CN115877523A - 400G optical transceiver module - Google Patents
400G optical transceiver module Download PDFInfo
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- CN115877523A CN115877523A CN202211672487.9A CN202211672487A CN115877523A CN 115877523 A CN115877523 A CN 115877523A CN 202211672487 A CN202211672487 A CN 202211672487A CN 115877523 A CN115877523 A CN 115877523A
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- 230000003287 optical effect Effects 0.000 title claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 110
- 239000000919 ceramic Substances 0.000 claims abstract description 93
- 239000013307 optical fiber Substances 0.000 claims abstract description 34
- 238000004891 communication Methods 0.000 claims abstract description 16
- 238000003466 welding Methods 0.000 claims abstract description 6
- 230000017525 heat dissipation Effects 0.000 claims description 11
- 239000000835 fiber Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000010329 laser etching Methods 0.000 claims description 4
- 238000004506 ultrasonic cleaning Methods 0.000 claims 1
- 238000005057 refrigeration Methods 0.000 abstract description 10
- 230000035945 sensitivity Effects 0.000 abstract description 5
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 230000005540 biological transmission Effects 0.000 description 9
- 230000008878 coupling Effects 0.000 description 9
- 238000010168 coupling process Methods 0.000 description 9
- 238000005859 coupling reaction Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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Abstract
The invention provides a 400G optical transceiving module, and relates to the field of optical modules. The 400G optical transceiver module comprises a PCB substrate, a stepped radiating block, a transmitting end optical fiber array, a receiving end optical fiber array, a first ceramic substrate and a second ceramic substrate, wherein the stepped radiating block is provided with an upper stepped surface and a lower stepped surface; a laser chip and a backlight detector are attached to the upper side of the first ceramic substrate; a TEC refrigeration piece is embedded in a groove on the lower side of the first ceramic substrate, and the TEC refrigeration piece and the laser chip are distributed in an up-down corresponding manner; the PD chip is attached to the upper side of the second ceramic substrate, and the laser chip and the first ceramic substrate as well as the PD chip and the second ceramic substrate are packaged through hot-press welding. The hot-press welding packaging shortens the communication line between the chip and the PCB substrate, improves the communication efficiency and ensures that the sensitivity of high-frequency signals meets the requirement.
Description
Technical Field
The invention relates to the technical field of optical modules, in particular to a 400G optical transceiver module.
Background
In the optical communication technology, an optical module is a core device for realizing photoelectric conversion and electro-optical conversion functions, and the optical module mainly comprises an optical transmitter, an optical receiver, a functional circuit, an optical interface and the like.
For example, chinese patent with publication No. CN107861197B and publication No. 2020.09.18 discloses an optical transmission assembly, a packaging process and an optical module, and specifically discloses an optical transmission assembly including: the device comprises a flexible circuit board, a laser chip, a backlight detector, a coupling lens, an isolator, a first adapter and a substrate; the flexible circuit board is used for supplying power to the laser chip and the backlight detector and transmitting electric signals; the laser chip is used for receiving the electric signal and converting the electric signal into an optical signal; the coupling lens is used for converging an optical signal emitted by the laser chip, wherein the optical signal is incident into the single-mode optical fiber ferrule of the first adapter through the isolator; and the substrate is used for providing a light path coupling medium for the laser chip and the coupling lens.
The optical transmission module in the prior art is designed with a laser chip to convert an electrical signal into an optical signal, and the optical signal is incident into a single-mode optical fiber ferrule through a coupling lens and an isolator. And, be connected flexible circuit board and laser chip through gold thread bonding, when transmission rate reaches certain degree, the high frequency signal sensitivity of gold thread transmission can't satisfy the requirement.
The situation of over high local heat is easy to occur due to large heat productivity of the laser chip; moreover, the laser chip and the coupling lens have a size difference, and it is difficult to achieve high alignment of the laser chip and the coupling lens.
Disclosure of Invention
In order to solve the above problems, an object of the present invention is to provide a 400G optical transceiver module, so as to solve the problem that when the transmission rate reaches a certain degree, the sensitivity of the high-frequency signal transmitted by the gold wire cannot meet the requirement; the laser chip has large heat productivity, so that the situation of over-high local heat is easy to occur; further, the laser chip and the coupling lens have a size difference, and it is difficult to achieve high alignment between the laser chip and the coupling lens.
The technical scheme of the 400G optical transceiver module is as follows:
the 400G optical transceiver module comprises a PCB substrate, a stepped radiating block, an emitting end optical fiber array, a receiving end optical fiber array, a first ceramic substrate and a second ceramic substrate, wherein the stepped radiating block is attached to the surface of the PCB substrate;
the stepped heat dissipation block is provided with an upper stepped surface and a lower stepped surface, the transmitting end optical fiber array and the receiving end optical fiber array are attached to the upper stepped surface side by side, and the first ceramic substrate and the second ceramic substrate are attached to the lower stepped surface side by side;
a laser chip and a backlight detector are attached to the upper side of the first ceramic substrate, an isolator is further arranged on the transmitting end optical fiber array corresponding to the laser chip, and a focusing lens is further arranged on the upper step surface between the laser chip and the isolator;
a groove is formed in the lower side of the first ceramic substrate, TEC refrigerating pieces are embedded in the groove and are respectively attached to the lower step surface and the first ceramic substrate, and the TEC refrigerating pieces and the laser chip are distributed in an up-and-down corresponding mode;
a PD chip is attached to the upper side of the second ceramic substrate and is arranged corresponding to the receiving end optical fiber array; the laser chip and the first ceramic substrate, and the PD chip and the second ceramic substrate are packaged through hot-press welding.
Furthermore, communication interfaces are respectively arranged on the lower sides of the laser chip and the PD chip, surface circuits are respectively arranged on the first ceramic substrate and the second ceramic substrate, and low-temperature solder balls are respectively connected between the communication interface of the laser chip and the surface circuit of the first ceramic substrate and between the communication interface of the PD chip and the surface circuit of the second ceramic substrate.
Further, the upper surface of first ceramic substrate is on a parallel with go up the ladder surface, just the upper surface of first ceramic substrate is less than go up the ladder surface setting.
Further, go up the stair face and be on a parallel with the bottom surface setting of notch cuttype radiating block, the stair face is keeping away from down be the slant and set up in the direction of going up the stair face, down the stair face for the inclination of the bottom surface of notch cuttype radiating block is between 0 to 5.
Further, the inclination angle of the lower step surface relative to the bottom surface of the stepped heat dissipation block is any angle between 1 degree and 3 degrees.
Further, a first inclined plane is arranged on the lower surface of the first ceramic substrate, and the inclined angle of the first inclined plane is equal to that of the lower stepped surface; the lower surface of the second ceramic substrate is provided with a second inclined plane, and the second inclined plane is equal to the inclination angle of the lower stepped surface.
Furthermore, micro grooves are uniformly arranged on the lower step surface, and the length direction of each micro groove is arranged along the surface inclination direction of the lower step surface; the first inclined plane, the second inclined plane all be equipped with down stair surface matched with little ridge, little ridge's length direction is followed first inclined plane or the surface slope direction of second inclined plane sets up.
Furthermore, the cross section profile of the micro groove is V-shaped, the depth of the micro groove is any size between 20 mu m and 200 mu m, and the distance between two adjacent micro grooves is any size between 200 mu m and 600 mu m.
Furthermore, the micro grooves and the micro ridges are both manufactured by adopting a laser etching and ultrasonic wave removing technology.
Furthermore, one side of the receiving end optical fiber array is provided with an overhanging part protruding out of the upper stepped surface, the overhanging part is positioned on the upper part of the second ceramic substrate, and the PD chip is arranged on the lower side of the overhanging part of the receiving end optical fiber array.
Has the beneficial effects that: this 400G optical transceiver module has adopted PCB base plate, notch cuttype radiating block, transmitting terminal fiber array, receiving terminal fiber array, first ceramic substrate and second ceramic substrate's design form, and the notch cuttype radiating block laminating is connected on the surface of PCB base plate, and first ceramic substrate and second ceramic substrate are pasted side by side and are adorned on the lower notch cuttype face of notch cuttype radiating block. The PCB substrate is electrically connected with the laser chip through a surface circuit of the first ceramic substrate, and laser emitted by the laser chip is converged to the end part of an optical fiber of the emission end optical fiber array through the focusing lens to play a role in emitting light; the PCB substrate is electrically connected with the PD chip through a surface circuit of the second ceramic substrate, and transmits the optical signal received by the receiving end optical fiber array to the PD chip to play a role in receiving light.
The stepped heat dissipation block is provided with an upper stepped surface and a lower stepped surface, the focusing lens is arranged on the upper stepped surface, the laser chip is arranged on the lower stepped surface, and the size difference between the laser chip and the focusing lens can be eliminated by utilizing the certain height difference between the upper stepped surface and the lower stepped surface, so that the aim of aligning the laser chip and the focusing lens in height is fulfilled. In addition, the laser chip and the first ceramic substrate, the PD chip and the second ceramic substrate are packaged through hot-press welding, compared with the electric connection formed by gold wire bonding, the hot-press welding shortens the communication line between the chip and the PCB substrate, improves the communication efficiency, and ensures that the sensitivity of high-frequency signals meets the requirement when the transmission rate reaches a certain degree.
And the laser chip and the backlight detector are mounted on the upper side of the first ceramic substrate, the TEC refrigeration pieces are embedded in the grooves on the lower side of the first ceramic substrate, and the TEC refrigeration pieces and the laser chip are distributed in an up-and-down corresponding mode. High temperature generated by the laser chip is conducted to the refrigerating end of the TEC refrigerating piece 7 through the first ceramic substrate, and the TEC refrigerating piece transmits absorbed heat downwards to the stepped heat dissipation block, so that a large amount of heat generated by the laser chip is effectively conducted and diffused, and the condition that local heat is too high is avoided.
Drawings
Fig. 1 is a schematic diagram of an internal structure of an optical transceiver module according to an embodiment of the invention;
FIG. 2 is a partial schematic view of a laser chip and a low temperature solder ball in an embodiment of a 400G optical transceiver module of the present invention;
FIG. 3 is a schematic front view of a 400G optical transceiver module according to an embodiment of the present invention;
fig. 4 isbase:Sub>A schematic cross-sectional view atbase:Sub>A-base:Sub>A in fig. 3.
In the figure: 1-PCB substrate, 2-step type heat dissipation block, 21-upper step surface, 22-lower step surface and 23-micro groove;
3-emitting end optical fiber array, 31-laser chip, 32-backlight detector, 33-isolator, 34-focusing lens and 35-low temperature tin ball;
4-receiving end optical fiber array, 41-PD chip, 5-first ceramic substrate, 6-second ceramic substrate and 7-TEC refrigeration piece.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
In embodiment 1 of the 400G optical transceiver module of the present invention, as shown in fig. 1 to 4, the 400G optical transceiver module includes a PCB substrate 1, a stepped heat dissipation block 2, a transmitting end optical fiber array 3, a receiving end optical fiber array 4, a first ceramic substrate 5, and a second ceramic substrate 6, wherein the stepped heat dissipation block 2 is attached to the surface of the PCB substrate 1; the stepped heat dissipation block 2 has an upper stepped surface 21 and a lower stepped surface 22, the transmitting end optical fiber array 3 and the receiving end optical fiber array 4 are attached to the upper stepped surface 21 side by side, and the first ceramic substrate 5 and the second ceramic substrate 6 are attached to the lower stepped surface 22 side by side.
A laser chip 31 and a backlight detector 32 are attached to the upper side of the first ceramic substrate 5, an isolator 33 is further arranged on the transmitting end optical fiber array 3 corresponding to the laser chip 31, and a focusing lens 34 is further arranged on the upper step surface 21 between the laser chip 31 and the isolator 33; a groove is formed in the lower side of the first ceramic substrate 5, the TEC refrigerating pieces 7 are embedded in the groove, the TEC refrigerating pieces 7 are respectively attached to the lower step face 22 and the first ceramic substrate 5, and the TEC refrigerating pieces 7 and the laser chip 31 are distributed in an up-and-down corresponding mode; a PD chip 41 is attached to the upper side of the second ceramic substrate 6, and the PD chip 41 is arranged corresponding to the receiving end optical fiber array 5; the laser chip 31 and the first ceramic substrate 5, and the PD chip 41 and the second ceramic substrate 6 are packaged by thermocompression bonding.
This 400G optical transceiver module has adopted PCB base plate 1, notch cuttype radiating block 2, transmitting terminal fiber array 3, receiving terminal fiber array 4, first ceramic substrate 5 and the design form of second ceramic substrate 6, and notch cuttype radiating block 2 laminating is connected on PCB base plate 1's surface, and first ceramic substrate 5 and second ceramic substrate 6 are installed in the subsides side by side on the lower stair face 22 of notch cuttype radiating block 2. The PCB substrate 1 is electrically connected with the laser chip 31 through a surface circuit of the first ceramic substrate 5, and laser emitted by the laser chip 31 is converged to the end part of an optical fiber of the emission end optical fiber array 3 through the focusing lens 34 to play a role in emitting light; the PCB substrate 1 is electrically connected to the PD chip 41 through the surface circuit of the second ceramic substrate 6, and transmits the optical signal received by the receiving end optical fiber array 4 to the PD chip 41, thereby performing an optical receiving function.
Because the stepped heat dissipation block 2 is provided with the upper stepped surface 21 and the lower stepped surface 22, the focusing lens 34 is installed on the upper stepped surface 21, and the laser chip 31 is installed on the lower stepped surface 22, the size difference between the laser chip 31 and the focusing lens 34 can be eliminated by utilizing a certain height difference between the upper stepped surface and the lower stepped surface, thereby realizing the purpose of height alignment between the laser chip 31 and the focusing lens 34. In addition, the laser chip 31 and the first ceramic substrate 5, and the PD chip 41 and the second ceramic substrate 6 are packaged by thermocompression bonding, and compared with the electrical connection formed by gold wire bonding, the thermocompression bonding shortens the communication line between the chip and the PCB substrate 1, improves the communication efficiency, and ensures that the sensitivity of the high-frequency signal meets the requirement when the transmission rate reaches a certain degree.
Moreover, a laser chip 31 and a backlight detector 32 are attached to the upper side of the first ceramic substrate 5, a TEC refrigeration sheet 7 is embedded in a lower groove of the first ceramic substrate 5, and the TEC refrigeration sheets 7 and the laser chip 31 are distributed in an up-and-down corresponding manner. High temperature that laser instrument chip 31 produced conducts the refrigeration end to TEC refrigeration piece 7 through first ceramic substrate 5, and TEC refrigeration piece 7 is with the downward transmission of absorbed heat to notch cuttype radiating block 2 to realize the large amount of heats that the diffusion laser instrument chip 31 produced of conduction effectively, avoid appearing the too high condition of local heat.
In this embodiment, the lower sides of the laser chip 31 and the PD chip 41 are respectively provided with a communication interface, and the first ceramic substrate 5 and the second ceramic substrate 6 are respectively provided with a surface circuit, as shown in fig. 2, the low temperature solder balls 35 are connected between the communication interface of the laser chip 31 and the surface circuit of the first ceramic substrate 5, and between the communication interface of the PD chip 41 and the surface circuit of the second ceramic substrate 6, and the electrical connection between the chip and the ceramic substrate is realized through the process of combining the low temperature solder balls 35 and the thermal compression bonding.
Specifically, the upper surface of the first ceramic substrate 5 is parallel to the upper stepped surface 21, and the upper surface of the first ceramic substrate 5 is disposed lower than the upper stepped surface 21. Moreover, the upper stepped surface 21 is disposed parallel to the bottom surface of the stepped heat sink 2, the lower stepped surface 22 is disposed obliquely downward in a direction away from the upper stepped surface 21, and an inclination angle of the lower stepped surface 22 with respect to the bottom surface of the stepped heat sink 2 is between 0 and 5 °. As a further preferable mode, the inclination angle of the lower step surface 22 with respect to the bottom surface of the stepped heat dissipation block 2 is any angle between 1 ° and 3 °.
In the present embodiment, the inclination angle of the lower step surface 22 with respect to the bottom surface of the stepped heat sink 2 is 1.5 °, as shown in fig. 3, the lower step surface 22 is set to be an inclined surface with a gradient of 1.5 °, and the front and rear positions of the first ceramic substrate 5 can be translated during the mounting process, so that the height of the upper surface of the first ceramic substrate 5 can be accurately adjusted, and the purpose of highly aligning the laser chip 31 and the focusing lens 34 is finally achieved.
Correspondingly, the lower surface of the first ceramic substrate 5 is provided with a first inclined surface, and the inclined angle of the first inclined surface is equal to that of the lower step surface 22; the lower surface of the second ceramic substrate 6 is provided with a second inclined surface, and the inclination angle of the second inclined surface is equal to that of the lower step surface 22. Moreover, the lower step surface 22 is uniformly provided with micro grooves 23, as shown in fig. 4, the length direction of the micro grooves 23 is arranged along the surface inclined direction of the lower step surface 22; the first inclined plane and the second inclined plane are both provided with a micro-convex ridge matched with the lower step surface 22, and the length direction of the micro-convex ridge is arranged along the surface inclined direction of the first inclined plane or the second inclined plane.
The cross section of each micro groove 23 is V-shaped, the depth of each micro groove is any size between 20 mu m and 200 mu m, and the distance between every two adjacent micro grooves 23 is any size between 200 mu m and 600 mu m. As a further preferable scheme, the depth of the micro groove 23 is 100 μm, and the distance between two adjacent micro grooves 23 is 300 μm, and correspondingly, the height of the micro ridge of the first inclined plane and the second inclined plane is 100 μm, and the distance between two adjacent micro ridges is 300 μm.
By utilizing the concave-convex matching between the micro grooves 23 and the micro ridges, the roughness of the surface to be pasted is increased, the left-right slippage in the pasting process is prevented easily, and the pasting stability and accuracy are ensured; moreover, the concave-convex matching plays a guiding role along the length direction, which is beneficial to controlling the posture direction of the back and forth movement of the first ceramic substrate 5, the laser chip 31, the second ceramic substrate 6 and the PD chip 41, and ensuring that the finally mounted laser chip 31 accurately faces the focusing lens 34.
In addition, the micro grooves 23 and the micro ridges are both manufactured by adopting a laser etching and ultrasonic wave removing technology, the precision of the laser etching is high, micron-sized fine processing can be realized, and residues generated by etching can be effectively removed through ultrasonic waves. One side of the receiving-side optical fiber array 4 has an overhang protruding from the upper stepped surface 21, the overhang is located on the upper portion of the second ceramic substrate 6, and the PD chip 41 is disposed on the lower side of the overhang of the receiving-side optical fiber array 4.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and substitutions can be made without departing from the technical principle of the present invention, and these modifications and substitutions should also be regarded as the protection scope of the present invention.
Claims (10)
1. A400G optical transceiver module is characterized by comprising a PCB substrate, a stepped radiating block, a transmitting end optical fiber array, a receiving end optical fiber array, a first ceramic substrate and a second ceramic substrate, wherein the stepped radiating block is attached to the surface of the PCB substrate;
the stepped heat dissipation block is provided with an upper stepped surface and a lower stepped surface, the transmitting end optical fiber array and the receiving end optical fiber array are attached to the upper stepped surface side by side, and the first ceramic substrate and the second ceramic substrate are attached to the lower stepped surface side by side;
a laser chip and a backlight detector are attached to the upper side of the first ceramic substrate, an isolator is further arranged on the transmitting end optical fiber array corresponding to the laser chip, and a focusing lens is further arranged on the upper step surface between the laser chip and the isolator;
a groove is formed in the lower side of the first ceramic substrate, TEC refrigerating pieces are embedded in the groove and are respectively attached to the lower step surface and the first ceramic substrate, and the TEC refrigerating pieces and the laser chip are distributed in an up-and-down corresponding mode;
a PD chip is attached to the upper side of the second ceramic substrate and is arranged corresponding to the receiving end optical fiber array; the laser chip and the first ceramic substrate, and the PD chip and the second ceramic substrate are packaged through hot-press welding.
2. The 400G optical transceiver module of claim 1, wherein the laser chip and the PD chip are respectively provided with a communication interface at the lower side thereof, the first ceramic substrate and the second ceramic substrate are respectively provided with a surface circuit thereon, and low temperature solder balls are respectively connected between the communication interface of the laser chip and the surface circuit of the first ceramic substrate, and between the communication interface of the PD chip and the surface circuit of the second ceramic substrate.
3. The 400G optical transceiver module of claim 2, wherein the upper surface of the first ceramic substrate is parallel to the upper stepped surface, and the upper surface of the first ceramic substrate is disposed lower than the upper stepped surface.
4. The 400G optical transceiver module of claim 3, wherein the upper stepped surface is parallel to the bottom surface of the stepped heat sink, the lower stepped surface is disposed obliquely downward in a direction away from the upper stepped surface, and an inclination angle of the lower stepped surface with respect to the bottom surface of the stepped heat sink is between 0 and 5 °.
5. The 400G optical transceiver module of claim 4, wherein the angle of inclination of the lower step surface with respect to the bottom surface of the stepped heat slug is any angle between 1 ° and 3 °.
6. The 400G optical transceiver module of claim 5, wherein a first inclined plane is disposed on a lower surface of the first ceramic substrate, and an inclination angle of the first inclined plane is equal to that of the lower stepped plane; the lower surface of the second ceramic substrate is provided with a second inclined plane, and the second inclined plane is equal to the inclination angle of the lower stepped surface.
7. The 400G optical transceiver module of claim 6, wherein the lower step surface is uniformly provided with micro grooves, and the length direction of the micro grooves is arranged along the surface inclination direction of the lower step surface; the first inclined plane, the second inclined plane all be equipped with down stair surface matched with little ridge, little ridge's length direction is followed first inclined plane or the surface slope direction of second inclined plane sets up.
8. The 400G optical transceiver module of claim 7, wherein the cross-sectional profile of the micro-grooves is V-shaped, the depth of the micro-grooves is any dimension between 20 μm and 200 μm, and the distance between two adjacent micro-grooves is any dimension between 200 μm and 600 μm.
9. The 400G optical transceiver module of claim 7, wherein the micro grooves and the micro ridges are formed by laser etching and ultrasonic cleaning.
10. The 400G optical transceiver module of claim 1, wherein one side of the receiving end fiber array has an overhang protruding from the upper step surface, the overhang is located on the upper portion of the second ceramic substrate, and the PD chip is disposed on the lower side of the overhang of the receiving end fiber array.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211672487.9A CN115877523B (en) | 2022-12-22 | 2022-12-22 | 400G optical transceiver module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211672487.9A CN115877523B (en) | 2022-12-22 | 2022-12-22 | 400G optical transceiver module |
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| CN115877523A true CN115877523A (en) | 2023-03-31 |
| CN115877523B CN115877523B (en) | 2023-07-25 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117111229A (en) * | 2023-08-01 | 2023-11-24 | Nano科技(北京)有限公司 | Light receiving assembly packaging structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120128290A1 (en) * | 2010-11-19 | 2012-05-24 | Electronics And Telecommunications Research Institute | Optical modules |
| CN110850534A (en) * | 2019-12-06 | 2020-02-28 | 绍兴柯芯光电技术有限公司 | Optical transceiver module and packaging method thereof |
| CN112198598A (en) * | 2020-11-13 | 2021-01-08 | 亨通洛克利科技有限公司 | Optical module structure |
| CN215575810U (en) * | 2021-07-26 | 2022-01-18 | 武汉联特科技股份有限公司 | Multi-channel optical module |
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- 2022-12-22 CN CN202211672487.9A patent/CN115877523B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120128290A1 (en) * | 2010-11-19 | 2012-05-24 | Electronics And Telecommunications Research Institute | Optical modules |
| CN110850534A (en) * | 2019-12-06 | 2020-02-28 | 绍兴柯芯光电技术有限公司 | Optical transceiver module and packaging method thereof |
| CN112198598A (en) * | 2020-11-13 | 2021-01-08 | 亨通洛克利科技有限公司 | Optical module structure |
| CN215575810U (en) * | 2021-07-26 | 2022-01-18 | 武汉联特科技股份有限公司 | Multi-channel optical module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117111229A (en) * | 2023-08-01 | 2023-11-24 | Nano科技(北京)有限公司 | Light receiving assembly packaging structure |
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