CN109298489A - A kind of light-receiving secondary module and optical module - Google Patents
A kind of light-receiving secondary module and optical module Download PDFInfo
- Publication number
- CN109298489A CN109298489A CN201811302373.9A CN201811302373A CN109298489A CN 109298489 A CN109298489 A CN 109298489A CN 201811302373 A CN201811302373 A CN 201811302373A CN 109298489 A CN109298489 A CN 109298489A
- Authority
- CN
- China
- Prior art keywords
- metal
- light
- circuit board
- secondary module
- receiving secondary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4272—Cooling with mounting substrates of high thermal conductivity
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4279—Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
Abstract
The present invention provides a kind of light-receiving secondary module and optical module.Light-receiving secondary module and optical module provided in an embodiment of the present invention, circuit board protrudes into the metal shell of light-receiving secondary module, so that the reception electrical chip on circuit board is closely connect with the output end of the avalanche photodide inside metal shell, be conducive to improve signal transmission quality；Metal layer on circuit board is contacted with reception electrical chip and insulating heat-conductive cushion block respectively, is conducive to receive electrical chip and realize by metal layer and insulating heat-conductive cushion block to radiate；The depressed area of backing metal provides the position of setting capacitor, provides high voltage with the booster circuit of capacitance connection for the normal work of avalanche photodide；The reflecting slant of optical transport array ends transmits light in avalanche photodide；Insulating heat-conductive cushion block provides electric isolution between metal layer and metal shell bottom surface, and compared with prior art, light-receiving secondary module and optical module provided in an embodiment of the present invention provide good received signal quality, solves the problems, such as electric isolution.
Description
Technical field
The present invention relates to technical field of photo communication more particularly to a kind of light-receiving secondary modules and optical module.
Background technique
Optical module is the important devices that photoelectric conversion is realized in Fiber Optical Communication System, mainly includes light emitting secondary module
(Transmitter Optical Subassembly, TOSA) and light-receiving secondary module (Receiver Optical
Subassembly, ROSA).In general, light emitting secondary module converts electrical signals to optical signal by laser, optical signal is led to
Cross optical fiber transmission；The optical signal of light-receiving secondary module reception optical fiber transmission, and electric signal is converted optical signals to, it is achieved in light
The photoelectric converting function of module.
In prior art, light-receiving secondary module receives electricity in order to realize the transmission of high speed signal, by trans-impedance amplifier TIA etc.
Chip is put into encapsulating housing, but this change needs to receive electrical chip and providing suitable electric isolution scheme.
Summary of the invention
The present invention provides a kind of light-receiving secondary module and optical module, solves the problems, such as to be electrically isolated in light-receiving secondary module.
In order to solve foregoing invention purpose, the embodiment of the present invention is adopted the following technical scheme that
In a first aspect, the embodiment of the present invention provides a kind of light-receiving secondary module, including metal shell, it is respectively protruding into the metal-back
The circuit board and optical transport array of body, the avalanche photodide inside the metal shell；The optical transport array
End forms reflecting slant, to transmit light to the avalanche photodide；The bottom surface of the metal shell is provided with insulation
Thermally conductive cushion block, insulating heat-conductive cushion block surface are provided with backing metal, and the circuit board is located at the surface of the backing metal；
The circuit board has booster circuit and metal layer, is provided with reception electrical chip on the metal layer, the metal layer with it is described
Backing metal contact, the output end of the booster circuit are connected with the feeder ear of the avalanche photodide, the snowslide light
The output end of electric diode is connected with the reception electrical chip；The surface of the backing metal has depressed area, the depressed area
It is provided with capacitor, the capacitor accesses in the booster circuit.
Second aspect, the embodiment of the present invention also provide a kind of optical module, including upper housing and lower case, the upper housing and
Above-mentioned light-receiving secondary module is equipped in the cavity that the lower case is formed.
Light-receiving secondary module provided in an embodiment of the present invention, circuit board protrude into metal shell, so that connecing on circuit board
It receives electrical chip and is closely connect with the output end of the avalanche photodide inside metal shell, be conducive to improve signal transmission matter
Amount；Metal layer on circuit board is contacted with reception electrical chip and insulating heat-conductive cushion block respectively, passes through metal conducive to electrical chip is received
Layer and insulating heat-conductive cushion block realize heat dissipation；The depressed area of backing metal provides the position of setting capacitor, the liter with capacitance connection
Volt circuit provides high voltage for the normal work of avalanche photodide；The reflecting slant of optical transport array ends is by optical transport
Into avalanche photodide；Insulating heat-conductive cushion block provides electric isolution between metal layer and metal shell bottom surface, and existing
There is technology to compare, light-receiving secondary module and optical module provided in an embodiment of the present invention provide good received signal quality, solution
Determined electric isolution the problem of.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not
It can the limitation present invention.
Detailed description of the invention
In order to illustrate more clearly of the technical solution of the application, letter will be made to attached drawing needed in the embodiment below
Singly introduce, it should be apparent that, for those of ordinary skills, without any creative labor,
It is also possible to obtain other drawings based on these drawings.
Fig. 1 is the optical module structure schematic diagram that the prior art provides；
Fig. 2 is a kind of optical module structure schematic diagram provided in an embodiment of the present invention；
Fig. 3 is light-receiving secondary module sectional axonometric drawing provided in an embodiment of the present invention；
Fig. 4 is light-receiving secondary module plane sectional view provided in an embodiment of the present invention；
Fig. 5 is the enlarged structure schematic diagram of a-quadrant in Fig. 4.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with attached drawing to embodiment party of the present invention
Formula is described in further detail.
Fig. 1 is the optical module structure schematic diagram that the prior art provides.As shown in Figure 1, generally, optical module includes upper housing
21, lower case 22, optical secondary module 23 and circuit board 24.Optical secondary module can be divided into light emitting secondary module and light-receiving time mould
Block；The embodiment of the present invention provides a kind of improvement project for light-receiving secondary module.Upper housing 21 and lower case 22 form optical module
Cavity, optical secondary module 23 and circuit board 24 are located in the cavity.In the prior art, optical secondary module has ceramic joining base
Plate 26, ceramic joining substrate 26 are connect by flexible board 25 with circuit board 24, and ceramic joining substrate is inside optical secondary module
Electrical part provides electrical connection.
Fig. 2 is a kind of optical module structure schematic diagram provided in an embodiment of the present invention.Identically as scheme shown in Fig. 1, this hair
The optical module that bright embodiment provides includes the cavity that upper housing and lower case form optical module, differently with scheme shown in Fig. 1, this
The optical module that inventive embodiments provide includes light emitting secondary module 01 and light-receiving secondary module 02, and light-receiving secondary module passes through optical fiber
Array 2 is connect with optical port connector 03.To avoid generating electromagnetism between the light emitting secondary module of optical module and light-receiving secondary module
Crosstalk and hot crosstalk etc., light emitting secondary module and light-receiving secondary module individually encapsulate.
The embodiment of the present invention provides a kind of light-receiving secondary module, including metal shell, is respectively protruding into the metal shell
Circuit board and optical transport array, the avalanche photodide inside the metal shell；The end of the optical transport array
Reflecting slant is formed, to transmit light to the avalanche photodide；The bottom surface of the metal shell is provided with insulating heat-conductive
Cushion block, insulating heat-conductive cushion block surface are provided with backing metal, and the circuit board is located at the surface of the backing metal；It is described
Circuit board has booster circuit and metal layer, and reception electrical chip, the metal layer and the metal are provided on the metal layer
Cushion block contact, the booster circuit is connected with the feeder ear of the avalanche photodide, the avalanche photodide it is defeated
Outlet is connected with the reception electrical chip；The surface of the backing metal has depressed area, and the depressed area is provided with capacitor, institute
Capacitor is stated to access in the booster circuit.
The embodiment of the present invention also provides a kind of optical module, including above-mentioned light-receiving secondary module.
Light-receiving secondary module provided in an embodiment of the present invention, circuit board protrude into metal shell, so that connecing on circuit board
It receives electrical chip and is closely connect with the output end of the avalanche photodide inside metal shell, be conducive to improve signal transmission matter
Amount；Metal layer on circuit board is contacted with reception electrical chip and insulating heat-conductive cushion block respectively, passes through metal conducive to electrical chip is received
Layer and insulating heat-conductive cushion block realize heat dissipation；The depressed area of backing metal provides the position of setting capacitor, the liter with capacitance connection
Volt circuit provides high voltage for the normal work of avalanche photodide, and the reflecting slants of optical transport array ends is by optical transport
Into avalanche photodide；Insulating heat-conductive cushion block provides electric isolution between metal layer and metal shell bottom surface.
Below to light-receiving secondary module provided in an embodiment of the present invention and optical mode in a manner of specific embodiment combination attached drawing
Block is specifically described.
Fig. 3 is light-receiving secondary module sectional axonometric drawing provided in an embodiment of the present invention, and Fig. 4 is provided in an embodiment of the present invention
Light-receiving secondary module plane sectional view, by attached drawing 3, Fig. 4 it is found that in a kind of light-receiving secondary module provided in an embodiment of the present invention
In, light-receiving secondary module includes metal shell 3.Metal shell 3 is the component that light-receiving secondary module is packaged, and light-receiving is secondary
Each component in module is located at the inside of metal shell 3.The opposite side wall of metal shell 3 or the setting of adjacent sidewall opening,
The end of circuit board 1 and the end of optical transport array 2 can extend into the inside of metal shell 3 as a result,.Preferably, for just
The setting of other component in light-receiving secondary module, circuit board 1 and optical transport array 2 pass through 3 opposing sidewalls of metal shell
Middle part extend into the inside of metal shell 3.
Circuit board 1 can be printing board PCB, be also possible to flexible circuit board FPC；Optical transport array 2 can be light
Fibre array is also possible to array waveguide grating AWG.
For the optical transport array 2 extending into inside metal shell 3, optical transport array 2 is used for transmission light, and by transmission
Optical coupling is into avalanche photodide 5.Specifically, 2 end of optical transport array has reflecting slant, and optical transport array 2 transmits
Light after reflecting slant reflects, be transmitted in avalanche photodide 5.In embodiments of the present invention, the inclination of reflecting slant
Angle is 45 ± 5 °.
Fig. 5 is the enlarged structure schematic diagram of a-quadrant in Fig. 4, as shown in figure 5, for the electricity extending into inside metal shell 3
Road plate 1, circuit board 1 are equipped with metal layer 6, and the upper and lower surfaces of circuit board 1, which are respectively equipped with, receives electrical chip 4 and backing metal
7, and metal layer 6 is in contact with reception electrical chip 4 and backing metal 7 respectively, as shown in Fig. 4.Wherein, receiving electrical chip 4 can
To be trans-impedance amplifier TIA, it is also possible to the integrated chip of trans-impedance amplifier and limiting amplifier, is used to receive from photoelectricity
The signal of avalanche diode.
Specifically, pad (not shown), and the pad of circuit board 1 are provided on circuit board 1 and reception electrical chip 4
It is connect with the pad received on electrical chip 4 by routing, and then can be realized circuit board 1 and receive the signal between electrical chip 4
Transmission.
Specifically, receiving the bottom surface that contacts with metal layer of electrical chip 4 is metal ground plane, by the connection with metal layer,
The ground for receiving electrical chip 4 is connected to metal layer, and then is connected to backing metal 7.
Specifically, the ground pad for receiving electrical chip 4 is connect with metal layer 6 by routing, and then is realized and received electrical chip 4
Ground connection.
Specifically, the ground pin of other devices is connected to metal layer on circuit board.
Specifically, circuit board upper surface has the first metal area, and circuit board lower surface has the second metal area, the first metal
It is connected between area and the second metal area by via hole, to form the metal layer of circuit board.
When receiving the work of electrical chip 4, heat can be generated by receiving electrical chip 4.Due to metal layer 6 respectively with receive electrical chip
4 and backing metal 7 be in contact, thus, receiving heat that electrical chip 4 generates is conducted by metal layer 6 on backing metal 7, with
Realize the heat dissipation for receiving electrical chip 4.
In addition, metal layer is contacted with backing metal, the ground electric attribute extension of metal layer is connected to backing metal, is increased
The area on the ground in light-receiving secondary module is conducive to the transmission quality for improving signal.
In embodiments of the present invention, the reception electrical chip 4 on circuit board 1 is connect with avalanche photodide 5 by routing,
Since routing is shorter, transmission speed and quality are higher, thus the routing received between electrical chip 4 and avalanche photodide 5 is got over
It is short better.To realize that receiving the short distance routing between electrical chip 4 and avalanche photodide 5 connects, circuit board 1 extend into gold
Belong to the inside of shell 3, and then realizes that light-receiving secondary module is individually encapsulated on the circuit card 1.
To transmit light to avalanche photodide 5, the end of optical transport array 2 and snowslide light convenient for optical transport array 2
The distance between electric diode 5 is fixed, and distance is shorter.It is stretched again due to optical transport array 2 by the side wall of metal shell 3
Enter the inside of metal shell 3, thus the position of optical transport array 2 is fixed.For end and the snowslide for realizing optical transport array 2
The distance between photodiode 5 is fixed, and the position of avalanche photodide 5 is also required to fix.
Specifically, avalanche photodide APD can be set on the surface of printing board PCB, also can be set in gold
Belong to the surface of cushion block 7.
Circuit board, which has to avalanche photodide, provides the booster circuit of operating high voltage.Host computer/system end is to light
The voltage that module provides is 3.3V, and voltage needed for APD work is 30V even 60V, so being provided with boosting electricity in circuit board
Road；In booster circuit, capacitor is Primary Component, since capacitor is larger, is not suitable for setting on circuit boards, so in metal gasket
The surface of block is provided with depressed area, capacitor is placed on depressed area, a part of capacitor as booster circuit, accesses circuit board
In booster circuit in, i.e., partial circuit in circuit board and capacitor together form complete booster circuit.
The end of optical transport array forms reflecting slant, is occurred by light in end, to transmit light to snowslide
Photodiode；Avalanche photodide is located at the lower section of optical transport array, between optical transport array and avalanche photodide
Be closer, to meet the efficient decoupling calls of light, capacitor is similarly positioned in the lower section of optical transport array, in order to avoid light pass
The position of defeated array, the surface of backing metal form depressed area, the height on the height low metal cushion block surface of depressed area, to reduce
The height of capacitor, and avalanche photodide is located at backing metal surface.
Depressed area can be set to arbitrary shapes/configurations, its purpose is that the height of capacitor is reduced, to avoid optical transport battle array
Column.
In optical module, common cushion block material be metal or ceramics, ceramics have insulation and thermal conduction characteristic, but hardness compared with
It is high, it is difficult to make boss or recess, be generally made into the cushion block of surfacing；Metal is conductive and thermal conductivity, plasticity
By force, it can be fabricated to various shape, but its electric conductivity generally requires setting and is electrically isolated structure.In the embodiment of the present invention, designing
When light-receiving secondary module, in order to provide cushion block to circuit board, according to metal and the different characteristics of ceramics, specific side is devised
Case.
Specifically, due to depressed area to be formed, to place capacitor, so should not use ceramic material, metal material be compared with
Depressed area is formed by backing metal, snowslide is carried by backing metal so having backing metal in secondary module for suitable material
Photodiode and capacitor；Backing metal is contacted with the ground of circuit board, and the shell of secondary module is metal material, is examined to be electrically isolated
Consider, backing metal cannot directly be contacted with shell, in conjunction with cooling requirements, so insulation is arranged between backing metal and shell
Thermally conductive cushion block, preferably ceramic cushion block.
Insulating heat-conductive cushion block 9 is equipped between 3 bottom surface of metal shell and backing metal 7, and the insulating heat-conductive cushion block 9 can be real
Being isolated between existing metal shell 3 and backing metal 7, as shown in attached drawing 3,4.In the embodiment of the present invention, insulating heat-conductive cushion block 9 can
With the preparation of Ceramics material.Due to being equipped with insulating heat-conductive cushion block 9 between 3 bottom surface of metal shell and backing metal 7, and insulation is led
Heat pad block 9 can isolating metal shell 3 and backing metal 7, thus fax will not occur between metal shell 3 and backing metal 7
It passs, and then fax will not occur between circuit board 1 and metal shell 7 and pass, so that light-receiving secondary module has good electricity
Isolation effect.
For 9 isolating metal cushion block 7 of insulating heat-conductive cushion block and metal shell 3, the embodiment of the present invention provides a kind of insulate and leads
The mode of heat pad block 9 isolating metal cushion block 7 and metal shell 3, but it is only for exemplary approach, it does not limit and insulate in the application
The other modes of thermally conductive cushion block 9 isolating metal cushion block 7 and metal shell 3.
Insulating heat-conductive cushion block 9 is located in 3 inner bottom surface of metal shell, and backing metal 7 is located on insulating heat-conductive cushion block 9,
Backing metal 7, insulating heat-conductive cushion block 9 and metal shell 3 are rendered as the form of stacked on top as a result,.Due to backing metal 7,
Insulating heat-conductive cushion block 9 and 3 bottom surface of metal shell are rendered as the form of stacked on top, thus, backing metal 7 and insulating heat-conductive pad
Block 9 can projection forms shade respectively on the bottom surface of metal shell 3.If insulating heat-conductive cushion block 9 is on the bottom surface of metal shell 3
It includes that backing metal 7 projects on the bottom surface of metal shell 3 and is formed by shade that projection, which forms shade, then shows backing metal 7
Size be less than the size of insulating heat-conductive cushion block 9, and backing metal 7 can not be in contact with the side wall of metal shell 3, thus
It can be realized 9 isolating metal cushion block 7 of insulating heat-conductive cushion block and metal shell 3.
Since circuit board 1 and optical transport array 2 are entered in metal shell 3 by the opening being arranged on 3 side wall of metal shell
Portion, thus need to pass through circuit board 1 and the junction of metal shell 3 and optical transport array 2 and the junction of metal shell 3
The mode of coating sealant is bonded, and then realizes the sealing of metal shell 3.
Insulating heat-conductive cushion block 9 and backing metal 7 are sequentially placed in 3 interior bottom portion of metal shell.6 He of metal layer will be provided with
The circuit board 1 for receiving electrical chip 4 extend into the inside of metal shell 3, meanwhile, optical transport array 2 is extend into metal shell 3
Inside, and the distance between end and the avalanche photodide 5 for adjusting optical transport array 2.The end of optical transport array 2 and snow
After the distance between avalanche photo diode 5 is adjusted, the steam carried on each component is removed by way of baking.Steam removal
Afterwards, sealant is applied in the junction and optical transport array 2 of circuit board 1 and metal shell 3 and the junction of metal shell 3.
The sealing to metal shell 3 is realized after sealing glue solidifying.If there are also other parts unsealings on metal shell 3, pass through filling
The mode of sealant realizes the integral sealing of metal shell 3.In embodiments of the present invention, the sealing of metal shell 3 uses and has
The shadowless glue of waterproof performance is realized.
It further, can also be in metal shell to substantially ensure 3 each operating environment of the component without steam in inside of metal shell
Nitrogen is filled in 3 inside, to further decrease the steam inside metal shell 3.
In optical module provided in an embodiment of the present invention, the outer surface of metal shell 3 is additionally provided with fixed column 12.This is fixed
Column 12 is used to fix metal shell 3 on circuit boards, and then realizes light-receiving secondary module is fixed on circuit boards.Due to solid
Fixed column 12 is used to fix metal shell 3 on circuit boards, therefore, the position setting of fixed column 12 and the size of fixed column 12
It needs to be set according to actual conditions.
Those skilled in the art will readily occur to of the invention its after considering specification and the disclosure invented here of practice
Its embodiment.This application is intended to cover any variations, uses, or adaptations of the invention, these modifications, purposes or
Person's adaptive change follows general principle of the invention and including the undocumented common knowledge in the art of the present invention
Or conventional techniques.The description and examples are only to be considered as illustrative, and true scope and spirit of the invention are by following
Claim is pointed out.
It should be understood that the relational terms of such as " first " and " second " or the like be used merely to an entity or
Operation is distinguished with another entity or operation, and without necessarily requiring or implying between these entities or operation, there are any
This actual relationship or sequence.The present invention is not limited to the precise structure already described above and shown in the accompanying drawings,
And various modifications and changes may be made without departing from the scope thereof.The scope of the present invention is only limited by the attached claims
System.
Claims (5)
1. a kind of light-receiving secondary module, which is characterized in that including metal shell, be respectively protruding into the metal shell circuit board and
Optical transport array, the avalanche photodide inside the metal shell；
The end of the optical transport array forms reflecting slant, to transmit light to the avalanche photodide；
The bottom surface of the metal shell is provided with insulating heat-conductive cushion block, and insulating heat-conductive cushion block surface is provided with backing metal,
The circuit board is located at the surface of the backing metal；
The circuit board has booster circuit and metal layer, is provided with reception electrical chip on the metal layer, the metal layer with
The backing metal contact, the output end of the booster circuit are connected with the feeder ear of the avalanche photodide, the snow
The output end of avalanche photo diode is connected with the reception electrical chip；
The surface of the backing metal has depressed area, and the depressed area is provided with capacitor, and the capacitor accesses the boosting electricity
Lu Zhong.
2. light-receiving secondary module according to claim 1, which is characterized in that it is described receive electrical chip ground plane with it is described
Metal layer contact.
3. light-receiving secondary module according to claim 1, which is characterized in that the ground pad for receiving electrical chip surface
It is connect by routing with the metal layer.
4. light-receiving secondary module according to any one of claims 1 to 3, which is characterized in that the metal layer includes being located at institute
State the first metal area of circuit board upper surface and the second metal area of lower surface, first metal area and second metal area
Between pass through via hole connect.
5. a kind of optical module characterized by comprising what upper housing and lower case, the upper housing and the lower case were formed
Light-receiving secondary module of any of claims 1-4 is equipped in cavity.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811302373.9A CN109298489A (en) | 2018-11-02 | 2018-11-02 | A kind of light-receiving secondary module and optical module |
| PCT/CN2019/098316 WO2020088011A1 (en) | 2018-11-02 | 2019-07-30 | Receiver optical subassembly and optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811302373.9A CN109298489A (en) | 2018-11-02 | 2018-11-02 | A kind of light-receiving secondary module and optical module |
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| Publication Number | Publication Date |
|---|---|
| CN109298489A true CN109298489A (en) | 2019-02-01 |
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|---|---|---|---|
| CN201811302373.9A Pending CN109298489A (en) | 2018-11-02 | 2018-11-02 | A kind of light-receiving secondary module and optical module |
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| WO2020088011A1 (en) * | 2018-11-02 | 2020-05-07 | 青岛海信宽带多媒体技术有限公司 | Receiver optical subassembly and optical module |
| CN111694110A (en) * | 2019-03-15 | 2020-09-22 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN112965190A (en) * | 2021-04-12 | 2021-06-15 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113179131A (en) * | 2021-04-22 | 2021-07-27 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113703103A (en) * | 2020-05-21 | 2021-11-26 | 东莞云晖光电有限公司 | Transmitter Optical Subassembly (TOSA) structure and active alignment method thereof |
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| WO2020088011A1 (en) * | 2018-11-02 | 2020-05-07 | 青岛海信宽带多媒体技术有限公司 | Receiver optical subassembly and optical module |
| CN111694110A (en) * | 2019-03-15 | 2020-09-22 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113703103A (en) * | 2020-05-21 | 2021-11-26 | 东莞云晖光电有限公司 | Transmitter Optical Subassembly (TOSA) structure and active alignment method thereof |
| CN113703103B (en) * | 2020-05-21 | 2023-07-28 | 东莞云晖光电有限公司 | Light emission sub-module (TOSA) structure and active alignment method thereof |
| CN112965190A (en) * | 2021-04-12 | 2021-06-15 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113179131A (en) * | 2021-04-22 | 2021-07-27 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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