JP2003222746A - Photoelectric coupling device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a photoelectric coupling device in which optical coupling of a light emitting element, a photodetector and an optical waveguide can be more accurately conducted and the optical waveguide is hardly changed in properties by heat. <P>SOLUTION: The photoelectric coupling device comprises a silicon mount 1 in which a light emitting laser 5 for converting an electric signal into an optical signal and a PIN photodiode 13 for converting the optical signal into the electric signal are fixed, and the optical waveguide 4 fixed at one end to the mount 1 and fixed at the other end to the mount 1 to pass the optical signal. In the device, the waveguide 4 is optically coupled to the laser 5 and the photodiode 13. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an opto-electrical coupling device which is integrated with a semiconductor integrated circuit on a wiring board and which mutually transmits an optical signal between a plurality of the semiconductor integrated circuits. .

[0002]

2. Description of the Related Art In a conventional opto-electrical coupling device, when an optical waveguide for transmitting signals between semiconductor integrated circuits mounted on the wiring board by using optical signals is arranged on the wiring board, The unevenness of the electronic components mounted on the top and the electrical wiring interfere with it, making it difficult to freely arrange and join the optical waveguide on the wiring board.

FIG. 18 shows "2001 Ishi, et al.
ctronic Components and Te
chnology Conference p. 870 "
3 is a cross-sectional view of the optoelectronic coupling device shown in FIG. 2, in which the optical waveguide 4 is arranged between the pair of wiring boards 11 in order to solve the problem of the optoelectronic coupling device. This opto-electric coupling device is attached to a semiconductor integrated circuit 6, and includes a light emitting laser 5 that is a light emitting element that converts an electric signal into an optical signal, a PIN photodiode 13 that is a light receiving element that converts an optical signal into an electric signal, and The waveguide 4 includes an optical waveguide 4 which is disposed between the upper and lower wiring boards 11 and whose end face is cut at an angle of 45 degrees, and a microlens array 22 provided in the middle of the optical path. Optical waveguide 4
Is composed of, for example, a polyimide resin, and has a reflecting surface 4r on which gold or aluminum metal is vapor-deposited on both end surfaces.
Are formed.

The semiconductor integrated circuit 6 includes an interposer 21.
The light emitting laser 5 and the PIN photodiode 13 are joined to the upper surface of the wiring substrate 11 via the solder bumps 7 so as to be optically coupled to the optical waveguide 4.

In this opto-electric coupling device, after the electric signal from the semiconductor integrated circuit 6 is converted into an optical signal by the light emitting laser 5, this optical signal passes through the microlens array 22 and then one reflecting surface 4r. Is totally reflected by and is introduced into the optical waveguide 4. The optical signal is totally reflected by the other reflecting surface 4r, is then sent to the PIN photodiode 13 through the microlens array 22, is converted into an electric signal there, and the signal is sent to the semiconductor integrated circuit 6.

[0006]

However, in this optoelectrical coupling device, the electronic component is mounted by soldering on the wiring substrate 11 in which the optical waveguide 4 is interposed. Then, there is a problem that the wiring board 11 is thermally deformed and the position of the optical waveguide 4 is displaced, or the material of the optical waveguide 4 is changed, and the characteristics thereof are changed. Further, the linear expansion coefficient of the wiring board 11 made of resin is
Since the light emitting laser 5, the PIN photodiode 13, and the semiconductor integrated circuit 6 made of silicon are larger by one digit,
Due to the temperature change, a positional deviation occurs between the light emitting laser 5 and the PIN photodiode 13 and the optical waveguide 4, and the optical coupling between the light emitting laser 5 and the PIN photodiode 13 and the optical waveguide 4 cannot be obtained. There was also a problem. Further, the light emitting laser 5 and the PIN
When the semiconductor integrated circuit 6 is bonded to the upper surface of the wiring board 11 so that the photodiode 13 is optically coupled to the optical waveguide 4, it is difficult to perform the alignment, and the light emitting laser 5 and the PIN are actually used. Even if the detector checks whether or not the photodiode 13 is optically well coupled to the optical waveguide 4, the opto-electric coupling device and the wiring board 11 are integrated, so that the setting of the opto-electric coupling device to the detector is made. There is also a problem that it is difficult to judge whether the optical coupling is good or bad.

An object of the present invention is to solve the above problems, and it is possible to more accurately perform optical coupling between a light emitting element, a light receiving element and an optical waveguide. The object of the present invention is to obtain an opto-electric coupling device in which the optical waveguide is hard to deteriorate due to heat.

[0008]

An opto-electrical coupling device of the present invention is an optical device which is integrated with a semiconductor integrated circuit on a wiring board and which transmits a signal between a plurality of the semiconductor integrated circuits using optical signals. An electric coupling device, wherein at least one of a light emitting element for converting an electric signal into the optical signal and a light receiving element for converting the optical signal into the electric signal is fixed, and one end is fixed to the mount. And an optical waveguide whose other end is fixed to the other mount and through which the optical signal passes, and the optical waveguide is optically coupled to the light emitting element and the light receiving element.

In the opto-electrical coupling device of the present invention, the mount is made of silicon like the semiconductor integrated circuit.

In the opto-electric coupling device of the present invention, the mount is provided with a reflecting surface for changing the optical path of the optical signal on the way.

In the opto-electrical coupling device of the present invention, the end face of the optical waveguide is provided with the reflecting surface for changing the optical path of the optical signal.

In the opto-electrical coupling device of the present invention, the optical waveguide is composed of a flexible member.

In the opto-electrical coupling device of the present invention, the optical waveguide is floated from the wiring board.

In the opto-electrical coupling device of the present invention, the mount is fixed to the semiconductor integrated circuit mounted on the wiring board.

In the optoelectronic coupling device of the present invention, the mount is fixed to the wiring board.

In the optoelectrical coupling device of the present invention, the light emitting element and the light receiving element are fixed to the mount so that their vertical axes intersect at 90 degrees, and the end face of the optical waveguide is the light emitting element. And is fixed to the mount so as to face either one of the light receiving element and a reflection surface is provided in the optical path of the optical signal between the optical waveguide and the light emitting element and the light receiving element. The wavelength of the optical signal is a wavelength that is reflected by the reflection surface and transmitted through the mount.

In the opto-electrical coupling device of the present invention, the silicon mount is provided with the inclined portion which is inclined with respect to the wiring substrate and to which the end portion of the optical waveguide is fixed.
The optical waveguide from the inclined portion is led out in a direction away from the wiring board.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, each embodiment of the present invention will be described, and the same or equivalent members and parts as those of the conventional one will be designated by the same reference numerals. Embodiment 1. 1A is a sectional view of an essential part of an optical module according to Embodiment 1 of the present invention, FIG. 1B is a sectional view taken along line I-I of FIG. 1A, and FIG. Optical module 1
3 is a cross-sectional view when 0 is mounted on the wiring board 11. FIG. In this opto-electrical coupling device, a first cutout portion 2a and a second cutout portion 2b are formed at both end portions, respectively, and 4 at the back side thereof.
The silicon mount 1 having an inclined surface of 5 ° and the solder bumps 7 are formed by the first cutouts 2a of the silicon mount 1.
A light emitting laser 5 which is a light emitting element which is attached by the above and which converts an electric signal into an optical signal; a PIN photodiode 13 which is a light receiving element which is attached to the second cutout portion 2b and converts an optical signal into an electric signal; 1 notch 2
a, a flexible optical waveguide 4 having an end portion housed in the second cutout portion 2b and an optical signal passing therethrough. Optical waveguide 4
Is composed of a pair of core parts 4a made of polyimide resin and a clad part 4b covering the core parts 4a.
The optical waveguide 4 is composed of a pair of optical waveguide portions 4c connected to each other by an optical connector 12. On the inclined surfaces of the first cutout 2a and the second cutout 2b,
The reflecting surface 3 is formed by vapor-depositing gold or aluminum metal.

The light emitting laser 5 is in a relationship of being optically coupled to the optical waveguide 4 via the reflecting surface 3, and is adjusted and joined so that the light of the light emitting laser 5 is optimally coupled. ing. Further, the PIN photodiode 13 is also in a relationship of being optically coupled to the optical waveguide 4 via the reflecting surface 3, so that the light of the PIN photodiode 13 is adjusted and joined so as to be optimally coupled. Has become.

The silicon mount 1 to which the light emitting laser 5 and the PIN photodiode 13 are attached is composed of a semiconductor integrated circuit 6 for driving the light emitting laser 5 and other semiconductor integrated circuits 6 by a two-layer semiconductor integrated circuit 6 and solder bumps 7. The optical modules 10 are joined together to form the optical module 10. A through hole 8 is formed in each of the pair of semiconductor integrated circuits 6, and the semiconductor integrated circuits 6 are electrically connected to each other through a wiring (not shown) provided in the through hole 8.

As shown in FIG. 2, a plurality of optical modules 1
0 is bonded to the wiring board 11 by solder bumps 7. The optical modules 10 are optically connected by the optical waveguide 4.

In this opto-electric coupling device, after the electric signal from the semiconductor integrated circuit 6 is converted into an optical signal by the light emitting laser 5, the optical signal is totally reflected by the reflecting surface 3 and then the optical waveguide 4.
Will be introduced to. The optical signal is totally reflected by the other reflecting surface 3 and then sent to the PIN photodiode 13, where it is converted into an electric signal, and the signal is sent to the semiconductor integrated circuit 6.

According to this structure, since the optical waveguide 4, the light emitting laser 5 and the PIN photodiode 13 can be fixed to the silicon diode 1 in advance, the optical waveguide 4 and the light emitting laser 5, and the optical waveguide 4 and the PIN photo diode. The diode 13 can be easily aligned for optimal optical coupling. Then, the integrated optoelectric coupling device may be bonded onto the semiconductor integrated circuit 6 mounted on the wiring board 11. Therefore, when mounting the semiconductor integrated circuit 6 on the wiring board 11 like the conventional one shown in FIG. 18, a troublesome position for optically coupling the light emitting laser 5 and the PIN photodiode 13 with the optical waveguide 4 is provided. No need for alignment.

The linear expansion coefficient of the wiring board 11 made of resin is such that the silicon mount 1, the light emitting laser 5 and the PI
Since the N photodiode 13 and the semiconductor integrated circuit 6 made of silicon are larger by one digit than the N photodiode 13, a positional shift occurs between the optical module 10 and the wiring substrate 11 due to temperature change and the like, but the silicon mount 1 is provided with the light emitting laser 5 , PI
There is almost no difference in linear expansion coefficient from the N photodiode 13, and good optical coupling is secured between the optical waveguide 4 and the light emitting laser 5, and between the optical waveguide 4 and the PIN photodiode 13. Also, the silicon mount 1, the light emitting laser 5, P
The IN photodiodes 13 are also excellent in terms of material thermal stability and mechanical strength.

Further, since the optical waveguides 4 are connected to each other by the space wiring between the optical modules 10 by utilizing the flexibility, they do not interfere with other electronic parts on the wiring board 11 and the electronic parts are prevented. Are mounted on the wiring board 11 with high density.

Embodiment 2. 3 is a sectional view of an optical module 10A according to a second embodiment of the present invention. This embodiment differs from the first embodiment in that a notch 2 is formed on the side of the silicon mount 1 opposite to the semiconductor integrated circuit 6 and the end of the optical waveguide 4 is joined to the notch 2. With such a configuration, the optical waveguide 4 is located farther from the surface of the wiring board 11 than in the first embodiment, and the optical module 10A on the wiring board 11 is correspondingly located.
Is easy to handle.

Embodiment 3. FIG. 4 is a sectional view when the optical module 10B according to the third embodiment of the present invention is mounted on the wiring board 11. In this embodiment, the wiring board 1
1 is joined to the silicon mound 1 of the optical module 10B, and the silicon mount 1 is provided with a through hole 14 for electrically connecting the semiconductor integrated circuit 6 and the wiring board 11. Different from the form 1. With such a configuration, when the optical module 10B is bonded to the wiring board 11, mechanical stress is not directly applied to the semiconductor integrated circuit 6, and the semiconductor integrated circuit 6 is mechanically protected. It Further, since the semiconductor integrated circuits 6 having greatly different linear expansion coefficients are not directly joined to the wiring board 11, thermal stress is not directly applied to the semiconductor integrated circuits 6, and in that respect also the semiconductor integrated circuits 6 Is protected.

Fourth Embodiment FIG. 5 is a sectional view when the optical module 10C according to the fourth embodiment of the present invention is mounted on the wiring board 11. In this embodiment, the optical waveguide 1
Reference numeral 5 denotes a first optical waveguide portion 15a and a second optical waveguide portion 15a, which have a predetermined length and are optically adjusted in advance with respect to the light emitting laser 5 and the PIN photodiode 13 and are attached to the silicon mount 1.
Optical waveguide portion 15b, the third optical waveguide portion 15c attached to the wiring board 11, the gap between the first optical waveguide portion 15a and the third optical waveguide portion 15c, the second optical waveguide It is composed of a joint portion 16 interposed in each gap between the portion 15b and the third optical waveguide portion 15c. The joint portion 16 has the optical waveguide portions 15a, 15b, 15 in the gap.
It is formed by filling a matching agent having a refractive index similar to that of c. The other structure is the same as that of the third embodiment.
As described above, the first optical waveguide portion 15a, the second optical waveguide portion 15b, and the third optical waveguide portion 15a are formed at the joint portion 16 made of the matching agent.
The optical waveguide portion 15c is optically coupled, so that the optical waveguide 15 can efficiently transmit an optical signal, and dust can be prevented from entering the gap.

Embodiment 5. 6 is a sectional view of an optical module 10D according to a fifth embodiment of the present invention. In this embodiment, the end face of the optical waveguide 4 is inclined at an angle of 45 degrees, and the end face is provided with a reflecting surface 17 on which metal such as gold or aluminum is deposited. The other configuration is the same as that of the optical module 10 of the first embodiment.

Sixth Embodiment FIG. 7 is a sectional view of an optical module 10E according to a sixth embodiment of the present invention. In this embodiment, the recess 18 is formed in the silicon mount 1. The light emitting laser 5 is provided in the recess 18. Although not shown, the PIN photodiode 13 is also provided in the recess. The other structure is the same as that of the second embodiment. In this embodiment, the light emitting laser 5 and the PIN photodiode 13 are the silicon mount 1.
Since it is accommodated in the recess 18 of the semiconductor integrated circuit 6 and the silicon mount 1, the light emitting laser 5,
The PIN photodiode 13 does not collide with and damage the semiconductor integrated circuit 6 or the like.

Embodiment 7. 8 is a sectional view of an optical module 10F according to a seventh embodiment of the present invention. In this embodiment, the light emitting laser 5 and the PIN photodiode 13 are fixed to the mount 1 so that their vertical axes intersect at 90 degrees. The end surface of the optical waveguide 4 faces the PIN photodiode 13. A partial reflection surface 3A is provided in the optical path of the optical signal between the optical waveguide 4 and the light emitting laser 5 and the PIN photodiode 13.
Is provided. The partial reflection surface 3A is provided on the 45 ° inclined surface of the silicon mount 1. In the case of this embodiment, an optical signal having a wavelength that is reflected by the partial reflection surface 3A and that is transmitted through the silicon mount 1 is used. That is, light having a wavelength not absorbed by silicon (Si) (light wavelength of 0.9 μm or more) is used. The other structure is the same as that of the second embodiment.

In this embodiment, the optical signal from the light-emitting laser 5 has a partial reflection surface 3 as shown by an arrow A indicating the optical axis.
It is reflected by A and is sent to the optical module on the left side in FIG. 8 through the optical waveguide 4. Further, in FIG. 8, an optical signal from the optical module on the left side is partially reflected by the partially reflecting surface 3
Although reflected by A, it goes straight as shown by the arrow B indicating the optical axis, passes through the silicon mount 1, is sent to the PIN photodiode 13, and is converted into an electric signal there. In this embodiment, the optical waveguide 4 is capable of transmitting light in both directions of arrow A and arrow B, which can reduce the number of optical waveguides 4 and improve the utilization efficiency of the optical waveguides 4. Optical module 10 on wiring board 11
The area occupied by F can be reduced. In addition,
The light emitting laser 5 is made to face the end face of the optical waveguide 4,
The PIN photodiode 13 is arranged on the semiconductor integrated circuit 6 side, and the light emitting laser 5 and the PIN photodiode 13 are arranged.
The position of may be exchanged and the silicon mount 1 may be fixed.

Embodiment 8. FIG. 9 (a) is a sectional view of an optical module 10G according to an eighth embodiment of the present invention, and FIG. 9 (b).
9A is a plan sectional view of a main part of FIG. 9A, and FIG. 9C is FIG. 9A.
FIG. 6 is a sectional view taken along line IX-IX in FIG. In this embodiment, the silicon mount 1 has four reflecting surfaces 3a, 3b,
3c and 3d are formed. The silicon mount 1 has a light emitting laser 5 at a position symmetrical with respect to the optical waveguide 4.
And the PIN photodiode 13 is joined.
The other structure is the same as that of the first embodiment. In this embodiment, the optical signal from the light emitting laser 5 is reflected by the reflecting surfaces 3a and 3b as shown by the arrow C indicating the optical axis and enters the optical waveguide 4. In addition, the optical signal from the optical waveguide 4 is reflected by the reflecting surfaces 3c and 3d as shown by the arrow D indicating the optical axis,
It enters the PIN photodiode 13. In this embodiment, similarly to the seventh embodiment, the optical waveguide 4 is capable of optical transmission in both directions of arrow C and arrow D.

Ninth Embodiment 10 (a) is a plan view of an optoelectronic coupling device according to a ninth embodiment of the present invention, and FIG. 10 (b).
FIG. 11 is a side sectional view of FIG. In this embodiment, the light emitting laser 5 and the PIN photodiode 13 are arranged side by side on the upper surface of the silicon mount 1. The silicon mount 1 is provided with a reflecting surface (not shown) facing the light emitting laser 5 and having an inclination angle of 45 degrees.
Further, the silicon mount 1 is provided with a reflecting surface 3 facing the PIN photodiode 13 and having an inclination angle of 45 degrees. According to this embodiment, the optical signal from the light emitting laser 5 is reflected by the reflecting surface and enters the first optical waveguide 4A as shown by the arrow E indicating the optical axis. The optical signal from the second optical waveguide 4B is reflected by the reflecting surface 3 and enters the PIN photodiode 13 as shown by the arrow mark indicating the optical axis. In this embodiment, by the optical waveguides 4A and 4B,
Optical signal from light emitting laser 5, PIN photodiode 1
The optical signals to 3 can be made individually.

Embodiment 10. 11 (a) is a plan view of an optoelectronic coupling device according to a tenth embodiment of the present invention.
FIG. 11B is a side sectional view of FIG. In this embodiment, the silicon mount 1 is provided with the reflecting surface 3 having a step. The first optical waveguide 4A and the second optical waveguide 4B are arranged one above the other. Other configurations are similar to those of the ninth embodiment. In this embodiment,
As in the ninth embodiment, the optical signals from the light emitting laser 5 and the optical signal to the PIN photodiode 13 can be individually provided by the optical waveguides 4A and 4B. Further, as compared with the ninth embodiment, the width dimension of the silicon mount 1 in the direction perpendicular to the axes of the optical waveguides 4A and 4B can be reduced.

Eleventh Embodiment 12 is a side sectional view of an optoelectrical coupling device according to Embodiment 11 of the present invention. In this embodiment, the light emitting laser 5 is bonded to the upper surface of the silicon mount 1. PI on the bottom of the silicon mount 1
The N photodiode 13 is joined. A reflection surface 17a is formed on the end surface of the first optical waveguide 4A so as to face the light emitting laser 5. A reflection surface 17b is formed on the end surface of the second optical waveguide 4B so as to face the PIN photodiode 13. In this embodiment, similarly to the ninth embodiment, the optical signal from the light emitting laser 5 and the optical signal to the PIN photodiode 13 can be individually provided.

Twelfth Embodiment FIG. 13 is a side sectional view when an optical module 10H according to a twelfth embodiment of the present invention is mounted on a wiring board 11. In this embodiment, the silicon mount 1 is provided with inclined notches 50a and 50b. The light emitting laser 5 is joined to the inclined cutout portion 50a. The PIN photodiode 13 is joined to the inclined cutout portion 50b. The silicon mount 1 is provided with an inclined portion 51a that is inclined with respect to the wiring board 11 and to which the end portion of the first optical waveguide 4A is fixed. First optical waveguide 4A from inclined portion 51a
Are led out in a direction away from the wiring board 11. Further, the end surface of the first optical waveguide 4A faces the light emitting laser 5.

Further, the silicon mount 1 is inclined with respect to the wiring board 11 and has a second optical waveguide 4B.
Is formed with an inclined portion 51b whose end is fixed. The second optical waveguide 4B from the inclined portion 51b is connected to the wiring board 11
It is derived in the direction away from. The end surface of the second optical waveguide 4B faces the PIN photodiode 13. In the figure, reference numeral 19 is an electric wiring for electrically connecting the light emitting laser 5, the PIN photodiode 13 and the semiconductor integrated circuit 6.

In this embodiment, the optical waveguides 4A, 4B are
Is led obliquely upward from the silicon mount 1, and the optical waveguides 4A, 4A and 4B are provided between the adjacent optical modules 10H.
When connecting by B, it is possible to connect without being affected by electronic parts or the like between the optical modules 10H. In this embodiment, since the light of the wavelength that passes through the silicon mount 1 is used, a through hole is provided in the silicon mount 1 between the light emitting laser 5, the PIN photodiode 13 and the optical waveguides 4A and 4B. However, depending on the wavelength used, it is necessary to provide a through hole.

Thirteenth Embodiment FIG. 14 is a side sectional view when an optical module 10I according to a thirteenth embodiment of the present invention is mounted on a wiring board 11. In this embodiment, the silicon mount 1 is provided with inclined notches 50a and 50b. The light emitting laser 5 is joined to the inclined cutout portion 50a. The PIN photodiode 13 is joined to the inclined cutout portion 50b. First optical waveguide 4
A and the second optical waveguide 4B are attached to the silicon mount 1. The silicon mount 1 has a first optical waveguide 4A that is inclined with respect to the wiring board 11 and
Is formed with an inclined portion 51a whose end is fixed. The first optical waveguide 4A from the inclined portion 51a is connected to the wiring board 11
It is derived in the direction away from. First optical waveguide 4A
Has an inclination of 45 degrees, and a reflecting surface 17 facing the light emitting laser 5 is formed on the end surface.

The silicon mount 1 is provided with an inclined portion 51b which is inclined with respect to the wiring board 11 and to which the end of the second optical waveguide 4B is fixed. Slope 5
The second optical waveguide 4B from 1b is led out in a direction away from the wiring board 11. The end surface of the second optical waveguide 4B has an inclination of 45 degrees, and the reflecting surface 17 facing the PIN photodiode 13 is formed on the end surface. It should be noted that in this embodiment as well, light of a wavelength that passes through the silicon mount 1 is used, so that the light emitting lasers 5, P
A through hole is not provided in the silicon mount 1 between the IN photodiode 13 and the optical waveguides 4A and 4B, but it may be necessary to provide a through hole depending on the wavelength used. In this embodiment, the optical waveguides 4A and 4B are led out in an obliquely upward direction from the silicon mount 1 as in the optoelectronic coupling device of the twelfth embodiment, and the adjacent optical modules 10 are connected.
When connecting I with the optical waveguides 4A and 4B, it is possible to connect without being affected by electronic parts or the like between the optical modules 10I.

Fourteenth Embodiment FIG. 15 is a side sectional view showing an optoelectronic coupling device according to a fourteenth embodiment of the present invention. In this embodiment, the silicon mount 1 is provided with inclined notches 50a and 50b. Inclined notch 5
A light emitting laser 5 is joined to 0a. The PIN photodiode 13 is joined to the inclined cutout portion 50b. The first optical waveguide 4A and the second optical waveguide 4B are attached to the silicon mount 1. The silicon mount 1 is inclined with respect to the wiring board 11 and has an inclined portion 51 to which the end of the first optical waveguide 4A is fixed.
a is formed. The first optical waveguide 4A from the inclined portion 51a is led out in a direction away from the wiring board 11. The end surface of the first optical waveguide 4A has an inclination of 45 degrees, and a reflection surface 17 for reflecting the optical signal from the light emitting laser 5 along the axis of the first optical waveguide 4A is formed on the end surface. There is.

The silicon mount 1 is provided with an inclined portion 51b which is inclined with respect to the wiring board 11 and to which the end of the second optical waveguide 4B is fixed. Slope 5
The second optical waveguide 4B from 1b is led out in a direction away from the wiring board 11. The end surface of the second optical waveguide 4B has an inclination of 45 degrees, and a reflective surface 17 for reflecting the optical signal from the second optical waveguide 4B to the PIN photodiode 13 is formed on the end surface. Since the light having the wavelength that passes through the silicon mount 1 is also used in this embodiment, a through hole is provided in the silicon mount 1 between the light emitting laser 5, the PIN photodiode 13 and the optical waveguides 4A and 4B. However, depending on the wavelength used, it is necessary to provide a through hole.

In this embodiment, Embodiments 12 and 1
Similar to the opto-electrical coupling device of No. 3, the optical waveguides 4A and 4B are led out from the silicon mount 1 in an obliquely upward direction, and when connecting the adjacent optical modules with the optical waveguides 4A and 4B, the optical module 10J is connected. It can be connected without being affected much by the electronic components around it. In the optical module 10J, the silicon mount 1 is the wiring board 1
The optical module 10 is connected to the wiring board 11 because it is bonded to the optical module 10.
When J is joined, no mechanical stress is directly applied to the semiconductor integrated circuit 6, and the semiconductor integrated circuit 6 is mechanically protected. Further, since the semiconductor integrated circuits 6 having greatly different linear expansion coefficients are not directly bonded to the wiring board 11, thermal stress is not directly applied to the semiconductor integrated circuits 6, and in that respect also the semiconductor integrated circuits 6 Is protected.

Fifteenth Embodiment 16 is a sectional view of an optical module 10K according to a fifteenth embodiment of the present invention, and FIG. 17 is a sectional view when the optical module 10K of FIG. 16 is mounted on a wiring board 11. In this embodiment, branch reflection surfaces 20A and 20B are provided facing the light emitting laser 5 and the PIN photodiode 13, respectively. In this embodiment, the light emitted from the light emitting laser 5 is branched into two directions of arrows T and H indicating the optical axis at the branch reflection surfaces 20A and 20B, and the optical signals from the respective light emission lasers 5 are branched reflection surfaces. After being reflected by 20A and 20B, the light is received by the PIN photodiode 13, and the plurality of optical modules 10 can be optically connected.

In each of the above embodiments, the case where the light emitting laser 5 is used as the light emitting element has been described, but the present invention is not limited to this, and a light emitting diode may be used. Further, although the PIN photodiode 13 is used as the light receiving element in the description, it may be, for example, an MSM photodiode. Further, although the optical waveguide 4 has been described as having a rectangular cross section, an optical fiber having a circular core cross section may be used. In order to protect the optical module from dust and the like, the optical module may be shielded with a resin mold or a cap. Further, in the opto-electrical coupling devices of the first to fourteenth embodiments, only the light emitting element or the light receiving element may be attached to the silicon mount 1.

[0047]

As described above, according to the opto-electric coupling device of the present invention, at least one of the light emitting element for converting an electric signal into an optical signal and the light receiving element for converting the optical signal into the electric signal is fixed. And a light guide having one end fixed to the mount and the other end fixed to another mount through which the optical signal passes, the light guide including the light emitting element and the light receiving element. Since it is optically coupled to the element, it is possible to easily align the optical waveguide and the light emitting element, and the optical waveguide and the light receiving element in advance so as to be optically coupled with each other. Then, it may be mounted on the wiring board in the same manner as other electronic components. Therefore, unlike the conventional one, when the semiconductor integrated circuit is mounted on the wiring board, a troublesome alignment for optically coupling the light emitting element and the light receiving element with the optical waveguide is unnecessary.

Further, according to the opto-electrical coupling device of the present invention, since the mount is made of silicon like the semiconductor integrated circuit, there is almost no difference in the value of the linear expansion coefficient between the mount and the semiconductor integrated circuit. In addition, thermal stress is not generated between the mount and the semiconductor integrated circuit, and the reliability of the optoelectronic coupling device is improved. Further, in the mount, various fine processing techniques of silicon by etching or the like can be used, and the degree of processing freedom can be increased.

Further, according to the opto-electric coupling device of the present invention, since the mount is provided with the reflecting surface for changing the optical path of the optical signal on the way, the space between the light emitting element and the light receiving element and the optical waveguide is provided. The restrictions on the arrangement can be reduced, and the degree of freedom in arranging the optoelectronic coupling device on the wiring board can be increased.

Further, according to the opto-electrical coupling device of the present invention, since the end face of the optical waveguide is provided with the reflecting surface for changing the optical path of the optical signal on the way, the light emitting element and the light receiving element and the optical waveguide are provided. It is possible to reduce the restrictions on the spatial arrangement of the photocouplers and to increase the degree of freedom in arranging the optoelectronic coupling device on the wiring board.

Further, according to the opto-electrical coupling device of the present invention, since the optical waveguide is composed of the flexible member, both can be formed by the optical optical waveguide without obstructing the electronic parts between the adjacent mounts. Can be connected. Further, it is possible to absorb the difference in the distance between the mounts and connect the both by an optical waveguide.

Further, according to the opto-electric coupling device of the present invention, since the optical waveguide is floated from the wiring board, the electric wiring on the wiring board and other mounted parts are hardly considered,
It is possible to design and arrange electric wiring on the wiring board and other mounted components.

Further, according to the opto-electric coupling device of the present invention, the mount is fixed to the semiconductor integrated circuit mounted on the wiring board, so that the opto-electric coupling device can be fixed as it is on the existing semiconductor integrated circuit. it can.

Further, according to the opto-electrical coupling device of the present invention, since the mount is fixed to the wiring substrate, mechanical stress is directly applied to the semiconductor integrated circuit when the opto-electrical coupling device is fixed to the wiring substrate. In such a case, the semiconductor integrated circuit is mechanically protected.

Further, according to the optoelectrical coupling device of the present invention, the light emitting element and the light receiving element are fixed to the mount so that their vertical axes intersect at 90 degrees, and the optical waveguide has its end face. Is fixed to the mount so as to face either one of the light emitting element and the light receiving element, and is reflected in the optical path of the optical signal between the optical waveguide and the light emitting element and the light receiving element. A surface is provided, and the wavelength of the optical signal is a wavelength that is reflected by the reflection surface and transmitted through the mount, so that the number of optical waveguides can be reduced,
The utilization efficiency of the optical waveguide can be improved. Also,
The area occupied by the opto-electric coupling device on the wiring board can be reduced.

Further, according to the opto-electrical coupling device of the present invention, the silicon mount is provided with the inclined portion which is inclined with respect to the wiring substrate and to which the end of the optical waveguide is fixed. Since the optical waveguide from the portion is led out in a direction away from the wiring board, when connecting between adjacent mounts by the optical waveguide, the mounts are connected without being significantly affected by electronic components between the mounts. Therefore, the opto-electrical coupling device can be easily mounted.

[Brief description of drawings]

1A is a sectional view of an optical module according to a first embodiment of the present invention, and FIG. 1B is a sectional view taken along line I-I of FIG. 1A.

FIG. 2 is a cross-sectional view when the optical module of FIG. 1 is mounted on a wiring board.

FIG. 3 is a sectional view of an optical module according to a second embodiment of the present invention.

FIG. 4 is a sectional view when an optical module according to a third embodiment of the present invention is mounted on a wiring board.

FIG. 5 is a sectional view when an optical module according to a fourth embodiment of the present invention is mounted on a wiring board.

FIG. 6 is a sectional view of an optical module according to a fifth embodiment of the present invention.

FIG. 7 is a sectional view of an optical module according to a sixth embodiment of the present invention.

FIG. 8 is a sectional view of an optical module according to a seventh embodiment of the present invention.

9 (a) is a sectional view of an optical module according to Embodiment 8 of the present invention, FIG. 9 (b) is a plan sectional view of FIG. 9 (a), and FIG. 9 (c) is FIG. 9 (a). It is a sectional view taken along line IX-IX in FIG.

10 (a) is a plan view of an optoelectronic coupling device according to a ninth embodiment of the present invention, and FIG. 10 (b) is FIG. 10 (a).
FIG.

FIG. 11 (a) is a tenth embodiment of the present invention.
11 is a plan view of the opto-electric coupling device of FIG.
It is a sectional side view of (a).

FIG. 12 is a sectional view of an optoelectronic coupling device according to an eleventh embodiment of the present invention.

FIG. 13 is a cross-sectional view of essential parts when an optical module according to a twelfth embodiment of the present invention is mounted on a wiring board.

FIG. 14 is a sectional view of an essential part when an optical module according to a thirteenth embodiment of the present invention is mounted on a wiring board.

FIG. 15 is a cross-sectional view of essential parts when an optical module according to a fourteenth embodiment of the present invention is mounted on a wiring board.

FIG. 16 is a sectional view of an optical module according to a fifteenth embodiment of the present invention.

FIG. 17 is a cross-sectional view when the optical module of FIG. 16 is mounted on a wiring board.

FIG. 18 is a cross-sectional view of a conventional optoelectric coupling device.

[Explanation of symbols]

1 Silicon Mount, 3,17 Reflective Surface, 3 Partial Reflective Surface, 4 Optical Waveguide, 5 Light Emitting Laser (Light Emitting Element), 6
Semiconductor integrated circuit, 9 optical signals, 10, 10A, 10B,
10C, 10D, 10E, 10F, 10G, 10H, 10I,
10J, 10K optical module, 11 wiring board, 13
PIN photodiode (light receiving element).

Continued front page    F-term (reference) 2H037 BA02 BA11 BA31 CA37 DA02                       DA06                 2H047 KA04 LA14 MA07 QA05                 5F073 AB16 AB28 BA02 EA29 FA13                       FA23 FA30                 5F088 AA03 BA16 BB01 JA03 JA09                       JA14 JA20

Claims (10)

[Claims] 1. An opto-electric coupling device which is integrated with a semiconductor integrated circuit on a wiring board and which transmits a signal between a plurality of the semiconductor integrated circuits using an optical signal, wherein the electrical signal is the optical signal. A mount to which at least one of a light-emitting element for converting into an electric signal and a light-receiving element for converting the optical signal into an electric signal is fixed, one end of which is fixed to the mount and the other end of which is fixed to another mount. An optical-electrical coupling device comprising: an optical waveguide through which the optical signal passes, the optical waveguide being optically coupled to the light-emitting element and the light-receiving element. 2. The optoelectronic coupling device according to claim 1, wherein the mount is made of silicon like the semiconductor integrated circuit. 3. The optoelectric coupling device according to claim 1, wherein the mount is provided with a reflecting surface for changing the optical path of the optical signal on the way. 4. The optoelectric coupling device according to claim 1, wherein a reflecting surface for changing the optical path of the optical signal is provided on the end face of the optical waveguide. 5. The optoelectric coupling device according to claim 1, wherein the optical waveguide is made of a flexible member. 6. The optoelectronic coupling device according to claim 1, wherein the optical waveguide is floated from the wiring board. 7. The optoelectric coupling device according to claim 1, wherein the mount is fixed to the semiconductor integrated circuit mounted on the wiring board. 8. The optoelectric coupling device according to claim 1, wherein the mount is fixed to the wiring board. 9. The light emitting element and the light receiving element are fixed to a mount so that their vertical axes intersect at 90 degrees, and the end face of the optical waveguide is either the light emitting element or the light receiving element. The optical waveguide is fixed to the mount so as to face one side, and a reflection surface is provided in the optical path of the optical signal between the optical waveguide and the light emitting element and the light receiving element. 9. The optoelectronic coupling device according to claim 3, wherein the wavelength is a wavelength that is reflected by the reflection surface and that is transmitted through the mount. 10. The silicon mount is provided with an inclined portion that is inclined with respect to the wiring board and has fixed end portions of the optical waveguide, and the optical waveguide from the inclined portion is the wiring board. The opto-electrical coupling device according to any one of claims 1 to 9, which is led out in a direction away from.