CN113376767B - Chip packaging structure and optical computing device - Google Patents
Chip packaging structure and optical computing device Download PDFInfo
- Publication number
- CN113376767B CN113376767B CN202110593659.2A CN202110593659A CN113376767B CN 113376767 B CN113376767 B CN 113376767B CN 202110593659 A CN202110593659 A CN 202110593659A CN 113376767 B CN113376767 B CN 113376767B
- Authority
- CN
- China
- Prior art keywords
- substrate
- chip
- photonic chip
- light source
- refrigerator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4267—Reduction of thermal stress, e.g. by selecting thermal coefficient of materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
Abstract
The embodiment of the application provides a chip packaging structure and optical computing equipment. Wherein, the structure includes: the photonic chip comprises a packaging substrate, a photonic chip and a light source component for providing light signals for the photonic chip; the light source component and the photonic chip are respectively arranged on the packaging substrate; and a resisting part for resisting the bending deformation of the packaging substrate is arranged between the light source assembly and the photonic chip. In the embodiment of the application, the bending deformation of the packaging substrate can be reduced through the resisting part, so that the offset of a light path from the light source assembly to the photonic chip can be reduced, and the optical coupling efficiency can be ensured.
Description
Technical Field
The present application relates to photonic chip technologies, and in particular, to a chip package structure and an optical computing device.
Background
Compared with a conventional electronic chip, the photonic chip is used for data transmission and processing by manipulating optical signals, and the photonic chip (or the optical chip) has advantages in high speed, low delay, low power consumption, and the like.
Currently, photonic chip packaging integration is the development direction of photonic chips, that is, a light source (e.g., a compact laser) is packaged together with a photonic chip to provide a light signal for the photonic chip by the light source. The coupling efficiency of coupling light emitted from an external light source into the photonic chip and the power of the external light source are key factors that limit how much light enters the interior of the photonic chip.
However, when the light source is packaged with the photonic chip, once the package structure is deformed, for example: thermal deformation may cause optical path deviation, and finally, the optical coupling efficiency is reduced sharply.
Disclosure of Invention
The present application is made in view of the above problems, and provides a chip package structure and a light computing device that solve the above problems, or at least partially solve the above problems.
Accordingly, a first aspect of the present application provides a chip package structure. The chip packaging structure comprises:
the photonic chip comprises a packaging substrate, a photonic chip and a light source component for providing optical signals for the photonic chip;
the light source component and the photonic chip are respectively arranged on the packaging substrate;
and a resisting part for resisting the bending deformation of the packaging substrate is arranged between the light source assembly and the photonic chip.
A second aspect of the present application provides a light computing device. The light computing device includes: the chip package structure provided by the first aspect.
In the technical scheme provided by the embodiment of the application, the photon chip and the light source assembly are respectively arranged on the packaging substrate, and a resisting part used for resisting the deformation of the packaging substrate is arranged between the light source assembly and the photon chip. Through the resisting part, the bending deformation of the packaging substrate can be reduced, so that the offset of a light path from the light source assembly to the photonic chip can be reduced, and the optical coupling efficiency can be ensured.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic diagram of a chip package structure according to an embodiment of the present disclosure;
FIG. 2a is a schematic view of a chip package structure undergoing a zigzag bending deformation;
FIG. 2b is an enlarged view at I in FIG. 2 a;
FIG. 3a is a schematic view of a chip package structure undergoing a bending deformation in a shape of a Chinese character 'tu';
FIG. 3b is an enlarged view at J in FIG. 3 a;
fig. 4 is a schematic diagram of a chip package structure according to another embodiment of the disclosure;
FIG. 5 is an enlarged view taken at H in FIG. 1;
fig. 6 is a flowchart illustrating a method for controlling a chip package structure according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that, the descriptions of "first", "second", etc. in this document are used for distinguishing different messages, devices, modules, etc., and do not represent a sequential order, nor limit the types of "first" and "second" to be different.
As shown in fig. 1, the light source module 1 and the photonic chip 2 are packaged on the same package substrate 3 to provide an optical signal from the light source module 1 to the photonic chip 2. Since the thermal expansion coefficients of the materials used for the light source module 1, the photonic chip 2 and the package substrate 3 are usually different, the thermal structural coupling effect is generated when the temperature changes, and the package substrate 3 is bent and deformed as shown in fig. 2a and 3 a. Alternatively, the package substrate 3 employs an organic substrate. When the temperature is high, the lower surface of the organic substrate expands a lot, and the upper surface expands a little due to the constraint of the light source assembly 1 and the photonic chip 2, so that the whole body can be bent and deformed in a shape like a Chinese character 'ao', as shown in fig. 2 a; when the temperature is low, the lower surface of the organic substrate shrinks more, and the upper surface shrinks less due to the constraints of the light source assembly 1 and the photonic chip 2, so that the whole organic substrate may have a zigzag bending deformation, as shown in fig. 3 a.
Mode field matching is required for optical coupling, and a light deviation of several microns results in a decrease in optical coupling efficiency. Temperature variations in the photonic chip are unavoidable, however they can lead to the above mentioned thermo-structural coupling effects, resulting in deformations of at least tens or even hundreds of micrometers. These deformations in turn cause a shift of the light (as shown in fig. 2b and 3b, the light 200 emitted by the light source module 1 is shifted compared to the normal light path 100), resulting in a sharp drop of the light coupling efficiency.
Fig. 4 shows a schematic diagram of a chip package structure according to an embodiment of the present application. As shown in fig. 4, the chip package structure includes: a package substrate 3, a photonic chip 2 and a light source assembly 1 for providing an optical signal to the photonic chip 2; the light source assembly 1 and the photonic chip 2 are respectively arranged on the packaging substrate 3; a resisting portion 1211 for resisting bending deformation of the package substrate 3 is disposed between the light source assembly 1 and the photonic chip 2.
In practice, the light source assembly 1 includes the light emitter 11. The light-emitting end face of the illuminator 11 may be opposite to and spaced apart from the light-incident end face of the photonic chip 2, so that the light emitted from the illuminator 11 can directly reach the light-incident end face of the photonic chip 2, thereby providing the photonic chip 2 with a light signal. Illustratively, the light emitter 11 may be a semiconductor light emitter, such as: a semiconductor laser light emitter.
The lower surface of the light source assembly 1 is encapsulated on the encapsulation surface (i.e., the upper surface) of the encapsulation substrate 3; the lower surface of the photonic chip 2 is encapsulated on the encapsulation surface of the encapsulation substrate 3, that is, the light source assembly 1 and the photonic chip 2 are installed on the same side of the encapsulation substrate 3.
In the technical scheme provided by the embodiment of the application, the photon chip and the light source assembly are respectively arranged on the packaging substrate, and a resisting part used for resisting the deformation of the packaging substrate is arranged between the light source assembly and the photon chip. Through the resisting part, the bending deformation of the packaging substrate can be reduced, so that the offset of a light path from the light source assembly to the photonic chip can be reduced, and the optical coupling efficiency can be ensured.
In one example, the light source module 1 and the photonic chip 2 abut against each other, and abutting surfaces of the light source module and the photonic chip form the resistive portion 1211. The light source component 1 and the photonic chip 2 form a whole with high rigidity, and can resist bending deformation of the packaging substrate under the action of thermal stress. In this embodiment, no additional components need to be added.
In another example, the above-described resisting portion may be an additionally added component. The material and the shape of the resisting part can be set according to actual needs, and the embodiment of the application does not specifically limit the shape, and only needs to resist the bending deformation of the packaging substrate.
In one example, the rigidity of the resisting portion 1211 may be greater than the rigidity of the package substrate 3.
In actual application, the stopper 1211 may be independently provided on the package substrate, and is not connected to the light source module 1 and the photonic chip 2.
In order to further enhance the resistance against the bending deformation of the package substrate under the thermal stress, so as to further reduce the degree of the bending deformation, as shown in fig. 4, the light source assembly 1 and the photonic chip 2 may be connected through the resistant portion 1211. Thus, the light source module 1, the photonic chip 2, and the resistive portion 1211 form a rigid whole, and the resistance against the bending deformation of the package substrate due to the thermal stress can be further increased. Illustratively, the resisting portion 1211 may be disposed to be attached to the package substrate 3.
Generally, when a light source works, a large amount of heat is generated, and if the heat is not dissipated for the light source in time, the operation and the service life of the light source are affected. Thus, as shown in fig. 4, the light source assembly 1 may include: a light emitter 11 and a refrigerator 12 for dissipating heat from the light emitter 11; the illuminator 11 is arranged above the refrigerator 12; the refrigerator 12 is disposed on the package substrate 3.
In the present embodiment, the heat of the light emitter 11 is transmitted to the package substrate 3 through the refrigerator 12, thereby ensuring that the temperature of the light emitter 11 is in an appropriate range.
In one embodiment, the refrigerator 12 may be a semiconductor refrigerator (TEC), and the use of a TEC helps improve chip integration.
As shown in fig. 4, the refrigerator 12 includes a hot-side substrate 121 and a cold-side substrate 122 disposed opposite to each other; the hot-side substrate 121 is disposed on the package substrate 3; the light emitter 11 is disposed on the cold-side substrate 122. Specifically, the refrigerator 12 further includes a plurality of semiconductor thermocouples disposed between the hot-side substrate 121 and the cold-side substrate 122, and the material of the semiconductor thermocouples may include bismuth antimonide.
As shown in fig. 4, the light emitter 11 may include a light emitter substrate 112 and a light emitter body 111 disposed on the light emitter substrate 112, and the light emitter substrate 112 may be disposed on the refrigerator 12, and particularly, may be disposed on a cold side substrate 122 of the refrigerator 12.
The hot-side substrate 121 and the chip substrate 21 of the photonic chip 2 may be connected by the resistive portion 1211.
When the refrigerator 12 is operated, the temperature of the cold substrate 122 is guided to the hot substrate 121, and a large amount of heat is accumulated on the hot substrate 121 of the refrigerator 12. In order to solve the heat dissipation problem of the refrigerator 12 itself, in the present embodiment, the hot-side substrate 121 of the refrigerator 12 is connected to the chip substrate 21 of the photonic chip 2 through the resistive portion 1211, so that the heat accumulated on the hot-side substrate 121 of the refrigerator 12 can be guided to the chip substrate 21 of the photonic chip 2 to be dissipated by the chip substrate 21, thereby improving the heat dissipation effect of the refrigerator 12. In general, the chip substrate 21 is made of a semiconductor material such as: silicon has good heat-conducting property.
In an implementation, the resistive portion 1211 may be an independent member, and the resistive portion 1211 is connected to the hot side substrate 121 and the chip substrate 21 of the photonic chip 2, respectively. In one example, the resistive portion 1211 and the hot side substrate 121 are connected by glue filled in a gap therebetween; the resist 1211 and the chip substrate 21 are connected by an adhesive filled in a gap therebetween. In order to improve the heat dissipation effect of the hot-side substrate 121, the adhesive may be a thermally conductive adhesive. In order to enhance the rigidity of the light source assembly 1, the photonic chip 2 and the resistance 1211 as a whole to improve the resistance against the bending deformation of the package substrate 3, in another example, the resistance 1211 may abut against the hot-side substrate 121 and the chip substrate 21 of the photonic chip 2, respectively. In the present embodiment, the resistive portion 1211 is connected to the hot-side substrate 121 and the chip substrate 21 of the photonic chip 2 by glue, which is exemplarily a heat conductive glue.
In another implementation, as shown in fig. 4, the resistant portion 1211 may be an extension portion of the hot-side substrate 121 extending toward the photonic chip 2; alternatively, the resistive portion 1211 may be an extension portion of the photonic chip 2 extending in the direction of the light source module 1 from the chip substrate 21. This further increases the rigidity of the entire assembly of the hot-side substrate 121, the chip substrate 21, and the resistive portion 1211.
In practical applications, the solution of extending the hot-side substrate 121 of the refrigerator 12 is easier and less costly than the solution of extending the chip substrate 21 of the photonic chip 2.
When the resistive portion 1211 is an extension portion extending from the hot side substrate 121 in a direction of the photonic chip 2, the resistive portion 1211 may abut against the chip substrate 21 of the photonic chip 2 or the resistive portion 1211 and the chip substrate 21 of the photonic chip 2 may be connected by an adhesive filled in a gap therebetween. If the chip substrate 21 of the photonic chip 2 is abutted against the resistive portion 1211, a glue, such as a thermal conductive glue, is disposed at a contact position. Illustratively, the material of the hot-side substrate 121 and its extension includes aluminum nitride ceramic, diamond, or silicon carbide.
When the resistive portion 1211 is an extension portion of the photonic chip 2 extending in the direction of the light source module 1, the resistive portion 1211 may abut against the hot-face substrate 121 or the resistive portion 1211 may be connected to the hot-face substrate 121 by an adhesive filled in a gap therebetween. If abutting, the resisting portion 1211 may be provided with glue, such as a thermal conductive glue, at a contact position with the hot side substrate 121. Illustratively, the material of the chip substrate 21 and its extension includes silicon.
It should be added that, the scheme of connecting through the glue filled in the gap between the two can provide a buffer effect when the package substrate 3 is subjected to bending deformation (specifically, the concave-shaped bending deformation), and reduce the probability that the two connected components are pushed away from each other at the contact position. The scheme of butt joint can improve the integral rigidity formed by the two mutually connected parts, thereby improving the resistance of the integral to bending deformation.
As shown in fig. 4, the photonic chip 2 includes a chip substrate 21 and a mirror 22 for guiding the light emitted from the light source assembly 1 to the light coupling position 400 of the photonic chip 2; the reflector 22 is disposed on the chip substrate 21. The above-mentioned reflector 22 may be a distributed bragg grating mirror or a metal mirror. The reflecting mirror surface of the reflecting mirror is also the light incident end surface of the photonic chip 2.
In order to increase the wiring density and reduce the cost, an organic substrate may be used as the package substrate 21. Since the CTE (coefficient of thermal expansion) of the organic substrate material is much larger than the CTE of the materials of the photonic chip and the light source module, the organic substrate may be deformed by bending when the temperature changes. However, since the resisting portion 1211 for resisting bending deformation of the organic substrate is disposed between the photonic chip 2 and the light source assembly 1 in the chip packaging structure provided in the embodiment of the present application, a bending deformation amplitude of the organic substrate can be reduced, so as to reduce an optical path offset, thereby ensuring optical coupling efficiency.
In addition, the above structure may further include: a detection unit (not shown) and a controller (not shown); the controller is in communication connection with the detection unit and the refrigerator 12, respectively, and is configured to determine a bending direction of the package substrate 3 according to a detection signal of the detection unit, and control a current of the refrigerator 12 according to the bending direction.
In the embodiment of the present application, the current for controlling the refrigerator is also the temperature difference between the hot side substrate and the cold side substrate of the refrigerator. By controlling the temperature difference between the hot-side substrate and the cold-side substrate, the respective deformation amounts of the hot-side substrate and the cold-side substrate can be controlled, so that the influence of the bending deformation of the packaging substrate 3 on the optical path deviation can be relieved, and the influence degree on the optical coupling efficiency can be reduced. In this embodiment, the direction of the light can be actively controlled. Although the amount that can be controlled is relatively small, it can be very effective for optical coupling.
It should be noted that, since the refrigerator 12 is used for dissipating heat from the light emitter 11, no matter how the current of the refrigerator 12 is adjusted, the temperature of the cold-side substrate 122 needs to be lower than that of the hot-side substrate 121, so as to achieve the purpose of heat dissipation. Generally, the cooling current is positive and the heating current is negative. Therefore, adjusting the current of refrigerator 12, specifically adjusting the magnitude of the current of refrigerator 12, does not change the direction of the current. During the operation of the refrigerator, the temperature of the cold-side substrate 122 is lower than that of the hot-side substrate 121, so that the refrigerator 12 always bends away from the package substrate, i.e., bends in a shape of a Chinese character 'ao'.
In practical application, the controller is specifically configured to:
when the bending direction is a direction bending towards the side of the refrigerator 12 and the photonic chip 2 (as shown in fig. 2 a), reducing the current of the refrigerator 12 can make the temperature difference between the cold-side substrate 121 and the hot-side substrate 122 smaller, which can be simply understood as: the temperature of the hot-side substrate 122 remains unchanged, and the temperature of the cold-side substrate 121 increases slightly, so that the volume of the cold-side substrate 121 tends to increase relative to the volume of the hot-side substrate, thereby reducing the extent of the concave-shaped bending deformation of the refrigerator 12, and helping to alleviate the influence of the bending of the package substrate 3 towards the side of the refrigerator 12 where the photonic chip 2 is located on the optical path deviation.
When the bending direction is a direction bending away from the side of the refrigerator 12 and the photonic chip 2 (as shown in fig. 3 a), increasing the current of the refrigerator 12 can make the temperature difference between the cold-side substrate 122 and the hot-side substrate 121 become larger, which can be simply understood as: the temperature of the hot-side substrate 121 is kept constant, and the temperature of the cold-side substrate 122 is reduced slightly, so that the volume of the cold-side substrate 122 tends to be reduced relative to the volume of the hot-side substrate 121, thereby increasing the amplitude of the concave-shaped bending deformation of the refrigerator 12, and being beneficial to relieving the influence of the bending of the package substrate 3, which is away from the refrigerator 12 and the photonic chip 2, on the optical path deviation.
In an implementable aspect, the detection unit comprises a strain sensor; the strain sensor is arranged on the packaging substrate; the controller is in communication connection with the strain sensor, and is configured to determine a bending direction of the package substrate 3 according to a detection signal of the strain sensor. The detection signal includes strain. In practical applications, the strain sensor may be disposed on the package surface or the back surface of the package substrate 3. The strain has a positive or negative sign, indicating an expanded state; negative indicates a contracted state. Specifically, the state of the package substrate 3 is determined according to the detection signal of the strain sensor; if the package substrate 3 is in the expanded state, determining that the bending direction of the package substrate 3 is a direction bending towards the refrigerator 12 and the side where the photonic chip 2 is located; if the package substrate 3 is in a contracted state, the bending direction of the package substrate 3 is determined to be a direction which is back to the refrigerator 12 and the side where the photonic chip 2 is located.
When the package substrate 3 is in the expanded state, the degree of expansion of the package side thereof is necessarily smaller than that of the back side thereof due to the thermal structural coupling effect, that is, the bending direction of the package substrate 3 is necessarily a direction bending toward the side of the refrigerator 12 and the photonic chip 2.
When the package substrate 3 is in the contracted state, the degree of contraction of the package side thereof is necessarily smaller than that of the back side thereof due to the thermal structural coupling effect, that is, the bending direction of the package substrate 3 is necessarily a direction bending away from the side where the refrigerator 12 and the photonic chip 2 are located.
In another implementable aspect, the detection unit includes a temperature sensor; the temperature sensor is disposed on the package substrate 3 and configured to detect a temperature of the package substrate 3. And the controller is in communication connection with the temperature sensor and is used for determining the bending direction of the packaging substrate 3 according to the detection signal of the temperature sensor. In one example, the controller is specifically configured to:
when the temperature of the package substrate 3 is less than or equal to a first threshold value, the bending direction is determined to be a direction bending away from the refrigerator 12 and the side where the photonic chip 2 is located.
When the temperature of the package substrate 3 is greater than or equal to a second threshold value, the bending direction is determined to be a direction bending toward the refrigerator 12 and the side where the photonic chip 2 is located.
When the temperature of the package substrate 3 is less than or equal to the first threshold, it indicates that the package substrate 3 is in a contracted state; when the temperature of the package substrate 3 is greater than or equal to the second threshold, it indicates that the package substrate 3 is in an expanded state. In practical applications, the second threshold may be greater than the first threshold. The specific numerical values of the first threshold and the second threshold can be determined through earlier experiments, and can be used as threshold parameters for subsequent automatic control after determination.
This will be described by way of example in connection with fig. 4:
as shown in fig. 4, the package substrate 3 is an organic substrate; the light source assembly 1 and the photonic chip 2 are disposed on the package substrate 3. The light source assembly 1 comprises a light emitter 11 and a refrigerator 12 for dissipating heat from the light emitter 11; the refrigerator 12 comprises a hot-surface substrate 121 and a cold-surface substrate 122 which are oppositely arranged; the hot-side substrate 121 is disposed on the package substrate 3; the light emitter 11 is disposed on the cold-side substrate 122; the hot-side substrate 121 further includes an extension 1211 extending toward the photonic chip 2. The extension 1211 abuts on the chip substrate 21 of the photonic chip 2. A thermally conductive adhesive is disposed at a contact position 300 of the extension 1211 and the chip substrate 21 of the photonic chip 2. The above structure further includes: a detection unit (not shown) and a controller (not shown); the controller is in communication connection with the detection unit and the refrigerator 12, and is configured to determine a bending direction of the package substrate 3 according to a detection signal of the detection unit, and control a current of the refrigerator 12 according to the bending direction.
Typically, the material of the chip substrate 21 is silicon; the material of the hot-side substrate 121 and the cold-side substrate 122 of the semiconductor refrigerator 12 is aluminum nitride ceramic. Silicon has a CTE of 2.6 ppm/deg.C, aluminum nitride a CTE of 4.7 ppm/deg.C, and organic substrates often have CTEs greater than 10 ppm/deg.C. Thus, when the temperature is high, the organic substrate is greatly deformed, and the whole organic substrate has a concave shape, as shown in fig. 2 a; the raised pattern appears when the temperature is low, as shown in fig. 3 a. However, the structure shown in fig. 4 has the following advantages: first, since the extension 1211 is provided and the material (silicon, aluminum nitride, etc.) used for the extension 1211 is strong in rigidity, thermal deformation can be reduced. Second, the extension 1211 of the hot-side substrate 121 is bonded to the chip substrate 21 of the photonic chip 2 by a good thermal conductive glue, so that the thermal conductivity problem of the TEC can be solved. Thirdly, because the TEC can change the temperature difference between the hot substrate 121 and the cold substrate 122, the thermal deformation thereof will also change due to the change of the temperature difference, and the amplitude of the zigzag bending deformation of the TEC will be changed, thereby actively controlling the light direction. Although the amount that can be controlled is relatively small, it can be very effective for optical coupling.
According to the scheme, under the condition that the organic substrate which can be wired at high density and is low in cost is reserved, deformation of the organic substrate is effectively reduced and light path deviation is controlled through extension of the lower substrate of the TEC.
The embodiment of the application also provides the optical computing equipment. The light computing device may include the chip package structure referred to in the embodiments described above.
The embodiment of the application also provides a chip packaging structure. As shown in fig. 5, the chip package structure includes: the optical module comprises a packaging substrate 3, a photonic chip 2, a light emitter 11 for providing optical signals for the photonic chip 2, and a refrigerator 12 for dissipating heat for the light emitter 11; the refrigerator 12 comprises a hot-surface substrate 121 and a cold-surface substrate 122 which are oppositely arranged; the hot-surface substrate 121 of the refrigerator 12 and the photonic chip 2 are respectively disposed on the package substrate 3; the light emitter 11 is disposed on the cold-side substrate 122 of the refrigerator 12. The chip packaging structure further comprises:
a detection unit (not shown);
and a controller (not shown) in communication connection with the detection unit and the refrigerator 12, respectively, for determining a bending direction of the package substrate 3 according to a detection signal of the detection unit and controlling a current of the refrigerator 12 according to the bending direction.
In the embodiment of the present application, the current for controlling the refrigerator is also the temperature difference between the hot side substrate and the cold side substrate of the refrigerator. By controlling the temperature difference between the hot-surface substrate and the cold-surface substrate, the respective deformation quantity of the hot-surface substrate and the cold-surface substrate can be controlled, so that the influence of the bending deformation of a part of the packaging substrate on the light path deviation is relieved, and the influence degree on the optical coupling efficiency can be reduced.
Optionally, the controller is specifically configured to:
when the bending direction is towards the refrigerator and the side where the photonic chip is located, reducing the current of the refrigerator;
and when the bending direction is the direction which is back to the refrigerator and the side where the photonic chip is located, increasing the current of the refrigerator.
Optionally, the detection unit includes a strain sensor;
the strain sensor is arranged on the packaging substrate;
and the controller is in communication connection with the strain sensor and is used for determining the bending direction of the packaging substrate according to the detection signal of the strain sensor.
Optionally, the controller is specifically configured to:
determining the state of the packaging substrate according to the detection signal of the strain sensor;
if the packaging substrate is in an expansion state, determining that the bending direction of the packaging substrate is a direction bending towards the refrigerator and the side where the photonic chip is located;
and if the packaging substrate is in a contraction state, determining that the bending direction of the packaging substrate is a direction which is back to the refrigerator and the side where the photonic chip is located.
Optionally, the detection unit includes a temperature sensor;
the temperature sensor is arranged on the packaging substrate and used for detecting the temperature of the packaging substrate;
and the controller is in communication connection with the temperature sensor and is used for determining the bending direction of the packaging substrate according to a detection signal of the temperature sensor.
Optionally, the controller is specifically configured to:
when the temperature of the packaging substrate is smaller than or equal to a first threshold value, determining that the bending direction is a direction which is back to the refrigerator and bends at the side where the photonic chip is located;
and when the temperature of the packaging substrate is greater than or equal to a second threshold value, determining that the bending direction is a direction bending towards the refrigerator and the side where the photonic chip is located.
In an implementable aspect, in the above chip packaging structure, a resisting portion 1211 for resisting bending deformation of the packaging substrate is arranged between the refrigerator 12 and the photonic chip 2.
Optionally, the refrigerator 12 and the photonic chip 2 are connected through the resistant portion. Specifically, the hot-side substrate 121 of the refrigerator 12 and the chip substrate 21 of the photonic chip 2 are connected through the resistive portion 1211.
Here, it should be noted that: the specific implementation manners of the chip package structure, the detection unit, and the controller provided in this embodiment may refer to the corresponding contents in the above embodiments, and are not described herein again.
Yet another embodiment of the present application provides a light computing device. The optical computing device includes the chip package structure included in the above embodiments.
Fig. 6 is a flowchart illustrating a method for controlling a chip package structure according to another embodiment of the present application. As shown in fig. 5, the chip package structure includes: the optical module comprises a packaging substrate, a photonic chip, a light emitter for providing optical signals for the photonic chip and a refrigerator for dissipating heat for the light emitter; the refrigerator comprises a hot surface substrate and a cold surface substrate which are oppositely arranged; the hot-surface substrate of the refrigerator and the photonic chip are respectively arranged on the packaging substrate; the illuminator is arranged on the cold surface substrate of the refrigerator. As shown in fig. 6, the control method includes:
601. and acquiring a detection signal of the detection unit.
602. And determining the bending direction of the packaging substrate according to the detection signal.
603. And controlling the current of the refrigerator according to the bending direction.
Optionally, in 603, "controlling the current of the refrigerator according to the bending direction" may be implemented by:
6031. and when the bending direction is towards the refrigerator and the side where the photonic chip is located, reducing the current of the refrigerator.
6032. And when the bending direction is the direction which is back to the refrigerator and the side where the photonic chip is positioned, increasing the current of the refrigerator.
Optionally, the detection unit includes a strain sensor; the strain sensor is disposed on the package substrate.
In the above 602, "determining the bending direction of the package substrate according to the detection signal" specifically includes:
6021a, determining the bending direction of the package substrate according to the detection signal of the strain sensor.
Alternatively, 6021a "determining the bending direction of the package substrate according to the detection signal of the strain sensor" may be implemented by:
and S11, determining the state of the packaging substrate according to the detection signal of the strain sensor.
And S12, if the packaging substrate is in an expansion state, determining that the bending direction of the packaging substrate is the direction bending towards the refrigerator and the side where the photonic chip is located.
And S13, if the packaging substrate is in a contraction state, determining that the bending direction of the packaging substrate is a direction which is back to the refrigerator and the side where the photonic chip is located.
Optionally, the detection unit includes a temperature sensor.
The temperature sensor is arranged on the packaging substrate and used for detecting the temperature of the packaging substrate;
in the above 602, "determining the bending direction of the package substrate according to the detection signal" specifically includes:
6021b, determining the bending direction of the package substrate according to the detection signal of the temperature sensor.
Optionally, 6021b "determining the bending direction of the package substrate according to the detection signal of the temperature sensor" may specifically be implemented by:
and S21, when the temperature of the packaging substrate is smaller than or equal to a first threshold value, determining that the bending direction is a direction which is back to the refrigerator and bends at the side where the photonic chip is located.
And S22, when the temperature of the packaging substrate is larger than or equal to a second threshold value, determining that the bending direction is a direction bending towards the refrigerator and the side where the photonic chip is located.
Here, it should be noted that: the steps of the control method and the specific implementation manner of the chip package structure provided in this embodiment may refer to the corresponding contents in the above method embodiments, and are not described herein again.
The technical solutions and the technical features in the above embodiments may be used alone or in combination in case of conflict with the present disclosure, and all embodiments that fall within the scope of protection of the present disclosure are intended to be equivalent embodiments as long as they do not exceed the scope of recognition of those skilled in the art.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (14)
1. A chip package structure, comprising: the photonic chip comprises a packaging substrate, a photonic chip and a light source component for providing optical signals for the photonic chip;
the light source component and the photonic chip are respectively arranged on the packaging substrate;
a resisting part for resisting the bending deformation of the packaging substrate is arranged between the light source assembly and the photonic chip, and the rigidity of the resisting part is greater than that of the packaging substrate;
the light source assembly is connected with the photon chip through the resisting part, and the light source assembly, the photon chip and the resisting part form a whole with high rigidity.
2. The structure of claim 1, wherein the light source assembly comprises: the refrigerator is used for radiating heat for the light emitter; the refrigerator comprises a hot surface substrate and a cold surface substrate which are oppositely arranged;
the hot-side substrate is arranged on the packaging substrate;
the light emitter is arranged on the cold-side substrate.
3. The structure of claim 2, wherein the hot-side substrate is connected to the photonic chip's chip substrate by the resistive portion.
4. The structure of claim 3, wherein the resistive portion is an extension of the thermal side substrate extending in a direction of the photonic chip.
5. The structure of claim 4, wherein the resistive portion abuts a chip substrate of the photonic chip.
6. The structure of claim 4, wherein the resist is connected to the chip substrate of the photonic chip by an adhesive filled in a gap therebetween.
7. The structure of claim 6, wherein the adhesive is a thermally conductive adhesive.
8. The structure of claim 4, wherein the material of the hot-side substrate and its extensions comprises aluminum nitride ceramic, diamond, or silicon carbide.
9. The structure of claim 2, further comprising: a detection unit and a controller;
the controller is respectively in communication connection with the detection unit and the refrigerator, and is used for determining the bending direction of the packaging substrate according to the detection signal of the detection unit and controlling the current of the refrigerator according to the bending direction.
10. The structure of claim 1, wherein the resisting portion is an extension portion of the chip substrate of the photonic chip extending in a direction of the light source assembly.
11. The structure of claim 10, wherein the material of the chip substrate and its extensions comprises silicon.
12. The structure of claim 1, wherein the photonic chip comprises a chip substrate and a mirror that directs light emitted by the light source assembly to a light coupling location of the photonic chip;
the reflector is arranged on the chip substrate.
13. The structure of claim 1, wherein the package substrate comprises an organic substrate.
14. A light computing device comprising a chip packaging structure according to any of claims 1 to 13.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110593659.2A CN113376767B (en) | 2021-05-28 | 2021-05-28 | Chip packaging structure and optical computing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110593659.2A CN113376767B (en) | 2021-05-28 | 2021-05-28 | Chip packaging structure and optical computing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113376767A CN113376767A (en) | 2021-09-10 |
| CN113376767B true CN113376767B (en) | 2022-08-26 |
Family
ID=77574811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110593659.2A Active CN113376767B (en) | 2021-05-28 | 2021-05-28 | Chip packaging structure and optical computing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113376767B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113421877B (en) * | 2021-06-16 | 2022-09-09 | 杭州光智元科技有限公司 | Semiconductor packaging structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1160600A1 (en) * | 2000-05-31 | 2001-12-05 | The Furukawa Electric Co., Ltd. | Semiconductor laser diode module |
| JP2011209516A (en) * | 2010-03-30 | 2011-10-20 | Kyocera Corp | Optical transmission substrate and optical module |
| JP2013142730A (en) * | 2012-01-07 | 2013-07-22 | Furukawa Electric Co Ltd:The | Optical module, circuit board, and communication system |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10123372A (en) * | 1996-10-18 | 1998-05-15 | Fujitsu Ltd | Optical module |
| WO1998045741A1 (en) * | 1997-04-08 | 1998-10-15 | Hitachi, Ltd. | Optical module, method for manufacturing optical module, and optical transmission device |
| JP2002057274A (en) * | 2000-08-09 | 2002-02-22 | Matsushita Electric Ind Co Ltd | High frequency optical circuit |
| JP2003222746A (en) * | 2002-01-29 | 2003-08-08 | Mitsubishi Electric Corp | Photoelectric coupling device |
| JP2003258357A (en) * | 2002-02-27 | 2003-09-12 | Kyocera Corp | Package for storing optical semiconductor element |
| US20060118947A1 (en) * | 2004-12-03 | 2006-06-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Thermal expansion compensating flip chip ball grid array package structure |
| US20090289350A1 (en) * | 2005-09-29 | 2009-11-26 | Nec Corporation | Semiconductor package, substrate, electronic device using such semiconductor package or substrate, and method for correcting warping of semiconductor package |
| US7707896B2 (en) * | 2008-01-15 | 2010-05-04 | Kuzdrall James A | Mechanical amplification of small dimensional changes using bowing |
| US8475056B2 (en) * | 2009-07-28 | 2013-07-02 | Jds Uniphase Corporation | Semiconductor device assembly |
| DE102010029522B4 (en) * | 2010-05-31 | 2022-07-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Stress reduction when inserting a chip into a package by means of a stress compensation region formed around the chip |
| JP2012256770A (en) * | 2011-06-10 | 2012-12-27 | Furukawa Electric Co Ltd:The | Laser module |
| CN208125949U (en) * | 2018-04-26 | 2018-11-20 | 北京协同创新研究院 | The coupling unit and opto-electronic device of a kind of lens fiber array, itself and chip |
| CN110401101A (en) * | 2019-07-26 | 2019-11-01 | 中国科学院半导体研究所 | The coupled structure and coupling process of semiconductor laser chip and silicon optical chip |
| CN110850534A (en) * | 2019-12-06 | 2020-02-28 | 绍兴柯芯光电技术有限公司 | Optical transceiver module and packaging method thereof |
| CN112713496A (en) * | 2020-12-29 | 2021-04-27 | 深圳市利拓光电有限公司 | High-speed laser |
-
2021
- 2021-05-28 CN CN202110593659.2A patent/CN113376767B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1160600A1 (en) * | 2000-05-31 | 2001-12-05 | The Furukawa Electric Co., Ltd. | Semiconductor laser diode module |
| JP2011209516A (en) * | 2010-03-30 | 2011-10-20 | Kyocera Corp | Optical transmission substrate and optical module |
| JP2013142730A (en) * | 2012-01-07 | 2013-07-22 | Furukawa Electric Co Ltd:The | Optical module, circuit board, and communication system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113376767A (en) | 2021-09-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9031107B2 (en) | Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic components | |
| EP2859391B1 (en) | Heat removal system for devices and subassemblies | |
| US6219364B1 (en) | Semiconductor laser module having improved metal substrate on peltier element | |
| JP3909257B2 (en) | Optical coupling device | |
| JP2013033022A (en) | Optical ranging device and electronic apparatus | |
| JP6669893B2 (en) | Bonding chip on glass assembly | |
| CN113376767B (en) | Chip packaging structure and optical computing device | |
| TWM541642U (en) | Semiconductor and composite heat dissipation substrate structure | |
| JP4271993B2 (en) | Optical module | |
| JP2007012717A (en) | Package type semiconductor device | |
| TWI771405B (en) | Optical module | |
| JP2019140390A (en) | Optical module | |
| CN113620234A (en) | Chip packaging structure, control method and optical computing equipment | |
| KR100866430B1 (en) | Optoelectronic module, and method for the production thereof | |
| TWM546046U (en) | Combination of semiconductor and high thermal conductivity heat dissipation substrate | |
| WO2023089059A2 (en) | Laser package and method for manufacturing a laser package | |
| JP2004128291A (en) | Semiconductor laser module and optical transmission receptacle | |
| JP2814987B2 (en) | Semiconductor laser module | |
| US6998587B2 (en) | Apparatus and method for heating micro-components mounted on a substrate | |
| JP3698967B2 (en) | Semiconductor laser module | |
| JP3241176B2 (en) | Optical package | |
| JPH09307018A (en) | Semiconductor element and manufacture thereof | |
| WO2024033980A1 (en) | Optical modulation device | |
| JP6311378B2 (en) | Optical module and optical module manufacturing method | |
| JP2002299748A (en) | Semiconductor laser module mount and semiconductor laser module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |