JP3241176B2 - Optical package - Google Patents
Optical packageInfo
- Publication number
- JP3241176B2 JP3241176B2 JP18039893A JP18039893A JP3241176B2 JP 3241176 B2 JP3241176 B2 JP 3241176B2 JP 18039893 A JP18039893 A JP 18039893A JP 18039893 A JP18039893 A JP 18039893A JP 3241176 B2 JP3241176 B2 JP 3241176B2
- Authority
- JP
- Japan
- Prior art keywords
- package
- optical
- photoelectric conversion
- covering member
- conversion element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Led Device Packages (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、光信号と電気信号との
送受信を行う光パッケージに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical package for transmitting and receiving an optical signal and an electric signal.
【0002】[0002]
【従来の技術】従来より、発光ダイオード(LED)、
レーザーダイオード(LD)、フォトダイオード(P
D)、光集積回路チップ(OEIC)に代表されるよう
な電気信号と光信号との送受信を行わせるための光電変
換素子を使用すると、光電変換素子が発熱し、この発熱
により光パッケージ内で温度上昇が起こり、光電変換素
子自体の特性が大きく変化してしまうために、図5の断
面図に示すように、パッケージ11の底面に冷却通路用
溝12または冷却通路用孔13a、13bを有する各基
板14a、14b、14cを一体化して形成させ、冷却
通路用孔13bにつながっている流体出入口用配管部1
5a、15bから流体を出入力させ、冷却通路用溝12
と冷却通路用孔13a、13bで循環させる方法により
(特開昭47−36973号公報参照)、あるいは図6
の断面図に示すように、電子素子22や発光または受光
素子23を有するパッケージ21につながれている光信
号の送受信手段である光ファイバにより形成される導波
路基板24の上面に冷却手段25を設ける方法により
(実開昭63−182555号公報参照)、光パッケー
ジ内部の冷却を行い、光電変換素子の温度変化による特
性の変化を極力抑えようとしていた。2. Description of the Related Art Conventionally, a light emitting diode (LED),
Laser diode (LD), photodiode (P
D) When a photoelectric conversion element for transmitting and receiving an electric signal and an optical signal as represented by an optical integrated circuit chip (OEIC) is used, the photoelectric conversion element generates heat. Since the temperature rises and the characteristics of the photoelectric conversion element itself change greatly, as shown in the cross-sectional view of FIG. 5, the package 11 has the cooling passage groove 12 or the cooling passage holes 13a and 13b on the bottom surface. Each of the substrates 14a, 14b, and 14c is integrally formed, and the fluid inlet / outlet pipe portion 1 connected to the cooling passage hole 13b.
5a and 15b, the fluid flows in and out, and the cooling passage grooves 12
6 through the cooling passages 13a and 13b (see JP-A-47-36973) or FIG.
As shown in the cross-sectional view of FIG. 1, a cooling means 25 is provided on an upper surface of a waveguide substrate 24 formed by an optical fiber which is a transmitting / receiving means of an optical signal connected to a package 21 having an electronic element 22 and a light emitting or receiving element 23. According to a method (see Japanese Utility Model Application Laid-Open No. 63-182555), the inside of the optical package is cooled, and the change in the characteristics of the photoelectric conversion element due to the temperature change is suppressed as much as possible.
【0003】[0003]
【発明が解決しようとする課題】ところが、従来の図5
の場合による冷却方法は、パッケージ11の外部を冷却
させるために、パッケージ11の内部の冷却方法として
は非常に効率が悪く、しかも流体を循環させるための装
置が必要となるために大型化してしまうという問題があ
った。また、図6の場合による冷却方法は、導波路基板
24の上面に冷却手段25を設けても、光ファイバ自体
は熱伝達を行わないためにパッケージ21の内部の冷却
方法としては非常に効率が悪く、しかも冷却手段25を
有するためにどうしても大型化してしまうという問題が
あった。However, the conventional FIG.
In the cooling method according to the above case, the outside of the package 11 is cooled, so that the cooling method inside the package 11 is very inefficient, and a device for circulating a fluid is required. There was a problem. In the cooling method in the case of FIG. 6, even if the cooling means 25 is provided on the upper surface of the waveguide substrate 24, since the optical fiber itself does not conduct heat transfer, the cooling method inside the package 21 is very efficient. There is a problem that the size is inevitably increased due to the provision of the cooling means 25.
【0004】[0004]
【課題を解決するための手段】本発明は、上記問題点に
鑑みてなされたものであり、パッケージ内部に光伝送手
段と、前記光伝送手段に接続される光電変換素子とが具
備され、光信号と電気信号との送受信を行う光パッケー
ジにおいて、前記光パッケージがフィルム状被覆部材で
構成され、絶縁性流体が封入された光パッケージであ
る。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has an optical transmission device inside a package and a photoelectric conversion element connected to the optical transmission device. In an optical package for transmitting and receiving a signal and an electric signal, the optical package is formed of a film-shaped covering member and is filled with an insulating fluid.
【0005】[0005]
【作用】本発明によれば、光伝送手段、光電変換素子を
絶縁性流体が封入されている気密状態のフィルム状被覆
部材で覆うことにより、絶縁性流体の対流によって光パ
ッケージ内部の熱をフィルム状被覆部材の外部へ放出す
るようになる。According to the present invention, the optical transmission means and the photoelectric conversion element are covered with an airtight film-like covering member in which the insulating fluid is sealed, so that the heat inside the optical package is reduced by the convection of the insulating fluid. It is released to the outside of the shape-like covering member.
【0006】[0006]
【実施例】以下、本発明の実施例を図面を用いて説明す
る。図1乃至図4は本発明の4つの実施例を示し、図に
おいて同じ部材は同じ符号で示す。図1は、本発明の第
1の実施例を示す図であり、光ファイバ1と電気回路2
により光信号と電気信号の送受信を行う場合であるが、
光パッケージは、光信号を電気信号に、あるいは電気信
号を光信号に変換させるLDやLEDなどの発光素子3
aとPDなどの受光素子3bなどよりなる光電変換素子
3、光ファイバ1と電気回路2との送受信を低損失に行
うために光ファイバ1・電気回路2・光電変換素子3の
相対的位置関係を好ましい状態で固定させるための保持
部材4、光ファイバ1・電気回路2・光電変換素子3・
保持部材4を気密状態で覆うフィルム状被覆部材5、フ
ィルム状被覆部材5の内部に封入されている絶縁性流体
6よりなる。Embodiments of the present invention will be described below with reference to the drawings. 1 to 4 show four embodiments of the present invention, in which the same members are denoted by the same reference numerals. FIG. 1 is a diagram showing a first embodiment of the present invention, wherein an optical fiber 1 and an electric circuit 2 are shown.
Is a case where optical signals and electric signals are transmitted and received by
The optical package is a light emitting element 3 such as an LD or LED for converting an optical signal into an electric signal or an electric signal into an optical signal.
a and a photoelectric conversion element 3 comprising a light receiving element 3b such as a PD, etc., and a relative positional relationship between the optical fiber 1, the electric circuit 2, and the photoelectric conversion element 3 for performing low-loss transmission and reception between the optical fiber 1 and the electric circuit 2. Holding member 4, optical fiber 1, electric circuit 2, photoelectric conversion element 3,
A film-shaped covering member 5 that covers the holding member 4 in an airtight state, and an insulating fluid 6 sealed inside the film-shaped covering member 5.
【0007】このように、保持部材4により光信号と電
気信号が低損失な送受信となるように固定しておき、光
ファイバ1・電気回路2・光電変換素子3・保持部材4
を気密状態であるフィルム状被覆部材5で覆い、内部に
絶縁性流体6を封入することによって、光電変換素子3
が発熱し、フィルム状被覆部材5の内部において温度上
昇が起こった場合に、絶縁性流体6が対流して、フィル
ム状被覆部材5の表面付近に熱が移動し、フィルム状被
覆部材5の外部との温度差による放熱作用が起こること
により熱が冷却するようになる。なお、パッケージをフ
ィルム状被覆部材5としたのは、外部との温度差による
放熱作用の効率を良くするためであり、例えばプラスチ
ックスシートを使用すればよい。As described above, the optical signal and the electric signal are fixed by the holding member 4 so that transmission and reception are performed with low loss, and the optical fiber 1, the electric circuit 2, the photoelectric conversion element 3, and the holding member 4 are fixed.
Is covered with a film-shaped covering member 5 in an airtight state, and an insulating fluid 6 is sealed therein.
When the temperature rises inside the film-shaped covering member 5, the insulating fluid 6 convects and heat moves to the vicinity of the surface of the film-shaped covering member 5, and the outside of the film-shaped covering member 5 The heat is cooled due to the heat radiation effect due to the temperature difference from the above. The reason why the package is made of the film-shaped covering member 5 is to improve the efficiency of the heat radiation action due to the temperature difference from the outside. For example, a plastic sheet may be used.
【0008】ここで、保持部材4は、光信号と電気信号
との送受信を低損失に行えるように少なくとも光ファイ
バ1・電気回路2・光電変換素子3のいずれか1つを保
持できるものであればよい。また、フィルム状被覆部材
5としては、封入する絶縁性流体6に影響されずに気密
状態を長時間維持でき、耐熱性を有し、外部からの光を
遮断するものであればどのようなものであってもよい。
そして、絶縁性流体6は、絶縁性を有し、かつ内部の素
子の酸化や劣化を促進させないものであればよく、例え
ばヘリウムなどの不活性ガス、フロンまたは窒素ガスで
あればよい。さらに4塩化フッ素などのような潜熱の大
きいものを絶縁性流体6として使用すると、発熱量の大
きな光電変換素子3に対しても放熱特性を向上させるこ
とができるようになる。Here, the holding member 4 can hold at least any one of the optical fiber 1, the electric circuit 2, and the photoelectric conversion element 3 so that transmission and reception of an optical signal and an electric signal can be performed with low loss. I just need. The film-shaped covering member 5 may be any material that can maintain an airtight state for a long time without being affected by the insulating fluid 6 to be sealed, has heat resistance, and blocks external light. It may be.
The insulating fluid 6 may be any fluid that has an insulating property and does not promote oxidation or deterioration of the internal elements, and may be, for example, an inert gas such as helium, Freon, or nitrogen gas. Further, when a material having a large latent heat, such as fluorine tetrachloride, is used as the insulating fluid 6, the heat radiation characteristics can be improved even for the photoelectric conversion element 3 having a large calorific value.
【0009】また、図1(b)に示すように、フィルム
状被覆部材5の内面または外面に振動子7を載置する
と、フィルム状被覆部材5が振動するために、放熱の効
果をより高めるようにすることができる。なお、振動子
7としては、フィルム状被覆部材5を全体的に振動させ
ることができるものであればよく、例えば水晶振動子、
ピエゾ素子、ダイヤフラム型振動子、バイメタル振動
子、静電アクチュエータなどを使用すればよい。Further, as shown in FIG. 1B, when the vibrator 7 is placed on the inner surface or the outer surface of the film-shaped covering member 5, the film-shaped covering member 5 vibrates, so that the heat radiation effect is further enhanced. You can do so. The vibrator 7 may be any as long as it can vibrate the film-shaped covering member 5 as a whole.
A piezo element, a diaphragm type vibrator, a bimetal vibrator, an electrostatic actuator, or the like may be used.
【0010】図2は、本発明の第2の実施例を示す断面
図であり、フィルム状被覆部材5の内部に電気回路2に
つながれている集積回路基板8をも設置させた場合であ
るが、このようにファイルム状被覆部材5内部に集積回
路基板8を設置させることにより、より小型化なもの
に、かつ光集積回路基板8が外部からの変動を受けにく
くすることができるようになる。FIG. 2 is a sectional view showing a second embodiment of the present invention, in which an integrated circuit board 8 connected to the electric circuit 2 is also installed inside the film-like covering member 5. By disposing the integrated circuit board 8 inside the film-shaped covering member 5 in this way, it becomes possible to make the optical integrated circuit board 8 more compact and less susceptible to external fluctuations. .
【0011】図3は、本発明の第3の実施例を示す断面
図であり、電気信号として外部へ接続するためのピン9
を有するICパッケージ10の面上に、光電変換素子3
として光集積回路チップを設置した場合である。ここ
で、光ファイバ1や光電変換素子3をICパッケージ1
0に載置する前に、ICパッケージ10の面上の光ファ
イバ1や光電変換素子3を載置する部分に目印等を付け
る、あるいは定位置に載置しやすいような凹部または凸
部を形成させるとにより、通常のICパッケージ10を
使用した場合でも光信号と電気信号を低損失に送受信さ
せることができるようになる。FIG. 3 is a sectional view showing a third embodiment of the present invention.
Photoelectric conversion element 3 on the surface of an IC package 10 having
Is a case where an optical integrated circuit chip is installed. Here, the optical fiber 1 and the photoelectric conversion element 3 are connected to the IC package 1.
Before mounting on the IC package 10, a mark or the like is formed on a portion on the surface of the IC package 10 where the optical fiber 1 or the photoelectric conversion element 3 is mounted, or a concave portion or a convex portion is formed so as to be easily mounted at a fixed position. By doing so, it becomes possible to transmit and receive an optical signal and an electric signal with low loss even when the normal IC package 10 is used.
【0012】図4は、本発明の第4の実施例を示す断面
図であり、電気信号から光信号へ変換させるのみの場合
であり、光ファイバ1と電気回路2間に発光素子3aを
設置させている。このように目的に応じて光電変換素子
3を最小限必要なもののみを使用することにより、被覆
部材5内部の発熱量が少なくなり、しかもより小型にす
ることができるようになる。FIG. 4 is a sectional view showing a fourth embodiment of the present invention, in which only an electric signal is converted into an optical signal. A light emitting element 3a is provided between the optical fiber 1 and the electric circuit 2. Let me. In this way, by using only the minimum required photoelectric conversion element 3 according to the purpose, the amount of heat generated inside the covering member 5 is reduced, and the size can be further reduced.
【0013】[0013]
【発明の効果】以上のように、本発明の光パッケージに
よれば、パッケージがフィルム状被覆部材で構成され、
絶縁性流体を封入することにより、フィルム状被覆部材
であるために、絶縁性流体の対流によって光パッケージ
内部の熱を放熱しやすくなり、小型で効率の良い冷却方
法を有する光パッケージを提供することができる。As described above, according to the optical package of the present invention, the package is constituted by the film-shaped covering member,
To provide an optical package having a small and efficient cooling method by enclosing an insulating fluid to facilitate heat radiation inside the optical package by convection of the insulating fluid because of a film-shaped covering member. Can be.
【図1】本発明の第1の実施例を示す図であり、図
(a)は斜視概略図、図(b)はX−X線断面概略図で
ある。FIG. 1 is a view showing a first embodiment of the present invention, wherein FIG. 1 (a) is a schematic perspective view and FIG. 1 (b) is a schematic sectional view taken along line XX.
【図2】本発明の第2の実施例を示す断面概略図であ
る。FIG. 2 is a schematic sectional view showing a second embodiment of the present invention.
【図3】本発明の第3の実施例を示す断面概略図であ
る。FIG. 3 is a schematic sectional view showing a third embodiment of the present invention.
【図4】本発明の第4の実施例を示す断面概略図であ
る。FIG. 4 is a schematic sectional view showing a fourth embodiment of the present invention.
【図5】従来の冷却手段を示す断面概略図である。FIG. 5 is a schematic sectional view showing a conventional cooling means.
【図6】従来の冷却手段を示す断面概略図である。FIG. 6 is a schematic sectional view showing a conventional cooling means.
1 :光ファイバ 2 :電気回路 3a:発光素子 3b:受光素子 3 :光電変換素子 4 :保持部材 5 :フィルム状被覆部材 6 :絶縁性流体 7 :振動子 8 :集積回路基板 9 :ピン 10:ICパッケージ 11、21:パッケージ 12:冷却用溝 13a、13b:冷却用孔 14a、14b、14c:基板 15a、15b:流体出入口用配管部 22:電子素子 23:受光素子または発光素子 24:導波路基板 25:冷却手段 1: optical fiber 2: electric circuit 3a: light emitting element 3b: light receiving element 3: photoelectric conversion element 4: holding member 5: film-shaped covering member 6: insulating fluid 7: vibrator 8: integrated circuit board 9: pin 10: IC package 11, 21: Package 12: Cooling groove 13a, 13b: Cooling hole 14a, 14b, 14c: Substrate 15a, 15b: Fluid inlet / outlet piping part 22: Electronic element 23: Light receiving element or light emitting element 24: Waveguide Substrate 25: Cooling means
Claims (1)
送手段に接続される光電変換素子とが具備され、光信号
と電気信号との送受信を行う光パッケージにおいて、前
記光パッケージがフィルム状被覆部材で構成され、内部
に絶縁性流体が封入され、該絶縁性流体の対流によって
上記光電変換素子の熱を放熱させるようにするととも
に、前記フィルム状被覆部材の内面または外面に振動子
を載置したことを特徴とする光パッケージ。1. An optical package for transmitting and receiving an optical signal and an electric signal, wherein an optical transmission means and a photoelectric conversion element connected to the optical transmission means are provided inside the package. It is composed of a member, an insulating fluid is sealed inside, and by the convection of the insulating fluid
The heat of the photoelectric conversion element is radiated.
A vibrator on the inner or outer surface of the film-shaped covering member;
Optical package characterized by placing the.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18039893A JP3241176B2 (en) | 1993-07-21 | 1993-07-21 | Optical package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18039893A JP3241176B2 (en) | 1993-07-21 | 1993-07-21 | Optical package |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0735956A JPH0735956A (en) | 1995-02-07 |
JP3241176B2 true JP3241176B2 (en) | 2001-12-25 |
Family
ID=16082545
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18039893A Expired - Fee Related JP3241176B2 (en) | 1993-07-21 | 1993-07-21 | Optical package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3241176B2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5954129A (en) * | 1996-02-14 | 1999-09-21 | Takahashi; Kei | Flow control unit |
JP3665975B2 (en) * | 1996-02-16 | 2005-06-29 | 敬 高橋 | Fluid regulation conveying means |
JP5804071B2 (en) * | 2011-09-15 | 2015-11-04 | 日本電気株式会社 | Optical transceiver and method for manufacturing the same |
JP7167889B2 (en) * | 2019-09-13 | 2022-11-09 | 豊田合成株式会社 | UV light irradiation device |
-
1993
- 1993-07-21 JP JP18039893A patent/JP3241176B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0735956A (en) | 1995-02-07 |
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