure of the optical fiber port 503, the upper substrate and the lower substrate are respectively provided with a groove, the groove of the upper substrate and the groove of the lower substrate enclose a hole diameter, and the optical fiber is arranged in the hole diameter; specifically, the groove of the upper substrate can be a semicircular structure, the groove of the lower substrate can be a semicircular structure, and a circular structure with the same diameter as the optical fiber is formed by the two semicircular structures; specifically, the grooves of the upper substrate and the grooves of the lower substrate may be respectively configured in a V-shaped structure.
Fig. 11 is a schematic diagram of a structural relationship between a silicon optical chip and a circuit board in an optical module according to an embodiment of the present invention. As shown in figure 11 of the drawings,
the optical module provided by the embodiment of the invention comprises a circuit board 300, a silicon optical chip 400, a laser box 500 and an optical fiber socket 600.
The circuit board 300 is provided with an opening 301 penetrating through the upper surface and the lower surface of the circuit board, and the silicon optical chip is arranged in the opening 301, so that the silicon optical chip can simultaneously radiate heat in the upper surface direction and the lower surface direction of the circuit board;
the substrate 302 is arranged on the lower surface of the circuit board, the silicon optical chip 400 penetrates through the opening 301 of the circuit board 300 and then is placed on the heat dissipation substrate 302, and the substrate 302 has the effects of supporting the silicon optical chip 400 and dissipating heat of the silicon optical chip 400;
the silicon optical chip 400 is electrically connected with the circuit board 300, specifically, a wire bonding connection can be realized;
the silicon optical chip 400 receives light from the laser box 500, and further modulates the light, specifically, loads a signal on the light; the silicon optical chip 400 receives light from the fiber optic receptacle 600, and converts the optical signal into an electrical signal.
The silicon optical chip 400 and the optical fiber receptacle 600 are optically connected by the optical fiber ribbon 401, and the optical fiber receptacle 600 is optically connected to an optical fiber outside the optical module. The light modulated by the silicon optical chip 400 is transmitted to the optical fiber socket 600 through the optical fiber ribbon 401, and is transmitted to the external optical fiber through the optical fiber socket 600; light transmitted from the external optical fiber is transmitted to the optical fiber ribbon 401 through the optical fiber socket 600, and is transmitted to the silicon optical chip 400 through the optical fiber ribbon 401; therefore, the silicon optical chip 400 outputs light carrying data to the optical module external optical fiber or receives light carrying data from the optical module external optical fiber.
Fig. 12 is a schematic view of an optical coupling structure of a silicon optical chip in an optical module according to an embodiment of the present invention. As shown in fig. 12, the silicon optical chip 400 is connected to the laser box 500 and the fiber optic receptacle 600 via optical fiber ribbons (401 and 402), respectively. The unthreaded hole of silicon optical chip is located the side edge of silicon optical chip, and the optical fiber ribbon realizes optical coupling with silicon optical chip through fiber interface 601.
Fig. 13 is a schematic structural diagram of a fiber port according to an embodiment of the present invention. As shown in fig. 13, since the optical fiber interface 601 realizes connection between the silicon optical chip and the laser box and the optical fiber socket, the number of optical fibers in the optical fiber interface is greater than the number of optical fibers in the optical fiber port 503, the optical fiber ribbon clamped by the optical fiber interface 601 includes an optical fiber/optical fiber ribbon 402 and an optical fiber ribbon 401, and the optical fiber interface includes an upper board 602, a lower board 603 and optical fiber ribbons (401, 402); the optical fiber ribbons (401, 402) are positioned between the upper combination board 602 and the lower combination board 603, the optical fiber ribbons are clamped by the structures arranged on the surfaces of the upper combination board and the lower combination board, and the sealing effect on the optical fiber ribbons can also be realized by the structures arranged on the surfaces of the upper combination board and the lower combination board.
As shown in fig. 13, a groove 606 is provided on a surface of a lower board 603 of the optical fiber interface 601, and an optical fiber ribbon is disposed in the groove, and the lower board and the optical fiber ribbon are covered and pressed by an upper board 602. The commonly used groove structure is a V-shaped groove or a U-shaped groove.
Specifically, the lower plate is provided with 10 grooves for accommodating 10 optical fibers.
The optical fiber ribbon comprises an inner layer and a protective layer, the inner layer realizes the optical transmission function of the optical fiber, the protective layer is arranged outside the inner layer, and the protective layer is added to protect the inner layer due to the fact that the inner layer is fine and easy to break. The inner layer is exposed after the protective layer is removed from the optical fiber, and the inner layer 605 of the optical fiber is located in the groove 606. The diameter of the inner layer is smaller than the diameter of the whole optical fiber. The protective layer is removed from the end part length of the optical fiber, the inner layer of the optical fiber is arranged in the groove of the lower plywood, and the optical fiber with partial length connected with the inner layer part is also positioned on the lower plywood so as to be convenient for fixing the optical fiber through the upper plywood and the lower plywood;
because the diameter of the inner layer of the optical fiber is different from the overall diameter of the optical fiber, in order to compensate for the height difference caused by the diameter, the lower closing plate 603 is provided with a step structure, the inner layer of the optical fiber is arranged on the upper step 607, the optical fiber is arranged on the lower step 609, and the groove 606 is formed on the surface of the upper step 607. The step structure enables the heights of the surfaces of the lower combination plates to be different, the upper combination plate 602 covers the upper step 607, and the special-shaped cover plate 604 covers the lower step 609; the upper step 607 is connected with the lower step 609 by a slope 608, correspondingly, the bottom surface of the special-shaped covering plate 604 is provided with a plane 611 and an inclined plane 610 which are connected with each other, the lower step 607 is covered at the plane 611, and the transition slope 608 of the upper step and the lower step is covered at the inclined plane 610.
In another structure of the optical fiber interface, the upper combination plate and the lower combination plate are respectively provided with a groove, the groove of the upper combination plate and the groove of the lower combination plate form a hole diameter, and the optical fiber is arranged in the hole diameter; specifically, the groove of the upper combination plate can be in a semicircular structure, the groove of the lower combination plate can be in a semicircular structure, and a circular structure with the same diameter as the optical fiber is formed by the two semicircular structures; specifically, the groove of the upper plywood and the groove of the lower plywood can be respectively set to be V-shaped structures.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (6)
1. An optical module is characterized by comprising a circuit board, a silicon optical chip, a laser box and an optical fiber socket;
the silicon optical chip is arranged on the surface of the circuit board;
the laser box comprises a laser chip and an optical fiber port, the optical fiber port is positioned at one end of the laser box, and the laser chip is arranged at the other end of the laser box relative to the optical fiber port;
an optical fiber is clamped in the optical fiber port, the optical fiber is optically connected with the silicon optical chip, and light emitted by the laser chip is emitted into the optical fiber;
and the silicon optical chip is optically connected with the optical fiber socket through an optical fiber ribbon.
2. The optical module according to claim 1, wherein the optical fiber port includes an upper substrate and a lower substrate, a groove is formed on a surface of the lower substrate, the optical fiber is disposed in the groove, and the lower substrate and the optical fiber are covered by the upper substrate.
3. The optical module of claim 2, wherein the upper substrate forms a groove, and the upper substrate groove and the lower substrate groove together clamp the optical fiber.
4. The optical module of any of claims 2 or 3, wherein the fiber port further comprises a profiled plate, a bottom surface of the profiled plate comprising a flat surface and an inclined surface;
the lower substrate comprises an upper step surface, a lower step surface and a step transition inclined surface, and the upper step surface forms the groove;
the special-shaped plate plane covers the lower step surface, and the special-shaped plate inclined plane covers the step transition inclined plane.
5. The optical module of claim 4, wherein the laser box comprises a conductive substrate and a focusing lens; one part of the conductive substrate is positioned in the laser box and is electrically connected with the laser chip; the other part of the conductive substrate is positioned outside the laser box and is electrically connected with the circuit board;
light emitted by the laser chip is converged by the focusing lens and then is emitted into the optical fiber.
6. The optical module of claim 4, wherein the laser box comprises a cover plate, a base plate, an electrically conductive substrate, and a focusing lens, wherein a portion of the electrically conductive substrate is located within the laser box, the laser chip is located on a lower surface of the electrically conductive substrate, and an upper surface of the electrically conductive substrate is in thermally conductive contact with the cover plate;
the other part of the conductive substrate is positioned outside the laser box and is electrically connected with the circuit board;
the cover plate is provided with a through hole, the focusing lens is arranged below the through hole and positioned on the bottom plate, and light emitted by the laser chip is converged by the focusing lens and then enters the optical fiber.
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| CN201910403334.6A CN111948762A (en) | 2019-05-15 | 2019-05-15 | Optical module |
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| CN201910403334.6A CN111948762A (en) | 2019-05-15 | 2019-05-15 | Optical module |
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