CN110850534A - Optical transceiver module and packaging method thereof - Google Patents
Optical transceiver module and packaging method thereof Download PDFInfo
- Publication number
- CN110850534A CN110850534A CN201911237467.7A CN201911237467A CN110850534A CN 110850534 A CN110850534 A CN 110850534A CN 201911237467 A CN201911237467 A CN 201911237467A CN 110850534 A CN110850534 A CN 110850534A
- Authority
- CN
- China
- Prior art keywords
- ceramic substrate
- transceiver module
- circuit board
- printed circuit
- optical transceiver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4286—Optical modules with optical power monitoring
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4287—Optical modules with tapping or launching means through the surface of the waveguide
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention relates to an optical transceiver module and a packaging method thereof, wherein the optical transceiver module comprises a printed circuit board, the printed circuit board is provided with a through groove, an iron sheet is fixedly arranged below the through groove, the upper surface of the iron sheet is fixedly provided with a ceramic substrate, the surface of the ceramic substrate is pasted with a vertical cavity surface emitting laser, a surface receiving detector, a laser driving chip, a transimpedance amplification chip and an optical fiber array, and the ceramic substrate and each part arranged on the surface of the ceramic substrate are covered and packaged by epoxy resin black glue. The optical transceiver module has the advantages of low cost, high reliability, good heat dissipation performance, compact structure, strong expandability and the like.
Description
Technical Field
The invention relates to an optical transceiver module and a packaging method thereof, in particular to an integrated optical transceiver module, belonging to the technical field of optical fiber communication.
Background
The optical transceiver module is widely applied to the fields of wireless base stations, ethernet networks, data centers, and recently emerging 5G transmission architectures as one of solutions for high-speed and high-capacity interconnection transmission. Compared with the traditional transmission of signals by using copper wires, the technology and the cost of the method have the advantages. A cable formed based on the traditional copper wiring has the defects of being heavy, large in bending radius, high in power consumption, short in transmission distance, low in speed and the like. The optical transceiver module has a plurality of advantages compared with the transmission of signals by light, for example, the transmission power on a link is lower, the weight is only one fourth of that of a direct-connected copper cable, the volume is about half of that of the copper cable, the bending radius can be smaller, the wiring in a machine room is more convenient, and the optical transceiver module has the advantages of better air flowing heat dissipation, longer transmission distance and the like.
One of the core parts of the optical transceiver module is the package of the optical device. At present, in a plurality of optical transceiver modules in the market, a TOSA and ROSA separate packaging mode is adopted, a large amount of limited design space in the modules is occupied, the flexibility of PCB design of a printed circuit board is reduced, the heat dissipation design is complex, and the complexity of the assembly of the whole module is increased.
Therefore, in order to solve the above technical problems, it is necessary to provide an innovative optical transceiver module and a method thereof to overcome the above-mentioned drawbacks in the prior art.
Disclosure of Invention
In order to solve the above problems, an object of the present invention is to provide an optical module and a method thereof, which have low cost, high reliability, good heat dissipation, compact structure and high expandability.
To achieve the above object, the present invention provides a technical solution:
an optical transceiver module comprises at least one optical fiber array, at least one ceramic substrate, at least one iron sheet, at least one piece of heat-dissipation silicone grease, at least one vertical cavity surface emitting laser, at least one surface receiving detector, at least one laser driving chip, at least one transimpedance amplification chip and at least one printed circuit board, wherein the printed circuit board is provided with a through groove, the iron sheet is fixedly arranged on the lower surface of the printed circuit board, the iron sheet is positioned below the through groove, and the heat-dissipation silicone grease is adhered to the back surface of the iron sheet;
the optical fiber array is adhered to the surface of the ceramic substrate in parallel, and the ceramic substrate and each part mounted on the surface of the ceramic substrate are covered and packaged by epoxy resin black glue;
the vertical cavity surface emitting laser and the surface receiving photodetector are connected with the optical fiber array through refractive index matching glue and achieve signal transmission, the vertical cavity surface emitting laser is electrically connected with the laser driving chip, the surface receiving detector is electrically connected with the transimpedance amplification chip, and the laser driving chip and the transimpedance amplification chip are electrically connected with the printed circuit board respectively.
Furthermore, the iron sheet is adhered to the right lower part of the through groove of the printed circuit board through ultraviolet curing glue.
Furthermore, a gold layer and an alignment mark are plated on the ceramic substrate, and the laser driving chip and the transimpedance amplification chip are attached to the gold layer, so that the laser driving chip and the transimpedance amplification chip can be conveniently bound and wired; the vertical cavity surface emitting laser and the surface receiving detector are attached to the alignment marks, so that the vertical cavity surface emitting laser and the surface receiving detector can be accurately positioned conveniently.
Further, the vertical cavity surface emitting laser, the surface receiving detector, the laser driving chip and the transimpedance amplifier chip are respectively attached to the surface of the ceramic substrate through silver paste.
Furthermore, the ceramic substrate is pasted on the iron sheet through silver paste, and the silver paste can enhance the heat conduction between the ceramic substrate and the iron sheet.
Furthermore, the optical fiber array comprises a plurality of single-mode optical fibers arranged in parallel, the end faces of the optical fibers for coupling form an angle of 45 degrees, and the end faces are plated with metal films to enhance reflection.
Furthermore, a microcontroller chip is further arranged on the printed circuit board, and the microcontroller chip is electrically connected with the bonding pad on the printed circuit board through a wiring.
Furthermore, the optical transceiver module further comprises a metal shell, the printed circuit board is placed in the metal shell, and the heat dissipation silicone grease pasted on the back of the iron sheet is in contact with the metal shell, so that the overall heat dissipation of the module is enhanced.
The invention also provides a technical scheme that:
the packaging method of the optical transceiver module comprises the following steps:
(1) the iron sheet is adhered to the right lower part of the through groove of the printed circuit board through ultraviolet curing glue and is fixed through ultraviolet exposure;
(2) respectively attaching the vertical cavity surface emitting laser, the surface receiving detector, the laser driving chip and the transimpedance amplifier chip to the surface of a ceramic substrate through silver paste, and baking and fixing the ceramic substrate through a constant temperature box;
(3) pasting the ceramic substrate subjected to surface mounting on an iron sheet through silver paste, and baking and fixing the ceramic substrate through a constant temperature box;
(4) adhering the optical fiber array to the surface of the ceramic substrate in parallel;
(5) packaging the ceramic substrate and each part arranged on the surface of the ceramic substrate by using epoxy resin black glue;
(6) and adhering the heat dissipation silicone grease to the back of the iron sheet, and enabling the heat dissipation silicone grease to be in direct contact with a metal shell for placing the printed circuit board.
Further, the specific steps of the step (4) are as follows: coating low-shrinkage ultraviolet curing glue on the bottom of the optical fiber array, coupling the optical fiber array with a vertical cavity surface emitting laser and a surface receiving detector, and irradiating by using ultraviolet light to form primary fixation after the coupling is finished; then filling refractive index matching glue between the optical fiber on the optical fiber array and the vertical cavity surface emitting laser and the surface receiving detector, and then irradiating by ultraviolet light for curing.
Compared with the prior art, the invention has the advantages that:
1. the optical transceiver module of the invention enables the whole structure of the module to be more compact, solves the problems of cost and assembly complexity of the traditional optical transceiver module packaged by a discrete device, has high reliability, can realize low-loss signal transmission, and has the advantages of strong expandability and the like.
2. Compared with the traditional discrete light receiving component, the light receiving and transmitting module can effectively reduce the cost, and adopts the ceramic substrate to ensure that the overall thermal stability of the module is better while greatly reducing the volume of an optical part.
3. The optical transceiver module and the packaging method thereof have the advantages of high coupling efficiency, low power consumption, convenient assembly, simple heat dissipation design, good heat dissipation performance and the like, so that the flexibility of an optical design part can be greatly improved, such as: the wavelength division multiplexing function and the like are conveniently integrated, and the packaging volume of the optical part is greatly reduced.
Drawings
Fig. 1 is an overall effect diagram of an optical transceiver module according to the present invention.
Fig. 2 is a schematic perspective view of an optical transceiver module according to the present invention.
Fig. 3 is a schematic perspective view of a printed circuit board and an iron sheet according to the present invention.
Fig. 4 is a schematic perspective view of the printed circuit board, the iron plate and the ceramic plate according to the present invention.
Fig. 5 is a schematic back perspective view of the optical transceiver module of the present invention.
FIG. 6 is a schematic diagram of the ceramic substrate of the present invention after gold plating.
FIG. 7 is a schematic diagram of a VCSEL, a surface-receiving detector, a laser driver chip, and a transimpedance amplifier chip according to the present invention.
Fig. 8 is a side view of an optical transceiver module of the present invention.
Fig. 9 is a side view of an alternative view of an optical transceiver module of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further specifically described below by way of embodiments in combination with the accompanying drawings.
Example (b): an optical transceiver module and a packaging method thereof are disclosed, as shown in fig. 1-9, the optical transceiver module includes an optical Fiber Array (FA) 1, a ceramic substrate 3, an iron sheet 4, a heat dissipation silicone grease 12, a vertical cavity surface emitting laser 6, a surface receiving detector 5, a laser driving chip 8, a transimpedance amplifier chip 7, and a Printed Circuit Board (PCB) 10, wherein a through groove is formed on a surface of the PCB 10, and the PCB 10 is disposed in a metal housing.
The optical fiber array 1 is supported on the ceramic substrate 3, and the two are bonded through the low-shrinkage ultraviolet curing adhesive 14. The ceramic substrate 3 is supported on an iron plate 4. The iron sheet 4 is located right below the through groove of the printed circuit board 10, and the iron sheet 4 and the printed circuit board 10 are bonded through ultraviolet curing glue. The vertical cavity surface emitting laser 6 and the surface receiving photodetector 5 are respectively attached to a ceramic substrate 3, and the ceramic substrate 3 is plated with a gold layer 3-1 and an alignment mark 3-2 also formed of a gold layer.
Specifically, the optical fiber array 1 is formed by placing 12 single-mode optical fibers 2 in parallel, the interval between the 12 optical fibers 2 is fixed to 250 μm, the end face for coupling is ground to 45 °, and the 45 ° end face is plated with a metal film 13, in this embodiment, an electron beam evaporation method is adopted, and the metal film 13 is gold.
The iron sheet 4 is adhered to the right lower part of the through groove on the printed circuit board 10 through ultraviolet curing glue, and is exposed under an ultraviolet lamp for curing and fixing. In this embodiment, the length and width of the iron sheet are all 3mm larger than the length and width of the through slot of the printed circuit board 10.
The relative positions of the alignment marks 3-2 on the ceramic substrate 3 are determined by the relative positions of the optical aperture of the VCSEL 6 and the optical aperture of the surface-receiving detector 5, and the two sets of alignment marks 3-2 are maintained on the same straight line. In this embodiment, the pitch of the optical fibers 2 in the optical fiber array 1 is 250 μm, so the pitch of the optical holes of the adopted VCSEL 6 and the pitch of the optical holes of the surface receiving detector 5 are both 250 μm.
The vertical cavity surface emitting laser 6 and the surface receiving detector 5 are pasted on the alignment mark 3-2 through a high-precision paster instrument and are adhered on the ceramic substrate 3 through an adhesive; similarly, the laser driving chip 8 and the transimpedance amplifier chip 7 are also attached to the area plated with the gold layer 3-1 on the ceramic substrate 3 by a chip mounter and fixed by an adhesive. In this embodiment, the adhesive is silver paste, and needs to be placed in a constant temperature oven for baking for 3 to 4 hours after the mounting is completed.
After the ceramic substrate 3 is pasted and fixed, the optical fiber array 1 coated with the low-shrinkage ultraviolet curing adhesive 14 is close to the ceramic substrate 3 along the horizontal direction, the position of the optical fiber array 1 is continuously adjusted until the coupling efficiency is highest, the position of the optical fiber array 1 is not adjusted, and an ultraviolet lamp is used for irradiating the area coated with the low-shrinkage curing adhesive 14, so that the optical fiber array 1 is fixed.
After the optical fiber array 1 is fixed, a proper amount of refractive index matching glue 15 is filled between the optical fibers 2 in the optical fiber array 1 and the vertical cavity surface emitting laser 6 and the surface receiving detector 5 to improve the coupling efficiency, and then the ultraviolet lamp is used for irradiation, so that secondary curing is completed. The vertical cavity surface emitting laser 6 and the surface receiving photodetector 5 are linked with the flat optical fiber array 1 by an index matching adhesive 15 and realize signal transmission.
After the optical fiber array 1 is cured for the second time, the epoxy resin black glue 11 is coated on the whole ceramic substrate 3, the optical fiber array 1, the vertical cavity surface emitting laser 6, the surface receiving detector 5, the laser driving chip 8 and the transimpedance amplifier chip 7 which are arranged on the ceramic substrate 3 are packaged, and final air-tight packaging is completed, so that the reliability and the heat dissipation performance of the module are enhanced.
The heat-dissipating silicone grease 12 is attached to the back surface of the iron plate 4 after the hermetic sealing is completed, so as to be in direct contact with the metal case for placing the entire printed circuit board 10, thereby enhancing heat dissipation.
The vertical cavity surface emitting laser 6 and the surface receiving detector 5 on the ceramic substrate 3 are respectively electrically connected with the laser driving chip 8 and the transimpedance amplifier chip 7 through gold wire ultrasonic welding.
And the laser driving chip 8 and the transimpedance amplification chip 7 on the ceramic substrate 3 are electrically connected with the welding pads around the through groove of the printed circuit board 10 through gold wire ultrasonic welding.
The microcontroller chip 9 on the printed circuit board 10 is electrically connected with the pads around the through grooves through the wires, so that the electrical connection in the whole transceiver module is completed.
The working principle of the optical transceiver module formed by the invention is as follows: the modulated external high-speed electrical signal enters a laser driving chip 8 on the ceramic substrate 3 through a printed circuit board 10, the laser driving chip 8 processes the electrical signal transmitted from the outside into an electrical signal suitable for driving the vertical cavity surface emitting laser 6, the vertical cavity surface emitting laser 6 converts the electrical signal transmitted from the outside into an optical signal after being driven by the laser driving chip 8, and the optical signal is emitted through the optical fiber array 1, so that the conversion from electricity to light is completed. Similarly, a high-speed modulated optical signal transmitted into the optical fiber array 1 from the outside is received by the surface receiving detector 5, the optical signal is converted into a weak electrical signal, and the weak electrical signal is subjected to amplitude limiting amplification, gain control, pre-emphasis and the like by the transimpedance amplification chip 7, so that an electrical signal suitable for communication with an upper computer (such as an exchanger) is formed, and optical-to-electrical conversion is completed.
The above embodiments are merely preferred embodiments of the present disclosure, which are not intended to limit the present disclosure, and any modifications, equivalents, improvements and the like, which are within the spirit and principle of the present disclosure, should be included in the scope of the present disclosure.
Claims (10)
1. An optical transceiver module is characterized by comprising at least one optical fiber array, at least one ceramic substrate, at least one iron sheet, at least one piece of heat dissipation silicone grease, at least one vertical cavity surface emitting laser, at least one surface receiving detector, at least one laser driving chip, at least one transimpedance amplification chip and at least one printed circuit board, wherein the printed circuit board is provided with a through groove, the iron sheet is fixedly arranged on the lower surface of the printed circuit board, the iron sheet is positioned below the through groove, and the heat dissipation silicone grease is adhered to the back surface of the iron sheet;
the optical fiber array is adhered to the surface of the ceramic substrate in parallel, and the ceramic substrate and each part mounted on the surface of the ceramic substrate are covered and packaged by epoxy resin black glue;
the vertical cavity surface emitting laser and the surface receiving photodetector are connected with the optical fiber array through refractive index matching glue and achieve signal transmission, the vertical cavity surface emitting laser is electrically connected with the laser driving chip, the surface receiving detector is electrically connected with the transimpedance amplification chip, and the laser driving chip and the transimpedance amplification chip are electrically connected with the printed circuit board respectively.
2. The optical transceiver module as claimed in claim 1, wherein the iron sheet is adhered to the printed circuit board directly under the through-groove by an ultraviolet curing adhesive.
3. The optical transceiver module as claimed in claim 1, wherein the ceramic substrate is plated with a gold layer and an alignment mark, the laser driver chip and the transimpedance amplifier chip are mounted on the gold layer, and the vcsel and the planar receiver detector are mounted on the alignment mark.
4. The optical transceiver module as claimed in claim 3, wherein the VCSEL, the surface-receiving detector, the laser driver chip and the transimpedance amplifier chip are respectively mounted on the surface of the ceramic substrate by silver paste.
5. The optical transceiver module as claimed in claim 1, wherein the ceramic substrate is adhered to the iron sheet by silver paste.
6. An optical transceiver module as claimed in claim 1, wherein the optical fiber array comprises a plurality of optical fibers arranged in parallel, the end surfaces of the optical fibers for coupling are at an angle of 45 °, and the end surfaces are coated with a metal film to enhance reflection.
7. The optical transceiver module as claimed in claim 1, wherein the printed circuit board further has a microcontroller chip, and the microcontroller chip is electrically connected to the pads on the printed circuit board through traces.
8. The optical transceiver module as claimed in claim 1, further comprising a metal housing, wherein the printed circuit board is disposed in the metal housing, and the heat-dissipating silicone grease adhered to the back surface of the iron plate contacts the metal housing.
9. The method of packaging an optical transceiver module as claimed in claim 1, wherein the method comprises the steps of:
(1) the iron sheet is adhered to the right lower part of the through groove of the printed circuit board through ultraviolet curing glue and is fixed through ultraviolet exposure;
(2) respectively attaching the vertical cavity surface emitting laser, the surface receiving detector, the laser driving chip and the transimpedance amplifier chip to the surface of a ceramic substrate through silver paste, and baking and fixing the ceramic substrate through a constant temperature box;
(3) pasting the ceramic substrate subjected to surface mounting on an iron sheet through silver paste, and baking and fixing the ceramic substrate through a constant temperature box;
(4) adhering the optical fiber array to the surface of the ceramic substrate in parallel;
(5) packaging the ceramic substrate and each part arranged on the surface of the ceramic substrate by using epoxy resin black glue;
(6) and adhering the heat dissipation silicone grease to the back of the iron sheet, and enabling the heat dissipation silicone grease to be in direct contact with a metal shell for placing the printed circuit board.
10. The packaging method according to the preceding claim, wherein the specific steps of step (4) are as follows: coating low-shrinkage ultraviolet curing glue on the bottom of the optical fiber array, coupling the optical fiber array with a vertical cavity surface emitting laser and a surface receiving detector, and irradiating by using ultraviolet light to form primary fixation after the coupling is finished; then filling refractive index matching glue between the optical fiber on the optical fiber array and the vertical cavity surface emitting laser and the surface receiving detector, and then irradiating by ultraviolet light for curing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911237467.7A CN110850534A (en) | 2019-12-06 | 2019-12-06 | Optical transceiver module and packaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911237467.7A CN110850534A (en) | 2019-12-06 | 2019-12-06 | Optical transceiver module and packaging method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110850534A true CN110850534A (en) | 2020-02-28 |
Family
ID=69608357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911237467.7A Pending CN110850534A (en) | 2019-12-06 | 2019-12-06 | Optical transceiver module and packaging method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110850534A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112764173A (en) * | 2020-12-31 | 2021-05-07 | 武汉联特科技股份有限公司 | Single-mode optical module based on MLG2.0 protocol |
| CN113359248A (en) * | 2021-06-02 | 2021-09-07 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113376767A (en) * | 2021-05-28 | 2021-09-10 | 上海曦智科技有限公司 | Chip packaging structure and optical computing device |
| CN113423260A (en) * | 2021-05-27 | 2021-09-21 | 深圳市极致兴通科技有限公司 | Can reduce COB device of solving receiving terminal light return loss |
| US11506849B2 (en) | 2021-02-05 | 2022-11-22 | Delta Electronics, Inc. | Optical transceiver and manufacturing method thereof |
| CN115877523A (en) * | 2022-12-22 | 2023-03-31 | 讯芸电子科技(中山)有限公司 | 400G optical transceiver module |
-
2019
- 2019-12-06 CN CN201911237467.7A patent/CN110850534A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112764173A (en) * | 2020-12-31 | 2021-05-07 | 武汉联特科技股份有限公司 | Single-mode optical module based on MLG2.0 protocol |
| WO2022142171A1 (en) * | 2020-12-31 | 2022-07-07 | 武汉联特科技股份有限公司 | Mlg2.0 protocol-based single-mode optical module |
| US11506849B2 (en) | 2021-02-05 | 2022-11-22 | Delta Electronics, Inc. | Optical transceiver and manufacturing method thereof |
| CN113423260A (en) * | 2021-05-27 | 2021-09-21 | 深圳市极致兴通科技有限公司 | Can reduce COB device of solving receiving terminal light return loss |
| CN113423260B (en) * | 2021-05-27 | 2022-11-18 | 深圳市极致兴通科技有限公司 | Can reduce COB device of receiving terminal light return loss |
| CN113376767A (en) * | 2021-05-28 | 2021-09-10 | 上海曦智科技有限公司 | Chip packaging structure and optical computing device |
| CN113359248A (en) * | 2021-06-02 | 2021-09-07 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN115877523A (en) * | 2022-12-22 | 2023-03-31 | 讯芸电子科技(中山)有限公司 | 400G optical transceiver module |
| CN115877523B (en) * | 2022-12-22 | 2023-07-25 | 讯芸电子科技(中山)有限公司 | 400G optical transceiver module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110850534A (en) | Optical transceiver module and packaging method thereof | |
| KR100460703B1 (en) | Electro-optical circuit board having unified optical transmission/receiving module and optical waveguide | |
| CN110388576B (en) | Optical module | |
| US6955481B2 (en) | Method and apparatus for providing parallel optoelectronic communication with an electronic device | |
| CN1333279C (en) | Silicon carrier for optical interconnect modules | |
| EP1723456B1 (en) | System and method for the fabrication of an electro-optical module | |
| CN106371176A (en) | Optoelectronic module with improved heat management | |
| US8705906B2 (en) | Photoelectric conversion module | |
| CN111352192B (en) | Optical module | |
| US20160226592A1 (en) | Integrated parallel optical transceiver | |
| WO2022142171A1 (en) | Mlg2.0 protocol-based single-mode optical module | |
| CN103250471A (en) | Printed circuit board assembly and a method for manufacturing the printed circuit board assembly | |
| JP5246136B2 (en) | Optical transceiver | |
| CN104503043B (en) | Multi-path parallel optical assembly | |
| CN212031793U (en) | Optical module | |
| WO2009107671A1 (en) | Photoelectric conversion device | |
| KR100734906B1 (en) | Optical interconnect using flexible optical printed circuit board | |
| CN1318869C (en) | Coupling structure for optical waveguide and optical device and optical alignment method by using the same | |
| WO2023077903A1 (en) | Optical module | |
| CN103257413B (en) | Parallel light transmit-receive component of mini serial SCSI broadband high-speed transmission | |
| TWI485455B (en) | Optoelectronic hybrid interconnect | |
| CN211086695U (en) | Optical transceiver module | |
| WO2007091733A2 (en) | Photoelectric converting device, manufacturing method of the same, and external waveguide | |
| CN113534359A (en) | Optical module | |
| TWI451147B (en) | Optoelectronic module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |