CN110376690A - A kind of optical module - Google Patents
A kind of optical module Download PDFInfo
- Publication number
- CN110376690A CN110376690A CN201910667924.XA CN201910667924A CN110376690A CN 110376690 A CN110376690 A CN 110376690A CN 201910667924 A CN201910667924 A CN 201910667924A CN 110376690 A CN110376690 A CN 110376690A
- Authority
- CN
- China
- Prior art keywords
- pedestal
- cover board
- heat
- optical device
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4267—Reduction of thermal stress, e.g. by selecting thermal coefficient of materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
Abstract
The present patent application provides a kind of optical module, the optical module includes optical device, pedestal, cover board and the handle being set on the pedestal, the handle is set to the end of the pedestal, the cover board is fastened and connected on the pedestal, the optical device is set to be enclosed by the pedestal and the cover board and set in the accommodation space formed, multiple pits towards its inside recess setting are set on the bottom surface of the cover board or the pedestal, multiple pits are laid on the cover board or the pedestal in the form of matrix array, heat-conducting pad is set between the pit and the optical device, the one side of the heat-conducting pad at least fits in the pit, the another side of the heat-conducting pad fits in the surface of the optical device, the thermally conductive rubber mat in part is limited in pit, thus thermally conductive rubber mat can be limited, irregular diffusion deformation occurs to be extruded in The side of optical device, and then guarantee the coupling tolerances between optical device and casing, guarantee the optical power of optical module.
Description
Technical field
The present invention relates to technical field of photo communication, more particularly to a kind of optical module.
Background technique
Optical module is the core devices for transmitting optical signal by optical fiber in fiber optic network.Existing module rate is higher and higher
It rises to from 25G to 200G, even 400G.Optical communications module high integration, the development trend of high-speed, so that optical module is towards more
Channel, miniaturization, high density direction continue to develop.Optical module power constantly increases simultaneously, and volumetric thermal density also constantly increases,
Temperature is very high when optical module being caused to work, thermally sensitive electric light/photoelectric conversion component and chip performance in optical module
It will be greatly reduced, even resulting in entire optical module can not work normally or fail.For the heat dissipation for guaranteeing optical module, generally use
The heat-conducting pad for being attached at optical device surface conducts optical device surface heat, at the same heat-conducting pad also with case surface phase
Fitting, so that heat is diffused via shell, but the material of heat-conducting pad is heat-conducting silicone grease, and heat-conducting silicone grease silicone oil is high,
Mobility is strong, and silicone oil is volatile to optical device inside or other marginal positions, between thus making between optical device and casing
Gap changes, and then because coupling tolerances change, so that a certain optical path or multichannel optical path in optical device deflect, leads
Optical power is caused to fall.
Summary of the invention
To overcome the problems in correlation technique, the present patent application provides a kind of optical module, and limitation is arranged on casing
Pit of the heat-conducting pad when being diffused flowing under heated, and then guarantee the coupling tolerances of optical device and casing, guarantee light
Power.
The present patent application provides a kind of optical module in implementing, and the optical module includes optical device, pedestal, cover board and is set to
Handle on the pedestal, the handle are set to the end of the pedestal, and the cover board is fastened and connected on the pedestal, institute
It states optical device and is set to be enclosed by the pedestal and the cover board and set in the accommodation space formed, the bottom of the cover board or the pedestal
Multiple pits towards its inside recess setting are set on face, and multiple pits are laid in the cover board in the form of matrix array
Or on the pedestal, heat-conducting pad is set between the pit and the optical device, the one side of the heat-conducting pad is at least pasted
Together in the pit, the another side of the heat-conducting pad fits in the surface of the optical device.
Further, the optical device includes optical transmitter module or optical receiver module.
Further, the pit toward the cover board inside and is depressed in set by the inner surface of the cover board；Or
The pit is toward the pedestal inside and is depressed in set by the inner surface of the pedestal.
Further, the opposite surface of the inner surface of the cover board pedestal coupled for the cover board,
The opposite surface of the inner surface of the pedestal cover board coupled for the pedestal.
Further, the matrix array form is is spaced along the length and width direction of the pedestal or the cover board
It lays.
Further, the material of the heat-conducting pad is heat-conducting silicone grease.
Compared with the relevant technologies, the beneficial effect for the technical solution that the present patent application is proposed includes:
The present patent application provides a kind of optical module in implementing, and the optical module includes optical device, pedestal, cover board and is set to described
Handle on pedestal, the handle are set to the end of the pedestal, and the cover board is fastened and connected on the pedestal, the light
Device is set to be enclosed by the pedestal and the cover board and set in the accommodation space formed, on the bottom surface of the cover board or the pedestal
Multiple pits towards its inside recess setting are set, and multiple pits are laid in the cover board or institute in the form of matrix array
It states on pedestal, heat-conducting pad is set between the pit and the optical device, the one side of the heat-conducting pad at least fits in
In the pit, the another side of the heat-conducting pad fits in the surface of the optical device, and the thermally conductive rubber mat in part is limited to pit
It is interior, it thus can limit thermally conductive rubber mat and irregular diffusion deformation occurs to be extruded in the side of optical device, and then guarantee optical device
Coupling tolerances between casing guarantee the optical power of optical module.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not
It can the limitation present invention.
Detailed description of the invention
The drawings herein are incorporated into the specification and forms part of this specification, and shows and meets implementation of the invention
Example is simultaneously used to explain the principle of the present invention together with specification.
Technical solution in order to illustrate the embodiments of the present invention more clearly or in prior art, below will to embodiment or
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Bright some embodiments for those of ordinary skill in the art without creative efforts, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the perspective view of the explosion of the optical module provided in the embodiment of the present invention；
Fig. 2 is the schematic diagram of top cover in the optical module provided in the embodiment of the present invention；
Fig. 3 is another schematic diagram of top cover in the optical module provided in the embodiment of the present invention；
Fig. 4 is the schematic diagram of heat-conducting pad after the compression provided in the embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment belongs to the range that the present invention is protected.
In the description of the present invention, it is to be understood that, term " on ", "lower", "vertical", "horizontal", "inner", "outside" etc.
The orientation or positional relationship of instruction is method based on the figure or positional relationship, is merely for convenience of the description present invention and letter
Change description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific orientation construct and
Operation, therefore be not considered as limiting the invention.Term " first ", " second " are used for description purposes only, and cannot understand
For indication or suggestion relative importance or implicitly indicate or imply include one or more technical characteristic.By
This defines " first ", the feature of " second " can explicitly or implicitly include one or more of the features.In this hair
In bright description, unless otherwise indicated, the meaning of " plurality " is two or more.
It please refers to shown in Fig. 1-4, provides a kind of optical module in the present patent application implementation, optical module includes optical device 10, base
Seat 21, cover board 22 and the handle 30 being set on pedestal 21, handle 30 are set to the end of pedestal 21, cover board 22 be fastened and connected in
On pedestal 21, optical device 10 is set to be enclosed by pedestal 21 and cover board 22 and set in the accommodation space formed, wherein optical device 10 includes
Optical transmitter module or optical receiver module realize the transmission to signal by optical device 10.
Cover board 22 is fastened and connected on pedestal 21, facilitates the disassembly between cover board 22 and pedestal 21.Further, in pedestal
21 enclose to set and are additionally provided with the other elements such as circuit board in the accommodation space to be formed with cover board 22, are enclosed by pedestal 21 and cover board 22 and set shape
At the encapsulation accommodation space of each element.
Be arranged on the bottom surface of cover board 22 or pedestal 21 it is multiple towards its inside recess setting pits 40, pit 40 toward
On the inside of cover board 22 and it is depressed in set by the inner surface of cover board 22；Or pit 40 toward 21 inside of pedestal and is depressed in pedestal 21
Inner surface set by, specifically, the opposite surface of the inner surface of cover board 22 pedestal 21 coupled for cover board 22, base
The opposite surface of the inner surface of seat 21 cover board 22 coupled for pedestal 21.
Multiple pits 40 are laid on cover board 22 or pedestal 21 in the form of matrix array, and matrix array form is along pedestal 21
Or the length and width direction of cover board 22 is spaced laying, wherein the length direction of pedestal 21 or cover board 22 referring to Figure 1 in A
To shown, the width direction of pedestal 21 or cover board 22 referring to Figure 1 in B to shown.
To realize the conduction of 10 surface heat of sun adjuster part, the heat dissipation of sun adjuster part 10 is realized, in pit 40 and optical device 10
Between be arranged heat-conducting pad 50, wherein the material of heat-conducting pad 50 be heat-conducting silicone grease.The one side of heat-conducting pad 50 at least fits in
In pit 40, the another side of heat-conducting pad 50 fits in the surface of optical device 10.Heat-conducting pad 50 is located in optical device 10 and base
Between seat 21 or cover board 22, and fit in 50 part of heat-conducting pad in pit 40 namely 50 court of heat-conducting pad
It is embedded in pit 40, is thus formed on heat-conducting pad 50 symmetrical with pit 40 in the part of the surface of cover board 22 or pedestal 21
Rectangular array lay protrusion, it is shown in Figure 4.When 50 part of heat-conducting pad is fitted in pit 40, compression can be limited
Heat-conducting pad 50 arbitrarily spread along different directions so that 50 part of heat-conducting pad is confined in pit 40, prevent from leading as a result,
Heat pad piece 50, because of any direction occurs in it diffusion and movement, leads to the coupling between heat-conducting pad 50 and optical device 10 when being pressurized
Conjunction tolerance changes or the side of sun adjuster part 10 is squeezed, and then influences work of the optical device 10 inside optical module
Make coupling position, guarantees the optical power of optical module.
In conclusion providing a kind of optical module in the present patent application implementation, the optical module includes optical device, pedestal, lid
Plate and the handle being set on the pedestal, the handle are set to the end of the pedestal, and the cover board is fastened and connected in institute
State on pedestal, the optical device is set to be enclosed by the pedestal and the cover board and set in the accommodation space formed, the cover board or
Multiple pits towards its inside recess setting, multiple pit cloth in the form of matrix array are set on the bottom surface of the pedestal
It is located on the cover board or the pedestal, heat-conducting pad, the heat-conducting pad is set between the pit and the optical device
One side at least fit in the pit, the another side of the heat-conducting pad fits in the surface of the optical device, partially leads
Hot glue pad is limited in pit, thus can limit thermally conductive rubber mat and irregular diffusion deformation occurs to be extruded in the side of optical device
Portion, and then guarantee the coupling tolerances between optical device and casing, guarantee the optical power of optical module.
Although the present invention, those skilled in the art have shown and described relative to one or more implementations
It will be appreciated that equivalent variations and modification based on the reading and understanding to the specification and drawings.The present invention includes all such repairs
Change and modification, and is limited only by the scope of the following claims.In particular, to various functions executed by the above components, use
It is intended to correspond in the term for describing such component and executes the specified function of the component (such as it is functionally of equal value
) random component (unless otherwise instructed), even if in structure with execute the exemplary of this specification shown in this article and realize
The open structure of function in mode is not equivalent.In addition, although the special characteristic of this specification is relative to several realization sides
Only one in formula is disclosed, but this feature can with such as can be for a given or particular application expectation and it is advantageous
One or more other features combinations of other implementations.Moreover, with regard to term " includes ", " having ", " containing " or its deformation
For being used in specific embodiments or claims, such term is intended to wrap in a manner similar to the term " comprising "
It includes.
The above is only a specific embodiment of the invention, it is noted that those skilled in the art are come
It says, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications also should be regarded as
Protection scope of the present invention.
Claims (6)
1. a kind of optical module, which is characterized in that the optical module includes optical device, pedestal, cover board and is set on the pedestal
Handle, the handle is set to the end of the pedestal, and the cover board is fastened and connected on the pedestal, and the optical device is set
It is placed in be enclosed by the pedestal and the cover board and set in the accommodation space formed, be arranged on the bottom surface of the cover board or the pedestal more
A pit towards its inside recess setting, multiple pits are laid in the cover board or the pedestal in the form of matrix array
On, heat-conducting pad is set between the pit and the optical device, and the one side of the heat-conducting pad at least fits in described recessed
In hole, the another side of the heat-conducting pad fits in the surface of the optical device.
2. optical module according to claim 1, which is characterized in that the optical device includes that optical transmitter module or optics connect
Receive module.
3. optical module according to claim 1, which is characterized in that the pit is toward the cover board inside and is depressed in
Set by the inner surface of the cover board；Or the pit is toward on the inside of the pedestal and being depressed in the inner surface institute of the pedestal
Setting.
4. optical module according to claim 3, which is characterized in that the inner surface of the cover board is that the cover board is coupled
The inner surface on the opposite surface of the pedestal connect, the pedestal is opposite for the coupled cover board institute of the pedestal
Surface.
5. optical module according to claim 1, which is characterized in that the matrix array form is along the pedestal or described
The length and width direction of cover board is spaced laying.
6. optical module according to claim 1, which is characterized in that the material of the heat-conducting pad is heat-conducting silicone grease.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910667924.XA CN110376690A (en) | 2019-07-23 | 2019-07-23 | A kind of optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910667924.XA CN110376690A (en) | 2019-07-23 | 2019-07-23 | A kind of optical module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110376690A true CN110376690A (en) | 2019-10-25 |
Family
ID=68255222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910667924.XA Withdrawn CN110376690A (en) | 2019-07-23 | 2019-07-23 | A kind of optical module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110376690A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021109645A1 (en) * | 2019-12-03 | 2021-06-10 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2021212849A1 (en) * | 2020-04-21 | 2021-10-28 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| US11828991B2 (en) | 2019-03-15 | 2023-11-28 | Hisense Broadband Multimedia Technologies Co., Ltd. | Optical module |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201521928U (en) * | 2009-11-10 | 2010-07-07 | 浙江摩根电子科技有限公司 | Radiating structure of LED module |
| CN101872042A (en) * | 2010-05-27 | 2010-10-27 | 华为技术有限公司 | Optical module and optical communication system |
| WO2011120188A1 (en) * | 2010-03-29 | 2011-10-06 | Telefonaktiebolaget L M Ericsson (Publ) | Cooling device for pluggable module, assembly of the cooling device and the pluggable module |
| CN207366791U (en) * | 2017-06-28 | 2018-05-15 | 中兴通讯股份有限公司 | One kind heat dissipation mouse cage and electronic equipment |
| CN109407224A (en) * | 2018-11-07 | 2019-03-01 | 东莞讯滔电子有限公司 | A kind of radiating subassembly, connector and connector assembly |
-
2019
- 2019-07-23 CN CN201910667924.XA patent/CN110376690A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201521928U (en) * | 2009-11-10 | 2010-07-07 | 浙江摩根电子科技有限公司 | Radiating structure of LED module |
| WO2011120188A1 (en) * | 2010-03-29 | 2011-10-06 | Telefonaktiebolaget L M Ericsson (Publ) | Cooling device for pluggable module, assembly of the cooling device and the pluggable module |
| CN101872042A (en) * | 2010-05-27 | 2010-10-27 | 华为技术有限公司 | Optical module and optical communication system |
| CN207366791U (en) * | 2017-06-28 | 2018-05-15 | 中兴通讯股份有限公司 | One kind heat dissipation mouse cage and electronic equipment |
| CN109407224A (en) * | 2018-11-07 | 2019-03-01 | 东莞讯滔电子有限公司 | A kind of radiating subassembly, connector and connector assembly |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11828991B2 (en) | 2019-03-15 | 2023-11-28 | Hisense Broadband Multimedia Technologies Co., Ltd. | Optical module |
| WO2021109645A1 (en) * | 2019-12-03 | 2021-06-10 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2021212849A1 (en) * | 2020-04-21 | 2021-10-28 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20191025 |
|
| WW01 | Invention patent application withdrawn after publication |