CN111694110A - Optical module - Google Patents
Optical module Download PDFInfo
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- CN111694110A CN111694110A CN201910196417.2A CN201910196417A CN111694110A CN 111694110 A CN111694110 A CN 111694110A CN 201910196417 A CN201910196417 A CN 201910196417A CN 111694110 A CN111694110 A CN 111694110A
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- chip
- optical
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- circuit board
- optical signal
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4287—Optical modules with tapping or launching means through the surface of the waveguide
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4206—Optical features
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4207—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback
- G02B6/4208—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback using non-reciprocal elements or birefringent plates, i.e. quasi-isolators
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4215—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
Abstract
The application discloses optical module belongs to optical communication technical field. The optical module includes: the optical module comprises a shell, an emitting chip, an optical component and a receiving chip, wherein the shell is provided with a light through port, and the emitting chip, the optical component and the receiving chip are all positioned in the shell; the transmitting chip is used for transmitting a first optical signal to the optical component according to a first electric signal; the optical assembly is used for transmitting the first optical signal to the light-transmitting port and transmitting a second optical signal emitted from the light-transmitting port to the receiving chip; the receiving chip is used for generating a second electric signal according to the second optical signal. The problem that the structure of an optical module is single in the related art is solved, and the optical module is used for the optical module.
Description
Technical Field
The application relates to the technical field of optical communication, in particular to an optical module.
Background
An optical module is often used in an optical fiber communication process, and the optical module has a function of inputting optical signals to an optical fiber according to electrical signals and generating the electrical signals according to the optical signals transmitted in the optical fiber.
In the related art, the optical module generally includes: the optical fiber laser comprises a round and square tube body, an optical transmitter and an optical receiver which are inserted on the round and square tube body, and an isolator and a filter which are arranged in the round and square tube body. The round and square tube body is provided with a light through opening, and the light emitter is used for inputting optical signals to the optical fiber according to the electric signals and sequentially transmits the optical signals to the light through opening through the isolator and the filter. The optical receiver is used for receiving an optical signal which is emitted into the optical module from the light-through port through the isolator and generating an electrical signal according to the optical signal.
However, the optical module of the related art has a relatively single structure.
Disclosure of Invention
The application provides an optical module, can solve the more single problem of structure of optical module, technical scheme is as follows:
there is provided a light module comprising: the optical module comprises a shell, an emitting chip, an optical component and a receiving chip, wherein the shell is provided with a light through port, and the emitting chip, the optical component and the receiving chip are all positioned in the shell;
the transmitting chip is used for transmitting a first optical signal to the optical component according to a first electric signal;
the optical assembly is used for transmitting the first optical signal to the light-transmitting port and transmitting a second optical signal emitted from the light-transmitting port to the receiving chip;
the receiving chip is used for generating a second electric signal according to the second optical signal.
The beneficial effect that technical scheme that this application provided brought includes at least:
in the optical module provided by the embodiment of the invention, the transmitting chip, the optical assembly and the receiving chip are all positioned in the shell, and the transmitting chip, the optical assembly and the receiving chip are mutually matched in the shell, so that the functions of transmitting light and receiving light of the optical module are realized. Moreover, the structure of the optical module is different from that of the optical module in the related art, so that the structure of the optical module is enriched.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an optical module according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another optical module according to an embodiment of the present invention;
fig. 3 is a schematic perspective view of an optical module shown in fig. 2 according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of another optical module according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of another optical module according to an embodiment of the present invention.
Detailed Description
To make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.
Because the structure of the optical module in the related art is single, the embodiment of the invention provides an optical module with a new structure.
Fig. 1 is a schematic structural diagram of an optical module according to an embodiment of the present invention, and as shown in fig. 1, the optical module includes: the device comprises a shell 01, a transmitting chip 02, an optical component 03 and a receiving chip 04, wherein the shell 01 is provided with a light through port 05. The transmitting chip 02, the optical component 03 and the receiving chip 04 are all located within the housing 01.
The emitting chip 02 is configured to emit a first optical signal to the optical component 03 according to the first electrical signal; the optical assembly 03 is configured to transmit a first optical signal to the light-passing port 05, and transmit a second optical signal incident from the light-passing port 05 to the receiving chip 04. The receiving chip 04 is configured to generate a second electrical signal according to the second optical signal.
For example, the transmitting chip 02 and the receiving chip 04 may both be laser chips, and in this case, the first optical signal and the second optical signal may both be laser signals. Alternatively, the transmitting chip 02 and the receiving chip 04 may also be other chips with a photoelectric conversion function, such as a light emitting diode chip, and the like, which is not limited in this embodiment of the present invention.
In summary, in the optical module provided in the embodiments of the present invention, the transmitting chip, the optical component, and the receiving chip are all located in the housing, and the transmitting chip, the optical component, and the receiving chip are mutually matched in the housing, so as to implement functions of transmitting light and receiving light of the optical module. Moreover, the structure of the optical module is different from that of the optical module in the related art, so that the structure of the optical module is enriched.
In addition, a transmitting shell is usually packaged outside a transmitting chip in the related art, a receiving shell is usually packaged outside a receiving chip, and the transmitting chip packaged in the transmitting shell, the receiving chip packaged in the receiving shell and the optical assembly are all packaged in a round tube body, so that the optical module is formed. Therefore, the formed optical module has a large volume, and the transmitting chip and the receiving chip need to be packaged independently, so that the manufacturing process of the optical module is complicated. In the optical module provided by the embodiment of the invention, the transmitting chip, the receiving chip and the optical assembly are all positioned in the shell, so that the optical module does not comprise the transmitting shell and the receiving shell, the size of the optical module is smaller, the transmitting chip, the receiving chip and the optical assembly can be simultaneously packaged in the shell, the transmitting chip and the receiving chip do not need to be independently packaged, the manufacturing process of the optical module is simplified, and the packaging cost is reduced.
Optionally, fig. 2 is a schematic structural diagram of another optical module provided in an embodiment of the present invention, please refer to fig. 2, and on the basis of fig. 1, an optical component in the optical module provided in the embodiment of the present invention may include: filter segment 031. The filter 031 can be used to transmit the first optical signal and reflect the second optical signal. The first direction X1 in which the first optical signal is emitted from the filter 031 is perpendicular to the second direction X2 in which the second optical signal is emitted from the filter 031.
After the emitting chip 02 emits the first optical signal to the optical assembly according to the first electrical signal, the filter 031 may transmit the first optical signal, so that the first optical signal is emitted to the light-passing port 05 of the housing 01, thereby achieving the light-emitting function of the optical module. When the optical module emits a second optical signal from the light-transmitting port 05, the filter 031 may reflect the second optical signal, so that the second optical signal is transmitted along the second direction and then transmitted to the receiving chip 04, thereby implementing the function of receiving light by the optical module.
With continued reference to fig. 2, the optical assembly may further include a fixing structure Y for fixing the filter 031. For example, the fixing structure Y may be located on the temperature adjustment surface where the filter 031 is located, and the fixing structure Y has a light-transmitting area, and the filter 031 may be fixed in the light-transmitting area. The first optical signal emitted from the emitting chip 02 can pass through the light-transmitting region and be directed to the filter 031.
Optionally, with continued reference to fig. 2, the optical assembly may further include: a first lens group 032, a separator 033 and a second lens group 034. Emitting chip 02, first battery of lenses 032, isolator 033, filter 031 and logical light mouth 05 arrange in proper order along first direction X1, and filter 031, second battery of lenses 034 and receiving chip 04 arrange in proper order along second direction X2. The first lens group 032 and the second lens group 034 may each include at least one lens. The emitting chip 02 may be passively or actively coupled with the first lens group 032, and the receiving chip 04 may be passively or actively coupled with the second lens group 034. The isolator 033 is configured to transmit an optical signal incident from a first side where the emission chip 02 is located (for example, a first optical signal emitted from the emission chip 02), and to block the optical signal incident from a side opposite to the first side from being transmitted, so that light can be prevented from being emitted to the emission chip 02. The first optical signal emitted by the emitting chip 02 sequentially passes through the first lens set 032 and the isolator 033 and then emits to the filter 031. The second optical signal reflected by the filter 031 passes through the second lens group 034 and then is transmitted to the receiving chip 04.
Further, please continue to refer to fig. 2, the optical module may further include: an input circuit board 06 and an output circuit board 07, and the housing 01 has an input port (not shown in fig. 2) and an output port (not shown in fig. 2). The input circuit board 06 is inserted into the input port and electrically connected to the emitter chip 02, and the input circuit board 06 is used for inputting the first electrical signal to the emitter chip 02. The output circuit board 07 is inserted into the output port and electrically connected to the receiving chip 04, and the receiving chip 04 is further configured to input the second electrical signal to the output circuit board 07. The input circuit board 06 and the output circuit board 07 in the optical module are circuit boards for electrically connecting the optical module to an external device.
Optionally, fig. 3 is a schematic perspective view of the optical module shown in fig. 2 according to an embodiment of the present invention. Referring to fig. 2 and 3 together, at least one of the input circuit board 06 and the output circuit board 07 may include: an insulating substrate 11, and a circuit layer 12 on the insulating substrate 11. Alternatively, the insulating substrate 11 may be a ceramic substrate, or other insulating substrate, such as a glass substrate or the like. Taking the example that each of the input circuit board 06 and the output circuit board 07 includes the insulating substrate 11 and the circuit layer 12 on the insulating substrate 11, the circuit layer 12 in the input circuit board 06 may be electrically connected to the transmitting chip 02, and the circuit layer 12 in the output circuit board 07 may be electrically connected to the receiving chip 04.
In addition, when the material of the case 01 is a conductor (e.g., metal), the circuit layer 12 needs to be insulated from the case 01. For example, the circuit layer 12 is not in contact with the housing 01, or both the input circuit board 06 and the output circuit board 07 may further include an insulating block 13 covering the circuit layer 12. The insulating substrate formed with the circuit layer can be stuck in a port (input port or output port) in the housing 01 through the insulating block.
Optionally, the light module may further include: the amplifier chip 011 is, for example, a trans-impedance amplifier (TIA) chip. The receiving chip 04 is electrically connected to the amplifier chip 011, and the amplifier chip 011 is electrically connected to the output circuit board 06. The receiving chip 04 is configured to input the second optical signal into the output circuit board through the amplifier chip 011, and the amplifier chip 011 is configured to amplify the second electrical signal and output the second electrical signal to the output circuit board 06.
Optionally, the light module may further include: the monitor chip 013, and the emission chip 02 located within the housing 01 may be arranged in the first direction described above. The emitting chip 02 may also be configured to emit a test light signal to the monitoring chip 013 when the first light signal is emitted, and the monitoring chip 013 is configured to monitor the light emitting power of the emitting chip 02 according to the test light signal. The monitoring chip 013 can be directly electrically connected to the output circuit board (e.g., electrically connected through wires), or the monitoring chip 013 can be electrically connected to the output circuit board through other structures (e.g., amplifier chip, etc.), or the monitoring chip 013 can be directly connected to a device external to the optical module through the output interface.
Optionally, with continuing reference to fig. 2, the optical module may further include: at least one thermostat 08 (e.g. a semiconductor cooler) is arranged in the housing 01, and in fig. 2, the light module includes one thermostat 08 as an example. The thermostat 08 illustratively has a temperature adjustment surface 081, and when the temperature in the housing 01 is high, the thermostat 08 can control the temperature adjustment surface 081 to lower the temperature, and thus lower the temperature in the housing 01; when the temperature in the housing 01 is low, the thermostat 08 can control the temperature adjusting surface 081 to raise the temperature, and then the temperature in the housing 01 is raised. The chips (e.g., transmitter chips, receiver chips, amplifier chips, monitoring chips) in the optical module are arranged on a temperature control surface 081 of the at least one temperature controller 08. Optionally, at least one structure of the optical components (e.g. the filter, the first lens group, etc. as described above) may also be arranged on the temperature control surface 081 of the at least one temperature controller 08. In the embodiment of the present invention, all chips in the optical module and all structures in the optical module are disposed on a temperature adjustment surface in a thermostat of the optical module.
Illustratively, as shown in fig. 2, the light module may include: a thermostat 08, and the temperature-adjusting surface 08 of the thermostat 08 may be rectangular, the propagation direction (the first direction X1) of the first optical signal emitted by the emitting chip 02 is parallel to one of two adjacent sides of the rectangle, and the propagation direction (the second direction X2) of the second optical signal emitted to the receiving chip 04 is parallel to the other of the two adjacent sides. In this case, the temperature control surface of the thermostat 08 is large, and the temperature control effect of the thermostat 08 is good. As another example, the optical module may include: the plurality of thermostats correspond to the plurality of chips (such as the transmitting chip and the receiving chip) in the optical module one by one, and each chip is arranged on the temperature adjusting surface of the corresponding thermostat.
Further, the light module may further include: the temperature-adjusting chip comprises a first gasket 09 and a second gasket 010, wherein the first gasket 09 and the second gasket 010 are both conductors, the first gasket 09 is padded between the emission chip 02 and a temperature-adjusting surface where the emission chip 02 is located, and the emission chip 02 is electrically connected with the input circuit board 06 through the first gasket 09 (the emission chip 02 is electrically connected with the first gasket 09, and the first gasket 09 can be electrically connected with the input circuit board 06 through a lead); the second spacer 010 is spaced between the receiving chip 04 and the temperature adjustment surface where the receiving chip 04 is located, and the receiving chip 04 is electrically connected to the output circuit board 07 through the second spacer 010. For example, since the receiving chip 04 has an anode and a cathode, the second pad 010 may also include an anode pad 0101 and a cathode pad 0102. The anode gasket 0101 is arranged between the anode of the receiving chip 04 and the temperature control surface, and the cathode gasket 0102 is arranged between the cathode of the receiving chip 04 and the temperature control surface.
Still further, the optical module may further include: the amplifier pads 012, 012 may be conductors. The amplifier gasket 012 is padded between the amplifier chip 011 and the temperature adjusting surface where the amplifier chip 011 is located; the receiver chip 04 is electrically connected to the amplifier chip 011 through the second pads 010 and 012 (the receiver chip 04 is electrically connected to the second pads 010, the second pads 010 can be electrically connected to the amplifier pads 012 through wires), and the amplifier chip 011 is electrically connected to the output circuit board 06 through the amplifier pads 012 (the amplifier chip 011 is electrically connected to the amplifier pads 012, and the amplifier pads are electrically connected to the output circuit board 06 through wires).
Optionally, the amplifier pads 012 are at a distance in the range of 10 to 250 micrometers from the output circuit board 06. It can be seen that the amplifier pad 012 is closer to the output circuit board 06, so that the amplifier pad 012 and the output circuit board 06 can be connected by a shorter lead, and the inductance and capacitance on the lead are less, which is more convenient for transmission of electrical signals, and can meet the requirements of high-speed, high-efficiency, and wide bandwidth transmission of signals.
Alternatively, the monitor chip 013 and the emission chip 02 may be both located on the first pad 09, and the cathode of the emission chip 02 is in contact with the first pad 09 (the anode of the emission chip 02 is not in contact with the first pad 09). Alternatively, the monitor chip 013 may not be located on the first pad 09, which is not limited in this embodiment of the present invention.
In addition, each chip (such as a transmitting chip, a receiving chip, etc.) in the optical module and each structure in the optical assembly may be soldered (such as eutectic soldering) or glued on a setting surface (such as a certain pad surface or a certain temperature adjusting surface, etc.) where the chip is located. If the chip is adhered to the installation surface, the chip can be adhered to the installation surface through the conductive adhesive.
It should be noted that there are various realizations of the optical component in the embodiment of the present invention, as long as the first optical signal can be emitted to the light-passing port, and the second optical signal incident from the light-passing port can be emitted to the receiving chip. Fig. 2 shows only a first realizable form of the optical assembly, two of which will be described below.
A second implementation of the optical assembly is shown in fig. 4. Fig. 4 is a schematic structural diagram of another optical module according to an embodiment of the present invention, referring to fig. 4, on the basis of fig. 2, the optical module may further include an optical path adjuster 035, and an arrangement position of each portion in the optical module may be different from the arrangement position in fig. 2. For example, the arrangement direction of the emission chip 02, the first lens group 032, the separator 033, the filter 031, and the light-passing port 05 in fig. 4 and in fig. 2 may be the first direction X1. However, the filter 031 and the optical path adjuster 035 are sequentially arranged along the second direction X2, the receiving chip 04, the second lens set 034 and the optical path adjuster 035 are sequentially arranged along the first direction X1, and the optical path adjuster 035 is configured to transmit the incident optical signal (e.g., the second optical signal emitted from the filter 031) to the second lens set 034.
For example, the optical path adjuster 035 may include a light reflecting structure 0351 and a filtering structure 0352, wherein the filter 031 is configured to transmit the incident second optical signal to the light reflecting structure 0351, the light reflecting structure 0351 is configured to reflect the incident second optical signal to the filtering structure 0352, and the filtering structure 0352 is configured to transmit the optical signal with the target wavelength in the incident second optical signal to the second lens group 034.
After the emitting chip 02 emits the first optical signal, the first optical signal can sequentially pass through the first lens set 032, the isolator 033, the filter 031 and the light-passing port 05, so as to emit the optical module. When a second optical signal is emitted from the light-passing port 05 to the outside of the optical module, the filter 031 may reflect the second optical signal, so as to transmit the second optical signal to the light-reflecting structure 0351 in the optical path adjuster. The light reflecting structure 0351 can reflect the second optical signal to the filtering structure 0352 in the optical path adjuster, and the filtering structure 0352 transmits the optical signal with the target wavelength in the second optical signal to the second lens set 034, and further transmits the optical signal to the receiving chip 04 through the second lens set 034.
In addition, when the optical assembly is implemented in the second implementation manner, the input interface and the output interface on the housing may be independent of each other, and the input circuit board and the output circuit board are independent of each other; alternatively, the input interface and the output interface on the housing may also be the same interface, and the input circuit board and the output circuit board may be integrated into an integrated circuit board Z in fig. 4, which may also include an insulating substrate and a circuit layer on the insulating substrate. In addition, as shown in fig. 4, the optical module may include two thermostats 08, wherein the emitting chip 02, the first lens group 032, the separator 033 and the filter 031 may be located on a temperature adjustment surface of one thermostat 08, and the receiving chip 04 and the second lens group 034 may be located on a temperature adjustment surface of another thermostat 08. The optical module shown in fig. 4 may further include: a support structure W inside the housing 01 on which the optical path adjuster 035 may be located.
A third implementation of the optical assembly is shown in fig. 5. Fig. 5 is a schematic structural diagram of another optical module according to an embodiment of the present invention, and referring to fig. 5, an optical assembly 03 may include: a transmitting optical fiber 036 and a receiving optical fiber 037. One end of the emitting optical fiber 036 and one end of the receiving optical fiber 037 are both coupled to the light-passing port 05, the other end of the emitting optical fiber 036 is coupled to the emitting chip 02, and the other end of the receiving optical fiber 037 is coupled to the receiving chip 04. The transmitting optical fiber 036 is used to transmit light inputted from the other end of the transmitting optical fiber 036 to one end of the transmitting optical fiber, and the receiving optical fiber is used to transmit light inputted from one end of the receiving optical fiber to the other end of the receiving optical fiber. A first optical signal emitted by the emitting chip 02 can be transmitted to the light-passing port 05 along the emitting optical fiber 036, and a second optical signal transmitted by the light-passing port can be transmitted to the receiving chip 04 along the receiving optical fiber 037. The second optical signal incident from the light transmitting port 05 cannot be incident on the transmitting optical fiber, and the first optical signal emitted from the transmitting chip 02 is not emitted to the receiving chip 04.
In summary, in the optical module provided in the embodiments of the present invention, the transmitting chip, the optical component, and the receiving chip are all located in the housing, and the transmitting chip, the optical component, and the receiving chip are mutually matched in the housing, so as to implement functions of transmitting light and receiving light of the optical module. Moreover, the structure of the optical module is different from that of the optical module in the related art, so that the structure of the optical module is enriched.
The above description is only exemplary of the present application and should not be taken as limiting, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. A light module, characterized in that the light module comprises: the optical module comprises a shell, an emitting chip, an optical component and a receiving chip, wherein the shell is provided with a light through port, and the emitting chip, the optical component and the receiving chip are all positioned in the shell;
the transmitting chip is used for transmitting a first optical signal to the optical component according to a first electric signal;
the optical assembly is used for transmitting the first optical signal to the light-transmitting port and transmitting a second optical signal emitted from the light-transmitting port to the receiving chip;
the receiving chip is used for generating a second electric signal according to the second optical signal.
2. The light module of claim 1, wherein the optical assembly comprises: a filter plate is arranged on the upper surface of the filter plate,
the filter is used for transmitting the first optical signal and reflecting the second optical signal, and the first direction of the first optical signal emergent from the filter is perpendicular to the second direction of the second optical signal emergent from the filter.
3. The light module of claim 2, wherein the optical assembly further comprises: a first lens group, a separator, and a second lens group,
the transmitting chip, the first lens group, the isolator, the filter and the light-passing port are sequentially arranged along the first direction, and the filter, the second lens group and the receiving chip are sequentially arranged along the second direction;
the isolator is used for transmitting an optical signal incident from a first side where the emitting chip is located and preventing the optical signal incident from the side opposite to the first side from transmitting.
4. The light module of any of claims 1 to 3, further comprising: an input circuit board and an output circuit board, the housing having an input port and an output port,
the input circuit board is inserted into the input port and is electrically connected with the transmitting chip, and the input circuit board is used for inputting the first electric signal to the transmitting chip;
the output circuit board is inserted into the output port and electrically connected with the receiving chip, and the receiving chip is further used for inputting the second electric signal to the output circuit board.
5. The light module of claim 4,
at least one of the input circuit board and the output circuit board includes: the circuit board comprises a ceramic substrate and a circuit layer positioned on the ceramic substrate.
6. The light module of claim 4, further comprising: at least one thermostat disposed within the housing,
the temperature regulator is provided with a temperature regulation surface, and the chip in the optical module is arranged on the temperature regulation surface of the at least one temperature regulator.
7. A light module according to claim 6, characterized in that at least one structure in the optical component is arranged on a tempering surface of the at least one thermostat.
8. The light module according to claim 6 or 7, characterized in that it comprises: a temperature regulator is arranged on the base, a temperature controller is arranged on the base,
the temperature adjusting surface of the temperature adjuster is rectangular, the propagation direction of the first optical signal emitted by the emitting chip is parallel to one of two adjacent sides of the rectangle, and the propagation direction of the second optical signal emitted to the receiving chip is parallel to the other of the two adjacent sides.
9. The light module according to claim 6 or 7, characterized in that the light module further comprises: a first spacer and a second spacer, wherein the first spacer and the second spacer are arranged in a circular shape,
the first gasket and the second gasket are both conductors, the first gasket is arranged between the transmitting chip and the temperature adjusting surface where the transmitting chip is located, and the transmitting chip is electrically connected with the input circuit board through the first gasket; the second gasket is arranged between the receiving chip and the temperature adjusting surface where the receiving chip is located, and the receiving chip is electrically connected with the output circuit board through the second gasket.
10. The light module of claim 9, further comprising: the temperature-regulating circuit comprises an amplifier chip and an amplifier gasket, wherein the amplifier gasket is a conductor, and the amplifier gasket is arranged between the amplifier chip and a temperature-regulating surface where the amplifier chip is located;
the receiving chip and the amplifier chip are electrically connected through the second gasket and the amplifier gasket, and the amplifier chip is electrically connected with the output circuit board through the amplifier gasket;
the receiving chip is used for inputting the second optical signal into the output circuit board through the amplifier chip, and the amplifier chip is used for amplifying the second electrical signal and then outputting the second electrical signal to the output circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910196417.2A CN111694110A (en) | 2019-03-15 | 2019-03-15 | Optical module |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910196417.2A CN111694110A (en) | 2019-03-15 | 2019-03-15 | Optical module |
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| CN111694110A true CN111694110A (en) | 2020-09-22 |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2697672Y (en) * | 2003-09-22 | 2005-05-04 | 捷耀光通讯股份有限公司 | Bidirectional transmitting/receiving module (Bi-Di TRx) using chip direct package process (COB) |
| EP1610162A1 (en) * | 2004-06-25 | 2005-12-28 | Andrea Pizzarulli | A method of assembling optoelectronic devices and an optoelectronic device assembled according to this method |
| CN202735549U (en) * | 2012-06-27 | 2013-02-13 | 武汉光迅科技股份有限公司 | Integral receiving and transmitting device |
| CN102934385A (en) * | 2010-04-07 | 2013-02-13 | 韩国电子通信研究院 | Bidirectional optical transmission and receiving device |
| US20150370020A1 (en) * | 2014-06-21 | 2015-12-24 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Parallel optical transceiver with top and bottom lenses |
| CN109212690A (en) * | 2018-10-29 | 2019-01-15 | 青岛海信宽带多媒体技术有限公司 | Single fiber bidirectional optical component and optical module |
| CN109298489A (en) * | 2018-11-02 | 2019-02-01 | 青岛海信宽带多媒体技术有限公司 | A kind of light-receiving secondary module and optical module |
-
2019
- 2019-03-15 CN CN201910196417.2A patent/CN111694110A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2697672Y (en) * | 2003-09-22 | 2005-05-04 | 捷耀光通讯股份有限公司 | Bidirectional transmitting/receiving module (Bi-Di TRx) using chip direct package process (COB) |
| EP1610162A1 (en) * | 2004-06-25 | 2005-12-28 | Andrea Pizzarulli | A method of assembling optoelectronic devices and an optoelectronic device assembled according to this method |
| CN102934385A (en) * | 2010-04-07 | 2013-02-13 | 韩国电子通信研究院 | Bidirectional optical transmission and receiving device |
| CN202735549U (en) * | 2012-06-27 | 2013-02-13 | 武汉光迅科技股份有限公司 | Integral receiving and transmitting device |
| US20150370020A1 (en) * | 2014-06-21 | 2015-12-24 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Parallel optical transceiver with top and bottom lenses |
| CN109212690A (en) * | 2018-10-29 | 2019-01-15 | 青岛海信宽带多媒体技术有限公司 | Single fiber bidirectional optical component and optical module |
| CN109298489A (en) * | 2018-11-02 | 2019-02-01 | 青岛海信宽带多媒体技术有限公司 | A kind of light-receiving secondary module and optical module |
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Application publication date: 20200922 |