CN111399141A - Optical device and optical module - Google Patents
Optical device and optical module Download PDFInfo
- Publication number
- CN111399141A CN111399141A CN202010398594.1A CN202010398594A CN111399141A CN 111399141 A CN111399141 A CN 111399141A CN 202010398594 A CN202010398594 A CN 202010398594A CN 111399141 A CN111399141 A CN 111399141A
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- China
- Prior art keywords
- mounting surface
- optical
- optical device
- side plates
- mounting
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4272—Cooling with mounting substrates of high thermal conductivity
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention relates to the technical field of optical communication and discloses an optical device and an optical module. The optical device includes a base, the base including: the mounting plate comprises a first mounting surface and a second mounting surface which are arranged oppositely; the two first side plates are formed by bending and extending two opposite sides of the first mounting surface towards the direction far away from the second mounting surface respectively; and the two second side plates are formed by bending and extending the two opposite sides of the second mounting surface towards the direction far away from the first mounting surface respectively. A light module comprising a light device as described above. The optical device of the embodiment of the invention provides two mounting surfaces which are arranged in a back-to-back manner and used for mounting elements, so that the integration level of the device can be effectively improved; the two first side plates and the two second side plates can be used for transmitting heat generated by elements arranged on the first installation surface and the second installation surface to an external large area from an internal local area, so that a heat dissipation channel with a large area is formed, and the elements are prevented from being damaged due to local high heat in the working process.
Description
Technical Field
The present invention relates to the field of optical communication technologies, and in particular, to an optical device and an optical module.
Background
Since twenty-first century, with the further development of moore's law, the chip size has become smaller and the processing power has become stronger, and the requirements for transmission rate and transmission capacity have become higher. The traditional electrical interconnection has certain limitations, has problems in loss, time delay, reflection, crosstalk, power supply noise, weight and the like, and is difficult to meet the requirements of the current society. The optical interconnection technology has the advantages of high bandwidth, low time delay, electromagnetic interference resistance and the like, and can meet the high requirements of interconnection networks on the performances of transmission bandwidth, transmission rate, power consumption and the like, so that the optical interconnection technology converts electrical signals into optical signals for transmission and undoubtedly has wide market demands and application prospects.
At present, a single optical device, including a laser, a modulator, a detector and the like, and a single electrical device, including a driver, a transimpedance amplifier and the like, can be successfully prepared, and the performance is good. However, many challenges still remain to integrate these optoelectronic devices without affecting their functions, and the optical devices in the prior art generally have the defects of low integration level and poor heat dissipation effect.
Disclosure of Invention
The invention aims to provide an optical device and an optical module, which solve the problems of low integration level and poor heat dissipation effect in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme:
a light device comprising a base, the base comprising:
the mounting plate comprises a first mounting surface and a second mounting surface which are arranged oppositely;
the two first side plates are formed by bending and extending two opposite sides of the first mounting surface towards the direction far away from the second mounting surface respectively;
and the two second side plates are formed by bending and extending the two opposite sides of the second mounting surface towards the direction far away from the first mounting surface respectively.
Optionally, a circuit board, a coupling lens, at least one optical chip and at least one electrical chip are mounted on the first mounting surface and/or the second mounting surface; the optical chips are electrically connected with the electric chips one by one, the circuit board is electrically connected with all the electric chips, and the coupling lens is coupled with all the optical chips.
Optionally, a stepped portion is disposed on the first mounting surface and/or the second mounting surface, the circuit board is mounted on the stepped portion, and the height of the stepped portion is equal to the thickness difference between the circuit board and the electrical chip.
Optionally, at least one position identification point for identifying the optical chip mounting position is further disposed on the first mounting surface and/or the second mounting surface.
Optionally, a recess is formed at one end of the circuit board electrically connected to the electrical chip, and the electrical chip is mounted on a region of the first mounting surface or the second mounting surface corresponding to the recess.
Optionally, two opposite sides of the first mounting surface are the same as two opposite sides of the second mounting surface, and the two first side plates and the two second side plates are perpendicular to the mounting plate.
Optionally, the optical device further comprises a first cover plate and/or a second cover plate; the first cover plate is arranged at the tops of the two first side plates, and the second cover plate is arranged at the tops of the two second side plates.
Optionally, the base is made of a heat conductive material with a thermal conductivity higher than a preset threshold.
Optionally, the optical chip is a laser, a modulator, or a detector, and the electrical chip is a driver or a transimpedance amplifier.
A light module comprising a light device as claimed in any one of the above.
Compared with the prior art, the embodiment of the invention has the following beneficial effects:
the optical device of the embodiment of the invention provides two mounting surfaces which are arranged in a back-to-back manner, and each mounting surface can be provided with an element, so that the integration level of the device can be effectively improved, and the volume of the whole optical device can be effectively reduced on the premise of realizing the same transmission performance; meanwhile, the two first side plates and the two second side plates can be used for transmitting heat generated by the elements arranged on the first installation surface and the second installation surface to an external large area from an internal local area, so that a heat dissipation channel with a large area is formed, and the elements are prevented from being damaged due to local high heat in the working process.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is an overall perspective view of an optical device according to an embodiment of the present invention.
Fig. 2 is an exploded view of an optical device according to an embodiment of the present invention.
Fig. 3 is a perspective view of an optical device provided in an embodiment of the present invention in a state where a cover plate is not provided.
Fig. 4 is a perspective view of a base according to an embodiment of the present invention.
Fig. 5 is a perspective view of another base according to an embodiment of the present invention.
Illustration of the drawings: the optical chip comprises a base 1, a circuit board 2, a coupling lens 3, an optical chip 4, an electric chip 5, a first cover plate 6, a mounting plate 10, a first mounting surface 11, a position identification point 12, a step part 13, a first side plate 20 and a second side plate 30.
Detailed Description
In order to make the technical solutions of the embodiments of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention without any creative efforts shall fall within the protection scope of the embodiments of the present invention.
The terms "comprises" and "comprising," and any variations thereof, in the description and claims of embodiments of the present invention and the above-described drawings, are intended to cover non-exclusive inclusions, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The embodiment of the invention mainly aims at the problems of low integration level and poor heat dissipation effect of the optical device, and improves the part of the optical device, which is used for bearing the base 1 of other units, so as to increase the integration level and increase the heat dissipation channel.
Referring to fig. 1 and fig. 2, an embodiment of the present invention provides an optical device, including a base 1, where the base 1 has a structure as shown in fig. 4, and includes:
a mounting plate 10 including two plate surfaces arranged in a back direction as a first mounting surface 11 and a second mounting surface (not shown) for mounting other component units;
two first side plates 20 formed by bending and extending two opposite sides of the first mounting surface 11 towards a direction far away from the second mounting surface;
the two second side plates 30 are formed by bending and extending two opposite sides of the second mounting surface respectively in a direction away from the first mounting surface 11.
Compared with the conventional optical device with only one mounting surface, the optical device provided by the embodiment of the invention provides two mounting surfaces which are arranged in a back-to-back manner, and each mounting surface can be used for mounting elements, so that the integration level of the device is effectively improved, and the volume of the whole optical device can be effectively reduced on the premise of realizing the same transmission performance.
Two first side plates 20 located on two opposite sides of the first mounting surface 11 and mainly used for transmitting heat generated by elements mounted on the first mounting surface 11 from an inner local area to an outer larger area; two second side plates 30 located on opposite sides of the second mounting surface are used mainly for transferring heat generated by components mounted on the second mounting surface from a local area on the inside to a larger area on the outside. Based on a plurality of side plates connected with the mounting plate 10, a heat dissipation channel with a large area can be formed, and damage caused by local high heat in the working process of elements is avoided.
Illustratively, the two first side plates 20 and the two second side plates 30 may be positioned on the same opposite sides of the mounting plate 10 as shown in fig. 4, and the two first side plates 20 and the two second side plates 30 are perpendicular to the mounting plate 10, so that the base 1 is overall H-shaped.
In fact, in other embodiments, the following arrangement may also be adopted: the two first side plates 20 are respectively disposed on two sides of the mounting plate 10 in the width direction, and the two second side plates 30 are respectively disposed on two sides of the mounting plate 10 in the length direction. The base 1 with the structure can also realize the effects of improving the integration level of the device and forming a good heat dissipation channel. In addition, other similar arrangements may also be employed, and the invention is not limited thereto.
Referring to fig. 2 and 3, in the optical device according to the embodiment of the present invention, the circuit board 2, the coupling lens 3, the at least one optical chip 4, and the at least one electrical chip 5 are mounted on the first mounting surface 11 and/or the second mounting surface, respectively.
On the same installation surface, the optical chips 4 are electrically connected with the electric chips 5 one by one, the circuit board 2 is electrically connected with all the electric chips 5, and the coupling lens 3 is coupled with all the optical chips 4.
At least one position recognition point 12 is further provided on the first mounting surface 11 and/or the second mounting surface as a reference point of the mounting position to ensure accuracy of the mounting position of each component.
Illustratively, the optical chip 4 may be a laser, a modulator or a detector, and the electrical chip 5 may be a driver or a transimpedance amplifier.
The coupling lens 3 is used for changing a mode field or a transmission direction of an optical signal output by the optical chip 4, so that the optical device can be conveniently connected with an external optical transmission medium, such as an optical fiber. In the configuration shown in fig. 1, the coupling lens 3 changes the transmission direction by 90 degrees, and the optical fiber can be connected to the optical device in parallel to the first mounting surface 11/the second mounting surface, which is advantageous for the optical device to be closely arranged.
As shown in fig. 3, in order to maximize the use of the assembly space and make the arrangement more compact, one end of the circuit board 2 electrically connected to the electric chip 5 is formed with a recess, and the electric chip 5 is mounted on a region of the first mounting surface 11 or the second mounting surface corresponding to the recess.
Because the thickness of the optical chip 4 is basically consistent with that of the electric chip 5, and the thickness of the circuit board 2 is relatively small, when the electric chip 5 is electrically connected with the circuit board 2 in a routing mode, the two ends of a metal wire (such as a gold wire) can present a height difference, so that the routing length is long. Therefore, as shown in fig. 5, in the embodiment of the present invention, a step portion 13 may be additionally provided on the first mounting surface 11 and/or the second mounting surface, the height of the step portion 13 is equal to the thickness difference between the circuit board 2 and the electrical chip 5, and the circuit board 2 is mounted on the step portion 13, so that the circuit board 2 and the electrical chip 5 are substantially level, thereby effectively shortening the wire bonding length.
In addition, in order to further improve the heat dissipation effect, the embodiment of the present invention may further include a first cover plate 6 and a second cover plate (not shown), wherein the first cover plate 6 is installed on the top of the two first side plates 20, and the second cover plate is installed on the top of the two second side plates 30, so as to further enlarge the heat dissipation area. Meanwhile, the base 1 and the cover plate can be made of high-heat-conduction materials with heat conduction coefficients higher than a preset threshold value, so that the heat conduction speed is improved.
Based on the above optical device structure, the embodiment of the present invention provides a corresponding optical device assembly method:
the first step is as follows: the optical chip 4 is mounted on the first mounting surface 11 with reference to the position recognition point 12.
The second step is that: the electric chip 5 is attached to the first mounting surface 11 with the optical chip 4 as a reference so that the connection positions of the electric chip 5 and the optical chip 4 are aligned.
The third step: the circuit board 2 is mounted on the first mounting surface 11.
The fourth step: and carrying out gold wire bonding to realize the electrical connection between the electrical chip 5 and the optical chip 4 and between the circuit board 2 and the electrical chip 5.
The fifth step: the first cover plate 6 is installed.
And then, completing the component assembly of the second mounting surface according to the steps.
In still another embodiment of the present invention, there is provided an optical module including the optical device of the above-described structure. Through the application to the optical device of this structure, can effectively improve the device integration level, reduce whole volume, improve the radiating effect simultaneously, guarantee the long-time normal work of module.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A light device comprising a base, wherein the base comprises:
the mounting plate comprises a first mounting surface and a second mounting surface which are arranged oppositely;
the two first side plates are formed by bending and extending two opposite sides of the first mounting surface towards the direction far away from the second mounting surface respectively;
and the two second side plates are formed by bending and extending the two opposite sides of the second mounting surface towards the direction far away from the first mounting surface respectively.
2. The optical device according to claim 1, wherein a circuit board, a coupling lens, at least one optical chip and at least one electrical chip are mounted on the first mounting surface and/or the second mounting surface; the optical chips are electrically connected with the electric chips one by one, the circuit board is electrically connected with all the electric chips, and the coupling lens is coupled with all the optical chips.
3. The optical device according to claim 2, wherein a stepped portion is provided on the first mounting surface and/or the second mounting surface, the circuit board is mounted on the stepped portion, and a height of the stepped portion is equal to a thickness difference between the circuit board and the electrical chip.
4. The optical device according to claim 2, wherein at least one position recognition point for identifying the mounting position of the optical chip is further provided on the first mounting surface and/or the second mounting surface.
5. The optical device according to claim 2, wherein a recess is formed at an end of the circuit board electrically connected to the electric chip, and the electric chip is mounted on a region of the first mounting surface or the second mounting surface corresponding to the recess.
6. The optical device according to claim 1, wherein opposite sides of the first mounting surface are the same as opposite sides of the second mounting surface, and both of the first side plate and the second side plate are perpendicular to the mounting plate.
7. A light device as claimed in claim 1, further comprising a first cover plate and/or a second cover plate; the first cover plate is arranged at the tops of the two first side plates, and the second cover plate is arranged at the tops of the two second side plates.
8. A light device as claimed in claim 1, characterized in that the mount is made of a thermally conductive material having a thermal conductivity higher than a preset threshold.
9. The optical device of claim 2, wherein the optical chip is a laser, a modulator, or a detector, and the electrical chip is a driver or a transimpedance amplifier.
10. A light module comprising the optical device according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010398594.1A CN111399141A (en) | 2020-05-12 | 2020-05-12 | Optical device and optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010398594.1A CN111399141A (en) | 2020-05-12 | 2020-05-12 | Optical device and optical module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111399141A true CN111399141A (en) | 2020-07-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010398594.1A Pending CN111399141A (en) | 2020-05-12 | 2020-05-12 | Optical device and optical module |
Country Status (1)
| Country | Link |
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| CN (1) | CN111399141A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111638580A (en) * | 2020-07-26 | 2020-09-08 | 武汉永鼎光通科技有限公司 | High-speed radiating optical module tube structure |
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| CN104952856A (en) * | 2015-06-27 | 2015-09-30 | 华东光电集成器件研究所 | Integrated circuit capable of realizing double-sided assembly |
| CN204696277U (en) * | 2015-04-27 | 2015-10-07 | 富士康(昆山)电脑接插件有限公司 | Connector and combination thereof |
| CN106443913A (en) * | 2016-12-20 | 2017-02-22 | 中航海信光电技术有限公司 | Optical module packaging structure and optical module |
| CN107546568A (en) * | 2017-08-31 | 2018-01-05 | 新华三技术有限公司 | Pcb board component and light emission component |
| CN109239861A (en) * | 2018-09-11 | 2019-01-18 | 武汉光迅科技股份有限公司 | A kind of silicon light optical transceiver module |
| CN110828442A (en) * | 2019-11-04 | 2020-02-21 | 弘凯光电(深圳)有限公司 | Packaging structure and manufacturing method thereof |
-
2020
- 2020-05-12 CN CN202010398594.1A patent/CN111399141A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204696277U (en) * | 2015-04-27 | 2015-10-07 | 富士康(昆山)电脑接插件有限公司 | Connector and combination thereof |
| CN104952856A (en) * | 2015-06-27 | 2015-09-30 | 华东光电集成器件研究所 | Integrated circuit capable of realizing double-sided assembly |
| CN106443913A (en) * | 2016-12-20 | 2017-02-22 | 中航海信光电技术有限公司 | Optical module packaging structure and optical module |
| CN107546568A (en) * | 2017-08-31 | 2018-01-05 | 新华三技术有限公司 | Pcb board component and light emission component |
| CN109239861A (en) * | 2018-09-11 | 2019-01-18 | 武汉光迅科技股份有限公司 | A kind of silicon light optical transceiver module |
| CN110828442A (en) * | 2019-11-04 | 2020-02-21 | 弘凯光电(深圳)有限公司 | Packaging structure and manufacturing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111638580A (en) * | 2020-07-26 | 2020-09-08 | 武汉永鼎光通科技有限公司 | High-speed radiating optical module tube structure |
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Application publication date: 20200710 |
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| RJ01 | Rejection of invention patent application after publication |