CN111338039B - Optical module - Google Patents

Abstract

The application provides an optical module, includes: a circuit board; the base is embedded on the circuit board; the laser assembly is attached to the base and used for emitting light which does not carry signals; the silicon optical chip is attached to the base and provided with a third optical hole, and light which is emitted by the laser assembly and does not carry signals is received through the third optical hole; the laser device comprises a laser device upper cover, the bottom of the laser device upper cover is fixedly connected with the base and used for covering the laser assembly, and the laser assembly is sealed between the laser device upper cover and the base. The application provides an optical module, laser subassembly and silicon optical chip set up on the base, and laser subassembly passes through the laser instrument upper cover and seals, realizes directly being laser subassembly and silicon optical chip heat dissipation through the base, and then is convenient for realize the inside heat dissipation of optical module, avoids the inside heat of optical module to concentrate and piles up, and the laser subassembly that sets up on the base is direct to be wrapped up in by the laser instrument upper cover, saves laser subassembly's encapsulation and the encapsulation of the laser subassembly of being convenient for.

Description

Optical module

Technical Field

The application relates to the technical field of optical communication, in particular to an optical module.

Background

The optical communication technology can be applied to novel services and application modes such as cloud computing, mobile internet, video and the like. In optical communication, an optical module is a tool for realizing the interconversion of optical signals and is one of the key devices in optical communication equipment. The adoption of a silicon optical chip to realize a photoelectric conversion function has become a mainstream scheme adopted by a high-speed optical module.

In the silicon optical module, a silicon optical chip is arranged on a circuit board and is electrically connected with the circuit board through routing; the silicon optical chip is connected with the optical interface of the optical module through the optical fiber ribbon, so that optical signals can enter and exit the silicon optical chip. The silicon material used for the silicon optical chip is not an ideal laser chip luminescent material, and the luminescent unit cannot be integrated in the silicon optical chip manufacturing process, so the silicon optical chip needs to be provided with light by an external light source.

Therefore, the silicon optical module usually further includes Laser Boxes (LB), transimpedance amplifiers (TIA), DRIVERs (DRIVER), and other electronic devices. However, with the development of optical communication, the integration level of the optical module is higher and higher, and the power density of the optical module is also increased, so that a large amount of heat is generated inside the optical module in the working process. If the heat generated inside the optical module cannot be dissipated in time, the working performance of the optical module will be seriously affected.

Disclosure of Invention

The embodiment of the application provides an optical module, which is convenient for realizing the internal heat dissipation of the optical module and avoiding the centralized accumulation of the internal heat of the optical module.

In a first aspect, an optical module provided in an embodiment of the present application includes:

a circuit board is provided with a plurality of circuit boards,

the base is embedded on the circuit board;

the laser assembly is attached to the base and used for emitting light which does not carry signals;

the silicon optical chip is attached to the base and provided with a third optical hole, and light which is emitted by the laser assembly and does not carry signals is received through the third optical hole;

the laser device comprises a laser device upper cover, wherein the bottom of the laser device upper cover is fixedly connected with the base and used for covering the laser assembly, and the laser assembly is arranged between the laser device upper cover and the base.

In a second aspect, the present application provides a light module comprising:

a circuit board;

a base disposed on the circuit board;

the laser assembly is attached to the base and used for emitting light which does not carry signals;

the silicon optical chip is attached to the base and provided with a third optical hole, and light which is emitted by the laser assembly and does not carry signals is received through the third optical hole;

the laser device comprises a laser device upper cover, wherein the bottom of the laser device upper cover is fixedly connected with the base and used for covering the laser assembly, and the laser assembly is arranged between the laser device upper cover and the base.

In the optical module that this application provided, set up the base, on laser subassembly and silicon optical chip set up the base, the bottom fixed connection base of laser instrument upper cover was established in laser subassembly's top, and then directly sets up laser subassembly between base and laser instrument upper cover. Through directly pasting laser assembly and silicon optical chip on the base, realize that the base directly dispels the heat for laser assembly and silicon optical chip, and then be convenient for realize the inside heat dissipation of optical module, avoid the inside heat of optical module to concentrate and pile up. Meanwhile, the laser assembly arranged on the base is directly wrapped by the upper cover of the laser device, so that the packaging of the laser assembly is saved and the packaging of the laser assembly is facilitated. Furthermore, laser subassembly and silicon optical chip directly paste the dress on the base, make laser subassembly and silicon optical chip be located same base, and it is the same to produce the influence of deformation to laser subassembly and silicon optical chip when the base is heated, makes the light alignment stability of laser subassembly and silicon optical chip better, and then simplifies laser subassembly and silicon optical chip assembly requirement.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure;

FIG. 4 is a schematic diagram of an exploded structure of an optical module according to an embodiment of the present application;

fig. 5 is a schematic front structure diagram of a circuit board according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of a circuit board provided in the embodiment of the present application with a protective cover removed;

fig. 7 is a schematic view of a partial structure of a light module according to an embodiment of the present application;

fig. 8 is a schematic view of a partial structure of an optical module according to an embodiment of the present application;

fig. 9 is a first exploded view of a partial structure of an optical module according to an embodiment of the present disclosure;

fig. 10 is a second exploded view of a partial structure of an optical module according to an embodiment of the present application;

fig. 11 is a schematic structural diagram of an upper cover of a laser according to an embodiment of the present disclosure;

fig. 12 is a top view of a laser upper cover according to an embodiment of the present disclosure;

fig. 13 is a partial cross-sectional view of the inside of an optical module according to an embodiment of the present application;

fig. 14 is a schematic diagram of a reverse structure of a circuit board according to an embodiment of the present disclosure;

fig. 15 is a schematic structural diagram of a base according to an embodiment of the present disclosure;

fig. 16 is a schematic structural diagram of a protective cover according to an embodiment of the present disclosure;

fig. 17 is a schematic structural diagram of a heat conduction column provided in an embodiment of the present application, which is disposed on an upper housing;

fig. 18 is a half sectional view of an optical module according to an embodiment of the present application;

fig. 19 is a partial enlarged view of a portion a in fig. 18.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes the interconnection among the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;

one end of the optical fiber 101 is connected with a far-end server, one end of the network cable 103 is connected with local information processing equipment, and the connection between the local information processing equipment and the far-end server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical network terminal 100 having the optical module 200.

An optical port of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the optical module realizes the interconversion of optical signals and electric signals, thereby realizing the establishment of information connection between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.

The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 through the optical network terminal 100, specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module.

At this point, a bidirectional signal transmission channel is established between the remote server and the local information processing device through the optical fiber, the optical module, the optical network terminal and the network cable.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network terminal is an upper computer of the optical module, provides data signals for the optical module, and receives the data signals from the optical module, and the common upper computer of the optical module also comprises an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network terminal structure. As shown in fig. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into the optical network terminal, specifically, the electrical port of the optical module is inserted into the electrical connector inside the cage 106, and the optical port of the optical module is connected to the optical fiber 101.

The cage 106 is positioned on the circuit board, and the electrical connector on the circuit board is wrapped in the cage, so that the electrical connector is arranged in the cage; the optical module is inserted into the cage, held by the cage, and the heat generated by the optical module is conducted to the cage 106 and then diffused by the heat sink 107 on the cage.

Fig. 3 is a schematic diagram of an optical module according to an embodiment of the present invention, and fig. 4 is a schematic diagram of an optical module according to an embodiment of the present invention. As shown in fig. 3 and 4, an optical module 200 according to an embodiment of the present invention includes an upper housing 201, a lower housing 202, an unlocking member, a circuit board 203, a protective cover 300, an optical fiber receptacle 400, and an optical fiber ribbon 401. Wherein, devices such as a silicon optical chip, a laser component and the like are arranged below the protective cover 300.

The upper case 201 and the lower case 202 form a case having a packing cavity. Specifically, the upper shell 201 is covered on the lower shell 202 to form a package cavity with two openings; the outer contour of the wrapping cavity is generally a square body, and specifically, the lower shell comprises a main plate and two side plates which are positioned at two sides of the main plate and are perpendicular to the main plate; the upper shell comprises a cover plate, and the cover plate covers two side plates of the upper shell to form a wrapping cavity; the upper shell can also comprise two side walls which are positioned at two sides of the cover plate and are perpendicular to the cover plate, and the two side walls are combined with the two side plates to realize that the upper shell covers the lower shell. Optionally, fins are arranged on the upper shell 201, and the upper computer is combined to assist in heat dissipation of the optical module.

The two openings may be two ends (204, 205) in the same direction, or two openings in different directions; one opening is an electric port 204, and a gold finger of the circuit board extends out of the electric port 204 and is inserted into an upper computer such as an optical network terminal; the other opening is an optical port 205 for external optical fiber access to connect with a silicon optical chip inside the optical module; the photoelectric devices such as the circuit board 203, the protective cover 300, the silicon optical chip, the laser assembly and the like are positioned in the packaging cavity.

The assembly mode of combining the upper shell and the lower shell is adopted, so that the circuit board 203, the protective cover 300 and the silicon optical chip and other devices can be conveniently installed in the shell, and the upper shell and the lower shell form the outermost packaging protective shell of the optical module; the upper shell and the lower shell are made of metal materials generally, so that electromagnetic shielding and heat dissipation are facilitated; generally, the housing of the optical module is not made into an integrated component, so that when devices such as a circuit board and the like are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component cannot be installed, and the production automation is not facilitated.

The unlocking component is located on the outer wall of the wrapping cavity/lower shell 202 and used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking component is provided with a clamping component matched with the upper computer cage; the end of the unlocking component can be pulled to enable the unlocking component to move relatively on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping component of the unlocking component; by pulling the unlocking component, the clamping component of the unlocking component moves along with the unlocking component, so that the connection relation between the clamping component and the upper computer is changed, the clamping relation between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.

The circuit board 203 is provided with circuit traces, electronic components (such as capacitors, resistors, triodes, and MOS transistors), and chips (such as an MCU, a clock data recovery CDR, a power management chip, and a data processing chip DSP).

The circuit board connects the electrical appliances in the optical module together according to the circuit design through circuit wiring to realize the functions of power supply, electrical signal transmission, grounding and the like.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; when the optical transceiver is positioned on the circuit board, the rigid circuit board can also provide stable bearing; the hard circuit board can also be inserted into an electric connector in the upper computer cage, and specifically, a metal pin/golden finger is formed on the surface of the tail end of one side of the hard circuit board and is used for being connected with the electric connector; these are not easily implemented with flexible circuit boards.

A flexible circuit board is also used in a part of the optical module to supplement a rigid circuit board; the flexible circuit board is generally used in combination with a rigid circuit board, for example, the rigid circuit board may be connected to the optical transceiver device through the flexible circuit board.

The periphery of the silicon optical chip is connected to the circuit board 203 via a plurality of conductive wires, so the silicon optical chip is generally disposed on the surface of the circuit board 203. The silicon optical chip is disposed on the circuit board 203 and electrically connected to the circuit board 203, and may be Wire Bonding, such as via a Gold Wire Bonding. However, the wire diameter of the gold wire is small and fragile, the wiring is dense, and the distance between wires is narrow, so that the phenomena of deformation, damage, collapse and the like are easily caused in the packaging process or the product use process of the optical module, thereby affecting the optical signal quality or causing the defects of short circuit, open circuit and the like. Therefore, a protective cover 300 is arranged, and the protective cover 300 covers the silicon optical chip and is used for protecting the routing of the silicon optical chip.

Specifically, the protective cover 300 covers the circuit board 203, the protective cover 300 covering the circuit board 203 forms a certain space with the circuit board 203, and the silicon optical chip and the routing area of the silicon optical chip are packaged in the space formed by the protective cover 300 and the circuit board 203. It should be noted that the package in the embodiment of the present application refers to an assembly form in which the space formed by the protection cover 300 and the circuit board 203, the silicon optical chip, the wire bonding area of the silicon optical chip, and other optoelectronic devices are in clearance fit with the protection cover 300.

Optionally, the inner surface of the protective cover 300, at a position corresponding to the wiring area, is provided with a first recess for avoiding a gold wire, so that the wiring area of the gold wire can be completely protected, the problems that the gold wire is easily deformed, damaged and collapsed in the existing optical module scheme are effectively solved, and the defects of short circuit, open circuit and the like can be avoided, thereby ensuring the optical signal quality.

The silicon optical chip is connected with an optical fiber socket 400 through an optical fiber ribbon 401, and the optical fiber socket 400 is used for coupling and connecting external optical fibers of the optical module. Optional optical fiber ribbons 401 include a first optical fiber ribbon for transmitting the signal light modulated by the silicon optical chip to the outside of the optical module, and a second optical fiber ribbon for receiving the signal light outside the optical module and transmitting the signal light to the silicon optical chip. The silicon optical chip receives light from the laser assembly, further modulates the light, specifically loads a signal on the light, and transmits the signal to the outside of the optical module through the first optical fiber ribbon; the silicon optical chip receives light from the second optical fiber ribbon and converts the optical signal into an electrical signal.

In order to facilitate the silicon optical chip to receive and emit light, in a specific embodiment of the present application, the silicon optical chip includes a plurality of optical holes, and the plurality of optical holes are configured to receive light transmitted by the laser component, output modulated signal light, and receive signal light transmitted to the silicon optical chip through an optical fiber outside the optical module. Optionally, the silicon optical chip includes a first optical aperture, a second optical aperture, and a third optical aperture, and the optical aperture has a plurality of optical channels therein. The first optical hole is used for coupling and connecting a first optical fiber ribbon and is used for transmitting the modulated signal light to the first optical fiber ribbon; the second optical hole is used for coupling and connecting a second optical fiber ribbon and receiving signal light transmitted through the second optical fiber ribbon; the third light hole is coupled with the laser assembly and used for receiving light which is emitted by the light source and does not carry signals.

The silicon optical chip internally comprises a Mach-Zehnder modulator, and optical signals are modulated by combining the Mach-Zehnder modulator, the transimpedance amplifier, the laser driver and other devices. The Mach-Zehnder modulator modulation adopts the same-wavelength light interference principle, one Mach-Zehnder modulator is provided with two interference arms, one beam of light is input to one single interference arm, two beams of light with the same wavelength need to be provided for one Mach-Zehnder modulator in total, and after the light is modulated by the Mach-Zehnder modulator, the light on the interference arms can be combined into one beam of light.

In an embodiment of the present application, the laser assembly comprises several laser assemblies. The third optical hole comprises a plurality of optical channels, and then a plurality of paths of light with the same wavelength can be input into the silicon optical chip through the optical channels, so as to provide light with the same wavelength for each interference arm of the Mach-Zehnder modulator. Because the light emitting power of a single laser chip is limited, the light of a plurality of laser chips can be superposed to increase the light power of a single wavelength, whereas in the prior art, the light of different wavelengths is generally provided among the plurality of laser chips, and the light power of the single wavelength is not superposed to increase.

Fig. 5 is a schematic front view of the circuit board 203 according to an embodiment of the present disclosure, and fig. 6 is a schematic structural view of the circuit board 203 with a protective cover removed. As shown in fig. 5 and 6, the protective cover 300 is disposed on the circuit board 203, and the laser module, the silicon optical chip 600, and the like are covered in a cavity formed by the protective cover 300 and the circuit board 203.

Fig. 7 is a first partial structure schematic view of an optical module according to an embodiment of the present application, fig. 8 is a second partial structure schematic view of the optical module according to the embodiment of the present application, fig. 9 is a first exploded view of fig. 8, and fig. 10 is a second exploded view of fig. 8. The structures shown in fig. 7-10 are located in the space formed by the protective cover and the circuit board. As shown in fig. 7 to 10, the optical module provided by the embodiment of the present application further includes a base 700, a laser cover 206, a laser assembly, and a silicon optical chip 600.

The laser assembly and the silicon optical chip 600 are attached to the base 700, the base 700 is fixedly connected to the bottom of the laser upper cover 206 and used for covering the laser assembly, and the laser assembly is arranged between the laser upper cover 206 and the base 700. The laser assembly and the silicon optical chip 600 are directly arranged on the base, so that the base can directly radiate the laser assembly and the silicon optical chip 600, the internal radiation of the optical module is convenient to realize, and the internal heat of the optical module is prevented from being concentrated and accumulated. Meanwhile, the laser assembly arranged on the base 700 is directly wrapped by the upper cover of the laser, so that the packaging of the laser assembly is saved and the packaging of the laser assembly is facilitated. Further, the laser assembly and the silicon optical chip 600 are directly attached to the base 700, so that the laser assembly and the silicon optical chip 600 are located on the same base, i.e. the laser assembly and the silicon optical chip 600 share the base; when the base 700 is heated to deform, the influence on the laser assembly and the silicon optical chip 600 is the same, so that the optical alignment stability of the laser assembly and the silicon optical chip 600 is good, and the assembly requirements of the laser assembly and the silicon optical chip are further simplified.

Optionally, the bottom of the laser cover 206 is fixedly connected to the base 700, for example, a fixing adhesive is used to fix the bottom of the laser cover 206 on the base 700. The laser cover 206 cooperates with the circuit board and base 700 to provide a relatively sealed environment for the laser assembly, thereby protecting the components of the laser assembly. The upper surface of the silicon optical chip 600 is provided with a transimpedance amplifier 601 and a laser driver 602.

In the embodiment of the present application, the base 700 is disposed on or mounted on a circuit board. Specifically, the base 700 is attached to the circuit board; alternatively, the circuit board is provided with a through hole, and the base 700 is embedded in the through hole.

In the embodiment of the present application, the laser assembly includes a first laser assembly 501 and a second laser assembly 502, and the first laser assembly 501 and the second laser assembly 502 emit light that does not carry a signal. A first laser assembly 501 and a second laser assembly 502 are attached to the base 700. Optionally, the first laser assembly 501 and the second laser assembly 502 are connected to a circuit on the circuit board by wire bonding.

Further, the optical module provided by the embodiment of the application further comprises a lens and an isolator. The lens, isolator and laser assembly cooperate to define a cavity formed by the laser cap 206 and the base 700. For example, a lens, specifically a focusing lens, is disposed in the light-emitting direction of the laser chip, and is located between the laser chip and the sealed light-transmitting member, and is used for converging light emitted by the laser chip for subsequent coupling; or two lenses, specifically a collimating lens and a focusing lens, are arranged in the light emitting direction of the laser chip, light emitted by the laser chip is changed into collimated light through the collimating lens, the collimated light can keep smaller optical power attenuation in the longer distance light transmission process, and the focusing lens receives the collimated light so as to converge and couple the light into the silicon optical chip. The isolator is used for preventing light emitted by the laser chip from returning to the laser chip after being emitted, so that the isolator is arranged in the light emitting direction of the laser chip. In the embodiment of the application, the isolator is arranged in the direction of the lens towards the laser chip, namely, a focusing lens is arranged between the isolator and the laser chip.

As shown in fig. 9 and 10, a first collimating lens, a first focusing isolator, and a focusing lens are sequentially disposed along the light emitting direction of the first laser module 501, and a second collimating lens, an isolator, and a second focusing lens are sequentially disposed along the light emitting direction of the second laser module 502. The first laser assembly 501 and the second laser assembly 502 may share an isolator and a sealed optically transparent member. The first collimating lens, the first focusing lens, the second collimating lens, the second focusing lens, the isolator and the sealing light-transmitting member are fixedly disposed on the base 700.

Optionally, the base 700 includes a base first region 701, a base second region 702, a base third region 703 and a base fourth region 704 on the top surface. The first base region 701, the second base region 702 and the third base region 703 are located at one end of the base 700, and the fourth base region 704 is located at the other end of the base 700. The second region 702 of the base is used for fixing and carrying the laser component, and the fourth region 704 of the base is used for fixing and carrying the silicon optical chip 600. Optionally, base first section 701 is configured to support a first fiber optic ribbon and base second section 702 is configured to support a second fiber optic ribbon.

A first gap 705 is arranged between the first base region 701 and the second base region 702, a second gap 706 is arranged between the second base region 702 and the third base region 703, and the laser upper cover 206 is mounted and fixed through the first gap 705 and the second gap 706. Optionally, the bottom of the laser upper cover 206 is clamped in the first gap 705 and the second gap 706, so as to achieve the mounting and fixing of the laser upper cover 206. Preferably, first gap 705 and second gap 706 are slightly wider than the width of the bottom of laser cap 206. Therefore, the laser upper cover 206 can be conveniently installed and fixed, the heat generated by the laser component on the base second region 702 is reduced to be conducted to the base first region 701 and the base third region 703, and the heat insulation among the base second region 702, the base first region 701 and the base third region 703 is realized. Since the laser assembly generates a large amount of heat during operation, which is one of the main heat sources in the optical module, the first gap 705 and the second gap 706 are provided to effectively reduce the lateral transfer of heat.

Fig. 11 is a perspective view of a laser upper cover 206 according to an embodiment of the present disclosure, and fig. 12 is a top view of the laser upper cover 206 according to an embodiment of the present disclosure. As shown in fig. 11 and 12, the laser upper cover 206 includes a top plate 2061, a first side plate 2062, a second side plate 2063, and a third side plate 2064. The first side plate 2062 is provided on one side in the longitudinal direction of the top plate 2061, the second side plate 2063 is provided on the other side in the longitudinal direction of the top plate 2061, and the fourth side plate 2064 is provided at the left end of the top plate 2061.

Optionally, the first side plate 2062, the second side plate 2063, and the third side plate 2064 form a first notch, and the first notch is used for penetrating out of the device; the top plate 2061, the first side plate 2062 and the second side plate 2063 form a second gap, and the second gap is used for transmitting light. When the laser upper cover 206 is covered on the laser assembly, the second gap is provided with a sealing light-transmitting piece, so that the laser upper cover 206 can form a relatively sealed space through the sealing light-transmitting piece, and meanwhile, the light generated by the laser assembly can be ensured to normally pass through. The laser cover 206 may be made of a thermally conductive material selected from an opaque material, such as a copper alloy. In the embodiment of the present application, the left end of the laser cover 206 is close to the laser assembly, and then the left end of the top plate 2061 is close to the laser assembly, and the right end of the top plate 2061 is close to the silicon optical chip 600.

In the embodiment of the present application, the sealing light-transmitting member plays a role in sealing the laser upper cover and transmitting light, and forms a side surface of the laser upper cover for light emission. The working environment of photoelectric devices such as a laser component and the like needs to be sealed to a certain degree so as to prevent the refraction influence of water vapor and the like on the devices and a light path, and the sealed light-transmitting piece plays a role in sealing a laser box; meanwhile, light emitted by the laser chip needs to be emitted out of the upper cover of the laser, and the sealing light-transmitting piece is used as a component part arranged on the upper cover of the laser and needs to have light-transmitting property so as to enable light generated by the laser component to be emitted out.

The light beam is emitted from the light emitting surface of the sealed light-transmitting piece, the emitted light beam enters the silicon optical chip, and the light beam is required to be emitted into the light incident surface of the silicon optical chip at a non-vertical angle in order to prevent the light beam from being reflected when entering the silicon optical chip and avoid optical power loss caused by reflection. Specifically, the waveguide structure for receiving light in the silicon optical chip and the light incident surface of the silicon optical chip are arranged at an acute angle, which requires that light beams are incident in a direction opposite to the waveguide structure after being refracted at the light incident surface of the silicon optical chip, and the direction is not consistent with the light emergent direction of the laser chip. The embodiment of the application designs the sealed light-transmitting piece at the second notch of the upper cover of the laser, and the light-emitting direction of the laser component is changed through the optical structure of the sealed light-transmitting piece so as to meet the light-entering requirement of the silicon optical chip.

Further, as shown in fig. 12, the left end surface of the laser upper cover 206 is inclined, and the left end surface of the laser upper cover 206 is not perpendicular to the side surfaces in the length direction of the first side plate 2062 and the second side plate 2063. In this embodiment, the length direction of the laser upper cover 206 is not parallel to the third optical aperture, i.e. the length direction of the laser upper cover 206 is not perpendicular to the surface of the silicon optical chip facing the laser module, which is helpful to meet the light incident requirement of the silicon optical chip and ensure that the light emitted by the laser module is incident to the third optical aperture.

Optionally, base 700 is a copper alloy heat sink base. Further, a base fixing hole is formed in the circuit board. The base 700 is clamped in the base fixing hole. The thermal conductivity of the base 700 material is higher than that of the circuit board material, so that the base 700 is used for replacing part of the structure of the circuit board, the thermal conductivity of the base is improved relative to the original circuit board, and the heat generated by the laser assembly and the silicon optical chip is conveniently diffused.

Fig. 13 is a partial cross-sectional view of an interior of an optical module according to an embodiment of the present application. As shown in fig. 13, the laser upper cover 206 covers the first laser assembly 501 and the second laser assembly 502, the projection of the top plate 2061 on the base 700 covers the first laser assembly 501 and the second laser assembly 502, the bottom of the first side plate 2062 is clamped in the first gap 705, the bottom of the second side plate 2063 is clamped in the second gap 706, and the first side plate 2062 and the second side plate 2063 are combined with the first gap 705 and the second gap 706 to fix the laser upper cover 206.

Optionally, the width of the first gap 705 is greater than the thickness of the bottom of the first side plate 2062, the width of the second gap 706 is greater than the thickness of the bottom of the second side plate 2063, and thus when the bottom of the first side plate 2062 is engaged in the first gap 705 and the bottom of the second side plate 2063 is engaged in the second gap 706, there are voids in both the first gap 705 and the second gap 706. Therefore, the laser upper cover 206 can be conveniently installed and fixed, the laser component on the second base area 702 can generate heat for longitudinal transmission, the heat generated by the laser component on the second base area 702 can be reduced to be conducted to the first base area 701 and the third base area 703, and the heat insulation between the second base area 702 and the first base area 701 and the third base area 703 can be realized.

Fig. 14 is a schematic reverse structure diagram of a circuit board 203 according to an embodiment of the present disclosure. As shown in fig. 14, a base fixing hole 2031 is provided on the circuit board 203, the base fixing hole 2031 penetrates the upper and lower surfaces of the circuit board 203, and the base 700 is engaged in the base fixing hole 2031. Optionally, a side of the base 700 facing away from the fixed protective cover 300 contacts the housing, e.g. an inner surface of the lower housing of the optical module. Preferably, the side of the base 700 facing away from the fixed laser assembly and the silicon die is contacted to the housing by a thermal pad, such as a third thermal pad.

Fig. 15 is a schematic structural diagram of a base 700 according to an embodiment of the present disclosure. As shown in fig. 15, the base 700 includes a base first region 701, a base second region 702, a base third region 703, and a base fourth region 704. The first base area 701, the second base area 702 and the third base area 703 are arranged side by side, a first gap 705 is arranged between the first base area 701 and the second base area 702, a second gap 706 is arranged between the second base area 702 and the third base area 703, and the fourth base area 704 is arranged at one end of the first base area 701, the second base area 702 and the third base area 703. Further, the first step surface 707 is provided at the side of the base first region 701, the base second region 702, the base third region 703 and the base fourth region 704. The first step surface 707 serves to support the circuit board when the base 700 is snapped into a base fixing hole on the circuit board. Meanwhile, in order to fixedly connect the base 700 to the circuit board, glue is generally used to bond the contact portion of the base 700 to the circuit board, so that the first step surface 707 facilitates bonding the base 700 to the circuit board.

Fig. 16 is a schematic structural diagram of a protective cover 300 according to an embodiment of the present disclosure. As shown in fig. 16, the protective cover 300 is provided with a first through hole 301 and a second through hole 302. The first through hole 301 is arranged at a position corresponding to the position of the laser assembly, and the second through hole 302 is arranged at a position corresponding to the position of the silicon optical chip. That is, when the protective cover 300 is fixedly covered on the circuit board, the projection of the first through hole 301 on the circuit board covers the laser assembly, and the projection of the second through hole 302 on the circuit board covers the silicon optical chip.

Optionally, the cross-sectional area of the first through hole 301 near the laser assembly is relatively small, and the cross-sectional area of the second through hole 302 near the silicon optical chip is relatively small. For example, the cross-sectional area of the first through hole 301 gradually increases from the position close to the laser assembly to the direction away from the laser assembly, and the cross-sectional area of the second through hole 302 gradually increases from the position close to the silicon microchip to the direction away from the silicon microchip. Further, a first inclined plane 3011 is provided at the edge of the first through hole 301, the sectional area of the first through hole 301 is enlarged by the first inclined plane 3011, a second inclined plane 3021 is provided at the edge of the second through hole 302, and the sectional area of the second through hole 302 is enlarged by the second inclined plane 3021.

In the embodiment of the present application, the protection cover 300 is fixedly connected to the circuit board. Optionally, the protective cover 300 is bonded to the circuit board by glue; alternatively, the protective cover 300 is fixedly connected to the circuit board by at least two fixing pins. For example, a fixing hole is provided at a position corresponding to the fixing pin on the substrate, and the fixing pin is engaged with the fixing hole, so that the shell-shaped protector can be fixed on the circuit board. It should be noted that the specific position of the fixing pin on the shell-shaped protective body can be determined according to the position of the openable hole of the circuit board. Generally, to open a hole in a circuit board, it is necessary to avoid the circuit and electronic devices such as resistors, capacitors, inductors, etc. on the circuit board.

In the embodiment of the present application, the protective cover 300 may be made of a transparent resin material such as PEI (Polyetherimide) or PC (Polycarbonate). The PEI material has strong high-temperature stability and high temperature resistance, the thermal deformation temperature reaches 220 ℃, and the PEI material can be used for a long time at the working temperature of minus 160-180 ℃. PEI also has good flame retardancy (flame rating UL 94-V-0), chemical resistance, and electrical insulation properties. And can process thin-walled products.

In addition, the inner surface and the outer surface of the protective cover 300 provided by the embodiment of the application are both subjected to mirror polishing, when a gold wire is damaged in an optical module, the protective cover 300 does not need to be disassembled, the damaged position of the gold wire can be visually determined, and for example, which specific gold wire is broken can be directly observed.

In the embodiment of the present application, the bottom of the edge of the first through hole 301 on the protective cover 300 presses the laser upper cover, and the bottom of the edge of the second through hole 302 presses the silicon optical chip. Optionally, the bottom of the edge of the second via hole 302 is pressed against the silicon optical chip by pressing the transimpedance amplifier and the laser driver.

In the embodiment of the application, the inner wall of the shell is provided with the plurality of heat-conducting columns, and the heat-conducting columns are used for conducting heat inside the optical module shell to the shell of the optical module, so that heat dissipation inside the optical module is facilitated. Optionally, the heat-conducting pillars are respectively disposed at positions corresponding to the laser assembly, the silicon optical chip, and the like. The heat-conducting column can be arranged according to the actual position of the laser assembly, the silicon optical chip and the like, such as on the inner wall of the upper shell or the inner wall of the lower shell. Assuming that the laser assembly, the silicon optical chip, and the like are disposed on a side of the circuit board facing the upper case, the heat conductive pillar is disposed on an inner wall of the upper case. Optionally, the heat conducting columns are of a conical structure.

Fig. 17 is a schematic structural diagram of a heat conduction column provided in an embodiment of the present application and disposed on an upper housing. As shown in fig. 17, the upper housing 201 is provided with a first heat conduction post 2011 and a second heat conduction post 2012. The projections of the first thermal conductive post 2011 and the second thermal conductive post 2012 in the direction of the circuit board 203 are covered on the base 700. Further, the projection of the first thermal conductive post 2011 in the direction of the circuit board 203 covers the laser upper cover 206, and the projection of the second thermal conductive post 2012 in the direction of the circuit board 203 covers the silicon optical chip. The cross-sectional area of the free end of the first heat-conducting post 2011 is smaller than the cross-sectional area of the contact position of the first heat-conducting post 2011 and the inner wall of the upper shell 201, and the cross-sectional area of the free end of the second heat-conducting post 2012 is smaller than the cross-sectional area of the contact position of the second heat-conducting post 2012 and the inner wall of the upper shell 201. Optionally, the cross-sectional area of the first heat-conducting post 2011 increases gradually from the free end to the contact with the inner wall of the upper housing 201, and the cross-sectional area of the second heat-conducting post 2012 increases gradually from the free end to the contact with the inner wall of the upper housing 201.

In this embodiment, the first heat-conducting post 2011 and the second heat-conducting post 2012 can be integrally formed with the upper housing 201, and can also be independent components, and are assembled with the upper housing 201 after being processed.

Fig. 18 is a half-sectional view of an optical module according to an embodiment of the present application, and fig. 19 is a partially enlarged view of a portion a in fig. 18. As shown in fig. 18 and 19, the top of the base 700 is embedded in a base fixing hole 2031 formed in the circuit board 203, a laser module and a silicon optical chip 600 are disposed on the top surface of the base 700, a laser upper cover 206 is covered above the laser module, a protective cover 300 is covered on the circuit board 203 and forms a cavity with the circuit board 203, and the laser module, the silicon optical chip 600 and the laser upper cover 206 are enclosed in the cavity formed by the protective cover 300 and the circuit board 203. The bottom surface of the base 700 is provided with a third thermal pad 209 for dissipating heat in the bottom surface direction of the base 700. The third thermal pad 209 may be formed by a thermal paste.

As shown in fig. 18 and 19, a first thermal conductive post 2011 contacts and connects to the laser cap 206 through the first via 301, and a second thermal conductive post 2012 contacts and connects to the transimpedance amplifier and the laser driver on top of the silicon optical chip 600 through the second via 302. The first inclined plane 3011 expands the sectional area of the first through hole 301, so as to facilitate the first heat-conducting post 2011 to penetrate through; the second inclined surface 3021 expands the cross-sectional area of the second through hole, facilitating the second heat-conducting pillar 2012 to be inserted therethrough.

Optionally, one side of the laser upper cover 206, which is away from the laser assembly, is provided with a first heat conduction pad 207, the free end of the first heat conduction column 2011 is in contact with the laser upper cover 206 through the first heat conduction pad 207, and then heat generated by the laser assembly is transferred to the laser upper cover 206, and then heat on the laser upper cover 206 is transferred to the first heat conduction column 2011 through the first heat conduction pad 207, and is transferred to the upper shell 201 through the first heat conduction column 2011, so that heat is dissipated through the upper shell 201. The first thermal pad 207 is used to ensure the efficiency of transferring heat from the laser cap 206 to the first thermal post 2011. The first thermal pad 207 may be formed by a thermal paste.

Optionally, a second thermal pad 208 is disposed on a side of the transimpedance amplifier and the laser driver on the top of the silicon optical chip 600, which faces away from the silicon optical chip 600, and a free end of the second thermal stud 2012 is in contact with the transimpedance amplifier and the laser driver through the second thermal pad 208. The transimpedance amplifier and the laser driver are main heat sources in the optical module, when the second heat-conducting column 2012 is in contact connection with the transimpedance amplifier and the laser driver through the second heat-conducting pad 208, heat generated by the transimpedance amplifier and the laser driver is transmitted to the second heat-conducting column 2012 through the second heat-conducting pad 208, transmitted to the upper shell 201 through the second heat-conducting column 2012, and radiated through the upper shell 201. The second thermal pad 208 is used to ensure the efficiency of heat transfer from the transimpedance amplifier and the laser driver to the second thermal stud 2012. The second thermal pad 208 may be formed by a thermal paste.

In the optical module that this application embodiment provided, on laser subassembly and silicon optical chip set up the base, laser subassembly and silicon optical chip respectively with circuit board routing connection, the laser instrument upper cover is established to the laser subassembly upper cover, the safety cover is established to the cover on the base, laser subassembly and silicon optical chip encapsulation are in the space that base and safety cover formed, realize through the routing connection of safety cover protection laser subassembly and circuit board and with the routing connection of silicon optical chip and circuit board. In addition, a first through hole and a second through hole are formed in the protective cover, the first through hole corresponds to the position of the laser assembly, and the second through hole corresponds to the position of the silicon optical chip; a first heat conduction column and a second heat conduction column are arranged on a shell of the optical module, the first heat conduction column corresponds to the position of the first through hole, the first heat conduction column extends into the first through hole, the second heat conduction column corresponds to the position of the second through hole, and the second heat conduction column extends into the second through hole. Because first heat conduction post and second heat conduction post are the good conductor of heat, the laser subassembly is conducted to first heat conduction post through the heat-conduction that first through-hole effused, the silicon optical chip is through the heat-conduction that second through-hole effused to the second heat conduction post, then through this first heat conduction post and second heat conduction post transmission to the casing of optical module on, and then with heat-conduction to the outside of optical module, realize forming the heat conduction route of laser subassembly and silicon optical chip through first heat conduction post and second heat conduction post, the heat dissipation of laser subassembly and silicon optical chip under the safety cover of being convenient for, avoid the inside heat of optical module to concentrate and pile up.

The same and similar parts among the embodiments in the specification are referred to each other. It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (9)

1. A light module, comprising:

a circuit board is provided with a plurality of circuit boards,

the base is embedded on the circuit board;

the laser assembly is attached to the base and used for emitting light which does not carry signals;

the silicon optical chip is attached to the base and provided with a third optical hole, and light which is emitted by the laser assembly and does not carry signals is received through the third optical hole;

the bottom of the laser upper cover is fixedly connected with the base and is used for covering the upper part of the laser assembly, and the laser assembly is arranged between the laser upper cover and the base;

the laser device comprises a base, a laser device upper cover and a laser device, wherein a first gap and a second gap are arranged on the base, and the laser device upper cover extends into the first gap and the second gap through the bottom to be fixedly connected with the base.

2. The light module of claim 1, wherein the base comprises a base first region, a base second region, a base third region, and a base fourth region; the first base area, the second base area and the third base area are positioned at the left part of the base, and the fourth base area is positioned at the right part of the base; the first gap is arranged between the second base area and the first base area; the second gap is arranged between the second region of the base and the third region of the base;

the laser assembly is attached to the second area of the base, and the silicon optical chip is attached to the fourth area of the base;

the bottom of the laser upper cover is clamped in the first gap and the second gap.

3. The optical module of claim 1, wherein the laser upper cover comprises a top plate and a first side plate, a second side plate and a third side plate connected to the top plate;

the first side plate and the second side plate are respectively arranged along the length direction of the top plate; the third side plate is arranged along the direction perpendicular to the length direction of the top plate, the third side plate is arranged at the left end of the top plate, and the third side plate, the first side plate and the second side plate form a first gap;

the top plate, the first side plate and the second side plate form a second notch at the right end of the upper cover of the laser, and the end face of the second notch is inclined.

4. The optical module as claimed in claim 1, wherein the circuit board is provided with a base fixing hole, and the base is embedded in the base fixing hole.

5. The optical module as claimed in claim 4, wherein the base has a first step surface, and the first step surface is connected to the circuit board so that the upper portion of the base is inserted into the base fixing hole.

6. The optical module of claim 1, wherein the laser assembly and the silicon optical chip are wire bonded to the circuit board;

the optical module further comprises a protective cover, wherein the protective cover covers the circuit board and is used for protecting the laser assembly and the routing of the silicon optical chip.

7. The optical module according to claim 6, wherein the protective cover is provided with a first through hole and a second through hole, the first through hole corresponds to the position of the laser upper cover, and the second through hole corresponds to the position of the silicon optical chip;

the optical module comprises an upper shell and a lower shell; a first heat-conducting column and a second heat-conducting column are arranged on the inner wall of the upper shell, the first heat-conducting column corresponds to the position of the first through hole and extends into the first through hole, the second heat-conducting column corresponds to the position of the second through hole and extends into the second through hole; the lower housing supports the base.

8. The optical module according to claim 7, wherein a first slope is provided in the first through hole, the first slope being inclined toward a top surface of the protective cover; a second inclined plane is arranged in the second through hole, and the second inclined plane inclines towards the top surface of the protective cover; the cross-sectional area of the first heat conduction column is gradually reduced from the contact part with the shell; the cross-sectional area of the second heat conduction column is gradually reduced from the contact part with the shell.

9. A light module, comprising:

a circuit board;

a base disposed on the circuit board;

the laser assembly is attached to the base and used for emitting light which does not carry signals;

the silicon optical chip is attached to the base and positioned on the same side of the base as the laser assembly, a third light hole is formed in the silicon optical chip, and light which is emitted by the laser assembly and does not carry signals is received through the third light hole;

the bottom of the laser upper cover is fixedly connected with the base and is used for covering the upper part of the laser assembly, and the laser assembly is arranged between the laser upper cover and the base;

the laser device comprises a base, a laser device upper cover and a laser device, wherein a first gap and a second gap are arranged on the base, and the laser device upper cover extends into the first gap and the second gap through the bottom to be fixedly connected with the base.

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